Hot melt adhesive film with lining paper

Abstract

The utility model discloses a hot melt adhesive film with lining paper, which relates to the technical field of hot melt adhesive films and comprises a storage mold frame, lining paper is fixedly arranged at the top of the storage mold frame, a heat conducting layer is fixedly arranged at the bottom of the storage mold frame, a reinforcing layer is fixedly arranged at the bottom of the heat conducting layer, and a heat conducting plate is fixedly arranged in the reinforcing layer. According to the utility model, the heat-conducting plate, the heat-conducting layer and the heat-conducting plate are adopted for heat conduction, and the heat-conducting plate, the heat-conducting layer and the heat-conducting plate are adopted for rapid heat conduction in order to prevent the situation that the structure in the prior art is simple and lacks a certain heat-conducting structure and avoid the situation that the melting speed of hot melt adhesive is very slow during heating; and in order to avoid poor adhesion effect of the hot melt adhesive due to the fact that the molten hot melt adhesive is difficult to uniformly adhere to an object, the hot melt adhesive layer is used for adhesion, the adhesion effect is ensured, the use efficiency is improved, and the hot melt adhesive is very convenient to use.

Description

TECHNICAL FIELD

[0001] The utility model relates to hot melt adhesive film technical field, concretely relates to a hot melt adhesive film with backing paper. BACKGROUND

[0002] Hot melt adhesive film is a film product with or without release paper, which can be conveniently operated continuously or intermittently, and can be widely used for bonding various fabrics, paper, high molecular materials and metals.

[0003] The prior art structure is relatively simple, lacks a certain heat conduction structure, so that the hot melt adhesive melts very slowly when heated, and the melted hot melt adhesive is difficult to stick evenly on the object, resulting in poor hot melt adhesive sticking effect, which greatly affects the use. UTILITY MODEL CONTENT

[0004] In view of the above problems existing in the prior art hot melt adhesive film, the utility model is proposed.

[0005] Therefore, the utility model aims to provide a hot melt adhesive film with backing paper, which solves the problem of lacking a certain heat conduction structure, so that the hot melt adhesive melts very slowly when heated.

[0006] In order to achieve the above purpose, the utility model provides the following technical scheme:

[0007] A hot melt adhesive film with backing paper, comprising a storage mold frame, the storage mold frame top is fixedly provided with backing paper, the storage mold frame bottom is fixedly provided with a heat conduction layer, the heat conduction layer bottom is fixedly provided with a reinforcing layer, the reinforcing layer is fixedly provided with a heat conduction plate, the heat conduction plate is fixedly provided with a heat conduction rod, the heat conduction plate bottom is fixedly provided with a guide film, and a plurality of air holes are fixedly provided in the guide film.

[0008] Preferably, the storage mold frame is fixedly provided with a hot melt adhesive layer, and the thickness of the storage mold frame and the hot melt adhesive layer is 2mm.

[0009] Preferably, the number of heat conduction rods is several, and they are evenly and spacedly distributed in the heat conduction plate.

[0010] Preferably, the heat conduction layer is a silicone grease layer, and the thickness of the heat conduction layer is 2mm.

[0011] Further, the heat conduction plate is a silicon carbide plate, and the thickness of the heat conduction plate is 3mm.

[0012] In the above technical scheme, the utility model provides the technical effect and advantages:

[0013] The utility model discloses, adopt heat conduction board, heat conduction layer and heat conduction board carry out heat conduction, in order to prevent prior art's structure is relatively simple and lacks certain heat conduction structure, avoid hot melt adhesive melt very slowly when heating, use heat conduction board, heat conduction layer and heat conduction board carry out fast heat conduction, and in order to avoid the hot melt adhesive that melts very difficultly even stick on the object, avoid leading to hot melt adhesive's sticking effect is poor, use hot melt adhesive layer carries out adhesion, guarantee the effect of adhesion, improve use efficiency, it is very convenient. BRIEF DESCRIPTION OF DRAWINGS

[0014] In order to more clearly illustrate the technical scheme in the embodiment of the present application or prior art, the following will be briefly introduced the drawing needed to be used in the embodiment, obviously, the drawing in the following description only is some embodiments of the utility model is recorded, for the ordinary skilled person in the art, still can obtain other drawings according to these drawings.

