Packaging jig of Hall module

Abstract

The utility model discloses a packaging jig of a Hall module, which is characterized in that a Hall integrated circuit board is provided with at least two product through holes which are arranged at intervals, at least one sleeve with internal threads is embedded in a rubber coating layer, so that a mounting hole with threads on the inner wall is formed, at least two positioning through holes are arranged on the outer side surface of a first side plate, and the positioning through holes are matched with the product through holes. A positioning pin is installed in each positioning through hole, the other end of the positioning pin with one end located on the outer side of the first side plate extends into the semi-closed cavity and is used for being embedded into a product through hole in the Hall integrated circuit board, and the outer side of the end, located in the semi-closed cavity, of each positioning pin is sleeved with a gasket. The end face of the other end of the gasket with one end embedded in the first side plate is used for making contact with the surface, facing the first side plate, of the Hall integrated circuit board. According to the utility model, the position precision and stability of the Hall integrated circuit board can be ensured, and the rigidity of the threaded surface is improved, thereby ensuring the stability of the connection structure.

Description

TECHNICAL FIELD

[0001] The utility model relates to hall element processing technical field, especially relate to a kind of packaging fixture of hall module. BACKGROUND

[0002] In some special linear motor module, multiple motors are needed to drive, in order to ensure the stable operation of the linear motor module, the Hall element is needed to compensate the motor. The overall size of the current Hall element is difficult to install for small linear motor, and the deformation of the Hall element will occur due to screw locking during installation. The Hall element uses PU resin potting glue, which is a thick liquid, easy to hang on the wall, and the surface of the glue will sink during the curing process, which affects the overall size and appearance of the Hall element. SUMMARY

[0003] The technical problem to be solved by the utility model is to provide a packaging fixture of hall module, which can ensure the position accuracy and stability of the Hall integrated circuit board, and improve the rigidity of the threaded surface of the Hall module to ensure the stability of the connection structure.

[0004] To solve the above technical problems, the utility model adopts the technical scheme of a packaging fixture of hall module, which comprises: a Hall integrated circuit board and a glue coating layer covering the outer side of the Hall integrated circuit board, the glue coating layer has at least one mounting hole with a threaded inner wall, the Hall integrated circuit board has at least two product through holes spaced apart, and at least one sleeve with an internal thread is embedded in the glue coating layer to form the mounting hole with a threaded inner wall, the glue pouring fixture comprises: a bottom plate arranged horizontally, a first side plate, a second side plate, a third side plate and a fourth side plate arranged vertically and in close contact with the upper surface of the bottom plate, the first side plate, the second side plate, the third side plate and the fourth side plate are arranged in sequence and connected tightly between each other to form a semi-closed cavity for the Hall integrated circuit board.

[0005] The outer side surface of the first side plate is provided with at least two positioning through holes, and a positioning pin is arranged in each of the positioning through holes. One end of the positioning pin is located on the outer side of the first side plate, and the other end of the positioning pin extends into the semi-closed cavity and is used for being embedded into a product through hole on the Hall integrated circuit board. The outer side of the one end of each positioning pin located in the semi-closed cavity is sleeved with a gasket, and the end surface of the other end of the gasket embedded into the first side plate is used for being in contact with the surface of the Hall integrated circuit board facing the first side plate. The inner side surface of the second side plate facing the semi-closed cavity is embedded with at least one internal thread pin sleeve corresponding to the sleeve. One end of the internal thread pin sleeve is connected with the second side plate, and the other end of the internal thread pin sleeve extends into the semi-closed cavity and is arranged in parallel with the second side plate. The fourth side plate arranged in parallel with the second side plate is provided with at least one supporting screw corresponding to the sleeve. The supporting screw passes through the fourth side plate and is in threaded connection with the internal thread pin sleeve in the semi-closed cavity. The sleeve is sleeved on the outer side of the supporting screw and is located between the inner side surface of the fourth side plate facing the semi-closed cavity and the internal thread pin sleeve.

[0006] The further improved scheme in the above technical scheme is as follows:

[0007] 1. In the above scheme, a gasket is sleeved on the outer side of the supporting screw and located between the sleeve and the internal thread pin sleeve.

[0008] 2. In the above scheme, the one end of the internal thread pin sleeve embedded into the second side plate is fixedly connected with the second side plate through a fastening screw embedded into the second side plate.

[0009] 3. In the above scheme, the product through hole, the positioning pin and the gasket on the Hall integrated circuit board are all provided with three.

