Conveying mechanism for chip detecting and packaging

Abstract

The utility model relates to the field of chip detecting and sorting, and discloses a conveying mechanism for chip detecting and packaging, which comprises a tray transferring component arranged along the X direction, and a first conveying line, a second conveying line and a third conveying line which extend along the Y direction, the second conveying line is used for conveying a discharging defective product chip tray, and the third conveying line is used for conveying a discharging non-defective product chip tray; the first conveying line comprises a first movement assembly and a second movement assembly, the second conveying line comprises a third movement assembly, the third conveying line comprises a fourth movement assembly and a fifth movement assembly, and the tray transferring assembly is used for transferring trays among the tray taking position, the first tray placing position and the second tray placing position; according to the tray conveying device, the first conveying line and the third conveying line are each internally provided with the two movement assemblies, the two movement assemblies can operate at the same time, and the tray circulation conveying efficiency is improved.

Description

TECHNICAL FIELD

[0001] The utility model relates to chip detection sorting technical field, especially a kind of conveying mechanism for chip detection packaging. BACKGROUND

[0002] At the end of the production process of chip, the packaged chip needs to be detected by multiple optical detection, and then sorted, packaged after good chip is sorted out.

[0003] At present, the main detection method is to rely on manual and electron microscope combined detection, visual camera detection, etc., but chip detection equipment and detection process are numerous, and multiple stations, multiple equipment, multiple repeated detection, sorting, transfer, conveying and other processes of chip product are also prone to damage and additional risk to chip, and multiple back-and-forth transfer of chip also makes the efficiency of chip detection and sorting too low to meet the increasing demand for chip detection and sorting efficiency. UTILITY MODEL CONTENT

[0004] The utility model solves the technical problem: how to improve the efficiency of chip transfer, in order to solve the above technical problem, the utility model provides a kind of conveying mechanism for chip detection packaging, with the X direction, Y direction and Z direction perpendicular to each other, including tray transfer assembly along X direction and first conveying line, second conveying line and third conveying line along Y direction, the first conveying line is used to convey the tray to be detected, the second conveying line is used to convey the tray of defective chip, and the third conveying line is used to convey the tray of good chip.

[0005] The first conveying line includes first motion assembly and second motion assembly, the first motion assembly is used to sequentially convey the tray to be detected from the feeding position to the first detection position and the first transfer position, and the second motion assembly is used to convey the tray to be detected from the first transfer position to the second detection position and / or the tray taking position.

[0006] The second conveying line includes third motion assembly, and the third motion assembly is used to drive the tray to move between the first tray placing position, the first sorting position and the first discharging position.

[0007] The third conveying line includes fourth motion assembly and fifth motion assembly, the fourth motion assembly is used to drive the tray to move between the second tray placing position and the second transfer position, and the fifth motion assembly is used to drive the tray to move between the second transfer position, the second sorting position and the second discharging position.

[0008] The tray transfer assembly is used to transfer the tray between the tray taking position, the first tray placing position and the second tray placing position.

[0009] Preferably, the feeding position, the first detection position, the first transfer position, the second detection position and the tray taking position are sequentially arranged along the Y direction.

[0010] The first unloading position, the first sorting position and the first tray placing position are sequentially arranged along the Y direction.

[0011] The second unloading position, the second sorting position, the second transfer position and the second tray placing position are sequentially arranged along the Y direction.

[0012] Preferably, the second conveying line is provided with a third detection position, and the third detection position is arranged between the first tray placing position and the first sorting position.

[0013] Preferably, the third conveying line is provided with a fourth detection position, and the fourth detection position is arranged between the second tray placing position and the second sorting position.

[0014] Preferably, the first detection position is used for cooperating with a detection mechanism and a material taking mechanism to detect the bottom surface and / or the side surface of the chip, and the second detection position, the third detection position and the fourth detection position are used for cooperating with the detection mechanism to detect the front surface of the chip.

[0015] Preferably, the first movement assembly, the second movement assembly, the third movement assembly, the fourth movement assembly and the fifth movement assembly each comprise a driving motor, a driving structure and a tray clamp, and the driving motor drives the tray clamp to reciprocate along the Y direction through the driving structure.

