Multifunctional composite foam tape
By using a composite structure consisting of a PET base layer, a boron nitride thermally conductive layer, a wave-absorbing layer, a first AB adhesive layer, and a silicone foam layer, combined with dual-gradient curing and vacuum infusion processes, the technical challenges of electromagnetic wave absorption, heat dissipation, and mechanical buffering of the tape were solved, thereby improving the bonding strength and impact resistance.
Patent Information
- Application Number
- CN202520527464.1
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-03-25
- Publication Date
- 2026-02-17
- Estimated Expiration
- 2035-03-25
AI Technical Summary
Existing tapes cannot simultaneously meet the requirements of electromagnetic wave absorption, heat dissipation, mechanical buffering, and high adhesive strength. Traditional wave-absorbing materials have poor thermal conductivity, heat dissipation materials may reflect electromagnetic waves, and multi-layer structures have insufficient interfacial adhesive strength and are prone to delamination.
The composite structure consists of a PET base layer, a boron nitride thermal conductive layer, a wave-absorbing layer, a first AB adhesive layer, a silicone foam layer, and a second AB adhesive encapsulation layer. Combined with a dual-gradient curing process and a vacuum infusion process, it achieves efficient electromagnetic wave absorption, heat dissipation, mechanical buffering, and high adhesion.
It achieves good structural stability, combines electromagnetic wave absorption, efficient heat dissipation, mechanical buffering and high adhesion, and improves impact resistance by 200%, making it suitable for high vibration scenarios.
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Figure CN223921341U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model relates to the technical field of adhesive tape, especially to a multifunctional composite foam adhesive tape. BACKGROUND
[0002] With the high frequency development of electronic equipment, electromagnetic interference (EMI) and heat accumulation problems are increasingly prominent, and single material adhesive tape is difficult to meet the needs of electromagnetic absorption and heat dissipation. The traditional wave absorbing material (such as ferrite) has poor heat conduction performance, which can easily cause local overheating, and the heat dissipation material (such as metal) can reflect electromagnetic waves and aggravate electromagnetic interference. In the prior art, the adhesive tape with a multi-layer structure not only has insufficient interfacial bonding strength and is prone to delamination, but also lacks a buffer layer that can easily cause structural failure due to mechanical vibration. Therefore, there is an urgent need for a multifunctional composite foam adhesive tape that can balance electromagnetic wave absorption, efficient heat dissipation, mechanical cushioning and high bonding strength. SUMMARY
[0003] The technical problem to be solved by the utility model is to provide a multifunctional composite foam adhesive tape, which not only has good structural stability, but also has electromagnetic wave absorption, efficient heat dissipation, mechanical cushioning and high bonding strength.
[0004] The technical scheme adopted by the utility model to solve its technical problem is: a multifunctional composite foam adhesive tape, comprising a PET base layer, one side of the PET base layer is provided with a boron nitride heat conduction layer, the side of the boron nitride heat conduction layer away from the PET base layer is provided with a wave absorbing layer, the side of the wave absorbing layer away from the boron nitride heat conduction layer is provided with a first AB glue bonding layer, the side of the first AB glue bonding layer away from the wave absorbing layer is provided with a silica gel foam layer, and the side of the silica gel foam layer away from the first AB glue bonding layer is provided with a second AB glue packaging layer.
[0005] In one embodiment, the thickness of the PET base layer of the multifunctional composite foam adhesive tape is 50-200 μm.
[0006] In one embodiment, the thickness of the boron nitride heat conduction layer of the multifunctional composite foam adhesive tape is 10-50 μm, and the thermal conductivity coefficient is ≥5 W / (m·K).
[0007] In one embodiment, the thickness of the wave absorbing layer of the multifunctional composite foam adhesive tape is 0.2-1.5 mm, the frequency band covers 2-40 GHz, and the reflection loss is ≤-25 dB.
[0008] In one embodiment, the thickness of the first AB glue bonding layer of the multifunctional composite foam adhesive tape is 20-100 μm.
[0009] In one of the embodiments, the thickness of the silica gel foam layer of the multifunctional composite foam tape is 0.5-2mm, the porosity is 70%-90%, and the compression rate is greater than or equal to 30%.
[0010] In one of the embodiments, the first AB adhesive layer of the multifunctional composite foam tape adopts a double-gradient curing process, and the second AB encapsulation layer adopts a vacuum pouring process.
[0011] The beneficial effects of the present application are:
[0012] The present application provides a multifunctional composite foam tape, which comprises a PET base layer, a boron nitride heat conduction layer, a wave absorption layer, a first AB adhesive layer, a silica gel foam layer, and a second AB encapsulation layer in sequence.
[0013] The multifunctional composite foam tape solves the contradiction between EMI and heat dissipation through the efficient heat dissipation of the boron nitride heat conduction layer and the wideband electromagnetic wave absorption of the wave absorption layer.
[0014] The multifunctional composite foam tape adopts a double-gradient curing process to prepare the first AB adhesive layer, which significantly improves the interlayer bonding force.