[0010] 4. In the above scheme, the one end of the gasket has a flange portion extending radially outward, and the flange portion is embedded into the first side plate.

[0011] Due to the use of the above technical scheme, the utility model has the following advantages compared with the prior art:

[0012] The utility model discloses a packaging jig of hall module, its hall integrated circuit board has at least 2 interval product through -hole, the outside surface of first side plate is provided with at least 2 positioning through -hole, every positioning through -hole is installed with a positioning pin, and the other end of the positioning pin of one end located first side plate outside extends to the semi -closed cavity and is used for embedding the product through -hole on the hall integrated circuit board, and the outside of every positioning pin one end located semi -closed cavity is all equipped with a washer, and the end face of the washer of one end embedding installation in first side plate is used for with the surface of hall integrated circuit board towards first side plate contact, can realize the rubber coating of hall module through simple structure and guarantee the size accuracy and the aesthetic property of product after rubber coating, can guarantee the position accuracy and stability of hall integrated circuit board, avoid its to be impacted by pouring glue and produce position deflection, deviation, can also form the interval between hall integrated circuit board and external rubber coating surface to guarantee the integrity of rubber coating, guarantee the stability of interval and facilitate demoulding operation simultaneously, still, at least one sleeve with internal thread is embedded in its rubber coating layer, thereby forming the mounting hole with the thread of inner wall, and at least one internal thread pin sleeve corresponding with the sleeve is embedded and installed on the inside surface of second side plate towards semi -closed cavity, and the other end of internal thread pin sleeve of one end with second side plate connects extends to semi -closed cavity, and at least one support screw corresponding with the sleeve is installed on the fourth side plate with second side plate parallel opposite setting, and support screw passes through fourth side plate and is with internal thread pin sleeve in semi -closed cavity screw connection, and the sleeve is equipped with on the outside of support screw and is located between the inside surface of fourth side plate towards semi -closed cavity and internal thread pin sleeve, form the threaded hole through the way of embedding sleeve and form the countersunk hole outside threaded hole to facilitate the connection of hall module, replace the mode of setting threaded hole on rubber coating layer directly, simplify the processing technology, improve the rigidity of threaded surface to guarantee the stability of connecting structure. BRIEF DESCRIPTION OF DRAWINGS

[0013] ATTACHMENT Figure 1 It is the structure schematic diagram of hall module;

[0014] ATTACHMENT Figure 2 It is the structure sectional view of hall module;

[0015] ATTACHMENT Figure 3 It is the structure schematic diagram of packaging jig of hall module of the utility model under one visual angle;

[0016] ATTACHMENT Figure 4 It is the structure schematic diagram of packaging jig of hall module of the utility model under another visual angle;

[0017] ATTACHMENT Figure 5 It is the structure sectional view of packaging jig of hall module of the utility model before pouring glue;

[0018] ATTACHMENT Figure 6The utility model discloses a packaging jig for hall module, which comprises a first side plate, a second side plate, a third side plate and a fourth side plate arranged in sequence and connected tightly with each other, and a bottom plate.

[0019] Attached Figure 7 The utility model discloses a packaging jig for hall module, which comprises a first side plate, a second side plate, a third side plate and a fourth side plate arranged in sequence and connected tightly with each other, and a bottom plate.

[0020] In the above drawings: 101, Hall integrated circuit board; 102, glue coating layer; 103, product through hole; 104, mounting hole; 1, first side plate; 2, second side plate; 3, third side plate; 4, fourth side plate; 41, counterbore; 5, bottom plate; 6, semi-closed cavity; 71, positioning through hole; 72, positioning pin; 8, gasket; 81, flange part; 91, vertical bolt; 92, horizontal bolt; 12, sleeve; 13, internally threaded pin sleeve; 131, fastening screw; 14, support screw; 15, gasket. DETAILED DESCRIPTION

[0021] The specific embodiments given below can further clarify the patent, but they are not a limitation of the patent.

[0022] Embodiment 1: a packaging jig for hall module, the hall module comprising: a Hall integrated circuit board 101 and a glue coating layer 102 covering the outer side of the Hall integrated circuit board 101, the glue coating layer 102 having at least one mounting hole 104 with a threaded inner wall, the Hall integrated circuit board 101 having at least two product through holes 103 arranged at intervals, and the glue coating layer 102 having at least one sleeve 12 with an internal thread embedded therein, thereby forming the mounting hole 104 with a threaded inner wall, the glue filling jig comprising: a horizontally arranged bottom plate 5, a first side plate 1, a second side plate 2, a third side plate 3 and a fourth side plate 4 arranged vertically and in close contact with the upper surface of the bottom plate 5, the first side plate 1, the second side plate 2, the third side plate 3 and the fourth side plate 4 being arranged in sequence and connected tightly with each other, thereby forming a semi-closed cavity 6 for placing the Hall integrated circuit board 101 between the bottom plate 5 and the first side plate 1, the second side plate 2, the third side plate 3 and the fourth side plate 4.

