Flow uniformizing device of atomic deposition equipment

Abstract

The utility model discloses a flow uniformizing device of atomic deposition equipment, which comprises a tail gas pipe main body, one end of the tail gas pipe main body is provided with a main pipeline, the other end of the tail gas pipe main body is provided with a plurality of branch pipelines at intervals, the end part of each branch pipeline is provided with a flow limiting plate, the end surface of each flow limiting plate is provided with a flow limiting port, and the tail gas pipe main body is provided with an air inlet. And with the main pipeline as a boundary, the calibers of the flow limiting openings of the flow limiting plates far away from the main pipeline are sequentially increased. According to the utility model, the flow-limiting plates are arranged on the branch pipelines, and the diameter of the flow-limiting opening of the flow-limiting plate closer to the main pipeline is smaller, so that the air exhaust uniformity of the branch pipelines can be ensured to a certain extent, namely, the tail gas emission of equipment is more uniform, and the consistency of products produced by the equipment is effectively improved.

Description

TECHNICAL FIELD

[0001] The utility model relates to the technical field of automobile controller, in particular to a flow uniformizing device of atomic deposition equipment. BACKGROUND

[0002] Atomic layer deposition technology is a kind of thin film preparation technology of atom level growth layer by layer.Ideal growth process, by selective alternation, expose different precursors to the surface of substrate, chemisorption and reaction on the surface to form deposition thin film.ALD is divided into "spatial isolation atomic layer deposition "(Spatial ALD) and "time isolation atomic layer deposition "(Temporal ALD).Spatial isolation atomic layer deposition (SALD) technology is a kind of thin film growth technology based on ALD technology, compared with traditional time isolation atomic layer deposition technology, spatial isolation atomic layer deposition technology has the characteristics of large area, large scale, can realize continuity production even can be applied to flexible substrate.

[0003] The growth of Al2O3 passivation layer of photovoltaic cell piece uses this spatial isolation atomic layer deposition.ALD passes through the gas phase precursor into reactor and chemisorption and reaction on the deposition matrix and forms deposition film, unreacted precursor and by-product, and is extracted from pipeline.At present, the tail gas extraction structure of equipment usually appears that the closer to the branch pipeline of main pipeline, the greater the gas flow rate in the branch pipeline, which makes the tail gas not be extracted uniformly, thereby causing the consistency of cell piece produced by equipment to be reduced. UTILITARY MODEL CONTENT

[0004] The utility model aims at providing a kind of flow uniformizing device of atomic deposition equipment, so that tail gas discharge is more uniform, and the consistency of product produced by equipment is improved.

[0005] To solve the above technical problems, the utility model provides a kind of flow uniformizing device of atomic deposition equipment, including tail gas pipe main body;

[0006] The tail gas pipe main body one end has main pipeline, and the tail gas pipe main body other end spacing is provided with multiple branch pipelines;

[0007] Flow limiting plate is installed at each branch pipeline port, and the end surface of flow limiting plate has flow limiting port;

[0008] With the main pipeline as boundary, the flow limiting port caliber of flow limiting plate away from the main pipeline increases in turn.

[0009] Further, the periphery of branch pipeline port and the outer end of flow limiting plate are provided with first flange plate, and multiple first fixing holes are formed on the first flange plate with spacing.

[0010] Further, the first flange plate end face has a sealing gasket.

[0011] Further, the flow limiting plate body part is in a tubular structure, and the flow limiting plate external contour is consistent with the branch pipeline port internal contour.

[0012] Further, the flow limiting plate external sidewall is sleeved with an O-ring.

[0013] Further, the flow limiting plate sidewall is provided with a placing groove, and the O-ring is sleeved in the placing groove.

[0014] Further, the placing groove is a dovetail groove.

[0015] Further, the flow uniformizing device of the atomic deposition equipment further comprises an adapter pipeline; the adapter pipeline is installed on the main pipeline through two matched second flange plates, and second fixing holes are arranged on the second flange plates at intervals.

[0016] Further, the second flange plate end face has a sealing gasket.

[0017] Further, the adapter pipeline is in a trumpet shape, a large-diameter end of the adapter pipeline is connected with the main pipeline, and a small-diameter end of the adapter pipeline is provided with a plurality of third fixing holes at intervals on the sidewall.