[0016] The driving structure comprises a synchronous belt.

[0017] Preferably, the first conveying line further comprises a tray separating mechanism arranged at the feeding position, and the tray separating mechanism comprises a first jacking mechanism and a tray separating assembly.

[0018] The first jacking mechanism comprises a first jacking motor and a first jacking plate, and the first jacking motor is used to drive the first jacking plate to move along the Z direction to abut against the stacked to-be-inspected tray at the jacking feeding position.

[0019] The tray separating assembly comprises a plurality of tray separating cylinders, and the tray separating cylinders are used to support the stacked to-be-inspected tray at the feeding position and cooperate with the first jacking mechanism to realize separation of the stacked to-be-inspected tray.

[0020] Preferably, the second conveying line comprises a first stacking mechanism arranged at the first unloading position, and the first stacking mechanism comprises a second jacking mechanism and a first stacking assembly.

[0021] The second jacking mechanism comprises a second jacking motor and a second jacking plate, and the second jacking motor is used to drive the second jacking plate to move along the Z direction to jack up the tray at the first unloading position.

[0022] The first stacking assembly comprises a plurality of first stacking structures for supporting the trays.

[0023] Preferably, the third conveying line comprises a second stacking mechanism arranged at the second unloading position, and the second stacking mechanism comprises a third jacking mechanism and a second stacking assembly.

[0024] The third jacking mechanism comprises a third jacking motor and a third jacking plate, and the third jacking motor is used to drive the third jacking plate to move along the Z direction to jack up the tray at the second unloading position.

[0025] The second stacking assembly comprises a plurality of second stacking structures for supporting the trays.

[0026] Preferably, at least one pressing plate assembly is arranged on the track of the first conveying line, the second conveying line and the third conveying line, and the pressing plate assembly comprises two pressing plate cylinders and two lower pressing plates arranged opposite along the axis of the corresponding conveying line, and the pressing plate cylinders are used to drive the corresponding lower pressing plate to move along the Z direction to clamp and fix the tray on the corresponding conveying line.

[0027] The transmission mechanism for chip detection and packaging provided in the embodiment of the utility model has the beneficial effects that compared with the prior art, and the beneficial effects are as follows:

[0028] In the utility model, three conveying lines are arranged, and the tray transfer assembly is used to transfer the trays between the three conveying lines, the three conveying lines are respectively used for feeding and unloading good products and defective products, the division of labor is clear, and the efficiency of tray conveying and transfer is higher; in addition, the first conveying line and the third conveying line are each provided with two movement assemblies, when the second movement assembly conveys the tray after detection to the tray taking position, the first movement assembly can simultaneously convey a new tray to be detected to the first detection position, the circulation and conveying efficiency of the tray is higher, when the fifth movement assembly conveys the tray after sorting to the second unloading position, the fourth movement assembly can simultaneously convey a new tray to be sorted to the second transfer position, the bottom side detection, front face detection and sorting of the chip can be simultaneously performed on different conveying lines, and therefore the efficiency of chip detection and sorting is improved. BRIEF DESCRIPTION OF DRAWINGS

[0029] Figure 1 is the perspective view of the utility model;

[0030] Figure 2 is another perspective view of the utility model;

[0031] Figure 3 is the top view of the utility model;

[0032] Figure 4 is the local structure schematic view of the first movement assembly of the utility model;

[0033] Figure 5 is the partial structure schematic view of the third motion assembly and the fifth motion assembly of the utility model;

[0034] Figure 6 is the partial structure schematic view of the second motion assembly and the fourth motion assembly of the utility model;

[0035] Figure 7 is the overall plan view of the utility model.

