Stamping die for manufacturing semiconductor lead frame

Abstract

The utility model relates to the technical field of stamping dies, and discloses a stamping die for manufacturing a semiconductor lead frame, which comprises a support table, the top of the support table is fixedly connected with a support frame, the top of the support frame is provided with a hydraulic cylinder, and the output end of the hydraulic cylinder is fixedly connected with a connecting plate. The connecting plate is connected with an upper die through a connecting mechanism, the connecting mechanism is used for connecting the connecting plate with the upper die, the top of the supporting table is fixedly connected with a lower die, the lower die is located under the upper die, the top of the supporting table is fixedly connected with a discharging plate, and the discharging plate is connected with the lower die. According to the semiconductor lead frame cooling device, cooling liquid circularly flows in the coiled pipe, heat is automatically absorbed, the stable and continuous cooling effect is guaranteed, the fan and the concentration box are matched to provide air cooling, the cooling process is further accelerated, cold air is sent to the air collection cover through the air outlet pipe, and it is guaranteed that the semiconductor lead frame on the discharging plate is rapidly cooled.

Description

Technical Field

[0001] This utility model relates to the field of stamping die technology, and in particular to a stamping die for manufacturing semiconductor lead frames. Background Technology

[0002] As a key component of semiconductor packaging, the semiconductor leadframe acts as a bridge connecting the chip to external circuits, significantly impacting the chip's electrical performance, heat dissipation, and mechanical stability. With the continuous trend towards miniaturization and high performance in modern electronic devices, higher demands are placed on the precision, quality, and production efficiency of semiconductor leadframes.

[0003] In the manufacturing process of semiconductor leadframes, stamping dies are crucial tools for shaping them. Stamping dies can precisely process metal sheets into leadframes of specific shapes and sizes through pressure processing, meeting the needs of different chip packages.

[0004] Existing stamping dies for semiconductor leadframe manufacturing typically rely on a single air-cooling or water-cooling method, which makes it difficult to quickly cope with high-temperature, high-load production environments while ensuring cooling efficiency. In this situation, the cooling efficiency of the die directly affects the cooling time of the semiconductor leadframe, thereby extending the production cycle and impacting overall production efficiency.

[0005] To address this problem, a stamping die for manufacturing semiconductor lead frames is proposed. Utility Model Content

[0006] To overcome the above shortcomings, this utility model provides a stamping die for manufacturing semiconductor lead frames, aiming to improve the problem that existing stamping dies for manufacturing semiconductor lead frames usually rely on a single air cooling or water cooling method, which makes it difficult to quickly cope with high-temperature and high-load production environments, thereby affecting cooling efficiency, prolonging cooling time, slowing down the production cycle, and reducing overall production efficiency.

[0007] To achieve the above objectives, the present invention adopts the following technical solution: a stamping die for manufacturing semiconductor lead frames, comprising a support platform, a support frame fixedly connected to the top of the support platform, a hydraulic cylinder mounted on the top of the support frame, a connecting plate fixedly connected to the output end of the hydraulic cylinder, an upper die connected to the connecting plate via a connecting mechanism, the connecting mechanism being used to connect the connecting plate and the upper die, a lower die fixedly connected to the top of the support platform, the lower die being located directly below the upper die, a discharge plate fixedly connected to the top of the support platform, the discharge plate being connected to the lower die, a fixing frame fixedly connected to the bottom of the support platform, and a cooling mechanism provided on the top of the fixing frame, the cooling mechanism being used to cool the stamped semiconductor lead frame.

[0008] As a further description of the above technical solution:

[0009] The connecting mechanism includes two fixed shells, which are respectively fixedly connected to the outer sides of the connecting plate. Two movable plates are slidably connected to the inner walls of the fixed shells. A spring is fixedly connected to the adjacent ends of the two movable plates, and the spring is fixedly connected to the inner wall of the fixed shell. A pin is fixedly connected to the distant ends of the two movable plates. Four fixed plates are fixedly connected to the top of the upper mold. The fixed plates have insertion holes, and the pins are inserted into the insertion holes.