[0015] The silica gel foam layer and the second AB encapsulation layer of the multifunctional composite foam tape form a "rigid-flexible composite" structure, and the impact resistance is improved by more than 200%, which is suitable for high-vibration scenes. BRIEF DESCRIPTION OF DRAWINGS
[0016] Figure 1 The structure diagram of the multifunctional composite foam tape of the embodiments of the present application.
[0017] Among them:
[0018] 1, PET base layer; 2, boron nitride heat conduction layer; 3, wave absorption layer; 4, first AB adhesive layer; 5, silica gel foam layer; 6, second AB encapsulation layer. DETAILED DESCRIPTION
[0019] In order to make the above-mentioned purposes, features and advantages of the present application more obvious and easy to understand, the specific embodiments of the present application will be described in detail below with reference to the drawings.
[0020] As Figure 1As shown, an embodiment of this application provides a multifunctional composite foam tape, including a PET base layer, a boron nitride thermally conductive layer disposed on one side of the PET base layer, a microwave absorbing layer disposed on the side of the boron nitride thermally conductive layer away from the PET base layer, a first AB adhesive layer disposed on the side of the microwave absorbing layer away from the boron nitride thermally conductive layer, a silicone foam layer disposed on the side of the first AB adhesive layer away from the microwave absorbing layer, and a second AB adhesive encapsulation layer disposed on the side of the silicone foam layer away from the first AB adhesive layer.
[0021] The specific implementation steps are as follows:
[0022] Step 1, PET substrate pretreatment: Select a PET film with a thickness of 50-200μm as the substrate, and use corona treatment or plasma activation technology to increase the surface energy to more than 50mN / m, thereby enhancing the adhesion of the boron nitride thermal conductive layer.
[0023] Step 2, Preparation of boron nitride thermal conductive layer: Hexagonal boron nitride nanosheets (h-BN) with a particle size of 0.5-5μm are uniformly mixed with epoxy resin at a mass ratio of 1:2 or existing boron nitride thermal conductive materials are directly used. Then, a 10-50μm thermal conductive layer is formed by precision coating process. The layer is pre-cured at 80℃ for 30 minutes and finally cured at 120℃ for 1 hour to ensure that the in-plane thermal conductivity is ≥5W / (m·K).
[0024] Step 3, Wave Absorbing Layer Forming: Mix 2-10μm 0FeSiAl@SiO2 particles with carbon nanotubes at a mass ratio of 6:4 and disperse them in polyurethane resin or directly use existing wave absorbing layer materials. Use magnetic field-assisted forming process to form a 0.2-1.5mm wave absorbing layer to ensure that the reflection loss in the 2-40GHz frequency band is ≤-25dB.
[0025] Step 4, Interlayer Lamination: The first AB adhesive layer (20-100μm thick) is cured using a dual-gradient curing process (pre-curing at 60℃ / 1h, final curing at 120℃ / 2h). One side of the first AB adhesive layer is firmly bonded to the microwave absorbing layer, and the other side is tightly bonded to the silicone foam layer. The silicone foam layer has a high porosity (70%-90%) and high compressibility (≥30%), with a thickness of 0.5-2mm. It can effectively absorb mechanical vibration and impact energy while maintaining good resilience and cushioning performance.
[0026] Step 5: Encapsulation and Protection: The second AB adhesive encapsulation layer employs a vacuum injection process. Under negative pressure (pressure -0.1MPa), the AB adhesive is evenly injected onto the surface and edges of the silicone foam layer, effectively eliminating interface bubbles and ensuring a tight bond between the adhesive layer and the foam layer. After curing, the second AB adhesive encapsulation layer achieves a complete seal over the silicone foam layer, forming a "rigid-flexible composite" structure. This structure combines the strength of a rigid encapsulation layer with the cushioning performance of a flexible foam layer, improving overall impact resistance by over 200% and significantly enhancing the product's reliability in high-vibration and high-impact environments.
[0027] The pre-curing stage of the dual-gradient curing process allows the AB adhesive to initially cross-link, forming a stable network structure while avoiding internal stress caused by rapid curing. The final curing stage ensures complete cross-linking of the AB adhesive, achieving optimal mechanical properties and interfacial bonding strength.
[0028] In the above structure, the optimized combination of a boron nitride thermally conductive layer and a wave-absorbing layer effectively resolves the conflict between electromagnetic interference (EMI) and heat dissipation. The first AB adhesive layer employs a dual-gradient curing process to enhance interlayer bonding. A silicone foam layer and a second AB adhesive encapsulation layer form a "rigid-flexible composite" structure, improving impact resistance by over 200%, making it suitable for high-vibration environments. This multifunctional composite foam tape not only boasts excellent structural stability but also combines electromagnetic wave absorption, efficient heat dissipation, mechanical cushioning, and high adhesion.
