Full-protection impact-resistant ceramic chip packaging structure

Abstract

The utility model discloses a fully-protected impact-resistant ceramic chip packaging structure, relates to the technical field of ceramic chip packaging structures, and aims to solve the problems that the impact resistance of the surface and the side edges of the conventional packaging structure needs to be improved, and the overall practicability needs to be improved. A first ceramic plate and a second ceramic plate are installed on the two symmetrical side faces of the chip body respectively, a plurality of first protruding strips are integrally connected to the outer surface of one side of the first ceramic plate, and second protruding strips are integrally connected to the edges of the four sides of the first ceramic plate and the edges of the four sides of the second ceramic plate. The symmetrical side surfaces of the first protruding strip are each provided with an inserting groove, and the first protruding strip is wrapped and sleeved with a second rubber wrapping strip. The effects that the impact resistance of the surface and the side edges can be improved, meanwhile, the connecting stability of all the structures is high, and practicability is high are achieved.

Description

TECHNICAL FIELD

[0001] The utility model relates to ceramic chip packaging structure technical field especially is related to a full protection's anti -impact type ceramic chip packaging structure. BACKGROUND

[0002] Ceramic chip refers to the chip structure is installed in the inside of high strength ceramic shell, and parallel sintering connects, realizes a ceramic package, and high strength ceramic can carry out external protection operation to chip structure, can play high -efficient waterproof, dustproof, corrosion -resistant effect.

[0003] The anti -impact performance of the surface and the side of the existing packaging structure needs to be improved, and the overall practicability needs to be improved. UTILITY MODEL CONTENT

[0004] The utility model discloses a full protection's anti -impact type ceramic chip packaging structure can improve the anti -impact performance of surface and side, and the connection stability of each structure is high, and the practicability is strong.

[0005] In order to realize the above-mentioned purpose, the utility model provides the following technical scheme:

[0006] A full protection's anti -impact type ceramic chip packaging structure, including chip main part, the symmetry both sides of chip main part are installed with first ceramic plate and second ceramic plate respectively, the one side outer surface of first ceramic plate is integrally connected with a plurality of first convex stripes, and the four side edges of first ceramic plate and second ceramic plate are integrally connected with second convex stripe.

[0007] By adopting the above technical scheme, the anti -impact performance of surface can be improved, and the heat dissipation area of whole chip can be improved, and then the heat dissipation performance of the chip can be improved, and the practicability has been effectively improved.

[0008] Further, the symmetry side surface of first convex stripe is provided with a slot respectively, and the outside of first convex stripe is wrapped with second rubber wrapping strip, and the symmetry both sides of second rubber wrapping strip are clamped in the inside of two slots respectively.

[0009] By adopting the above technical scheme, the anti -impact performance of surface can be further improved.

[0010] Further, the second convex stripe of first ceramic plate is wrapped and installed with first rubber wrapping strip, and the second convex stripe of second ceramic plate is wrapped and installed with third rubber wrapping strip.

[0011] By adopting the above technical scheme, the anti -impact performance of side can be further improved.

[0012] Further, the chip body and the first ceramic plate and the chip body and the second ceramic plate are provided with insulating glue layers.

[0013] By adopting the technical scheme, stable connection of various structures is ensured.

[0014] Further, the first ceramic plate and the second ceramic plate are integrally connected with a plurality of first connecting strips on the surface adjacent to the chip body, and the second ceramic plate is integrally connected with a plurality of second connecting strips on the other side surface, and the first connecting strips and the second connecting strips are in T-shaped cross section.

[0015] By adopting the technical scheme, the firmness of the adhesion of various structures can be improved, and the firmness of the adhesion of the chip and the circuit board can be improved.

[0016] Further, the chip body is provided with a plurality of pins at the symmetrical side edges.

[0017] By adopting the technical scheme, the chip can be conveniently electrically connected.