[0010] As a further description of the above technical solution:

[0011] Two sliding plates are fixedly connected to the outer side of the movable plate. The sliding plates are slidably connected to the inner wall of the fixed shell, and the outer side of the sliding plates is provided with anti-slip texture.

[0012] As a further description of the above technical solution:

[0013] The connecting mechanism also includes two connecting plates, which are fixedly connected to the outer sides of the connecting plate respectively, and the connecting plates are connected to the upper mold by fasteners.

[0014] As a further description of the above technical solution:

[0015] The cooling mechanism includes a semiconductor refrigeration box, which is mounted on top of a fixed frame. A central storage box is fixedly connected to the top of the fixed frame, and a circulating pump is also fixedly connected to the top of the fixed frame. The water outlet of the fixed frame is connected to a serpentine pipe via a connecting pipe one. The end of the serpentine pipe away from the connecting pipe one is fixedly connected to the input end of the circulating pump. The output end of the circulating pump is fixedly connected to the water inlet of the semiconductor refrigeration box via a connecting pipe two. A connecting pipe is connected to the side of the central storage box away from the semiconductor refrigeration box. A fan is fixedly connected to the end of the connecting pipe away from the central storage box. The fan is connected to an air collecting hood via an air outlet pipe. The air collecting hood is fixedly connected to the inner wall of the support platform and is located at the bottom of the discharge plate.

[0016] As a further description of the above technical solution:

[0017] The central box has several through holes on the side away from the connecting pipe.

[0018] As a further description of the above technical solution:

[0019] Guide rods are fixedly connected to the bottom four corners of the upper mold, and guide grooves are opened at the top four corners of the lower mold. The guide rods are inserted into the guide grooves.

[0020] As a further description of the above technical solution:

[0021] An electric push rod is installed on the top of the support platform, and a push plate is fixedly connected to the output end of the electric push rod. The push plate is slidably connected to the lower mold.

[0022] This utility model has the following beneficial effects:

[0023] 1. In this invention, coolant circulates within a serpentine tube, automatically absorbing heat to ensure stable and continuous cooling. A fan and a central cooling unit work together to provide air cooling, further accelerating the cooling process. Cool air is delivered to the air collector hood through an outlet duct, ensuring rapid cooling of the semiconductor lead frame on the discharge plate. The central cooling unit exchanges air with the outside environment through through-holes, automatically replenishing external air. This design shortens the cooling cycle of the formed semiconductor lead frame, improves the overall efficiency of the production line, and accelerates the production pace.

[0024] 2. In this utility model, the initial connection and positioning of the upper mold and the connecting plate are achieved through the automatic cooperation of the insert post and the insertion hole. The insert post automatically compresses the spring and inserts into the insertion hole under the action of the inclined plane, simplifying the operation process and reducing manual intervention. Finally, fasteners ensure the stability of the connection. The operation is simple, efficient, and ensures the reliability of the connection. Attached Figure Description

[0025] Figure 1 This is a perspective view of a stamping die for manufacturing semiconductor lead frames according to the present invention.

[0026] Figure 2 This is a schematic diagram of the fixing frame structure of a stamping die for manufacturing semiconductor lead frames according to the present invention.

[0027] Figure 3 This invention provides a schematic diagram of a connecting plate structure for a stamping die used in the manufacture of semiconductor lead frames.

[0028] Figure 4 This is a schematic diagram of the fastener structure of a stamping die for manufacturing semiconductor lead frames according to this utility model.

[0029] Figure 5 This is a schematic diagram of the fixed shell structure of a stamping die for manufacturing semiconductor lead frames according to this utility model.

[0030] Figure 6 This is a schematic diagram of the structure of a stamping die for manufacturing semiconductor lead frames according to the present invention.

