Diamond laser cutting device

Abstract

The utility model belongs to the technical field of laser cutting, and discloses a diamond laser cutting device which comprises a base, a laser assembly and an air suction piece. The laser assembly is arranged above the base, comprises an emitting part and is used for emitting pulse laser for laser cutting; the air suction part is located on the outer side of the emission part, a plurality of air suction holes are formed in the bottom of the air suction part around the emission part and used for collecting material chippings generated in the cutting process, the air suction part is of a square or circular structure, an air suction channel is formed in the air suction part, an outer connector is fixed to the air suction part and communicated with the interior of the air suction channel, and the outer connector is connected with the air suction channel. The device is used for externally connecting dust collection equipment. The air suction holes formed in the bottom of the air suction part around the emission part can form an effective chipping collecting area, in the laser cutting process, generated diamond chippings can be rapidly sucked into the air suction part, the chippings are prevented from being attached to materials to be cut or a laser assembly, and therefore the cutting effect is improved.

Description

TECHNICAL FIELD

[0001] The utility model belongs to laser cutting technical field, concretely relates to a diamond laser cutting device. BACKGROUND

[0002] Diamond has excellent performance such as very high hardness and abrasion resistance, high chemical stability and high thermal conductivity, is widely used in various fields, in order to meet different purposes, artificial diamond needs to be further processed. At present, laser cutting becomes one of the most commonly used diamond processing methods because of fast speed, high precision and other advantages. However, restricted by technology, there are still certain problems in the process of using laser cutting diamond.

[0003] Through the retrieval, it is found that the announcement number CN221159005U discloses a device for laser cutting diamond, adjusts the free end opposite the fixed end of the processing object to the direction of the laser light collecting part through the adjusting mechanism, adjusts the specified position of the processing object to the specified position that continues to deviate by β degrees compared with the XY plane to process, can save the process of polishing and grinding operation, can save polishing and grinding time, and can prevent diamond crystal from collapsing and crushing in the process of polishing and grinding, and improve production efficiency. However, when the laser beam is focused and irradiated on the diamond, the local area can be rapidly heated, the diamond material is expanded by heat and is sputtered in the form of debris, the diamond debris can be attached to the cutting surface, a pollution layer is formed, and the surface finish and accuracy after processing are affected. UTILITY MODEL CONTENT

[0004] To solve the above technical problems, the utility model provides a diamond laser cutting device, and aims at solving the technical problems that when the laser beam is focused and irradiated on the diamond, the local area can be rapidly heated, the diamond material is expanded by heat and is sputtered in the form of debris, the diamond debris can be attached to the cutting surface, a pollution layer is formed, and the surface finish and accuracy after processing are affected in the prior art to some extent.

[0005] The technical scheme of the utility model is as follows: a diamond laser cutting device, comprising:

[0006] The base is used for placing the cutting material to be cut.

[0007] The laser assembly is arranged above the base and comprises an emission part for focusing laser for laser cutting.

[0008] The air suction member is provided with a plurality of air suction holes around the air suction member, and is used for collecting the material debris generated in the cutting process.

[0009] In some embodiments, the suction member is in a square or circular structure, and the suction member is internally provided with a suction passage, and an external connector is fixed on the suction member and is in communication with the inside of the suction passage, and is used for externally connecting a dust collection device.

[0010] In some embodiments, the mounting plate is arranged above the base and is used for supporting and fixing the laser assembly.

[0011] The laser assembly further comprises a laser emitter and a reflection assembly, and the laser emitter and the reflection assembly are fixedly connected to the mounting plate, the laser emitted by the laser emitter is reflected by the reflection assembly, and is focused by the emitting part and then vertically downwardly irradiates and cuts the cutting surface of the material to be cut.

[0012] In some embodiments, the Z-axis linear module is fixedly connected to the mounting plate, and the output end of the Z-axis linear module is fixedly connected with a fixed frame, and the emitting part is fixed in the fixed frame.

[0013] In some embodiments, the suction member is arranged at the bottom of the fixed frame.

[0014] In some embodiments, the top of the base is fixedly connected with a Y-axis linear module, the output end of the Y-axis linear module is fixedly connected with an X-axis linear module, the output end of the X-axis linear module is fixedly connected with a fixing assembly, and the fixing assembly is used for fixing the material to be cut.

[0015] The one or more technical solutions provided in the embodiments have at least the following technical effects or advantages:

[0016] The plurality of suction holes arranged around the emitting part at the bottom of the suction member can form an effective debris collection area, and the generated diamond debris can be quickly sucked into the inside of the suction member during the laser cutting process, so that the accumulation of the debris in the working area is avoided, and the debris can be collected in time, so that the cutting effect is improved. BRIEF DESCRIPTION OF DRAWINGS

[0017] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed in the embodiment description will be briefly introduced. Obviously, the drawings in the following description are some embodiments of the present application, and other drawings can be obtained by those skilled in the art without creative labor.

[0018] Fig. 1 It is a structural schematic diagram of the present application.

[0019] Fig. 2 It is a partial structural schematic diagram of the present application.

[0020] Fig. 3 This is a bottom view of a partial structure of this utility model.

[0021] In the attached image:

[0022] 1. Base; 2. Mounting plate; 3. Emitter; 4. Suction component; 5. Suction hole; 6. External connector; 7. Laser emitter; 8. Reflection assembly; 9. Z-axis linear module; 10. Fixing frame; 11. Y-axis linear module; 12. X-axis linear module; 13. Fixing assembly. Detailed Implementation

[0023] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of the embodiments. Based on the embodiments of this application, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of this application.

[0024] It should be noted that all directional indications in the embodiments of this application are only used to explain the relative positional relationship and movement of each component in a specific posture. If the specific posture changes, the directional indications will also change accordingly.