[0023] The outer side surface of the first side plate 1 is provided with at least two positioning through holes 71, each of which is provided with a positioning pin 72, one end of which is located on the outer side of the first side plate 1, and the other end of which extends into the semi-closed cavity 6 and is used to be embedded in the product through hole 103 on the Hall integrated circuit board 101, and the outer side of the other end of each positioning pin 72 located in the semi-closed cavity 6 is provided with a gasket 8, one end of which is embedded in the first side plate 1, and the other end of which is used to contact the surface of the Hall integrated circuit board 101 facing the first side plate 1, and the inner side surface of the second side plate 2 facing the semi-closed cavity 6 is embedded with at least one internally threaded pin sleeve 13 corresponding to the sleeve 12, one end of which is connected with the second side plate 2, and the other end of which extends into the semi-closed cavity 6, and the fourth side plate 4 opposite to the second side plate 2 is provided with at least one supporting screw 14 corresponding to the sleeve 12, which passes through the fourth side plate 4 and is screwed with the internally threaded pin sleeve 13 in the semi-closed cavity 6, and the sleeve 12 is sleeved on the outer side of the supporting screw 14 and located between the inner side surface of the fourth side plate 4 facing the semi-closed cavity 6 and the internally threaded pin sleeve 13.

[0024] The outer side of the above-mentioned supporting screw 14 and between the sleeve 12 and the internally threaded pin sleeve 13 is sleeved with a gasket 15; one end of the above-mentioned internally threaded pin sleeve 13 embedded in the second side plate 2 is fixedly connected with the second side plate 2 through a fastening screw 131 embedded in the second side plate 2; the outer side surface of the fourth side plate 4 opposite to the semi-closed cavity 6 is provided with a countersunk hole 41 for embedding the cap body of the supporting screw 14.

[0025] Embodiment 2: a packaging jig for a Hall module, the Hall module comprising: a Hall integrated circuit board 101 and a rubber coating layer 102 covering the outer side of the Hall integrated circuit board 101, the rubber coating layer 102 having at least one mounting hole 104 with a threaded inner wall, the Hall integrated circuit board 101 having at least two product through holes 103 spaced apart, and the rubber coating layer 102 being embedded with at least one sleeve 12 with an internal thread, thereby forming the mounting hole 104 with a threaded inner wall, and the mounting channel of the Hall element is reinforced by adding the sleeve, and the glue filling jig comprises: a bottom plate 5 arranged horizontally, and a first side plate 1, a second side plate 2, a third side plate 3 and a fourth side plate 4 arranged vertically and in close contact with the upper surface of the bottom plate 5, the first side plate 1, the second side plate 2, the third side plate 3 and the fourth side plate 4 being arranged in sequence and being tightly connected with each other, thereby forming a semi-closed cavity 6 with the bottom plate 5, which can accommodate the Hall integrated circuit board 101;

[0026] The outer side surface of the first side plate 1 is provided with at least two positioning through holes 71, each of which is provided with a positioning pin 72, one end of which is located on the outer side of the first side plate 1, and the other end of which extends into the semi-closed cavity 6 and is used to be embedded into the product through hole 103 on the Hall integrated circuit board 101, and the outer side of the other end of each positioning pin 72 located in the semi-closed cavity 6 is provided with a gasket 8, one end of which is embedded into the first side plate 1, and the other end of which is used to contact the surface of the Hall integrated circuit board 101 facing the first side plate 1, and the inner side surface of the second side plate 2 facing the semi-closed cavity 6 is embedded with at least one internally threaded pin sleeve 13 corresponding to the sleeve 12, one end of which is connected with the second side plate 2, and the other end of which extends into the semi-closed cavity 6, and the fourth side plate 4 which is parallel to the second side plate 2 is provided with at least one supporting screw 14 corresponding to the sleeve 12, which passes through the fourth side plate 4 and is screwed with the internally threaded pin sleeve 13 in the semi-closed cavity 6, and the sleeve 12 is sleeved on the outer side of the supporting screw 14 and located between the inner side surface of the fourth side plate 4 facing the semi-closed cavity 6 and the internally threaded pin sleeve 13.

