Radio frequency structure

By designing a centering connection structure and a gold-plated RF rod in the HDPCVD equipment, the problem of increased reflected power caused by poor connection of the bias RF copper rod was solved, thus improving the stability and efficiency of the equipment.

CN223921553UActive Publication Date: 2026-02-17PIOTECH (SHENYANG) SEMICONDUCTOR EQUIPMENT CO LTD
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Patent Information

Application Number
CN202520409937.8
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2025-03-10
Publication Date
2026-02-17
Estimated Expiration
2035-03-10

AI Technical Summary

Technical Problem

In HDPCVD equipment, the bias RF copper rod may bend and deform due to poor connection, which increases the RF reflection power and affects the stability and efficiency of the equipment.

Method used

Design an RF structure including a fixed flange, a matching unit, and an alignment connection structure. The fixed flange and the matching unit are precisely aligned by locating pins and locating holes. A gold-plated layer is applied to the surface of the RF rod to prevent oxidation. An insulating sleeve is fitted around the outer periphery to protect the contact surface.

Benefits of technology

It effectively reduces radio frequency reflection power, improves equipment efficiency and stability, avoids changes in contact resistance, and ensures the stability and accuracy of signal transmission.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model discloses a radio frequency structure which comprises a fixed flange, a matcher and a centering connection structure, and the fixed flange is connected with the matcher through the centering connection structure. By implementing the structure provided by the utility model, the radio frequency reflection power can be effectively reduced, and the working efficiency and the stability of equipment are improved.
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Description

TECHNICAL FIELD

[0001] The utility model relates to a semiconductor equipment technical field especially relates to a radio frequency structure. BACKGROUND

[0002] In the process operation of HDPCVD (High-Density Plasma Chemical Vapor Deposition) equipment, the deposition process and the sputtering process are carried out at the same time. The sputtering process is to attract argon ions to the wafer for directional bombardment through the biasing radio frequency field, so as to effectively prevent defects such as cavities in the film. In order to ensure the stability of the sputtering process, the biasing radio frequency reflection power should be as small as possible, and the preset biasing radio frequency power needs to be transmitted to the reaction chamber efficiently and stably.

[0003] As shown in Figure 1 and Figure 2 , the biasing radio frequency matching device in the HDPCVD equipment is connected with the reaction chamber through the fixed flange. The fixed flange passes through the insulating sleeve and the radio frequency copper rod. Since the matching device and the fixed flange are connected through the quick-release clamp, this connection method cannot ensure that the two are concentric, which may cause the copper rod inside to bend and deform during installation. The bending of the copper rod makes the connection between it and the electrical connection jack in the matching device eccentric, thereby changing the contact area and contact resistance between the two, ultimately leading to an increase in radio frequency reflection power.

[0004] Moreover, when the conductive copper rod transmits radio frequency current, especially when the contact between the copper rod and the matching device is poor, the poorly contacted part may generate a large current, causing local high temperature. High temperature is easy to cause oxidation on the surface of the copper rod, forming an oxide film with poor conductivity. This oxide film increases the impedance of the surface of the copper rod, further increasing the radio frequency reflection power.

[0005] Therefore, it is necessary to design a new structure to effectively reduce the radio frequency reflection power and improve the working efficiency and stability of the equipment. UTILITY MODEL CONTENT

[0006] The utility model aims at overcoming the defects of prior art, and provides a radio frequency structure.

[0007] To solve the above technical problems, the utility model aims at realizing the following technical scheme: providing a radio frequency structure, comprising: a fixed flange, a matching device, and a centering connection structure connected between the fixed flange and the matching device.

[0008] Further technical solutions are as follows: the centering connecting structure comprises a first positioning structure and a second positioning structure, the first positioning structure is arranged on an end surface of the fixed flange close to the adapter, the second positioning structure is arranged on an end surface of the adapter close to the fixed flange, and the first positioning structure is connected with the second positioning structure.

[0009] Further technical solutions are as follows: the first positioning structure comprises a positioning pin, and the second positioning structure comprises a positioning hole.

[0010] Further technical solutions are as follows: the number of the first positioning structures is at least two.

[0011] Further technical solutions are as follows: a through hole is arranged in the fixed flange, a radio frequency rod is arranged in the through hole, and an air isolation layer is arranged on an outer surface of the radio frequency rod.

[0012] Further technical solutions are as follows: the air isolation layer comprises a gold plating layer.

[0013] Further technical solutions are as follows: the thickness of the gold plating layer is 0.1 μm to 5 μm.