[0031] Legend:

[0032] 1. Support platform; 2. Support frame; 3. Hydraulic cylinder; 4. Connecting plate; 5. Upper mold; 501. Guide rod; 6. Connecting mechanism; 601. Fixed shell; 602. Movable plate; 603. Insert post; 604. Spring; 605. Slide plate; 606. Fixed plate; 607. Insertion hole; 608. Fastener; 609. Connecting plate; 7. Lower mold; 701. Guide groove; 8. Electric push rod; 801. Push plate; 9. Fixed frame; 10. Cooling mechanism; 1001. Semiconductor refrigeration box; 1002. Circulating pump; 1003. Connecting pipe one; 1004. Serpentine pipe; 1005. Connecting pipe two; 1006. Connecting pipe; 1007. Fan; 1008. Air outlet pipe; 1009. Air collection hood; 1010. Centralized box; 1011. Through hole; 11. Discharge plate. Detailed Implementation

[0033] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0034] Reference Figures 1-6 The present invention provides an embodiment of a stamping die for manufacturing semiconductor lead frames, comprising a support platform 1, a support frame 2 fixedly connected to the top of the support platform 1, a hydraulic cylinder 3 mounted on the top of the support frame 2, a connecting plate 4 fixedly connected to the output end of the hydraulic cylinder 3, an upper die 5 connected to the connecting plate 4 via a connecting mechanism 6, the connecting mechanism 6 being used to connect the connecting plate 4 and the upper die 5, a lower die 7 fixedly connected to the top of the support platform 1, the lower die 7 being located directly below the upper die 5, a discharge plate 11 fixedly connected to the top of the support platform 1, the discharge plate 11 being connected to the lower die 7, a fixing frame 9 fixedly connected to the bottom of the support platform 1, a cooling mechanism 10 provided on the top of the fixing frame 9, the cooling mechanism 10 being used to cool the stamped semiconductor lead frame.

[0035] Specifically, the support platform 1 and the support frame 2 work together to provide stable support, ensuring that the output end connecting plate 4 of the hydraulic cylinder 3 can work stably. The hydraulic cylinder 3 and the connecting plate 4 work together to drive the upper die 5 to move up and down, ensuring that the stamping process of the semiconductor lead frame is efficient and precise. The connecting mechanism 6 realizes a simple, efficient and reliable connection between the upper die 5 and the connecting plate 4, which facilitates the installation and replacement of the mold and helps to improve the mold maintenance efficiency in the production process. The lower die 7 works with the support platform 1 and is located below the upper die 5 to ensure stable support of the raw material during the forming process. The ejector plate 11 works with the lower die 7 to effectively eject the stamped semiconductor lead frame, improving production efficiency.

[0036] Reference Figure 3 , Figure 4 and Figure 5 The connecting mechanism 6 includes two fixed shells 601, which are fixedly connected to the outer sides of the connecting plate 4 respectively. Two movable plates 602 are slidably connected to the inner walls of the fixed shells 601. Springs 604 are fixedly connected to the near ends of the two movable plates 602, and springs 604 are fixedly connected to the inner walls of the fixed shells 601. Insert pins 603 are fixedly connected to the far ends of the two movable plates 602. Four fixed plates 606 are fixedly connected to the top of the upper mold 5. The fixed plates 606 have insertion holes 607, and the insertion pins 603 are inserted into the insertion holes 607. Two sliding plates 605 are fixedly connected to the outer sides of the movable plates 602. The sliding plates 605 are slidably connected to the inner walls of the fixed shells 601, and anti-slip textures are provided on the outer sides of the sliding plates 605.

[0037] Specifically, the fixed housing 601 provides a stable installation and movement space for the movable plate 602, spring 604, insert post 603, and sliding plate 605. During the installation of the upper mold 5, the fixed plate 606 on top of the upper mold 5 contacts the insert post 603 and pushes it to move. The insert post 603 causes the movable plate 602 to slide within the fixed housing 601. At this time, the spring 604 is compressed, generating elastic potential energy, causing the movable plate 602 to move, which in turn moves the insert post 603. When the insert post 603 moves to align with the insertion hole 607 on the fixed plate 606, the spring 604 releases its elastic potential energy, pushing the insert post 603 into the insertion hole 607. This achieves a convenient and quick initial positioning connection between the upper mold 5 and the connecting plate 4, simplifying the installation process, reducing the complexity of manual calibration, and improving connection efficiency. The sliding plate 605, fixed to the outside of the movable plate 602, slides on the inner wall of the fixed housing 601. Its anti-slip texture increases friction, facilitating the disassembly of the upper mold 5.

