Heat dissipation device
By using plastic injection molding and electroplated metal layer heat dissipation device design, the problems of complex assembly and high cost of traditional SOC heat dissipation devices are solved, achieving lightweight, low cost and high-efficiency heat dissipation.
Patent Information
- Application Number
- CN202520496402.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-03-20
- Publication Date
- 2026-02-13
- Estimated Expiration
- 2035-03-20
AI Technical Summary
Traditional automotive SOC cooling devices suffer from problems such as cumbersome assembly processes, a wide variety of materials, poor precision of metal sealing cavities, large size, high weight, high cost, and failure to meet lightweight design requirements.
The design employs a plastic injection-molded housing, combined with an electroplated metal layer to construct the circuitry. The cooling chamber and sealing structure made of plastic simplify the electrical connection and heat dissipation process, reducing the types of materials and manufacturing steps.
It achieves lightweight design, simplifies manufacturing and assembly processes, reduces material costs, improves heat dissipation efficiency and system stability, and reduces noise and vibration.
Smart Images
Figure CN223912860U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model relates to a heat dissipation technical field especially relates to a heat dissipation device. BACKGROUND
[0002] The current traditional vehicle SOC (System-on-Chip) cooling mode is water cooling device, in the metal sealed cavity, water is used as medium, and the heat generated by the chip is dissipated through water flow rate, so that the SOC cooling effect is achieved through forced circulation.
[0003] However, the traditional automobile SOC heat dissipation device, the SOC chip is connected through the PCB board, and the PCB board is installed on the opposite side of the metal sealed cavity with fasteners, the whole assembly process is complicated, the BOM (Bill of Materials) material types are many, and the fasteners are prone to failure, and the metal sealing cavity has poor forming precision, large volume and high weight, which cannot meet the lightweight design requirements, and the metal sealing cavity also needs to be treated on the rustproof surface, which is high in cost. UTILITY MODEL CONTENTS
[0004] In order to solve the above technical problems or partially solve the above technical problems, the utility model provides a heat dissipation device.
[0005] The utility model provides a heat dissipation device, which comprises a shell, the shell is plastic injection molding, the shell is provided with first cavity and second cavity respectively on the two sides opposite in height direction, wherein the first cavity is provided with electroplated area, the electroplated area is electroplated with metal layer, a plurality of components are attached on the metal layer to construct circuit through the metal layer for realizing the electrical connection between the components, cooling liquid inlet and cooling liquid outlet are communicated with the second cavity respectively, lower cover plate is sealed and blocked on the second cavity to form cooling chamber, and the cooling chamber is used for dissipating heat of the components on the metal layer after the cooling liquid is poured in.
[0006] In addition, the heat dissipation device provided in the above application can have the following additional technical features:
[0007] Specifically, the lower cover plate is connected on the second cavity through hot melt sealing.
[0008] Specifically, the projection surface of the second cavity covers the metal layer.
[0009] Specifically, the remaining area except the electroplated area in the first cavity is insulated.
[0010] Specifically, the second cavity is U-shaped or wave-shaped.
[0011] Specifically, the first wave plate and the second wave plate are arranged in the second cavity, and a wave-shaped medium channel is formed between the first wave plate and the second wave plate, one end of the medium channel communicates with the cooling liquid inlet, and the other end of the medium channel communicates with the cooling liquid outlet.
[0012] Specifically, the plurality of components are arranged on the projection surface of the medium channel in the direction of the components.
[0013] Specifically, a limiting frame and heat dissipation silica gel are further arranged on the metal layer, the limiting frame is arranged at the welding point of the component, and the heat dissipation silica gel is arranged in the limiting frame and placed on the welding point.
[0014] Specifically, an upper cover plate is further arranged, and the upper cover plate is detachably connected to the first cavity to seal the first cavity.
[0015] Specifically, the shape of the upper cover plate is matched with the shape of the opening of the first cavity.
[0016] Compared with the prior art, the technical scheme provided by the embodiment of the utility model has the following advantages:
[0017] (1) The shell is formed by plastic injection molding, so that the first cavity and the second cavity are formed on the two sides in the height direction, compared with the traditional cavity metal forming, the injection molding cycle is shorter, the injection molding efficiency is higher, and it is suitable for mass production, and at the same time, the injection molding can produce more accurate structure size, lighter weight, and more meet the design requirements of lightweight.
[0018] (2) The metal layer is used as the carrier of electrical connection, and the circuit is formed in the first cavity by electroplating, so as to realize the electrical connection between the components, this design directly integrates the complex circuit and the components in the first cavity, avoids the traditional use of connecting the components through the PCB board and the fastening mode of fixing the PCB board by the fastener, reduces the material types, not only saves the material cost, but also simplifies the manufacturing and assembly process.