[0014] Further technical solutions are as follows: the radio frequency rod is a radio frequency copper rod.

[0015] Further technical solutions are as follows: an insulating sleeve is sleeved on an outer periphery of the radio frequency rod, and the insulating sleeve is arranged in the through hole.

[0016] Further technical solutions are as follows: the fixed flange and the adapter are connected through a clamp.

[0017] The beneficial effects of the utility model compared with the prior art are as follows: the utility model increases the centering connecting structure on the connecting mode of the original fixed flange and the adapter, ensures the stable connection of the fixed flange and the adapter, avoids the change of contact resistance caused by the deformation of the radio frequency copper rod, realizes the effective reduction of radio frequency reflection power, and improves the working efficiency and stability of the equipment.

[0018] The utility model will be further described in combination with the drawings and specific embodiments. DRAWINGS

[0019] In order to more clearly illustrate the technical scheme of the embodiment of the utility model, the drawings needed in the embodiment description will be briefly introduced, and obviously, the drawings in the following description are some embodiments of the utility model, and for those skilled in the art, other drawings can also be obtained according to these drawings without creative labor.

[0020] Figure 1 It is the structure schematic view of the existing semiconductor equipment radio frequency structure.

[0021] Figure 2 A local enlarged schematic view of A in FIG. Figure 1

[0022] Figure 3 A structure schematic view of a radio frequency structure provided by the embodiment of the present application;

[0023] Figure 4 A local enlarged schematic view of B in FIG. Figure 3

[0024] Figure 5 A structure schematic view of a radio frequency rod provided by the embodiment of the present application;

[0025] Explanation of the signs in the figure:

[0026] 10, radio frequency rod; 11, air isolation layer; 20, insulating sleeve; 30, fixing flange; 31, positioning pin; 40, matching device. DETAILED DESCRIPTION

[0027] The technical solutions in the embodiments of the present application will be clearly and completely described with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, rather than all the embodiments of the present application. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative labor fall within the protection scope of the present application.

[0028] It should be understood that, when used in the specification and the appended claims, the terms "comprise" and "include" indicate the existence of the described features, integers, steps, operations, elements, and / or components, but do not exclude one or more other features, integers, steps, operations, elements, components, and / or groups thereof.

[0029] It should also be understood that the terms used in the present application specification are only for the purpose of describing specific embodiments and do not intend to limit the present application. As used in the present application specification and the appended claims, the singular forms "a", "an" and "the" are intended to include the plural forms, unless the context clearly indicates otherwise.

[0030] It should be further understood that the term "and / or" used in the present application specification and the appended claims means any combination of one or more of the associated listed items and all possible combinations, and includes these combinations.

[0031] ​​In the process of the HDPCVD device, the deposition and sputtering processes are carried out simultaneously, and the sputtering is achieved by attracting argon ions to bombard the wafer through a bias radio frequency field to prevent film defects. The bias radio frequency reflected power should be as small as possible to ensure the stability of the sputtering process. The bias radio frequency matcher 40 is connected and fixed to the fixed flange 30 through a quick-release clamp, but such a connection cannot ensure complete concentricity, which may cause the copper rod to be bent and deformed. The bending of the copper rod may cause poor contact of the copper rod with the matcher 40, change the contact area and resistance, and increase the radio frequency reflected power. The poor contact may also cause local high temperature, leading to oxidation of the surface of the copper rod, further increasing the impedance and the radio frequency reflected power.

[0032] Therefore, the embodiment of the utility model provides a radio frequency structure, realize effective reduce radio frequency reflected power, promote the working efficiency and stability of equipment.

[0033] Specifically, the structure is provided with a centering connection structure, which ensures effective transmission of radio frequency signals and reduces reflection through cooperation of the fixed flange 30, the matcher 40 and the centering connection structure; the positioning device in the centering connection structure ensures accurate butt joint of the flange and the matcher 40, optimizes the signal path and further reduces reflection loss; the radio frequency rod 10 is arranged in the flange, and the reflection and interference of signals are reduced through the air isolation layer 11 such as a gold plating layer, and the signal transmission efficiency is improved; the radio frequency rod 10 is made of copper material and has good electrical conductivity, which reduces reflection and improves power transmission capacity; the stability and efficient work of the radio frequency rod 10 are ensured through the insulating sleeve 20 and the through hole design, and external interference is avoided; the fixed flange 30 and the matcher 40 are connected through a clamp, the firmness of the overall structure is enhanced, and long-term stable operation is ensured.