[0036] In the figure: 1, first conveying line; 11, first motion assembly; 111, first drive motor; 112, first drive structure; 12, second motion assembly; 121, second drive motor; 122, second drive structure; 13, loading position; 14, first detection position; 15, second detection position; 16, tray taking position; 17, tray clamp; 18, first jacking mechanism; 181, first jacking motor; 182, first jacking plate; 19, tray separating assembly; 191, tray separating cylinder;

[0037] 2, second conveying line; 21, third motion assembly; 211, third drive motor; 212, third drive structure; 22, first unloading position; 23, first sorting position; 24, first tray placing position; 25, third detection position; 26, second jacking mechanism; 261, second jacking motor; 262, second jacking plate; 27, first stacking structure;

[0038] 3, third conveying line; 31, fourth motion assembly; 311, fourth drive motor; 312, fourth drive structure; 32, fifth motion assembly; 321, fifth drive motor; 322, fifth drive structure; 33, second unloading position; 34, second sorting position; 35, second tray placing position; 36, fourth detection position; 37, third jacking mechanism; 371, third jacking motor; 372, third jacking plate; 38, second stacking structure;

[0039] 4, pressing plate assembly; 41, pressing plate cylinder; 42, lower pressing plate;

[0040] 5, tray transferring assembly. DETAILED DESCRIPTION

[0041] The specific embodiments of the utility model are described in further detail below in combination with the drawings and examples. The following examples are used to illustrate the utility model, but are not used to limit the scope of the utility model.

[0042] As Figures 1 to 3As shown, the utility model discloses a kind of transmission mechanism for chip detection packaging, it has mutually perpendicular X direction, Y direction and Z direction, including the tray transfer assembly 5 being set along X direction and the first conveying line 1, the second conveying line 2 and the third conveying line 3 being set along Y direction extension, the first conveying line 1 is used to convey to be detected tray, the second conveying line 2 is used to convey to discharge defective product chip tray, the third conveying line 3 is used to convey to discharge good product chip tray;

[0043] The first conveying line 1 includes first motion assembly 11 and second motion assembly 12, first motion assembly 11 is used to sequentially convey to be detected tray from feeding position 13 to first detection position 14 and first handover position, second motion assembly 12 is used to convey to be detected tray from first handover position to second detection position 15 and / or tray taking position 16;

[0044] The second conveying line 2 includes third motion assembly 21, and third motion assembly 21 is used to drive tray to move between first tray placing position 24, first sorting position 23 and first discharging position 22;

[0045] The third conveying line 3 includes fourth motion assembly 31 and fifth motion assembly 32, fourth motion assembly 31 is used to drive tray to move between second tray placing position 35 and second handover position, and fifth motion assembly 32 is used to drive tray to move between second handover position, second sorting position 34 and second discharging position 33;

[0046] Tray transfer assembly 5 is used to transfer tray between tray taking position 16, first tray placing position 24 and second tray placing position 35.

[0047] Specifically, in one embodiment, the chips to be detected are placed in the trays to be detected, and a plurality of trays to be detected are stacked and placed at the feeding position 13 of the first conveying line 1. When the detection starts, the first moving assembly 11 drives a tray to be detected to move along the Y direction to the first detection position 14. At the first detection position 14, the chips in the tray to be detected are taken out to the detection mechanism for detection. When the chips in the tray to be detected are all detected, the first moving assembly 11 continues to convey the tray to the first transfer position and transfers the tray to the second moving assembly 12. The second moving assembly 12 starts to transport the tray to the second detection position 15 and / or the tray taking position 16. According to different detection items, the chips in the tray need to be detected for the second time after being detected in sequence. At this time, the second moving assembly 12 drives the tray to the second detection position 15 to stop. After the second detection, the second moving assembly 12 drives the tray to the tray taking position 16. In other embodiments, the second moving assembly 12 can directly convey the tray to the tray taking position 16. While the second moving assembly 12 conveys the tray, the first moving assembly 11 can also return to the feeding position 13 to clamp and move a new tray to be detected to the first detection position. The two are performed simultaneously, unlike the traditional scheme in which the first moving assembly 11 needs to convey the tray to the tray taking position 16 before returning to the feeding position 13 to take a new tray to be detected. The transfer and conveying efficiency of the tray is higher, and the detection and transfer efficiency of the chips is also improved.