[0019] (3) The lower cover plate is sealed and blocked on the second cavity to form a cooling chamber, the cooling liquid enters from the cooling liquid inlet and the cooling liquid outlet, so that the cooling chamber passes into the cooling liquid to dissipate heat for the components on the metal layer, since the whole shell is made of plastic material, that is, the cooling chamber is also made of plastic material, compared with the traditional metal cavity, there is no need for rust prevention treatment, which further reduces the production cost. BRIEF DESCRIPTION OF DRAWINGS
[0020] The drawings incorporated into the specification and forming a part thereof, show embodiments consistent with the present utility model, and together with the specification serve to explain the principles of the present utility model.
[0021] In order to more clearly illustrate the above and other technical solutions of the embodiments of the present application or the prior art, the accompanying drawings needed to be used in the description of the embodiments or the prior art will be briefly introduced as follows. Obviously, those skilled in the art can obtain other drawings according to these drawings without any creative effort.
[0022] Figure 1 It is an exploded structural schematic view of the heat dissipation device according to one embodiment of the present application;
[0023] Figure 2 It is another exploded structural schematic view of the heat dissipation device according to one embodiment of the present application;
[0024] Figure 3 It is a top view structural schematic view of the first cavity according to one embodiment of the present application;
[0025] Figure 4 It is a bottom view structural schematic view of the second cavity according to one embodiment of the present application.
[0026] As shown in the drawings:
[0027] 10, housing; 100, first cavity; 101, second cavity; 1000, electroplating area;
[0028] 20, metal layer;
[0029] 30, cooling liquid inlet;
[0030] 40, cooling liquid outlet;
[0031] 50, lower cover plate;
[0032] 60, first wave plate; 61, second wave plate; 600, medium channel;
[0033] 70, limiting frame;
[0034] 80, heat dissipation silica gel;
[0035] 90, upper cover plate. DETAILED DESCRIPTION
[0036] In order to more clearly illustrate the above and other technical solutions of the embodiments of the present application or the prior art, the accompanying drawings needed to be used in the description of the embodiments or the prior art will be briefly introduced as follows. Obviously, those skilled in the art can obtain other drawings according to these drawings without any creative effort.
[0037] Many specific details are set forth in the following description in order to provide a thorough understanding of the present application. However, the present application can be practiced according to other embodiments that can not be described in detail herein.
[0038] The heat dissipation device of the present application is described below in conjunction with the drawings.
[0039] As shown in Figure 1 , Figure 2 and Figure 3 , the heat dissipation device of the present application can include a housing 10, which is made of plastic injection molding. The housing 10 has a first cavity 100 and a second cavity 101 on opposite sides along the height direction.
[0040] In the present application, the housing 10 is made of plastic injection molding to form a first cavity 100 and a second cavity 101 on opposite sides along the height direction. Compared with traditional cavity metal molding, the injection molding cycle is shorter, the injection molding efficiency is higher, and it is suitable for mass production. At the same time, injection molding can produce more accurate structure size, lighter weight, and more in line with the design requirements of lightweight. In addition, plastic is not easily affected by environmental factors such as humidity and pollution. Moreover, plastic itself has the characteristics of chemical corrosion resistance and impact resistance, making the product's service life and performance in harsh environments more stable.
[0041] Among them, the first cavity 100 is provided with an electroplated area 1000, and the electroplated area 1000 is electroplated with a metal layer 20. A plurality of components are attached to the metal layer 20 to build a circuit through the metal layer 20 for electrical connection between the components. The metal layer 20 can be made of copper, nickel, silver, etc., which can be selected according to actual conditions. For example, copper is easy to electroplate, has good mechanical strength and durability, and the cost of copper is relatively moderate, suitable for most electronic products.
[0042] It should be noted that the circuit refers to the conductive path formed on the metal layer 20 by building a circuit on the metal layer 20.
[0043] Specifically, the metal layer 20 serves as a carrier for electrical connections. By electroplating in the first cavity 100, it forms circuits to achieve electrical connections between various components. This design directly integrates complex circuits and component connections into the first cavity 100. Compared to traditional heat dissipation devices, which typically require the use of a separate PCB (Printed Circuit Board) to achieve electrical connections between components and fasteners to secure the PCB, this design not only saves material costs but also simplifies the manufacturing and assembly process. The components can be AMP (Amplifier), PMM (Power Management Module), DDR (Double Data Rate), etc.
[0044] It should be noted that by precisely designing the position and shape of the electroplating area 1000, it can be ensured that the current flows only through the predetermined line path, thereby avoiding electrical connections in irrelevant areas and unnecessary conductivity. The position and shape of the electroplating area 1000 can be set according to the actual situation.