[0034] In order to better understand the above technical solutions, the above technical solutions will be described in detail below in combination with the drawings of the specification and specific embodiments.

[0035] Please refer to Figure 3 and Figure 4 A radio frequency structure comprises a fixed flange 30, a matcher 40 and a centering connection structure, and the centering connection structure is connected between the fixed flange 30 and the matcher 40.

[0036] In the embodiment, the centering connection structure avoids deformation of the radio frequency copper rod caused by bearing transverse external force, which further causes changes in contact resistance and ultimately causes the problem of large radio frequency reflected power, affecting the process performance of the machine and the film quality.

[0037] In an embodiment, please refer to Figure 3 and Figure 4The centering connecting structure comprises a first positioning structure and a second positioning structure, the first positioning structure is arranged on the end surface of the fixing flange 30 close to the adapter 40, and the second positioning structure is arranged on the end surface of the adapter 40 close to the fixing flange 30.

[0038] In an embodiment, referring to Figure 3 and Figure 4 The first positioning structure comprises a positioning pin 31, and the second positioning structure comprises a positioning hole.

[0039] In an embodiment, referring to Figure 3 and Figure 4 The number of the first positioning structures is at least two.

[0040] In an embodiment, referring to Figure 3 and Figure 4 The fixing flange 30 and the adapter 40 are connected through a clamp.

[0041] Specifically, the accurate centering is realized by machining the positioning pin 31 and the positioning hole at the interface of the fixing flange 30 and the adapter 40. The fixing flange 30 is provided with at least two positioning pins 31, and the adapter 40 is machined with corresponding positioning holes. When connected, the positioning pin 31 is inserted into the positioning hole, and then the fixing flange 30 and the adapter 40 are firmly connected together through the quick-release clamp, so as to ensure the accurate centering between the two.

[0042] Since the radio frequency copper rod will be subjected to certain lateral external force in the use process, deformation will occur, and then the contact resistance will change, thereby increasing the radio frequency reflection power. Through the design of the centering connecting structure, the deformation can be effectively avoided, the contact is maintained well, and the reflection power is reduced.

[0043] In addition, the first positioning structure can be arranged as a positioning hole, and the second positioning structure can be arranged as a positioning pin 31.

[0044] In another embodiment, the first positioning structure is a positioning key, and the second positioning structure is a positioning hole. Of course, the first positioning structure can also be arranged as a positioning hole, and the second positioning structure can be arranged as a positioning key. The centering is realized by machining corresponding key grooves on the connecting surface of the fixing flange 30 and cooperating with the positioning keys installed on the adapter 40. The positioning keys inserted into the key grooves can ensure the centering of the two structures and avoid relative deviation in the connecting process.

[0045] In an embodiment, referring to Figure 3 and Figure 4 The fixing flange 30 is provided with a through hole, the radio frequency rod 10 is inserted into the through hole, and the outer surface of the radio frequency rod 10 is provided with an air isolation layer 11.

[0046] In the embodiment, the air isolation layer 11 is arranged to avoid oxidation of the surface of the copper rod, thereby improving the contact performance.

[0047] In an embodiment, referring to Figure 5 The air isolation layer 11 includes a gold plating layer.

[0048] Specifically, the gold plating layer not only prevents the copper rod from direct contact with air to avoid the formation of an oxidation film, but also avoids scratches caused by repeated disassembly and assembly, thereby reducing the increase in contact resistance. This measure helps to reduce the reflected power of the radio frequency and improve the performance of the device.

[0049] In an embodiment, referring to Figure 5 The thickness of the gold plating layer is 0.1 μm to 5 μm.

[0050] Specifically, according to the frequency of the radio frequency signal, the thickness of the gold plating layer should be between 0.1 μm and 5 μm. In actual application, by selecting an appropriate thickness of the gold plating layer, the formation of an oxidation film can be effectively prevented and the stability of electrical contact can be ensured.

[0051] In an embodiment, referring to Figure 5 The radio frequency rod 10 is a radio frequency copper rod; of course, in other embodiments, the radio frequency rod 10 can also be a rod body made of other materials, as long as it can be used in a radio frequency environment.

[0052] In an embodiment, referring to Figure 3 The radio frequency rod 10 is surrounded by an insulating sleeve 20, and the insulating sleeve 20 is arranged in the through hole.

