Semiconductor multi-field high and low temperature all-in-one machine

Abstract

The utility model discloses a semiconductor multi-field high and low temperature all-in-one machine which comprises a heat transfer medium cycle, a first-stage refrigeration cycle and a second-stage refrigeration cycle, and the heat transfer medium cycle and the first-stage refrigeration cycle share a condenser and a condensation fan. The air conditioner has the advantages that the mixed refrigeration principle of double-working-medium external overlapping and air convection heat exchange is used for refrigeration, the mixed heating principle of electric heating and compressor hot gas bypass is used for heating, and PID intelligent adjustment of the opening degree of a hot gas bypass valve and the rotating speed of a draught fan are adopted for temperature control in the control mode; the temperature of a heat transfer medium can be set, adjusted and stably adjusted in a large range of-100 DEG C to + 200 DEG C, and the energy consumption during temperature control in a full-temperature area is greatly reduced.

Description

TECHNICAL FIELD

[0001] The utility model relates to high and low temperature all -in -one technical field, concretely is semiconductor many field high and low temperature all -in -one. BACKGROUND

[0002] The production and test chuck of semiconductor chip generally use heat transfer medium to control temperature, since different process links need low temperature control and high temperature control, the heat transfer medium generally adopts non-conductive electronic fluorination liquid or silicon-based heat conducting oil, is delivered to the cooling equipment by circulating pump and is recycled back to the refrigerating unit, uses vapor compression refrigeration technology inside the refrigerating unit to cool the heat transfer medium, and then is output by circulating pump, and the cycle is repeated; in the circulation loop, a electric heating device is connected in series with the refrigeration evaporator, and when heating is needed, the electric heating device is used to circulate and heat.

[0003] Under high temperature working condition, the air convection heat exchange refrigeration of the heat transfer medium is directly carried out by using the air-cooled condenser, which can greatly improve the energy efficiency and the stability of the system compared with the vapor compression cycle refrigeration. Under low temperature working condition, the heat is generated by heat gas bypass in the vapor compression cycle, which can not only reduce the power consumption of the compressor, but also improve the temperature rising and falling speed compared with the electric heating method. Through the two two-way proportional valves, the flow output to the cooling equipment can be dynamically adjusted under the condition that the total flow of the heat transfer medium through the heat exchanger is unchanged, which can greatly improve the versatility of the equipment in multiple fields. The main application scenarios are chip thin film deposition, IGBT test, chip sorting and other occasions that require large temperature range control and are sensitive to equipment energy consumption. The heat transfer medium in the chip temperature control chuck generally uses electronic fluorination liquid or silicon-based heat conducting oil, and the temperature range can reach -100 DEG C to +200 DEG C. With the rapid development of domestic semiconductor industry chain, the market urgently needs a stable, energy-saving and efficient high and low temperature unit product that can refrigerate and heat, and the output flow is dynamically adjustable, which can accurately control the temperature of various chip production and test processes. SUMMARY

[0004] The utility model discloses a semiconductor many field high and low temperature all -in -one can solve the problem in the background art.

[0005] To achieve the above object, the utility model provides the following technical scheme: a semiconductor many field high and low temperature all -in -one, including expansion tank, one end of expansion tank is equipped with the electric heater who connects with it, the electric heater both ends are equipped with the medium import pipe and condenser who connects with it respectively, one end of condenser is equipped with the fan, the other end of condenser is equipped with the medium export pipe who connects with it away from the medium import pipe, be equipped with the first pipeline who connects with it between the electric heater and condenser, be equipped with the second pipeline and third pipeline who connect with it respectively on the first pipeline, the other end of third pipeline is connected with one end of condenser.

[0006] Further optimization, one end of the third pipeline is connected with one end of the condenser, and the third pipeline is sequentially provided with an evaporator, a heat exchanger and an evaporative condenser connected therewith.

[0007] Further optimization, the lower ends of the evaporator, the heat exchanger and the evaporative condenser are respectively provided with a pipeline one connected therewith, and the pipeline one is connected with the medium outlet pipe.

[0008] Further optimization, the evaporative condenser is respectively provided with a pipeline two connected therewith at both ends, and the pipeline two is sequentially provided with a first compressor and a second compressor symmetrically arranged.

[0009] Further optimization, the first compressor and the second compressor are respectively provided with a first shock-absorbing pipe, a second shock-absorbing pipe and a third shock-absorbing pipe, a fourth shock-absorbing pipe, and the second shock-absorbing pipe and the fourth shock-absorbing pipe are respectively provided with a first oil separator and a second oil separator.

[0010] Further optimization, the pipeline two connected with the evaporative condenser is sequentially provided with an unloading valve, an energy regulating valve and an expansion container connected therewith.

[0011] Further optimization, the connecting pipeline between the heat exchanger and the evaporative condenser is provided with a liquid injection capillary, a liquid injection electromagnetic valve, a first dry filter, a first electronic expansion valve and a hot gas bypass.

[0012] Further optimization, the evaporative condenser and the condenser are connected through a fourth pipeline, and the fourth pipeline is sequentially provided with a second electronic expansion valve, a second dry filter and a liquid storage tank connected therewith.