[0029] In one embodiment, the thickness of the PET base layer of the multifunctional composite foam tape is 50-200 μm. PET base layers with thicknesses of 50 μm, 60 μm, 70 μm, 100 μm, 120 μm, 150 μm, 180 μm, or 200 μm can be used, with 120 μm being preferred. Using a PET base layer within this thickness range as the basic support layer can effectively block low-frequency electromagnetic interference and also has good tensile strength, stability, and surface fit.
[0030] In one embodiment, the thickness of the boron nitride thermally conductive layer of the multifunctional composite foam tape is 10-50 μm, and the thermal conductivity is ≥5 W / (m·K). Boron nitride thermally conductive layers with thicknesses of 10 μm, 20 μm, 30 μm, 40 μm, or 50 μm can be used, with 30 μm being preferred. The thermal conductivity of the boron nitride thermally conductive layer within this thickness range is ≥5 W / (m·K), significantly improving heat dissipation performance and solving the thermal management challenges in high power density scenarios.
[0031] In one embodiment, the absorbing layer of the multifunctional composite foam tape has a thickness of 0.2-1.5 mm, covers a frequency band of 2-40 GHz, and has a reflection loss ≤-25 dB. The absorbing layer can have a thickness of 0.2 mm, 0.6 mm, 1 mm, 1.2 mm, or 1.5 mm, preferably 1 mm. This thickness range effectively suppresses electromagnetic interference and meets electromagnetic shielding requirements.
[0032] In one embodiment, the thickness of the first AB adhesive layer of the multifunctional composite foam tape is 20-100 μm. A first AB adhesive layer with a thickness of 20 μm, 40 μm, 60 μm, 80 μm, or 100 μm can be used, with 60 μm being preferred. This thickness range of the first AB adhesive layer achieves uniform stress distribution, improves the overall structural reliability, ensures interlayer bonding strength, effectively reduces interface stress, and avoids delamination or cracking.
[0033] In one embodiment, the silicone foam layer of the multifunctional composite foam tape has a thickness of 0.5-2 mm, an open area ratio of 70%-90%, and a compression ratio ≥30%. Silicone foam layers with thicknesses of 0.5 mm, 1 mm, 1.2 mm, 1.5 mm, or 2 mm can be used, with 1.2 mm being preferred. Silicone foam layers within this thickness range exhibit excellent cushioning performance and can effectively absorb impact energy.
[0034] In one embodiment, the first AB adhesive layer of the multifunctional composite foam tape employs a dual-gradient curing process, while the second AB adhesive encapsulation layer employs a vacuum infusion process. The dual-gradient curing process includes a pre-curing stage (60℃ / 1h) and a final curing stage (120℃ / 2h). The pre-curing stage allows the AB adhesives to initially cross-link, forming a stable network structure while avoiding internal stress caused by rapid curing. The final curing stage ensures complete cross-linking of the AB adhesives, achieving optimal mechanical properties and interfacial bonding strength. The vacuum infusion process ensures that the AB adhesives fully fill the pores of the silicone foam layer, forming a uniform encapsulation layer, eliminating air bubbles and voids, improving the density and environmental sealing of the encapsulation layer, and enhancing the overall structure's impact and vibration resistance.
[0035] The embodiments described above are merely illustrative of several implementations of this utility model, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the utility model patent. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this utility model, and these all fall within the protection scope of this utility model. Therefore, the protection scope of this utility model patent should be determined by the appended claims.
Claims
1. A multi-functional composite foam tape, characterized by, The PET base layer is provided with a boron nitride heat-conducting layer on one side, the boron nitride heat-conducting layer is provided with a wave-absorbing layer on the side away from the PET base layer, the wave-absorbing layer is provided with a first AB adhesive bonding layer on the side away from the boron nitride heat-conducting layer, the first AB adhesive bonding layer is provided with a silica gel foam layer on the side away from the wave-absorbing layer, and the silica gel foam layer is provided with a second AB adhesive packaging layer on the side away from the first AB adhesive bonding layer.
2. The multi-functional composite foam tape according to claim 1, wherein The thickness of the PET base layer is 50-200 μm.
3. The multi-functional composite foam tape according to claim 1, wherein The thickness of the boron nitride heat-conducting layer is 10-50 μm, and the thermal conductivity is greater than or equal to 5 W / (m·K).
4. The multi-functional composite foam tape according to claim 1, wherein The thickness of the wave-absorbing layer is 0.2-1.5 mm, the frequency band covers 2-40 GHz, and the reflection loss is less than or equal to -25 dB.
5. The multi-functional composite foam tape according to claim 1, wherein The thickness of the first AB adhesive bonding layer is 20-100 μm.
6. The multi-functional composite foam tape according to claim 1, wherein The thickness of the silica gel foam layer is 0.5-2 mm, the porosity is 70%-90%, and the compression rate is greater than or equal to 30%.
7. The multi-functional composite foam tape according to claim 1, wherein The first AB adhesive bonding layer adopts a double-gradient curing process, and the second AB adhesive packaging layer adopts a vacuum pouring process.