[0018] In summary, the beneficial technical effects of the utility model are:

[0019] 1. The utility model discloses a plurality of first convex strips on the upper surface of the first ceramic plate can improve the impact resistance of the upper surface of the ceramic chip, and the plurality of first convex strips can effectively improve the heat dissipation area of the first ceramic plate, improve the impact resistance and the heat dissipation performance of the chip, and effectively improve the practicability.

[0020] 2. The utility model discloses a plurality of first connecting strips integrally connected on the first ceramic plate and the second ceramic plate, which can improve the firmness of the connection between the insulating glue layer and the first ceramic plate and the second ceramic plate, and improve the structural stability and firmness of the entire ceramic chip, and a plurality of T-shaped second connecting strips integrally connected on the other side surface of the second ceramic plate, which can improve the firmness of the adhesion of the entire ceramic chip on the circuit board, and further improve the practicability. DRAWINGS

[0021] Figure 1 It is a schematic diagram of the three-dimensional structure of the utility model;

[0022] Figure 2 It is an enlarged view of A of the utility model; Figure 1 ​

[0023] Figure 3 The utility model discloses Figure 1 The enlarged view of B.

[0024] In the drawing: 1, chip main body, 2, pin, 3, insulating adhesive layer, 4, first ceramic plate, 5, first convex strip, 6, first rubber wrapping strip, 7, second rubber wrapping strip, 8, second convex strip, 9, second ceramic plate, 10, third rubber wrapping strip, 11, slot, 12, first connecting strip, 13, second connecting strip. Specific implementation

[0025] The utility model method is further explained in detail below in connection with the drawings.

[0026] Referring to Figure 1 , a kind of fully protected anti-impact ceramic chip package structure, including chip main body 1, first ceramic plate 4 and second ceramic plate 9 are respectively installed on the symmetry two sides of chip main body 1, a plurality of first convex strips 5 are integrally connected on the side outer surface of first ceramic plate 4, second convex strip 8 is integrally connected at the four side edges of first ceramic plate 4 and second ceramic plate 9, insulating adhesive layer 3 is arranged between chip main body 1 and first ceramic plate 4 and between chip main body 1 and second ceramic plate 9, a plurality of pins 2 are arranged at the symmetry side of chip main body 1, wherein the impact resistance of the upper surface of the entire ceramic chip can be improved by using a plurality of first convex strips 5 on the upper surface of first ceramic plate 4, the heat dissipation area of first ceramic plate 4 can be effectively improved by the arrangement of a plurality of first convex strips 5, the heat dissipation performance of the chip is also improved while improving the impact resistance, and the practicality is effectively improved, since second convex strip 8 is integrally connected at the four side edges of first ceramic plate 4 and second ceramic plate 9, the impact resistance of the side edge of the ceramic chip can be improved.

[0027] Referring to Figure 1 , one slot 11 is respectively arranged on the symmetry side surface of first convex strip 5, second rubber wrapping strip 7 is wrapped around the outside of first convex strip 5, the symmetry two sides of second rubber wrapping strip 7 are clamped in the inside of two slots 11, first rubber wrapping strip 6 is installed by wrapping the outside of second convex strip 8 of first ceramic plate 4, third rubber wrapping strip 10 is installed by wrapping the outside of second convex strip 8 of second ceramic plate 9, wherein the impact resistance of the entire ceramic chip can be further improved by the arrangement of first rubber wrapping strip 6, second rubber wrapping strip 7 and third rubber wrapping strip 10.

[0028] Referring to Figure 1 , Figure 3The first ceramic plate 4 and the second ceramic plate 9 are integrally connected with a plurality of first connecting strips 12 on the surface adjacent to the chip body 1, and the other side surface of the second ceramic plate 9 is integrally connected with a plurality of second connecting strips 13, and the cross section of the first connecting strips 12 and the second connecting strips 13 are all T-shaped, wherein the plurality of first connecting strips 12 integrally connected on the first ceramic plate 4 and the second ceramic plate 9 can use the T-shaped first connecting strips 12 to improve the connection firmness of the insulating glue layer 3 with the first ceramic plate 4 and the second ceramic plate 9, thereby improving the structural stability and firmness of the whole ceramic chip, and the plurality of T-shaped second connecting strips 13 integrally connected on the other side surface of the second ceramic plate 9 can improve the firmness of the whole ceramic chip adhered on the circuit board, and the practicability is further improved.