[0027] The product through hole 103, the positioning pin 72 and the gasket 8 on the Hall integrated circuit board 101 are all provided with three; the gasket 8 is a TO-220C transistor gasket, which is used to fix the position of the Hall integrated circuit board inside the Hall element; one end of the gasket 8 is provided with a flange part 81 extending radially outward, which is embedded into the first side plate 1; the positioning pin 72 is a screw with external threads;

[0028] The first side plate 1, the second side plate 2, the third side plate 3 and the fourth side plate 4 are all fixedly connected with the bottom plate 5 through vertical bolts 91; the first side plate 1 and the third side plate 3 which are parallel to each other are fixedly connected through two horizontal bolts 92 which respectively pass through the second side plate 2 and the third side plate 3.

[0029] In use, one end of at least two gaskets corresponding to the product through holes on the Hall integrated circuit board is installed into the installation groove on the inner side surface of the first side plate, and the other end of the gasket extends out of the inner side surface of the first side plate;

[0030] At least two positioning pins are respectively embedded into the product through holes on the Hall integrated circuit board after passing through the positioning through holes provided on the outer side surface of the first side plate and the gaskets installed on the inner side surface of the first side plate, and the Hall integrated circuit board is installed on the inner side of the first side plate and the gasket which contacts the Hall integrated circuit board by the end surface keeps the interval between the Hall integrated circuit board and the inner side surface of the first side plate;

[0031] One end of the at least one internally threaded pin sleeve is mounted on the inner side surface of the second side plate and the other end thereof extends out of the inner side surface of the second side plate;

[0032] The at least one support screw corresponding to the internally threaded pin sleeve is extended from the outer side surface of the fourth side plate to the inner side thereof, the at least one sleeve is correspondingly sleeved on the outer side of the support screw, and then the support screw is threadedly connected with the internally threaded pin sleeve on the second side plate, so that the sleeve is limited between the inner side surface of the fourth side plate and the internally threaded pin sleeve and the fourth side plate is connected with the second side plate through the support screw and the internally threaded pin sleeve;

[0033] The lower end of the first side plate is tightly mounted on the upper surface of the bottom plate, the lower ends of the second side plate and the fourth side plate connected with each other are tightly mounted on the upper surface of the bottom plate, at this time, the first side plate is connected between one end of the second side plate and one end of the fourth side plate, the third side plate is arranged between the other end of the second side plate and the other end of the fourth side plate and the lower end of the third side plate is tightly mounted on the upper surface of the bottom plate, and the second side plate and the fourth side plate are tightly connected with the first side plate and the third side plate outside the two ends thereof, so that a semi-closed cavity for injecting glue is formed between the first side plate, the second side plate, the third side plate, the fourth side plate and the bottom plate which are tightly connected with each other, and the Hall integrated circuit board mounted on the inner side of the first side plate, the internally threaded pin sleeve mounted on the inner side surface of the second side plate and the sleeve sleeved on the outer side of the support screw are located in the semi-closed cavity;

[0034] The encapsulation glue is injected into the semi-closed cavity, and after shaping and cooling, the Hall element is obtained.

[0035] The further explanation of the above embodiment is as follows:

[0036] The Hall element has the function and is convenient to install through the design of the inner cavity of the jig;

[0037] The semi-closed structure is adopted, only the upper glue injection port is reserved, the remaining parts are tightly combined, the shape of the Hall element is fixed by the traditional screw locking type, and the heights of the jig plates in front, back, left and right of the Hall element are the length of the Hall element, so that the distance between the product and the outgoing line of the mover is ensured.

[0038] Only the screw locking is needed to fix, the jig is flexible and convenient to install, and the cost is low; the overall size precision of the Hall element is ensured by the face-to-face cooperation between the jig plates; the total length of the Hall element is ensured by the fixed height of the jig plate, and the interference with the outgoing line of the mover is avoided.

[0039] The whole structure is simple, compact and reliable, the whole jig can be directly put into a glue filling machine to perform glue filling operation, convenient for personnel operation, there is no groove structure, easy to demold, and the Hall element cannot be demolded; the glue filling process can be formed at one time, without secondary processing, reducing the working step and saving time.

[0040] The Hall element obtained by processing can be screwed on the end face of the sleeve during installation, the screw can be prevented from contacting the glue surface of the Hall element, thereby ensuring the appearance and aesthetics, and the Hall element can be screwed more tightly on the rotor without affecting the appearance of the Hall element.

