Wafer chamfering device

Abstract

The utility model discloses a wafer chamfering device which comprises a vacuum adsorption table, a machine frame and a grinding machine with a grinding head, the grinding machine is arranged on the machine frame and can move on the machine frame in the Y-axis direction and the Z-axis direction, a rotating shaft of the grinding head is in the vertical Z-axis direction, the vacuum adsorption table is arranged on the machine frame and can rotate and move on the machine frame, and the vacuum adsorption table is arranged on the machine frame and can rotate and move on the machine frame. The rotating shaft is in the vertical Z-axis direction, the displacement is in the X direction, and at least three adsorption stations are arranged on the vacuum adsorption table. According to the polishing machine, the wafer is transversely placed (namely horizontally placed) and is easier to position, the Y-direction displacement and the Z-direction displacement are integrated in the upward space, the large freedom degree of the three-dimensional space of the polishing machine is guaranteed, the gantry frame is arranged at the tail end of one side of the machine frame, more X-direction displacement space is reserved on the machine frame, multiple stations can be conveniently arranged, and the machining efficiency can be better improved.

Description

Technical Field

[0001] This utility model relates to a wafer chamfering device. Background Technology

[0002] When performing batch chamfering on wafers, the first consideration is work efficiency. Existing equipment can generally only process one or two wafers at a time, and the continuity is poor (for example, our company's existing equipment 202322415125.8). Based on this, we are now upgrading and transforming the existing equipment to produce a new wafer chamfering device. Summary of the Invention

[0003] This invention provides a wafer chamfering device to solve the problems existing in the prior art.

[0004] The technical solutions adopted in this utility model are as follows:

[0005] A wafer chamfering device includes a vacuum adsorption stage, a frame, and a polishing machine with a polishing head. The polishing machine is mounted on the frame and can be displaced in the Y and Z axes on the frame. The rotation axis of the polishing head is in the vertical Z axis direction. The vacuum adsorption stage is mounted on the frame and can rotate and displace on the frame. The rotation axis is in the vertical Z axis direction, and the displacement is in the X direction. At least three adsorption stations are provided on the vacuum adsorption stage.

[0006] Furthermore, the frame is equipped with a gantry frame, which is located at one end of the frame. The grinding machine is mounted on the gantry frame and can be displaced in the Y and Z axes.

[0007] Furthermore, the gantry frame is equipped with two mutually perpendicularly arranged lead screw mechanisms for realizing the displacement of the grinding machine in the Y and Z axis directions.

[0008] Furthermore, the frame is provided with a horizontally arranged lead screw structure for driving the vacuum adsorption stage to move in the X direction. A motor and a reduction gearbox are provided at the straight free end of the lead screw structure. The motor shaft is connected to the input end of the reduction gearbox, and a platform is fixed at the output end of the reduction gearbox. The vacuum adsorption stage is fixed to the platform.

[0009] Furthermore, the vacuum adsorption stage includes a base, an adsorption seat, perforated plates, and a gas inlet. The adsorption seat is fixed to the base and has independent flow channels and adsorption chambers. Each flow channel is connected to an adsorption chamber. Several perforated plates are fixed to the adsorption seat, and each perforated plate closes an adsorption chamber. Each perforated plate forms an adsorption station. The upper end face of the perforated plate is higher than the upper end face of the adsorption seat. Each flow channel is connected to a gas inlet.

[0010] Furthermore, a positioning stage is provided on the adsorption seat and on one side of each perforated plate.

[0011] This utility model has the following beneficial effects:

[0012] This application places the wafer horizontally (i.e., horizontally), which makes it easier to position, and integrates the Y and Z displacements into the upward space, ensuring a large degree of freedom in the three-dimensional space of the grinding machine. The gantry is set at one end of the frame, which provides more X displacement space on the frame, making it easier to set up multiple workstations and improve processing efficiency. Attached Figure Description

[0013] Figure 1 This is a structural diagram of the present utility model.

[0014] Figure 2 This is a structural diagram of a vacuum adsorption stage.

[0015] Figure 3 The structural diagram for achieving displacement in the X direction. Detailed Implementation

[0016] The present invention will be further described below with reference to the accompanying drawings.

[0017] like Figures 1 to 3 This utility model discloses a wafer chamfering device, including a vacuum adsorption stage 1, a frame 3, and a polishing machine 2 with a polishing head. The polishing machine 2 is mounted on the frame 3 and can be displaced in the Y and Z axes on the frame. The rotation axis of the polishing head of the polishing machine 2 is the vertical Z axis. The vacuum adsorption stage 1 is mounted on the frame 3 and can rotate and be displaced on the frame. The rotation axis of the vacuum adsorption stage 1 is the vertical Z axis, and the displacement is in the X direction. Four adsorption stations 11 are provided on the vacuum adsorption stage 1.

[0018] The vacuum adsorption stage 1 of this invention includes a base 12, an adsorption seat 13, perforated plates, and a gas inlet 14. The adsorption seat 13 is spaced apart from and parallel to the base 12, and the two are fixed together by guide posts. The spaced arrangement is for the convenience of installing the gas inlet 14. The adsorption seat 13 is provided with independent flow channels and adsorption chambers. The adsorption chambers are located on the upper end surface of the adsorption seat 13, and each flow channel is connected to one adsorption chamber. Four perforated plates are fixed on the upper end surface of the adsorption seat 13, and each perforated plate corresponds to one adsorption chamber. Each perforated plate forms an adsorption station 11, and each flow channel is connected to one gas inlet 14.