[0025] The following disclosure provides many different embodiments or examples for implementing different structures of this application. To simplify the disclosure, specific examples of components and arrangements are described below. Of course, these are merely examples and are not intended to limit the scope of this application. Furthermore, reference numerals and / or reference letters may be repeated in different examples; such repetition is for simplification and clarity and does not in itself indicate a relationship between the various embodiments and / or arrangements discussed.

[0026] Please see Figs. 1-3 A diamond laser cutting device includes a base 1, a laser assembly, and a suction unit 4. The base 1 is used to hold the material to be cut. The laser assembly is disposed above the base 1 and includes an emitting part 3, which is a convex lens used to focus the laser for laser cutting. The suction unit 4 is located outside the emitting part 3, and the bottom of the suction unit 4 is provided with multiple suction holes 5 around the emitting part 3 for collecting material debris generated during the cutting process. The multiple suction holes 5 around the emitting part 3 at the bottom of the suction unit 4 can form an effective debris collection area. During the laser cutting process, the diamond debris generated is quickly sucked into the suction unit 4, thereby avoiding the accumulation of debris in the working area. By collecting the debris in a timely manner, it is possible to prevent debris from adhering to the material to be cut or the laser assembly, thereby improving the cutting effect.

[0027] The suction component 4 has a square or round structure and an internal suction channel. An external connector 6 is fixed to the suction component 4 and is connected to the internal suction channel for connecting an external vacuum cleaner. The vacuum cleaner generates a strong suction force, and the debris generated during laser cutting enters the suction component 4 through the suction hole 5 and is discharged through the suction channel.

[0028] A diamond laser cutting device further includes a mounting plate 2, located above a base 1, for supporting and fixing a laser assembly. The laser assembly also includes a laser emitter 7 and a reflecting assembly 8. The reflecting assembly 8 includes multiple reflectors, which are configured to reflect the laser beam in a predetermined direction. The laser beam can be controlled by adjusting the angle and position of the reflectors. The laser emitter 7 and the reflecting assembly 8 are fixedly connected to the mounting plate 2. The laser emitted by the laser emitter 7 is expanded and reflected by the reflecting assembly 8, focused by the emitting part 3, and then vertically downwards to irradiate and cut the cutting surface of the material to be cut.

[0029] A diamond laser cutting device further includes a Z-axis linear module 9, which is fixedly connected to a mounting plate 2. A fixed frame 10 is fixedly connected to the output end of the Z-axis linear module 9, and the emitting part 3 is fixed inside the fixed frame 10. An air suction component 4 is installed at the bottom of the fixed frame 10. The Z-axis linear module 9 includes a frame, a servo motor is fixedly connected to the top of the frame, a ball screw is fixedly connected to the output end of the servo motor, the ball screw extends into the interior of the frame, a ball nut is fitted on the ball screw, a mounting bracket is fixedly connected to the outer side of the ball nut, the fixed frame 10 is fixedly connected to the mounting bracket, a slider is fixedly connected to the inner side of the mounting bracket, and a slide rail is provided on the outer side of the frame. The slider is slidably connected to the slide rail. By driving the ball screw with the servo motor, the emitting part 3 can move in the Z-axis direction, allowing adjustment of the laser's focal point and improving the laser cutting effect.

[0030] A Y-axis linear module 11 is fixedly connected to the top of the base 11. An X-axis linear module 12 is fixedly connected to the output end of the Y-axis linear module 11. A fixing component 13 is fixedly connected to the output end of the X-axis linear module 12. The fixing component 13 is used to fix the material to be cut, so as to facilitate the adjustment of the position of the material to be cut.

[0031] In some embodiments, the suction element 4 may be disposed on the outside of the fixing component 13 for adsorbing diamond fragments generated during the cutting process.

[0032] It should be noted that the terms “comprising,” “including,” or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such process, method, article, or apparatus.

[0033] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A diamond laser cutting apparatus, characterized by, Include: Base (1) for placing the material to be cut; Laser assembly arranged above the base (1), including an emission part (3) for focusing laser for laser cutting; Suction member (4) with a plurality of suction holes (5) around it for collecting material debris generated during cutting.

2. The diamond laser cutting apparatus of claim 1, wherein, The suction member (4) is in square or circular structure, the suction member (4) is provided with suction channel inside, the suction member (4) is fixed with external connector (6), the external connector (6) is connected with suction channel inside, for external connection of dust collection equipment.

3. The diamond laser cutting apparatus of claim 1, wherein, Also includes a mounting plate (2), the mounting plate (2) is located above the base (1), for supporting and fixing the laser assembly; The laser assembly further comprises a laser emitter (7) and a reflection assembly (8), the laser emitter (7) and the reflection assembly (8) are fixedly connected on the mounting plate (2), the laser emitted by the laser emitter (7) is reflected by the reflection assembly (8) after beam expansion, and then is focused by the emission part (3) and vertically downward to the cutting surface of the material to be cut for irradiation cutting.

4. The diamond laser cutting apparatus of claim 1, wherein, Also includes Z-axis linear module (9), the Z-axis linear module (9) is fixedly connected on the mounting plate (2), the output end of the Z-axis linear module (9) is fixedly connected with the fixed frame (10), and the emission part (3) is fixed in the fixed frame (10).

5. The diamond laser cutting apparatus of claim 4, wherein, The suction member (4) is installed at the bottom of the fixed frame (10).

6. The diamond laser cutting apparatus of claim 1, wherein, The top of the base (1) (1) is fixedly connected with Y-axis linear module (11), the output end of the Y-axis linear module (11) is fixedly connected with X-axis linear module (12), the output end of the X-axis linear module (12) is fixedly connected with fixed assembly (13), and the fixed assembly (13) is used for fixing the material to be cut.

Images