[0048] Subsequently, the tray transfer assembly 5 transfers the tray to the second tray placing position 35 of the third conveying line 3. The fourth moving assembly 31 clamps and drives the tray to move against the Y direction to the second transfer position and transfers the tray to the fifth moving assembly 32. The fifth moving assembly 32 clamps and drives the tray to the second sorting position 34. At the second sorting position 34, the chips are taken out by the sorting mechanism for sorting. According to the detection result, the sorting mechanism takes out the defective chips in the tray and places them in the empty tray at the first sorting position 23 of the second conveying line 2. The good chips are taken out and placed in the ribbon packaging mechanism for packaging, so as to realize the sorting of the good and defective chips. After the empty tray at the first sorting position 23 is full of defective chips, the third moving assembly 21 clamps and drives the tray of defective chips to the first tray stacking position 22. The fifth moving assembly 32 clamps and drives the empty tray to the second tray stacking position 33. While the sorting mechanism sorts the chips in the tray and the fifth moving assembly 32 conveys the empty tray to the second tray stacking position 33, the fourth moving assembly 31 can simultaneously go to the second tray placing position 35 to clamp a new tray to be sorted and drive the new tray to the second transfer position. In addition, during the conveying and transferring of the chip tray, the movement of each moving assembly is independently controlled. When the first moving assembly 11 moves, the second moving assembly 12, the third moving assembly 21, the fourth moving assembly 31 and the fifth moving assembly 32 can also move simultaneously to complete their respective tasks of transferring the tray. The efficiency of the tray circulation is also improved.

[0049] Further, in the case of ribbon packaging of good chips, when the program determines that the second conveying line 2 needs to be supplemented with empty trays for carrying defective chips, the fourth movement assembly 31 is used to clamp and drive the empty tray on the third conveying line 3 at the second transfer position and move to the second tray placing position 35, and then the tray transfer assembly 5 clamps and takes the empty tray to the first tray placing position 24, and the third movement assembly 21 clamps and drives the empty tray at the first tray placing position 24 to the first sorting position 23 for subsequent placement of defective chips. The entire tray circulation efficiency is improved, and the trouble and low efficiency of manual placement of empty trays on the second conveying line 2 are avoided.

[0050] Further, when the good chips are not packaged by the ribbon mechanism, but are packaged by the tray, the sorting mechanism takes out the defective chips and places them in the empty tray on the second conveying line 2, and after the good chips are arranged, the good chip tray on the third conveying line 3 is conveyed to the second unloading position 33 by the fifth movement assembly 32. In this production mode, the second conveying line 2 does not need to be pre-placed with an empty tray, and the tray transfer assembly 5 alternately places the tray from the first conveying line 1 into the second conveying line 2 and the third conveying line 3. When the sorting mechanism performs the sorting action, the good chips on the second conveying line 2 are exchanged with the defective chips on the third conveying line 3, and finally the first unloading position 22 outputs the defective chip tray and the second unloading position 33 outputs the good chip.

[0051] In some embodiments, the tray loading position 13, the first detection position 14, the first transfer position, the second detection position 15, and the tray taking position 16 are sequentially arranged along the Y direction;

[0052] The first unloading position 22, the first sorting position 23, and the first tray placing position 24 are sequentially arranged along the Y direction;

[0053] The second unloading position 33, the second sorting position 34, the second transfer position, and the second tray placing position 35 are sequentially arranged along the Y direction.

[0054] Further, the second conveying line 2 is provided with a third detection position 25, and the third detection position 25 is arranged between the first tray placing position 24 and the first sorting position 23. The third conveying line 3 is provided with a fourth detection position 36, and the fourth detection position 36 is arranged between the second tray placing position 35 and the second transfer position.

[0055] Further, the first detection position 14 is used for cooperating with the detection mechanism and the material taking mechanism to detect the bottom surface and / or the side surface of the chip, and the second detection position 15, the third detection position 25, and the fourth detection position 36 are used for cooperating with the detection mechanism to detect the front surface of the chip.

[0056] Specifically, according to different requirements of different chip detection projects, the chip front surface, side surface and top surface can be selectively detected. In the first detection position 14, the tray is fixed, and the gripper can grab the chip to the detection mechanism to detect the bottom surface and side surface of the chip. The second detection position 15, the third detection position 25 and the fourth detection position 36 are used for cooperating with the detection mechanism to detect the front surface of the chip. The difference lies in that the second detection position 15, the third detection position 25 and the fourth detection position 36 are respectively located on the first conveying line 1, the second conveying line 2 and the third conveying line 3. According to the actual process in the transmission and detection process, the chip in the tray can be fixed at any one of the second detection position 15, the third detection position 25 and the fourth detection position 36 for detection. The detection of the front surface of the chip is more flexible and variable, and can also meet the transmission requirements of each tray on the conveying line, thereby improving the efficiency of the conveying and circulation of the tray.