[0038] Reference Figure 3 and Figure 4The connecting mechanism 6 also includes two connecting plates 609, which are fixedly connected to the outer sides of the connecting plate 4 respectively. The connecting plate 4 is connected to the upper mold 5 by fasteners 608.

[0039] Specifically, the connecting plate 609 provides the mounting base for the fastener 608 and mates with it. After the initial positioning and connection between the upper mold 5 and the connecting plate 4 via the insert 603 and the insertion hole 607, the fastener 608 passes through the connecting plate 609 and is fastened to the upper mold 5. The connecting plates 609 are distributed on both sides of the outer side of the connecting plate 4, which can evenly transmit the fastening force between the connecting plate 4 and the upper mold 5. This achieves a stable and reliable final connection between the upper mold 5 and the connecting plate 4. The fastener 608 consists of bolts and nuts.

[0040] Reference Figure 1 , Figure 2 and Figure 6 The cooling mechanism 10 includes a semiconductor refrigeration box 1001, which is mounted on top of a fixed frame 9. A central box 1010 is fixedly connected to the top of the fixed frame 9, and a circulation pump 1002 is also fixedly connected to the top of the fixed frame 9. The outlet of the fixed frame 9 is connected to a serpentine pipe 1004 via a connecting pipe 1003. The end of the serpentine pipe 1004 away from the connecting pipe 1003 is fixedly connected to the input end of the circulation pump 1002. The output end of the circulation pump 1002 is connected to the semiconductor refrigeration box 1002 via a connecting pipe 21005. The water inlet of the box 1001 is fixedly connected. The side of the centralized box 1010 away from the semiconductor refrigeration box 1001 is connected to the connecting pipe 1006. The end of the connecting pipe 1006 away from the centralized box 1010 is fixedly connected to the fan 1007. The fan 1007 is connected to the air collecting hood 1009 through the air outlet pipe 1008. The air collecting hood 1009 is fixedly connected to the inner wall of the support platform 1. The air collecting hood 1009 is located at the bottom of the discharge plate 11. Several through holes 1011 are opened on the side of the centralized box 1010 away from the connecting pipe 1006.

[0041] Specifically, a stable cold source is provided by a semiconductor cooling box 1001, which works in conjunction with a circulating pump 1002, connecting pipe one 1003, connecting pipe two 1005, and a serpentine tube 1004. After cooling by the semiconductor cooling box 1001, the coolant is transported to the serpentine tube 1004 via connecting pipe one 1003. Due to its large surface area, the serpentine tube 1004 allows the coolant to fully absorb heat from the surrounding environment as it circulates. The coolant, carrying heat, then returns to the circulating pump 1002 and then back to the semiconductor cooling box 1001 via connecting pipe two 1005 for recooling, thus forming a stable coolant circulation system that continuously provides cooling capacity for the cooling process. Simultaneously, a central box 1010 serves as a storage and exchange space for cold air, working in conjunction with a connecting pipe 1006, a fan 1007, an air outlet duct 1008, and an air collector shroud 1009. After the fan 1007 starts, it draws cold air from the central cooling box 1010 through the connecting pipe 1006. This cold air is then efficiently transported to the air collection hood 1009 through the air outlet pipe 1008, achieving air cooling. The central cooling box 1010, through several through holes 1011 on its side away from the connecting pipe 1006, naturally exchanges air with the outside air, automatically replenishing it with fresh cold air to ensure that there is always sufficient cold air in the central cooling box 1010 for air cooling.