[0029] Working principle: when used, the ceramic chip is adhered at the specified position of the circuit board, and a plurality of pins 2 are welded and fixed, at this time, the plurality of T-shaped second connecting strips 13 integrally connected on the outer surface of the second ceramic plate 9 can effectively improve the firmness of the ceramic chip adhered on the circuit board, and after installation, it can be normally used, and in the process of use, the plurality of first protrusions 5 on the upper surface of the first ceramic plate 4 and the second rubber wrapping strip 7 wrapped outside the first protrusion 5 can improve the surface impact resistance of the whole ceramic chip, and since the second protrusion 8 is integrally connected at the side edge of the first ceramic plate 4 and the second ceramic plate 9, and the first rubber wrapping strip 6 and the third rubber wrapping strip 10 are wrapped outside the second protrusion 8, the efficient side impact protection can be realized, and the chip is prevented from being damaged by slight impact of external objects in the process of use, and since the plurality of first connecting strips 12 are integrally connected on the first ceramic plate 4 and the second ceramic plate 9, the T-shaped first connecting strips 12 can be used to improve the connection firmness of the insulating glue layer 3 with the first ceramic plate 4 and the second ceramic plate 9, thereby improving the structural stability and firmness of the whole ceramic chip.

[0030] The real-time examples of the specific embodiment are the preferred examples of the utility model, and do not limit the protection scope of the utility model, so that: equivalent changes made according to the structure, shape and principle of the utility model should be covered in the protection scope of the utility model.

Claims

1. A fully protected, impact-resistant ceramic chip packaging structure, comprising a chip body (1), characterized in that: The chip body (1) has a first ceramic plate (4) and a second ceramic plate (9) installed on its two symmetrical sides respectively. Multiple first protrusions (5) are integrally connected to one outer surface of the first ceramic plate (4), and second protrusions (8) are integrally connected to the four sides of the first ceramic plate (4) and the second ceramic plate (9).

2. The fully protected, impact-resistant ceramic chip packaging structure according to claim 1, characterized in that: A slot (11) is provided on the symmetrical side surface of the first protrusion (5). The first protrusion (5) is wrapped with a second rubber wrapping strip (7). The symmetrical sides of the second rubber wrapping strip (7) are respectively engaged inside the two slots (11).

3. The fully protected, impact-resistant ceramic chip packaging structure according to claim 1, characterized in that: The second protrusion (8) of the first ceramic plate (4) is wrapped with a first rubber wrapping strip (6), and the second protrusion (8) of the second ceramic plate (9) is wrapped with a third rubber wrapping strip (10).

4. The fully protective, impact-resistant ceramic chip packaging structure according to claim 1, characterized in that: An insulating adhesive layer (3) is provided between the chip body (1) and the first ceramic plate (4) and between the chip body (1) and the second ceramic plate (9).

5. The fully protected, impact-resistant ceramic chip packaging structure according to claim 1, characterized in that: Multiple first connecting strips (12) are integrally connected to the surfaces of the first ceramic plate (4) and the second ceramic plate (9) adjacent to the chip body (1). Multiple second connecting strips (13) are integrally connected to the outer surface of the other side of the second ceramic plate (9). The cross-sections of the first connecting strips (12) and the second connecting strips (13) are both T-shaped.

6. The fully protected, impact-resistant ceramic chip packaging structure according to claim 1, characterized in that: Multiple pins (2) are provided on the symmetrical sides of the chip body (1).

Images