[0057] In some embodiments, the first movement assembly 11, the second movement assembly 12, the third movement assembly 21, the fourth movement assembly 31 and the fifth movement assembly 32 each include a driving motor, a driving structure and a tray clamp 17. The driving motor drives the tray clamp 17 to move back and forth along the Y direction through the driving structure. The driving structure includes a synchronous belt.

[0058] Specifically, the first movement assembly 11 includes a first driving motor 111 and a first driving structure 112, the second movement assembly 12 includes a second driving motor 121 and a second driving structure 122, the third movement assembly 21 includes a third driving motor 211 and a third driving structure 212, the fourth movement assembly 31 includes a fourth driving motor 311 and a fourth driving structure 312, and the fifth movement assembly 32 includes a fifth driving motor 321 and a fifth driving structure 322. Each driving structure includes a synchronous wheel, a synchronous belt, a linear guide rail and a photoelectric sensor. When driving, the driving motor rotates and drives the synchronous belt to rotate through the synchronous wheel. The synchronous belt drives the guide rail slider on the linear guide rail to move along the Y direction. The tray clamp 17 is fixedly installed on the guide rail slider and moves with the guide rail slider. When the tray clamp 17 clamps and fixes the tray through the air cylinder, the tray can be driven to move back and forth along the Y direction.

[0059] In some embodiments, the first conveying line 1 further includes a tray separating mechanism arranged at the feeding position 13. The tray separating mechanism includes a first lifting mechanism 18 and a tray separating assembly 19.

[0060] The first lifting mechanism 18 includes a first lifting motor 181 and a first lifting plate 182. The first lifting motor 181 is used to drive the first lifting plate 182 to move along the Z direction to abut against the stacked trays to be detected at the lifting feeding position 13.

[0061] The sub-pallet assembly 19 comprises a plurality of sub-pallet cylinders 191 for supporting the stacked test pallets at the loading position 13 and cooperating with the first lifting mechanism 18 to realize the separation of the stacked test pallets.

[0062] Specifically, in one specific embodiment, four sub-pallet cylinders 191 are arranged at four corners of the loading position 13, and each sub-pallet cylinder 191 is provided with a support rod driven by a cylinder. During the actual sub-pallet process, a plurality of pallets loaded with test chips are stacked on the support rod. When sub-pallet loading is required, the first lifting motor 181 drives the first lifting plate 182 to move upward and contact the lowermost test pallet. Then the sub-pallet cylinder 191 retracts the support rod, and all test pallets are supported by the first lifting plate 182. Then the first lifting motor 181 drives the pallets to move downward by one pallet height, and the sub-pallet cylinder 191 drives the support rod to extend again, thereby separating the lowermost test pallet from the upper stacked pallets. The first lifting plate 182 continues to move downward to place the lowermost test pallet on the track, and then the pallet clamp 17 on the first movement assembly 11 clamps the test pallet to move the test pallet.

[0063] Further, the second conveying line 2 comprises a first stacking mechanism arranged at the first unloading position 22, and the first stacking mechanism comprises a second lifting mechanism 26 and a first stacking assembly. The second lifting mechanism 26 comprises a second lifting motor 261 and a second lifting plate 262, and the second lifting motor 261 is used to drive the second lifting plate 262 to move along the Z direction to lift the pallet at the first unloading position 22. The first stacking assembly comprises a plurality of first stacking structures 27, and each first stacking structure 27 is used to support a different support point of the stacked pallets at the first unloading position 22.

[0064] Further, the third conveying line 3 comprises a second stacking mechanism arranged at the second unloading position 33, and the second stacking mechanism comprises a third lifting mechanism 37 and a second stacking assembly. The third lifting mechanism 37 comprises a third lifting motor 371 and a third lifting plate 372, and the third lifting motor 371 is used to drive the third lifting plate 372 to move along the Z direction to lift the pallet at the second unloading position 33. The second stacking assembly comprises a plurality of second stacking structures 38 for supporting the pallets, and each second stacking structure 38 is used to support a different support point of the stacked pallets at the second unloading position 33. The specific structure of the second stacking structure 38 is the same as that of the first stacking structure 27, and both can stably support the pallets.