[0042] Reference Figure 3 Guide rods 501 are fixedly connected to the bottom four corners of the upper mold 5, and guide grooves 701 are opened at the top four corners of the lower mold 7. The guide rods 501 and guide grooves 701 are inserted and matched.

[0043] Specifically, guide rods 501 fixed at the four corners of the bottom of the upper die 5 cooperate with guide grooves 701 opened at the four corners of the top of the lower die 7. During the stamping process, when the hydraulic cylinder 3 drives the upper die 5 downward, the guide rods 501 move towards the guide grooves 701 and insert into them. As the upper die 5 continues to descend, the guide rods 501 slide along a predetermined path within the guide grooves 701. Because the guide rods 501 and guide grooves 701 are distributed at the four corners of the die, this uniform layout ensures that the upper die 5 receives uniform and stable guidance throughout the descent.

[0044] Reference Figure 1 and Figure 2 An electric push rod 8 is installed on the top of the support platform 1. The output end of the electric push rod 8 is fixedly connected to a push plate 801, and the push plate 801 is slidably connected to the lower mold 7.

[0045] Specifically, an electric push rod 8 mounted on the top of the support platform 1 works in conjunction with the push plate 801 and the lower die 7. After the semiconductor lead frame is stamped, the electric push rod 8 receives a start command and begins to work, pushing the push plate 801. This achieves automatic unloading of the stamped product. Compared to manual unloading, this significantly reduces labor input and manual operation time.

[0046] Working Principle: The hydraulic cylinder 3 is activated, causing the connecting plate 4 to move downwards. Since the connecting plate 4 is connected to the upper mold 5 via the connecting mechanism 6, the upper mold 5 descends accordingly. Simultaneously, the guide rods 501 at the four corners of the bottom of the upper mold 5 insert into the guide grooves 701 at the four corners of the top of the lower mold 7, ensuring the stability and accuracy of the upper mold 5's descent. When the upper mold 5 contacts the lower mold 7, it stamps the material on the lower mold 7, completing the stamping of the semiconductor lead frame. Subsequently, the hydraulic cylinder 3 drives the upper mold 5 to rise and reset. After stamping is completed, the electric push rod 8 is activated, and its output pushes the push plate 801. The push plate 801 slides along the lower mold 7, pushing the formed semiconductor lead frame from the lower mold 7 onto the discharge plate 11 for subsequent processing stages.

[0047] As the formed semiconductor lead frame slides on the discharge plate 11, the semiconductor cooling box 1001 cools it. Connecting pipe 1003 delivers coolant to the serpentine tube 1004. The coolant flows within the serpentine tube 1004, absorbing heat before returning to the circulation pump 1002. Under the action of the circulation pump 1002, the coolant then enters the semiconductor cooling box 1001 through connecting pipe 2 1005. Simultaneously, the fan 1007 starts, drawing cold air from the central cooling box 1010 through connecting pipe 1006 and sending it to the air collector shroud 1009 through the air outlet 1008, thus providing air cooling to the semiconductor lead frame on the discharge plate 11 and accelerating the cooling process. The central cooling box 1010 exchanges air with the outside environment through the through-hole 1011, replenishing the external air supply.

[0048] By aligning and moving the upper mold 5 with the connecting plate 4, the fixing plate 606 contacts the insertion post 603. Under the action of the inclined surface of the insertion post 603, the insertion post 603 compresses the spring 604. When the insertion post 603 is released to the insertion hole 607, it inserts into the insertion hole 607, achieving the initial connection and positioning between the upper mold 5 and the connecting plate 4. Finally, the connecting plate 4 and the upper mold 5 are further secured together by the fastener 608 to ensure the stability of the connection.