[0015] Figure 1 It is the three-dimensional structure schematic diagram of the utility model;

[0016] Figure 2 It is the plane structure top schematic diagram of the utility model;

[0017] Figure 3 It is the guiding film bottom structure schematic diagram of the utility model.

[0018] Mark explanation:

[0019] 1, storage mould frame;2, backing paper;3, heat conduction layer;4, reinforcing layer;5, heat conduction board;6, heat conduction stick;7, guiding film;8, air hole;9, hot melt adhesive layer. Specific implementation

[0020] In order to make the technical personnel of the prior art better understand the technical scheme of the utility model, the following will be combined with the drawings to the utility model further detailed introduction.

[0021] The utility model embodiment discloses a hot melt adhesive film with backing paper.

[0022] The utility model provides Figures 1-3The illustrated one is a hot melt adhesive film with backing paper, including storage mold frame 1, the top of storage mold frame 1 is fixedly provided with backing paper 2, the bottom of storage mold frame 1 is fixedly provided with heat conducting layer 3, the bottom of heat conducting layer 3 is fixedly provided with reinforcing layer 4, reinforcing layer 4 is fixedly provided with heat conducting plate 5 in, heat conducting plate 5 is fixedly provided with heat conducting rod 6 in, the bottom of heat conducting plate 5 is fixedly provided with guide film 7, a plurality of air holes 8 are fixedly provided in guide film 7, heat conducting plate 5, heat conducting layer 3 and heat conducting plate 5 are used for heat conduction, in order to prevent the prior art structure is relatively simple and lacks certain heat conduction structure, avoid the hot melt adhesive melts very slowly when heating, heat conducting plate 5, heat conducting layer 3 and heat conducting plate 5 are used for rapid heat conduction, air holes 8 can be quickly ventilated, guide film 7 is polyimide film, reinforcing layer 4 is carbon fiber cloth layer, heat conducting rod 6 is silica rod.

[0023] In order to facilitate bonding, such as Figures 1-2 The storage mold frame 1 is fixedly provided with a hot melt adhesive layer 9, and the thickness of the storage mold frame 1 and the hot melt adhesive is 2mm, in order to facilitate bonding.

[0024] In order to make the heat conduction effect uniform, as Figure 1 The number of heat conducting rods 6 is several, and they are uniformly distributed in the heat conducting plate 5, in order to make the heat conduction effect uniform.

[0025] In order to facilitate heat conduction, as Figure 1 The heat conducting layer 3 is a silicone layer, and the thickness of the heat conducting layer 3 is 2mm, in order to facilitate heat conduction.

[0026] Finally, in order to better heat conduction, as Figure 1 The heat conducting plate 5 is a silicon carbide plate, and the thickness of the heat conducting plate 5 is 3mm, in order to better heat conduction.

[0027] The above only describes certain exemplary embodiments of the present application by way of illustration, without doubt, for ordinary skilled in the art, without departing from the spirit and scope of the present application, the described embodiments can be modified in various ways. Therefore, the above drawings and description are illustrative in nature, and should not be understood as limiting the scope of protection of the present application.

Claims

1. A hot-melt adhesive film with backing paper, comprising a storage die (1), characterized in that, The storage mold frame (1) top is fixedly provided with lining paper (2), the storage mold frame (1) bottom is fixedly provided with heat conducting layer (3), the heat conducting layer (3) bottom is fixedly provided with reinforcing layer (4), the reinforcing layer (4) is fixedly provided with heat conducting plate (5) in, the heat conducting plate (5) is fixedly provided with heat conducting rod (6) in, the heat conducting plate (5) bottom is fixedly provided with guide film (7), the guide film (7) is fixedly provided with multiple air holes (8) in.

2. The paper-backed hot melt adhesive film according to claim 1, wherein The storage mold frame (1) is fixedly provided with hot melt adhesive layer (9), and the thickness of the storage mold frame (1) and the hot melt adhesive is 2mm.

3. The paper-backed hot melt adhesive film according to claim 1, wherein, The number of the heat conducting rod (6) is several, and is evenly spaced in the heat conducting plate (5).

4. The paper-lining hot-melt adhesive film according to claim 1, wherein The heat conducting layer (3) adopts silicon grease layer, and the thickness of the heat conducting layer (3) is 2mm.

5. The paper-lining hot-melt adhesive film according to claim 1, wherein The heat conducting plate (5) adopts silicon carbide plate, and the thickness of the heat conducting plate (5) is 3mm.

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