[0041] When the packaging jig of the Hall module is used, the Hall module can be encapsulated by a simple structure, the size precision and aesthetics of the encapsulated product can be ensured, the position precision and stability of the Hall integrated circuit board can be ensured, the position deflection and deviation of the Hall integrated circuit board caused by glue filling impact can be avoided, the spacing between the Hall integrated circuit board and the external encapsulation surface can be formed to ensure the integrity of the encapsulation, the stability of the spacing can be ensured, and the demolding operation is convenient; in addition, the threaded hole is formed by the inner sleeve, and the counterbore hole is formed outside the threaded hole to facilitate the connection of the Hall module, which replaces the threaded hole arranged directly on the encapsulation layer, simplifies the processing technology, improves the rigidity of the threaded surface, and ensures the stability of the connection structure.

[0042] The above embodiments are only for illustrating the technical concept and characteristics of the utility model, the purpose is to enable people skilled in the art to understand the content of the utility model and implement it, and cannot limit the protection scope of the utility model. Any equivalent changes or modifications made according to the spirit and essence of the utility model shall be covered within the protection scope of the utility model.

Claims

1. A packaging jig of a Hall module, the Hall module comprising: The application discloses a Hall integrated circuit board (101) and a glue coating layer (102) covering the outer side of the Hall integrated circuit board (101), wherein the glue coating layer (102) is provided with at least one mounting hole (104) with a threaded inner wall, and the Hall integrated circuit board (101) is provided with at least two product through holes (103) arranged at intervals; and the glue coating layer (102) is embedded with at least one sleeve (12) with an internal thread, so as to form the mounting hole (104) with the threaded inner wall. The mounting jig comprises a bottom plate (5) arranged horizontally, a first side plate (1), a second side plate (2), a third side plate (3) and a fourth side plate (4) arranged vertically and in close contact with the upper surface of the bottom plate (5), and the first side plate (1), the second side plate (2), the third side plate (3) and the fourth side plate (4) are sequentially arranged and closely connected with each other, so as to form a semi-closed cavity (6) for placing the Hall integrated circuit board (101) in the bottom plate (5).

2. The packaging jig of the Hall module according to claim 1, wherein: The outer side surface of the first side plate (1) is provided with at least two positioning through holes (71), each of which is provided with a positioning pin (72); one end of the positioning pin (72) is located on the outer side of the first side plate (1), and the other end of the positioning pin (72) extends into the semi-closed cavity (6) and is used for being embedded into the product through hole (103) on the Hall integrated circuit board (101); the outer side of the one end of each positioning pin (72) in the semi-closed cavity (6) is provided with a gasket (8); the other end of the gasket (8) is embedded into the first side plate (1) and used for being in contact with the surface of the Hall integrated circuit board (101) facing the first side plate (1); the inner side surface of the second side plate (2) facing the semi-closed cavity (6) is embedded with at least one internal thread pin sleeve (13) corresponding to the sleeve (12); one end of the internal thread pin sleeve (13) is connected with the second side plate (2), and the other end of the internal thread pin sleeve (13) extends into the semi-closed cavity (6) and is arranged in parallel with the second side plate (2); the fourth side plate (4) arranged in parallel with the second side plate (2) is provided with at least one supporting screw (14) corresponding to the sleeve (12); the supporting screw (14) penetrates through the fourth side plate (4) and is in threaded connection with the internal thread pin sleeve (13) in the semi-closed cavity (6); and the sleeve (12) is sleeved on the outer side of the supporting screw (14) and located between the inner side surface of the fourth side plate (4) facing the semi-closed cavity (6) and the internal thread pin sleeve (13).

3. The packaging jig of the Hall module according to claim 1 or 2, characterized in that: A gasket (15) is sleeved on the outer side of the supporting screw (14) and located between the sleeve (12) and the internal thread pin sleeve (13).

4. The packaging jig of the Hall module according to claim 1, wherein: The one end of the internal thread pin sleeve (13) embedded into the second side plate (2) is fixedly connected with the second side plate (2) through a fastening screw (131) embedded into the second side plate (2). The product through hole (103), the positioning pin (72) and the gasket (8) on the Hall integrated circuit board (101) are all provided with three.

5. The packaging jig of Hall modules according to claim 1, characterized in that: One end of the gasket (8) has a flange portion (81) extending radially outward, which is embedded in the first side plate (1).

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