[0045] Furthermore, the remaining areas of the first cavity 100, except for the electroplated area 1000, are insulated. Since the remaining areas, except for the electroplated area 1000, are plastic areas, plastic has good insulation properties, preventing unnecessary electrical short circuits or accidental conduction. The electroplated area 1000 defines the position of the metal layer 20, ensuring that electrical connections are limited to specific areas, while other areas are isolated by plastic, enhancing electrical safety.
[0046] The coolant inlet 30 and coolant outlet 40 are respectively connected to the second cavity 101. The coolant inlet 30 is connected to the coolant supply system (such as a water pump), while the coolant outlet 40 is connected to the condenser or coolant return pipe to ensure the circulation and temperature control of the coolant. This allows the coolant to enter through the coolant inlet 30 and exit through the coolant outlet 40, achieving continuous flow of coolant and ensuring continuous heat exchange.
[0047] The lower cover plate 50 is sealed on the second cavity 101 to form a cooling chamber to prevent coolant leakage. The cooling chamber is used to dissipate heat from the components on the metal layer 20 after the coolant is introduced. Since the entire housing 10 is made of plastic, the cooling chamber is also made of plastic. Compared with traditional metal cavities, no rust prevention treatment is required, which further reduces production costs.
[0048] Furthermore, such as Figure 2 As shown, the lower cover plate 50 can be heat-sealed onto the second cavity 101.
[0049] It should be noted that the lower cover plate 50 is made of plastic material, so that the lower cover plate 50 is formed in one body with the second cavity 101 through a hot melting process, compared with the connection mode that the traditional metal cavity is connected with the cover plate through ultrasonic welding, the sealing is better, and the reliability is higher.
[0050] In an embodiment of the present application, as shown in Figure 2 and Figure 3 , the projection surface of the second cavity 101 covers the metal layer 20, which can provide a larger area of the heat dissipation surface, so that the multiple components can better dissipate heat, and the heat dissipation efficiency of the components is improved.
[0051] In an embodiment of the present application, as shown in Figure 2 and Figure 4 , the second cavity 101 is in U shape or wave shape, which can prolong the heat exchange path, provide more time and surface contact area for heat exchange with the components, so that the cooling liquid has more opportunities to absorb heat and take it away, thereby improving the heat dissipation efficiency. At the same time, compared with the straight line design, the wave shape or U shape design can realize a longer cooling path in the same space, the structure is more compact, the space can be effectively saved, and higher heat dissipation performance is provided.
[0052] Exemplarily, as shown in Figure 2 , the second cavity 101 is in U shape.
[0053] In an embodiment of the present application, as shown in Figure 2 and as shown in Figure 4 , the heat dissipation device further comprises a first wave plate 60 and a second wave plate 61, the first wave plate 60 and the second wave plate 61 are arranged in the second cavity 101, and a wave-shaped medium channel 600 is formed between the first wave plate 60 and the second wave plate 61, one end of the medium channel 600 is communicated with the cooling liquid inlet 30, and the other end of the medium channel 600 is communicated with the cooling liquid outlet 40.
[0054] Specifically, the wave-shaped medium channel 600 formed by the cooperation of the first wave plate 60 and the second wave plate 61 can control the flow rate of the cooling liquid and limit the flow direction of the cooling liquid through the wave shape, can effectively disperse the instantaneous stress in the cooling liquid flow, and the cooling liquid moves smoothly, so that there is no excessive impact force in the flow process, which helps to reduce the vibration and impact in the second cavity 101, and reduce the noise generated.
[0055] Meanwhile, the first wave plate 60 and the second wave plate 61 are used to construct the medium channel 600, convenient installation is achieved, and the medium channel 600 formed has an open side close to the component, so that the cooling liquid directly contacts the bottom wall of the second cavity 101, the contact distance with the component is reduced, and the heat dissipation effect is improved.
[0056] Further, the plurality of components are arranged on the projection surface of the medium channel 600 in the direction of the components, the components are closer to the cooling liquid flow path, heat from the components can be directly absorbed, the heat dissipation efficiency is improved, and the arrangement of the components can help ensure that the cooling liquid uniformly covers each component, so that the risk of local overheating is avoided.
[0057] In an embodiment of the present application, as shown in Figure 1 The present application also comprises a limiting frame 70 and a heat dissipation silica gel 80 on the metal layer 20, the limiting frame 70 is arranged at the welding point of the component, the heat dissipation silica gel 80 is arranged in the limiting frame 70 and placed on the welding point, the limiting frame 70 can effectively limit the heat dissipation silica gel 80, the loss of the heat dissipation silica gel 80 caused by heat flow in a high-temperature environment is reduced, the service life of the heat dissipation silica gel 80 is prolonged, and the stability and long-term effectiveness of the heat dissipation silica gel 80 are ensured.