[0065] Specifically, the first and second stacking assemblies have the same structure, each including a base and a turnover support rod arranged on the base, wherein the turnover axis of the turnover support rod is parallel to the Y direction, and the turnover support rod can only be turned upward around the turnover axis, and the turning angle is less than 90 degrees. When the tray stacking is needed, the lifting plate lifts the tray and drives the turnover support rod to rotate, so that the tray is stacked with the original tray, and then the lifting plate moves downward, and the turnover support rod is reset under the action of the torsional spring, the lifting plate continues to descend, and the stacked tray is blocked and supported by the turnover support rod, so that the continuous stacking of the tray is realized.

[0066] In addition, the first lifting motor 181, the second lifting motor 261 and the third lifting motor 371 are all lead screw motors, which drive the lifting plate to move along the Z direction. The first lifting plate 182, the second lifting plate 262 and the third lifting plate 372 are all U-shaped structures, which can contact and lift the tray along the two side edges in the Y direction.

[0067] Furthermore, in some embodiments, the first stacking mechanism, the second stacking mechanism and the tray separating mechanism are each provided with a limiting rod for limiting the stacked tray, and the top of the limiting rod is provided with a limiting sensor for sensing the height of the stacked tray, so as to facilitate the issuance of a warning and the handling of the staff.

[0068] In some embodiments, at least one pressing plate assembly 4 is arranged on the track of the first conveying line 1, the second conveying line 2 and the third conveying line 3. The pressing plate assembly 4 includes two pressing plate cylinders 41 and two lower pressing plates 42 arranged opposite along the axis of the corresponding conveying line. The pressing plate cylinder 41 is used to drive the corresponding lower pressing plate 42 to move along the Z direction to clamp and fix the tray on the corresponding conveying line. Specifically, the pressing plate assembly 4 is used to fix the tray at a specific position on the conveying line, so as to avoid the vibration or displacement of the tray during detection or sorting, so that the mechanical hand in the sorting mechanism and other mechanisms can accurately and stably take the chip from the tray. The lower pressing plate 42 can also flatten the deformed tray, so as to facilitate the photographing detection of the vision system in the detection mechanism, and facilitate the suction of the chip by the mechanical hand in the sorting mechanism and the detection mechanism, thereby facilitating the smooth progress of the tray detection work and the sorting work.

[0069] In conclusion, the utility model embodiment provides a kind of transmission mechanism for chip detection packaging, it is provided with three conveying lines, and it is transferred tray between three conveying lines by tray transfer assembly 5, three conveying lines are respectively used for feeding and discharging good product and defective product, division of labor is clear, and the efficiency of tray conveying transfer is higher;In addition, two movement components are provided in first conveying line 1 and third conveying line 3, when second movement component 12 is conveyed after detection tray to tray position 16, first movement component 11 can simultaneously convey new to-be-inspected tray to first detection position 14, and the efficiency of circulation and conveying of tray is higher, and when fifth movement component 32 conveys the tray after sorting to second discharge position 33, fourth movement component 31 can simultaneously convey new to-be-sorted tray to second handover position, and the efficiency of circulation and conveying of tray is also improved, so that the pace of tray transfer in the whole process is better, can adapt to more variable situation, more practical.

[0070] The above is only the preferred embodiment of the utility model, and it should be pointed out that, for ordinary skilled person in the art, without departing from the technical principle of the utility model, a number of improvements and substitutions can be made, and these improvements and substitutions should also be regarded as the protection scope of the utility model.