[0049] Finally, it should be noted that the above are merely preferred embodiments of the present utility model and are not intended to limit the present utility model. Although the present utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A stamping die for semiconductor lead frame manufacturing comprising a support table (1), characterized in that: The top of the support table (1) is fixedly connected with a support frame (2), the top of the support frame (2) is provided with a hydraulic cylinder (3), the output end of the hydraulic cylinder (3) is fixedly connected with a connecting plate (4), the connecting plate (4) is connected with an upper die (5) through a connecting mechanism (6), the connecting mechanism (6) is used for connecting the connecting plate (4) and the upper die (5), the top of the support table (1) is fixedly connected with a lower die (7), the lower die (7) is located directly below the upper die (5), the top of the support table (1) is fixedly connected with a discharge plate (11), the discharge plate (11) is connected with the lower die (7), the bottom of the support table (1) is fixedly connected with a fixed frame (9), the top of the fixed frame (9) is provided with a cooling mechanism (10), and the cooling mechanism (10) is used for cooling the punched semiconductor lead frame.

2. The stamping die for manufacturing a semiconductor lead frame according to claim 1, wherein: The connecting mechanism (6) comprises two fixed shells (601), the two fixed shells (601) are fixedly connected on the outer sides of the connecting plate (4), respectively, the inner wall of the fixed shell (601) is slidably connected with two movable plates (602), the proximal end of the two movable plates (602) is fixedly connected with a spring (604), the spring (604) is fixedly connected with the inner wall of the fixed shell (601), the distal end of the two movable plates (602) is fixedly connected with a plug post (603), the top of the upper die (5) is fixedly connected with four fixed plates (606), the fixed plate (606) is provided with a plug hole (607), and the plug post (603) is inserted into the plug hole (607).

3. The stamping die for manufacturing a semiconductor lead frame according to claim 2, wherein: The outer side of the movable plate (602) is fixedly connected with two sliding plates (605), the sliding plate (605) is slidably connected with the inner wall of the fixed shell (601), and the outer side of the sliding plate (605) is provided with anti-skid lines.

4. The stamping die for manufacturing a semiconductor lead frame according to claim 1, wherein: The connecting mechanism (6) further comprises two connecting plates (609), the two connecting plates (609) are fixedly connected on the outer sides of the connecting plate (4), respectively, and the connecting plate (4) is connected with the upper die (5) through a fastener (608).

5. The stamping die for semiconductor lead frame manufacturing according to claim 1, wherein: The cooling mechanism (10) comprises a semiconductor refrigeration box (1001), the top of the fixed frame (9) is fixedly connected with a concentration box (1010), the top of the fixed frame (9) is fixedly connected with a circulating pump (1002), the water outlet end of the fixed frame (9) is communicated with a serpentine pipe (1004) through a connecting pipe one (1003), one end of the serpentine pipe (1004) away from the connecting pipe one (1003) is fixedly connected with the input end of the circulating pump (1002), the output end of the circulating pump (1002) is fixedly connected with the water inlet end of the semiconductor refrigeration box (1001) through a connecting pipe two (1005), one side of the concentration box (1010) away from the semiconductor refrigeration box (1001) is communicated with a connecting pipe (1006), one end of the connecting pipe (1006) away from the concentration box (1010) is fixedly connected with a fan (1007), the fan (1007) is communicated with a wind collecting cover (1009) through an air outlet pipe (1008), the wind collecting cover (1009) is fixedly connected to the inner wall of the support table (1), and the wind collecting cover (1009) is located at the bottom of the discharge plate (11).

6. The stamping die for semiconductor lead frame manufacturing according to claim 5, wherein: A plurality of through holes (1011) are formed in one side of the concentration box (1010) away from the connecting pipe (1006).

7. The stamping die for semiconductor lead frame manufacturing according to claim 1, wherein: The bottom of the upper die (5) is fixedly connected with guide rods (501), and the top of the lower die (7) is provided with guide grooves (701) at four corners.

8. The stamping die for semiconductor lead frame manufacturing according to claim 1, wherein: The top of the support table (1) is provided with an electric push rod (8), and the output end of the electric push rod (8) is fixedly connected with a push plate (801). The top of the support table (1) is provided with an electric push rod (8), and the output end of the electric push rod (8) is fixedly connected with a push plate (801).

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