[0058] Meanwhile, the welding point between the component and the metal layer 20 is often a place where high temperature is easily generated, the welding point bears a large heat load in the heat dissipation device, especially in high-power applications, the welding point can rapidly heat up due to current flow, thermal cycling and other factors, so the heat dissipation silica gel 80 is arranged at the welding point, which is more conducive to heat conduction and transmission.
[0059] In an embodiment of the present application, as shown in Figure 1 The present application also comprises an upper cover plate 90, which is detachably connected to the first cavity 100 and used for plugging the first cavity 100, so that the first cavity 100 can be effectively plugged by the upper cover plate 90, external dust, pollutants or sundries are prevented from entering the first cavity 100, and the cleanliness and normal operation of the internal components are protected.
[0060] In an embodiment of the present application, as shown in Figure 1As shown, the shape of the upper cover plate 90 is matched with the shape of the opening of the first cavity 100, ensuring that the two can perfectly fit. Such a design avoids assembly difficulties caused by shape mismatch, improves assembly accuracy, and reduces human errors during assembly. And because of the shape matching, the upper cover plate 90 can be quickly and accurately positioned and fixed when installed, simplifying the assembly steps, saving time and labor costs, and improving production efficiency. At the same time, the shape matching design can ensure that there is no gap or gap between the upper cover plate 90 and the opening of the first cavity 100, effectively preventing external contaminants or dust from entering the cavity, thereby protecting the internal components and the heat dissipation system, ensuring the sealing of the heat dissipation device, and avoiding the influence of external factors on the internal heat dissipation effect.
[0061] In summary, the heat dissipation device of the embodiments of the present application has the characteristics of light weight and fast forming speed, and simplifies the manufacturing process and assembly steps, thereby improving the overall assembly efficiency. At the same time, it also reduces the types of materials required, effectively reducing the material cost.
[0062] It should be noted that in this paper, relational terms such as "first" and "second" are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between the entities or operations. Moreover, the term "includes", "contains" or any other variant thereof is intended to cover non-exclusive inclusion, so that the process, method, article or device including a series of elements not only includes those elements, but also includes other elements not explicitly listed or inherent to such process, method, article or device. Without more limitations, the element defined by the statement "includes a" does not exclude the presence of another identical element in the process, method, article or device including the element.
[0063] The above is only a specific embodiment of the present application, so that those skilled in the art can understand or implement the present application. Various modifications of these embodiments will be apparent to those skilled in the art, and the general principles defined herein can be implemented in other embodiments without departing from the spirit or scope of the present application. Therefore, the present application will not be limited to these embodiments described herein, but will conform to the widest scope consistent with the principles and novel features disclosed herein.
Claims
1. A heat dissipation device, characterized in that, include: The housing is injection molded from plastic. The housing has a first cavity and a second cavity respectively on opposite sides along its height direction. The first cavity is provided with an electroplating area, on which a metal layer is electroplated. Multiple components are mounted on the metal layer to form a circuit through the metal layer for realizing electrical connection between the components. The coolant inlet and coolant outlet are respectively connected to the second cavity; The lower cover plate is sealed onto the second cavity to form a cooling chamber, which is used to dissipate heat from the components on the metal layer after coolant is introduced.
2. The heat dissipation device according to claim 1, characterized in that, The lower cover plate is connected to the second cavity by a heat-sealing connection.
3. The heat dissipation device according to claim 1, characterized in that, The projection surface of the second cavity covers the metal layer.
4. The heat dissipation device according to claim 1, characterized in that, The remaining areas of the first cavity, except for the electroplating area, are insulated.
5. The heat dissipation device according to claim 1, characterized in that, The second cavity is U-shaped or wavy.
6. The heat dissipation device according to claim 5, characterized in that, It also includes a first wave plate and a second wave plate, both of which are disposed in the second cavity, and a wave-shaped medium channel is formed between the first wave plate and the second wave plate. One end of the medium channel is connected to the coolant inlet, and the other end of the medium channel is connected to the coolant outlet.
7. The heat dissipation device according to claim 6, characterized in that, Multiple components are distributed and arranged on the projection surface of the medium channel in the direction of the components.
8. The heat dissipation device according to claim 1, characterized in that, It also includes a limiting frame and thermal silicone on the metal layer, the limiting frame being disposed at the solder joint of the component, and the thermal silicone being disposed within the limiting frame and placed on the solder joint.
9. The heat dissipation device according to claim 1, characterized in that, It also includes an upper cover plate, which is detachably connected to the first cavity and is used to seal the first cavity.
10. The heat dissipation device according to claim 9, characterized in that, The shape of the upper cover plate is adapted to the opening shape of the first cavity.