[0013] Further optimization, the medium inlet pipe and the medium outlet pipe are respectively provided with a medium inlet valve and a medium outlet valve, a pipeline three connected therebetween is provided with a first proportional regulating valve, the medium outlet pipe is further provided with a circulating pump, and the medium inlet pipe is sequentially provided with a temperature sensor and a second proportional regulating valve.

[0014] Further optimization, the third pipeline is respectively provided with a first electromagnetic valve and a second electromagnetic valve connected therewith. Beneficial effects

[0015] The integrated high and low temperature semiconductor multi-field unit provided by this utility model uses a mixed refrigeration principle of dual working fluid external cascade and air convection heat transfer for cooling, and adopts a mixed heating principle of electric heating and compressor hot gas bypass. The control method adopts PID intelligent adjustment of the opening of the hot gas bypass valve and the fan speed to control the temperature. It can realize the setting, adjustment and stable adjustment of the heat transfer medium temperature within a wide range of -100℃ to +200℃, and greatly reduce the energy consumption when controlling the temperature in the entire temperature range. Attached Figure Description

[0016] Figure 1 This is a schematic plan view of the overall structure of this utility model. Detailed Implementation

[0017] The following are specific embodiments of the present invention, which are described in conjunction with the accompanying drawings. However, the present invention is not limited to these embodiments. Example

[0018] like Figure 1 As shown, the integrated high and low temperature semiconductor multi-field machine includes an expansion chamber 1. An electric heater 2 is connected to one end of the expansion chamber 1. A medium inlet pipe 33 and a condenser 15 are respectively connected to the two ends of the electric heater 2. A fan 16 is provided at one end of the condenser 15. A medium outlet pipe 34 is connected to the other end of the condenser 15 away from the medium inlet pipe 33. A first pipe 35 is provided between the electric heater 2 and the condenser 15. A second pipe 36 and a third pipe 37 are respectively provided on the first pipe 35. The other end of the third pipe 37 is connected to one end of the condenser 15.

[0019] In this embodiment, one end of the third pipe 37 is connected to one end of the condenser 15, and the third pipe 37 is sequentially provided with an evaporator 26, a regenerator 25 and an evaporator-condenser 10 connected thereto.

[0020] The evaporator 26, the regenerator 25 and the evaporator-condenser 10 are respectively provided with a connecting pipe on both sides of the lower end, and the connecting pipe is connected to the medium outlet pipe 34.

[0021] The evaporator condenser 10 has two pipes connected to it at both ends, and the first compressor 7 and the second compressor 12 are symmetrically arranged on the pipes.

[0022] The first compressor 7 and the second compressor 12 are respectively provided with a first shock absorber 6, a second shock absorber 8, a third shock absorber 11, and a fourth shock absorber 13 on both sides. The second shock absorber 8 and the fourth shock absorber 13 are each provided with a first oil separator 9 and a second oil separator 39 on one side.

[0023] The second pipeline connected to the evaporator condenser 10 is sequentially equipped with an unloading valve 5, an energy regulating valve 14, and an expansion container 38.

[0024] The connecting pipe between the regenerator 25 and the evaporator-condenser 10 includes a liquid spraying capillary tube 22, a liquid spraying solenoid valve 21, a first dryer filter 20, a first electronic expansion valve 23, and a hot gas bypass 24.

[0025] Evaporator-condenser 10 and condenser 15 are connected by a fourth pipe 40, and the fourth pipe 40 is sequentially equipped with a second electronic expansion valve 19, a second dryer filter 18 and a liquid storage tank 17 connected thereto.

[0026] Medium inlet pipe 33 and medium outlet pipe 34 are respectively equipped with medium inlet valve 30 and medium outlet valve 28. There is a connecting pipe 3 between medium inlet pipe 33 and medium outlet pipe 34, which is equipped with a first proportional regulating valve 29. A circulating pump 27 is also provided on medium outlet pipe 34. Temperature sensor 31 and second proportional regulating valve 32 are sequentially provided on medium inlet pipe 33.

[0027] The third pipe 37 is equipped with a first solenoid valve 3 and a second solenoid valve 4 connected thereto.

[0028] The main components include three modules: heat transfer medium circulation, primary vapor compression cycle, and secondary vapor compression cycle.

[0029] The heat transfer medium circulation module includes a circulating pump, a two-way proportional control valve, a flow switching solenoid valve, a temperature sensor, an evaporator, an electric heater, and an expansion tank. The first-stage refrigeration cycle module includes a compressor, vibration damping tubes, an oil separator, a condenser, a condenser fan, a dryer filter, a liquid receiver, an energy regulating valve, and an electronic expansion valve. The second-stage refrigeration cycle module includes a compressor, vibration damping tubes, an oil separator, a condenser, an evaporator-condenser, an unloading valve, an expansion vessel, a liquid injection solenoid valve, a liquid injection capillary tube, and an electronic expansion valve. The heat transfer medium circulation and the first-stage refrigeration cycle share a single condenser and condenser fan.