[0018] Compared with the prior art, the utility model has at least the following beneficial effects:

[0019] The utility model discloses a flow limiting plate is arranged on each branch pipeline, and the flow limiting plate closer to the main pipeline is smaller in flow limiting port diameter, which can ensure the uniformity of the gas extraction of each branch pipeline to some extent, makes the device exhaust emission more uniform, and effectively improves the consistency of the product of the device production. ACCURACY OF DRAWINGS

[0020] Figure 1 It is the whole structure schematic view of the flow uniformizing device of the atomic deposition equipment in an embodiment of the utility model;

[0021] Figure 2 It is the structure schematic view of the tail gas pipe body in the flow uniformizing device of the atomic deposition equipment in an embodiment of the utility model;

[0022] Figure 3 It is the schematic view of the tail gas pipe body port in the flow uniformizing device of the atomic deposition equipment in an embodiment of the utility model;

[0023] Figure 4 It is the structure schematic view of the flow limiting plate in the flow uniformizing device of the atomic deposition equipment in an embodiment of the utility model;

[0024] Figure 5A schematic diagram of pipeline distribution of an ALD process cavity in the prior art.

[0025] In the figure: 1, tail gas pipe body; 11, main pipeline; 12, branch pipeline; 13, first flange; 131, first fixing hole; 14, second flange; 141, second fixing hole; 2, flow limiting plate; 21, flow limiting port; 3, O-ring; 4, adapter pipeline; 41, third fixing hole. DETAILED DESCRIPTION

[0026] The flow uniformizing device of the atomic deposition equipment will be described in more detail below with reference to the schematic diagram, wherein the preferred embodiments of the present application are shown, and it should be understood that the present application described herein can be modified by those skilled in the art while still achieving the advantageous effects of the present application. Therefore, the following description should be understood as a broad knowledge for those skilled in the art, and not as a limitation of the present application.

[0027] The present application will be described in more detail below with reference to the accompanying drawings in the following paragraphs. The advantages and features of the present application will be more apparent according to the following description. It should be noted that the drawings are all in a very simplified form and all use non-precise proportions, only to facilitate, clearly assist in the purpose of illustrating the embodiments of the present application.

[0028] As shown in Figure 2 and Figure 3 , the present embodiment proposes a flow uniformizing device of an atomic deposition equipment, comprising a tail gas pipe body 1; the tail gas pipe body 1 has a main pipeline 11 at one end, and a plurality of branch pipelines 12 are arranged at the other end of the tail gas pipe body 1.

[0029] As shown in Figure 1 , a flow limiting plate 2 is installed at the port of each branch pipeline 12, and the flow limiting plate 2 has a flow limiting port 21 at the end face; the flow limiting port 21 of the flow limiting plate 2 away from the main pipeline 11 increases in size in turn.

[0030] In the above embodiment, in use, the corresponding specification of the flow limiting plate 2 is installed on each of the plurality of branch pipelines 12 of the tail gas pipe body 1, then the branch pipelines 12 are respectively connected with each exhaust pipe port of the atomic deposition equipment, and the main pipeline 11 is connected with the air exhaust device, by starting the air exhaust device, the exhaust emission of the atomic deposition equipment can be realized.

[0031] Specifically, as shown in Figure 5, the exhaust pipe main body 1 is used to connect the four exhaust ports a and the exhaust device, because the distances of the branch pipes 12 to the trunk pipe 11 are different, the flow rate of the airflow in the branch pipe 12 closer to the trunk pipe 11 is obviously larger, which makes it impossible to uniformly extract the exhaust gas, thereby reducing the consistency of the battery pieces produced by the equipment, and the novel device can ensure the uniformity of the exhaust gas extraction of the branch pipes 12 to a certain extent, that is, the exhaust gas emission of the equipment is more uniform, thereby effectively improving the consistency of the products produced by the equipment.

[0032] In a specific embodiment, the first flange plate 13 is arranged on the outer periphery of the branch pipe 12 and one end of the flow limiting plate 2, and a plurality of first fixing holes 131 are arranged on the first flange plate 13 at intervals.

[0033] The first flange plate 13 is arranged to ensure stable installation of the flow limiting plate 2.

[0034] Further, the first flange plate 13 has a sealing gasket (not shown in the figure) on the end face to ensure the sealing performance after installation of the flow limiting plate 2.

[0035] Preferably, in combination with the above Figure 4 The main part of the flow limiting plate 2 is in a tubular structure, and the external contour of the flow limiting plate 2 is consistent with the internal contour of the port of the branch pipe 12. Through the above design, the flow limiting plate 2 can be inserted into the branch pipe 12 during installation of the flow limiting plate 2 and the branch pipe 12, which is simple to operate.