[0053] In order to avoid the formation of an oxidation film and improve the contact performance, a gold plating layer is added to the surface of the radio frequency copper rod to ensure a low reflected power. The radio frequency rod 10 is surrounded by an insulating sleeve 20, which can provide additional protection against damage caused by excessive contact or operation, thereby further ensuring the stability of the reflected power.

[0054] Of course, for the air isolation layer 11, copper alloy or aluminum alloy materials can also be used, as long as the material can achieve the effect of air isolation.

[0055] In summary, in the embodiment, the accurate centering when the fixed flange 30 is connected to the adapter 40 is ensured, and a centering connection structure is added. Two or more positioning pins 31 can be arranged on the fixed flange 30, and a corresponding number of positioning holes can be machined on the adapter 40. When connected, the positioning pins 31 on the fixed flange 30 are first inserted into the positioning holes on the adapter 40 to ensure that the two are centered. Then, the fixed flange 30 and the adapter 40 are fastened together by quick-release clamps to ensure firm and stable connection.

[0056] The design of the centering connecting structure can effectively avoid deformation of the radio frequency copper rod due to bearing of transverse external force, thereby preventing change of contact resistance, avoiding increase of radio frequency reflected power, and further ensuring stability of the equipment and film quality.

[0057] In order to avoid oxidation and scratching of the surface of the radio frequency rod 10, thereby reducing the contact resistance, a gold layer is plated on the surface of the radio frequency rod 10. According to the radio frequency signal frequency, the thickness of the gold plating layer should be controlled between 0.1 μm and 5 μm to optimize the electrical contact performance.

[0058] The gold plating layer isolates the contact of the copper rod with air, prevents the formation of an oxide film on the surface of the copper rod, avoids poor conductivity caused by the oxide film, and thereby increases the radio frequency reflected power. The gold plating layer not only prevents oxidation, but also has certain hardness and toughness, which can effectively avoid increase of the surface contact resistance due to scratching of the copper rod in the repeated disassembly and assembly process, thereby reducing the reflected power.

[0059] That is, by designing the centering connecting structure, the contact resistance is affected by deformation of the radio frequency copper rod; at the same time, the gold plating process is used to effectively prevent oxidation and scratching of the surface of the copper rod, and further reduce the radio frequency reflected power. These measures can significantly improve the performance of the semiconductor equipment and ensure stability of the process performance and film quality of the machine.

[0060] The radio frequency structure described above increases the centering connecting structure on the original connecting mode of the fixed flange 30 and the matching device 40, ensures stable connection of the fixed flange 30 and the matching device 40, avoids change of contact resistance caused by deformation of the radio frequency copper rod, effectively reduces the radio frequency reflected power, and improves the working efficiency and stability of the equipment.

[0061] The above is only a specific embodiment of the present application, but the protection scope of the present application is not limited thereto, and any skilled person in the art can easily think of various equivalent modifications or replacements within the technical range disclosed by the present application, and these modifications or replacements should be covered within the protection scope of the present application. Therefore, the protection scope of the present application should be subject to the protection scope of the claims.

Claims

1. A radio frequency structure, characterized in that, include: The system includes a fixed flange, a matching device, and a centering connection structure. The centering connection structure is connected between the fixed flange and the matching device. The centering connection structure includes a first positioning structure and a second positioning structure. The first positioning structure is provided on the end face of the fixed flange near the matching device, and the second positioning structure is provided on the end face of the matching device near the fixed flange. The first positioning structure and the second positioning structure are connected.

2. The radio frequency structure according to claim 1, characterized in that, The first positioning structure includes a positioning pin; the second positioning structure includes a positioning hole.

3. The radio frequency structure according to claim 2, characterized in that, The number of the first positioning structures is at least two.

4. A radio frequency structure according to any one of claims 1 to 3, characterized in that, The fixed flange has a through hole, and an RF rod is inserted into the through hole. An air-insulating layer is provided on the outer surface of the RF rod.

5. The radio frequency structure according to claim 4, characterized in that, The air barrier layer includes a gold-plated layer.

6. The radio frequency structure according to claim 5, characterized in that, The thickness of the gold plating layer is 0.1 μm to 5 μm.

7. The radio frequency structure according to claim 4, characterized in that, The radio frequency rod is a radio frequency copper rod.

8. The radio frequency structure according to claim 4, characterized in that, The radio frequency rod is covered with an insulating sleeve, which is placed inside the through hole.

9. A radio frequency structure according to any one of claims 1 to 3, characterized in that, The fixed flange and the matching device are connected by a clamp.