MOSFET packaging structure

Abstract

The utility model relates to the technical field of MOSFET production, in particular to an MOSFET packaging structure which comprises a packaging shell arranged on a PCB, a first heat dissipation piece and a second heat dissipation piece, the packaging shell is composed of a shell body and a base, the shell body and the base are connected and fixed through a connecting piece, and the first heat dissipation piece and the second heat dissipation piece are arranged on the PCB. A cavity for packaging the chip is also arranged between the shell and the base; wherein the connecting piece penetrates through the packaging shell and fixes the first heat dissipation piece and the second heat dissipation piece, through the arrangement of the pair of heat dissipation pieces, the temperature accumulated on the chip and the PCB can be effectively conducted, and the situation that normal use of the chip is affected by too high temperature is avoided; and the first heat dissipation piece and the packaging shell can be fixed at the same time through the connecting piece, and the connecting piece can also fix the second heat dissipation piece after penetrating through the PCB, so that the heat dissipation pieces and the heat conduction pieces are convenient to disassemble and replace.

Description

TECHNICAL FIELD

[0001] The utility model relates to MOSFET production technical field especially relates to a MOSFET package structure. BACKGROUND

[0002] MOSFET (metal-oxide semiconductor field effect transistor) is a common semiconductor device, and is widely used in electronic circuits as a switch or amplifier, and the main purpose of MOSFET packaging is to protect the chip, provide electrical connection and ensure the reliability and stability of the device.

[0003] When the MOSFET chip is packaged, a heat dissipation structure also needs to be provided to prevent the chip temperature from being too high to affect normal use. For example, the prior art Chinese patent No. "CN222281984U" discloses a TO3P packaged MOSFET chip with a clip structure, which includes a bottom base island, a packaging cover mounted on the bottom base island, a packaging space between the packaging cover and the bottom base island, a positioning frame provided inside the packaging space, a heat dissipation plate provided on the packaging cover to dissipate heat, and a heat conduction layer filled in the positioning frame. The utility model forms a closed chip packaging space by tightly combining the packaging cover and the bottom base island. When the chip is working, the heat generated by the chip is transferred to the heat conduction layer, and then the heat is conducted to the heat dissipation plate by the heat conduction layer. The heat dissipation plate provided on the packaging cover serves as the main heat dissipation structure, further dissipating the heat conducted by the heat conduction layer to the environment, and maintaining the stable working temperature of the chip.

[0004] In the specific operation, the chip is cooled by the heat dissipation plate, but the heat dissipation plate is arranged in the packaging shell, which is not convenient to disassemble and replace after long-term use or damage, and the heat dissipation efficiency may be low by only arranging the heat dissipation plate. UTILITY MODEL CONTENTS

[0005] The utility model aims at solving the above-mentioned inconvenience of disassembling and assembling the heat dissipation fin in the prior art, and provides a MOSFET package structure.

[0006] In order to achieve the above-mentioned purpose, the utility model adopts the following technical scheme:

[0007] A MOSFET package structure is designed, which includes a packaging shell placed on a PCB board, a first heat dissipation member and a second heat dissipation member, the packaging shell is composed of a shell and a base, the shell and the base are connected and fixed by a connecting piece, and a cavity for packaging a chip is further provided between the shell and the base.

[0008] The connecting piece penetrates the packaging shell and fixes the first heat dissipation member and the second heat dissipation member.

[0009] Further, the top of the shell is provided with a mounting groove, and a step groove formed by extending downward on both sides of the mounting groove, the first heat dissipation member is arranged in the mounting groove, and two sides of the first heat dissipation member are clamped in the step groove, and the other two sides are bent downward and attached to the side of the chip.

[0010] Further, a plurality of heat dissipation protrusions are arranged on the top of the first heat dissipation member, and a first heat conduction sheet is arranged between the first heat dissipation member and the chip, and the two sides of the first heat conduction sheet are attached to the heat dissipation protrusions and the chip.

[0011] Further, the second heat dissipation member is arranged in position corresponding to the first heat dissipation member, and a second heat conduction sheet is arranged between the second heat dissipation member and the PCB.