[0019] When the wafer is delivered to the adsorption station 11 by the robot arm, in order to facilitate the accurate positioning of the camera, that is, the CCD and the robot arm work together to accurately deliver the wafer to the adsorption station 11 and ensure that the wafers on each adsorption station 11 are in the same position, a positioning stage 10 is provided on the adsorption seat 13 and located on one side of each perforated plate. The positioning stage 10 is used for the positioning of the CCD.

[0020] A gantry frame 31 is mounted on the frame 3, located at one end of the frame 3. The gantry frame 31 has two mutually perpendicularly arranged lead screw mechanisms for realizing the displacement of the grinding machine 2 in the Y and Z axes. A horizontally arranged lead screw structure is mounted on the frame 3 for driving the vacuum adsorption stage 1 to move in the X direction. A motor 41 and a reduction gearbox 42 are located at the straight free end of the lead screw structure. The rotating shaft of the motor 41 is connected to the input end of the reduction gearbox 42, and a platform 43 is fixed to the output end of the reduction gearbox 42. The base 12 in the vacuum adsorption stage 1 is fixed to the platform 43.

[0021] This invention places the gantry frame at one end of the machine frame 3, providing more X-axis displacement space on the machine frame 3 and integrating Y-axis and Z-axis displacements into the upward space, ensuring a large degree of freedom in the three-dimensional space of the grinding machine 2. In use, the vacuum adsorption stage 1 is first moved away from the gantry frame. The robotic arm places the wafers (1-4) to be chamfered and polished onto the vacuum adsorption stage 1. The vacuum adsorption of each adsorption station 11 is individually controlled (i.e., the air inlet 14 is connected to a separate control valve). After the wafers are placed, the vacuum adsorption stage 1 moves closer to the gantry frame. Once it reaches the desired position, the grinding head of the grinding machine 2 is brought close to the wafer at one of the adsorption stations 11 through the cooperation of a CCD and laser sensor. The upper surface of the perforated plate on the adsorption station 11 is higher than the upper surface of the adsorption seat 13, causing the edge of the wafer to be "suspended" above the adsorption seat 13, facilitating the grinding head's polishing of the wafer. It should be noted that during the design process, the size of the perforated plate should not exceed the wafer size, and the outer edge of the wafer should be exposed outside the perforated plate after it is adsorbed. The gap between two adjacent adsorption stations should also be controlled to ensure that the grinding head is positioned between them. When chamfering the wafer at each adsorption station 11, the grinding head moves around the wafer in one circumference. After chamfering is completed at one adsorption station 11, the vacuum adsorption stage 1 rotates to continue chamfering and grinding of the wafer at the next adsorption station 11. Compared to our company's existing equipment (patent CN202322415125.8), this application places the wafer horizontally (i.e., horizontally), making positioning easier, and integrates the Y and Z direction displacements into the upward space, ensuring a large degree of freedom in the three-dimensional space of the grinding machine 2. The gantry is positioned at one end of the frame 3, providing more X-direction displacement space on the frame 3, facilitating the setup of multiple stations and significantly improving processing efficiency.

[0022] The above description is only a preferred embodiment of the present utility model. It should be noted that for those skilled in the art, several improvements can be made without departing from the principle of the present utility model, and these improvements should also be considered within the protection scope of the present utility model.

Claims

1. A wafer chamfering device, comprising a vacuum adsorption table (1), a frame (3) and a grinder (2) with a grinding head, characterized in that: The polishing machine (2) is arranged on the frame (3) and can be displaced in Y and Z axial directions, and the rotation axis of the polishing head is the vertical Z axial direction. The vacuum adsorption table (1) is arranged on the frame (3) and can be rotated and displaced on the frame, the rotation axis is the vertical Z axial direction, and the displacement is the X direction. At least three adsorption stations (11) are arranged on the vacuum adsorption table (1).

2. The wafer beveling device of claim 1, wherein: The frame (3) is provided with a portal frame (31) arranged at one end of the frame (3). The polishing machine (2) is arranged on the portal frame and can be displaced in Y and Z axial directions.

3. The wafer beveling device of claim 2, wherein: The portal frame (31) is provided with two mutually perpendicular screw mechanisms for realizing the displacement of the polishing machine (2) in Y and Z axial directions.

4. The wafer beveling device of claim 1, wherein: A horizontally arranged screw structure is arranged on the frame (3) for driving the vacuum adsorption table (1) to be displaced in the X direction. A motor (41) and a speed reducer (42) are arranged at the linear free end of the screw structure. The rotating shaft of the motor (41) is connected with the input end of the speed reducer (42). The output end of the speed reducer (42) is fixed with a carrier (43). The vacuum adsorption table (1) is fixed with the carrier (43).

5. The wafer beveling device of claim 1, wherein: The vacuum adsorption table (1) comprises a base (12), an adsorption seat (13), a hole plate and a gas connection head (14). The adsorption seat (13) is fixed with the base (12). Independent flow channels and adsorption cavities are arranged on the adsorption seat (13). Each flow channel is connected with one adsorption cavity. A plurality of hole plates are fixed on the adsorption seat (13). Each hole plate corresponds to one adsorption cavity and is closed. Each hole plate forms one adsorption station (11). The upper end surface of the hole plate is higher than the upper end surface of the adsorption seat (13). Each flow channel is connected with one gas connection head (14).

6. The wafer beveling device of claim 5, wherein: A positioning table (10) is arranged on the adsorption seat (13) and located at one side of each hole plate.

Images