Claims

1. A transmission mechanism for chip inspection and packaging, having mutually perpendicular X, Y, and Z directions, characterized in that, The tray transfer assembly is arranged along the X direction, and the first conveying line, the second conveying line and the third conveying line are arranged along the Y direction, the first conveying line is used for conveying the to-be-inspected trays, the second conveying line is used for conveying the tray of the defective chips, and the third conveying line is used for conveying the tray of the good chips; The first conveying line comprises a first movement assembly and a second movement assembly, the first movement assembly is used for sequentially conveying the to-be-inspected trays from the feeding position to the first detection position and the first transfer position, and the second movement assembly is used for conveying the to-be-inspected trays from the first transfer position to the second detection position and / or the tray taking position; The second conveying line comprises a third movement assembly, and the third movement assembly is used for driving the tray to move between the first tray placing position, the first sorting position and the first unloading position; The third conveying line comprises a fourth movement assembly and a fifth movement assembly, the fourth movement assembly is used for driving the tray to move between the second tray placing position and the second transfer position, and the fifth movement assembly is used for driving the tray to move between the second transfer position, the second sorting position and the second unloading position; The tray transfer assembly is used for transferring the tray between the tray taking position, the first tray placing position and the second tray placing position.

2. The chip inspection packaging transport mechanism according to claim 1, wherein The feeding position, the first detection position, the first transfer position, the second detection position and the tray taking position are sequentially arranged along the Y direction; The first unloading position, the first sorting position and the first tray placing position are sequentially arranged along the Y direction; The second unloading position, the second sorting position, the second transfer position and the second tray placing position are sequentially arranged along the Y direction.

3. The chip testing packaging transport mechanism according to claim 2, wherein, The third detection position is arranged on the second conveying line and located between the first tray placing position and the first sorting position.

4. The chip testing packaging transport mechanism according to claim 3, wherein, The fourth detection position is arranged on the third conveying line and located between the second tray placing position and the second transfer position.

5. The chip testing packaging transport mechanism according to claim 4, wherein, The first detection position is used for cooperating with a detection mechanism and a material taking mechanism to detect the bottom surface and / or the side surface of the chip, and the second detection position, the third detection position and the fourth detection position are used for cooperating with the detection mechanism to detect the front surface of the chip.

6. The chip detection and packaging conveying mechanism according to claim 1, wherein The first movement assembly, the second movement assembly, the third movement assembly, the fourth movement assembly and the fifth movement assembly each comprise a driving motor, a driving structure and a tray clamp, the driving motor drives the tray clamp to move back and forth along the Y direction through the driving structure; The driving structure comprises a synchronous belt.

7. The chip testing packaging transport mechanism according to claim 1, wherein, The first conveying line further comprises a tray separating mechanism arranged at the feeding position, and the tray separating mechanism comprises a first lifting mechanism and a tray separating assembly; The first lifting mechanism comprises a first lifting motor and a first lifting plate, the first lifting motor is used for driving the first lifting plate to move along the Z direction to abut against the stacked to-be-inspected trays at the feeding position; The tray separating assembly comprises a plurality of tray separating cylinders, the tray separating cylinders are used for supporting the stacked to-be-inspected trays at the feeding position and cooperating with the first lifting mechanism to separate the stacked to-be-inspected trays.

8. The chip testing packaging transport mechanism according to claim 1, wherein, The second conveying line comprises a first stacking mechanism arranged at the first unloading position, and the first stacking mechanism comprises a second lifting mechanism and a first stacking assembly; The second jacking mechanism comprises a second jacking motor and a second jacking plate, and the second jacking motor is used to drive the second jacking plate to move along the Z direction to jack up the tray at the first unloading position. The first stacking assembly comprises a plurality of first stacking structures for supporting the tray.

9. The chip testing packaging transport mechanism according to claim 1, wherein, The third conveying line comprises a second stacking mechanism arranged at the second unloading position, and the second stacking mechanism comprises a third jacking mechanism and a second stacking assembly. The third jacking mechanism comprises a third jacking motor and a third jacking plate, and the third jacking motor is used to drive the third jacking plate to move along the Z direction to jack up the tray at the second unloading position. The second stacking assembly comprises a plurality of second stacking structures for supporting the tray.

10. The chip testing packaging transport mechanism according to claim 1, wherein, At least one pressing plate assembly is arranged on the track of the first conveying line, the second conveying line and the third conveying line, and the pressing plate assembly comprises two pressing plate cylinders and two lower pressing plates arranged oppositely along the axis of the corresponding conveying line, and the pressing plate cylinder is used to drive the corresponding lower pressing plate to move along the Z direction to clamp and fix the tray on the corresponding conveying line.

Images