[0012] Further, the connecting member is in a columnar structure, and is arranged on both sides of the packaging shell and sequentially penetrates the first heat dissipation member, the step groove and the PCB, and the connecting member is further screwed with the second heat dissipation member through the thread at the end.

[0013] Further, a plurality of heat dissipation fins are circumferentially arranged on the connecting member at the top protruding part, and the heat dissipation fins are arranged at intervals, and the protruding part at the top of the connecting member further abuts against the shell.

[0014] The MOSFET packaging structure has the advantages that: the chip is packaged by the packaging shell, the protection effect of preventing collision is achieved, dust protection is also achieved to a certain extent, a pair of heat dissipation members are further arranged, the temperature accumulated on the chip and the PCB can be effectively conducted through the arrangement of the pair of heat dissipation members, the normal use of the chip is avoided due to high temperature, the first heat dissipation member and the packaging shell can be fixed through the connecting member, and the second heat dissipation member can be fixed after the connecting member penetrates the PCB, so that the heat dissipation member and the heat conduction sheet can be conveniently disassembled and replaced. BRIEF DESCRIPTION OF DRAWINGS

[0015] Figure 1 It is a structural schematic diagram of the utility model;

[0016] Figure 2 It is a structural schematic diagram of the first and second heat dissipation members of the utility model;

[0017] Figure 3 It is Figure 2 It is an enlarged structural schematic diagram of area A.

[0018] In the figure: 1, package shell; 11, shell; 12, base; 13, step groove; 2, first heat dissipation piece; 21, heat dissipation protrusion; 3, second heat dissipation piece; 4, connecting piece; 41, heat dissipation fin. DETAILED DESCRIPTION

[0019] The technical solutions in the embodiments of the utility model will be clearly and completely described below with reference to the drawings in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all the embodiments.

[0020] Referring to Figures 1-3 A MOSFET packaging structure, comprising a package shell 1 placed on a PCB board, and a first heat dissipation piece 2 and a second heat dissipation piece 3, the package shell 1 is composed of a shell 11 and a base 12, the shell 11 and the base 12 are connected and fixed through a connecting piece 4, and a cavity for packaging a chip is further arranged between the shell 11 and the base 12.

[0021] Among them, the connecting piece 4 is arranged through the package shell 1, and the first heat dissipation piece 2 and the second heat dissipation piece 3 are fixed.

[0022] Further, the top of the shell 11 is provided with a mounting groove, and step grooves 13 are formed by extending downward on both sides of the mounting groove, the first heat dissipation piece 2 is arranged in the mounting groove, two sides of the first heat dissipation piece 2 are clamped in the step grooves 13, and the other two sides are bent downward and attached to the side of the chip.

[0023] In this embodiment, the chip is adhered to the base 12 by adhesive, and the height of the chip is slightly higher than the step groove 13, so that the first heat dissipation piece 2 can be attached to the first heat conduction fin.

[0024] Specifically, the first heat dissipation piece 2 and the second heat dissipation piece 3 are both heat dissipation fins, which conduct heat to the chip and the PCB board respectively by contact conduction, and the side of the first heat dissipation piece 2 is attached to the chip to better conduct heat to the chip.

[0025] Further, a plurality of heat dissipation protrusions 21 are arranged on the top of the first heat dissipation piece 2, wherein a first heat conduction fin is arranged between the first heat dissipation piece 2 and the chip, and the heat dissipation protrusions 21 and the chip are attached on both sides of the first heat conduction fin.

[0026] More specifically, the second heat dissipation piece 3 is arranged in position corresponding to the first heat dissipation piece 2, and a second heat conduction fin is arranged between the second heat dissipation piece 3 and the PCB board.

[0027] In general, the connecting pieces 4 are in a columnar structure, which are distributed on both sides of the package shell 1 and sequentially pass through the first heat dissipation piece 2, the stepped groove 13 and the PCB board, and are threadedly connected with the second heat dissipation piece 3 through the threaded line at the end.