[0036] Further, the O-ring 3 is sleeved on the outer sidewall of the flow limiting plate 2, and the sealing performance between the flow limiting plate 2 and the branch pipe 12 after installation is ensured through the arrangement of the O-ring 3.

[0037] Further, the side wall of the flow limiting plate 2 is provided with a placing groove (not shown in the figure), and the O-ring 3 is sleeved in the placing groove. Through the arrangement of the placing groove, the positioning and placement of the O-ring 3 are realized.

[0038] Further, the placing groove is a dovetail groove, which improves the stability of the installation of the O-ring 3, thereby ensuring the effective sealing of the O-ring.

[0039] In a specific embodiment, the flow uniformizing device of the atomic deposition equipment further comprises an adapter pipeline 4; the adapter pipeline 4 is installed on the trunk pipe 11 through two matched second flange plates 14, and second fixing holes 141 are arranged on the second flange plates 14 at intervals.

[0040] Further, the second flange plate 14 end face has a sealing gasket (not shown in the figure), which guarantees the sealing between the adapter pipeline 4 and the main pipeline 11.

[0041] In the above embodiment, the adapter pipeline 4 is trumpet-shaped, and the large-diameter end of the adapter pipeline 4 is connected with the main pipeline 11. By setting the adapter pipeline 4 to be trumpet-shaped, the good confluence of each branch pipeline 12 and the main pipeline 11 is guaranteed.

[0042] The small-diameter end side wall of the adapter pipeline 4 is provided with a plurality of third fixing holes 41. Through the setting of the third fixing hole 41, the stable installation of the adapter pipeline 4 and the pipeline of the air extraction device is guaranteed.

[0043] In summary, compared with the prior art, the utility model has at least the following advantages:

[0044] The utility model discloses a flow limiting plate is set up on each branch pipeline, and the flow limiting plate is closer to the main pipeline, and the flow limiting port diameter is smaller, which can guarantee the uniformity of the air extraction of each branch pipeline to a certain extent, that is, the exhaust emission of the equipment is more uniform, and the consistency of the product of the equipment production is effectively improved.

[0045] Obviously, those skilled in the art can make various modifications and variations to the utility model without departing from the spirit and scope of the utility model. Thus, if these modifications and variations of the utility model belong to the scope of the utility model claims and equivalent technologies, the utility model also intends to include these modifications and variations.

Claims

1. An atomic deposition apparatus' s flow uniformizing device, characterized by, Including tail gas pipe main body; The tail gas pipe main body one end has dry road pipeline, and the tail gas pipe main body other end interval is provided with a plurality of branch pipeline; Each branch pipeline port is installed with flow limiting plate, and the flow limiting plate end surface has flow limiting port; With the dry road pipeline as the boundary, the flow limiting port caliber of the flow limiting plate away from the dry road pipeline increases gradually.

2. The flow uniformizing device of an atomic deposition apparatus according to claim 1, wherein The first flange plate is provided with a plurality of first fixing holes at intervals on the first flange plate.

3. The flow uniformizing device of an atomic deposition apparatus according to claim 2, wherein The first flange plate end surface has sealing gasket.

4. The flow uniformizing device of an atomic deposition apparatus according to claim 2, wherein The flow limiting plate main body part is tubular structure, and the flow limiting plate external contour is consistent with the branch pipeline port internal contour.

5. The flow uniformizing device of an atomic deposition apparatus according to claim 4, wherein The flow limiting plate outer side wall is sleeved with O type ring.

6. The flow uniformizing device of an atomic deposition apparatus according to claim 5, wherein The flow limiting plate side wall is provided with placing groove, and the O type ring is sleeved in the placing groove.

7. The flow uniformizing device of an atomic deposition apparatus according to claim 6, wherein The placing groove adopts dovetail groove.

8. The flow uniformizing device of an atomic deposition apparatus according to claim 1, wherein It further includes adapter pipeline; the adapter pipeline is installed on the dry road pipeline through two matched second flange plates, and the second flange plate is provided with second fixing hole at intervals.

9. The flow uniformizing device of an atomic deposition apparatus according to claim 8, wherein The second flange plate end surface has sealing gasket.

10. The flow uniformizing device of an atomic deposition apparatus according to claim 8, wherein The adapter pipeline is trumpet-shaped, the large-diameter one end of the adapter pipeline is connected with the dry road pipeline, and the small-diameter one end of the adapter pipeline is provided with a plurality of third fixing holes at intervals on the side wall.

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