[0028] Finally, the connecting pieces 4 are circumferentially distributed with a plurality of heat dissipation fins 41 at the top protruding part, and the connecting pieces 4 are further abutted with the shell 11 at the top protruding part.

[0029] Specifically, the connecting pieces 4 can be copper hollow heat pipes in the prior art, which are in contact with the first heat dissipation piece 2 and the second heat dissipation piece 3, and conduct heat through the heat dissipation fins 41 at the top, thereby further improving the heat dissipation efficiency of the chip.

[0030] The bottom end of the connecting piece 4 is threadedly connected with the second heat dissipation piece 3, and the top protruding part thereof is abutted with the shell 11, so as to simultaneously fix the first heat dissipation piece 2 and the second heat dissipation piece 3.

[0031] Of course, in order to better fix the connecting pieces 4, a fastening nut can be threadedly connected at the bottom of the connecting pieces 4.

[0032] Working mode; in working, the chip is packaged by the shell 11 and the base 12, and after packaging, the package shell 1 is arranged on the PCB board, the first heat dissipation piece 2 is arranged in the mounting groove, and the second heat dissipation piece 3 is arranged on the other side of the PCB board and is arranged in position correspondence with the first heat dissipation piece 2.

[0033] Then, the connecting pieces 4 sequentially pass through the first heat dissipation piece 2, the stepped groove 13 and the PCB board, and are threadedly connected with the second heat dissipation piece 3, and the protruding part at the top end of the connecting pieces 4 is abutted with the shell 11, thereby simultaneously fixing the first heat dissipation piece 2 and the second heat dissipation piece 3.

[0034] The above is only the preferred specific implementation mode of the present application, but the protection scope of the present application is not limited thereto, any skilled person in the art can make equivalent replacement or change according to the technical scheme and the inventive concept of the present application within the technical range disclosed by the present application, which should be covered in the protection scope of the present application.

Claims

1. A MOSFET package structure comprising a package housing (1) placed on a PCB board, and a first heat sink (2) and a second heat sink (3), characterized in that: The packaging shell (1) is composed of a shell (11) and a base (12), the shell (11) and the base (12) are connected and fixed by a connecting piece (4), and a cavity for packaging a chip is arranged between the shell (11) and the base (12). The connecting piece (4) penetrates the packaging shell (1) and fixes the first heat dissipation piece (2) and the second heat dissipation piece (3).

2. The MOSFET package structure of claim 1, wherein: The top of the shell (11) is provided with a mounting groove, and a step groove (13) is formed by extending downward on both sides of the mounting groove, the first heat dissipation piece (2) is arranged in the mounting groove, and the first heat dissipation piece (2) is clamped in the step groove (13) on both sides, and the other two sides are bent downward and attached to the side of the chip.

3. The MOSFET package structure of claim 1, wherein: A plurality of heat dissipation protrusions (21) are arranged on the top of the first heat dissipation piece (2), wherein the first heat dissipation piece (2) and the chip are provided with a first heat conduction sheet, and the two sides of the first heat conduction sheet are attached to the heat dissipation protrusions (21) and the chip.

4. The MOSFET package structure of claim 1, wherein: The second heat dissipation piece (3) is arranged in position corresponding to the first heat dissipation piece (2), and a second heat conduction sheet is arranged between the second heat dissipation piece (3) and the PCB.

5. The MOSFET package structure of claim 2, wherein: The connecting piece (4) is in a columnar structure, the connecting piece (4) is distributed on both sides of the packaging shell (1) and penetrates the first heat dissipation piece (2), the step groove (13) and the PCB in sequence, and the connecting piece (4) is further threadedly connected with the second heat dissipation piece (3) through the threaded wire at the end.

6. The MOSFET package structure of claim 5, wherein: The connecting piece (4) is circumferentially distributed with a plurality of heat dissipation fins (41) at the top protruding part, the plurality of heat dissipation fins (41) are arranged at intervals, and the protruding part of the top of the connecting piece (4) further abuts against the shell (11).

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