[0030] The heat transfer medium circulation module integrates two refrigeration technologies: air convection heat transfer and vapor compression circulation. When the temperature of the heat transfer medium is low, the refrigeration efficiency of air convection heat transfer is low, so vapor compression refrigeration is used for low-temperature temperature control. When the temperature of the heat transfer medium is high, vapor compression refrigeration is unsatisfactory and energy-intensive, so the system switches to air convection heat transfer to achieve energy saving and improve system reliability.

[0031] Two refrigeration systems are switched using flow-switching solenoid valves. The two refrigeration systems are connected in parallel and each is connected in series with a switching solenoid valve. The two solenoid valves have opposite opening and closing states, and the switching is intelligently achieved by adjusting the temperature of the heat transfer medium.

[0032] It integrates two heating technologies: electric heating and hot gas bypass heating. Hot gas bypass heating involves directly injecting high-temperature, high-pressure Freon gas discharged from a two-stage compressor into the evaporator to heat the heat transfer medium inside the evaporator. This allows the vapor compression cycle to achieve both cooling and heating effects. Hot gas bypass heating can operate independently when temperature control is needed at low temperatures, or it can operate simultaneously with electric heating when rapid temperature rise is required. Compared to systems without hot gas bypass, it is more energy-efficient and highly effective.

[0033] By integrating the heater with the expansion chamber, the bubbles generated by the heating element heating the heat transfer medium can be directly discharged into the expansion chamber through the exhaust pipe. The heat transfer medium in the expansion chamber can also be directly replenished to the heater in a timely manner, which can effectively avoid the risk of the heater burning dry.

[0034] High-temperature temperature control is achieved using variable frequency drive (VFD) technology for fans. A PID algorithm intelligently adjusts the fan motor frequency to control the fan speed, thereby indirectly controlling the temperature of the heat transfer medium in circulation. Compared to constant-speed fans combined with PID temperature control using heating elements, this method eliminates the need for heating elements during the temperature control process, effectively reducing equipment power consumption and operating noise.

[0035] Two parallel two-way proportional control valves are used to precisely regulate the outlet flow rate of the heat transfer medium. Compared with the method of using a circulating pump with variable frequency, this method can achieve dynamic and precise adjustment of the external flow rate from 0% to 100% while ensuring that the total flow rate through the refrigeration system does not change significantly. It has a wider adjustment range, stabilizes the operating conditions of the refrigeration system, and improves the reliability of the equipment.

[0036] The pipeline connections are made by welding, which makes them less prone to leakage. For connections that cannot be welded, flanges, chucks, or other connection methods are used, which make them less prone to leakage under large temperature changes and provide good sealing performance at low temperatures.

[0037] The two-stage refrigeration cycle is designed with a liquid injection solenoid valve and a liquid injection capillary tube, which can inject liquid to cool the inside of the compressor during high-temperature cooling, ensuring that the compressor can operate continuously and stably.

[0038] The primary refrigeration cycle is designed with an energy regulating valve, which can stabilize the suction pressure of the primary compressor and improve the reliability of equipment operation.

[0039] It integrates multiple refrigeration, heating and flow control systems to form a high and low temperature unit that is compatible with semiconductor production testing equipment. It has good industry application and promotion value, and is especially suitable for intelligent automatic temperature control of equipment such as thin film deposition, IGBT testing and chip sorting.

[0040] Finally, it should be noted that the above description is merely a preferred embodiment of this utility model and is not intended to limit the utility model. Although the utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this utility model should be included within the scope of protection of this utility model.

Claims

1. A high and low temperature integrated machine for multiple semiconductor fields, characterized in that: The device includes an expansion tank (1), an electric heater (2) connected to one end of the expansion tank (1), a medium inlet pipe (33) and a condenser (15) connected to the two ends of the electric heater (2), a fan (16) at one end of the condenser (15), a medium outlet pipe (34) connected to the other end of the condenser (15) away from the medium inlet pipe (33), a first pipe (35) connected between the electric heater (2) and the condenser (15), a second pipe (36) and a third pipe (37) connected to the first pipe (35), and the other end of the third pipe (37) connected to one end of the condenser (15).

2. The integrated high and low temperature semiconductor multi-field machine according to claim 1, characterized in that: One end of the third pipe (37) is connected to one end of the condenser (15), and the third pipe (37) is provided with an evaporator (26), a regenerator (25) and an evaporator-condenser (10) connected thereto in sequence.

3. The integrated high and low temperature semiconductor multi-field machine according to claim 2, characterized in that: The evaporator (26), the regenerator (25) and the evaporator-condenser (10) are respectively provided with a connecting pipe on both sides of the lower end, and the connecting pipe is connected to the medium outlet pipe (34).

4. The integrated high and low temperature semiconductor multi-field machine according to claim 3, characterized in that: The evaporator condenser (10) is provided with two pipes connected to its two ends, and the first compressor (7) and the second compressor (12) are arranged symmetrically on the pipes.

5. The integrated high and low temperature semiconductor multi-field machine according to claim 4, characterized in that: The first compressor (7) and the second compressor (12) are respectively provided with a first shock absorber (6), a second shock absorber (8), a third shock absorber (11), and a fourth shock absorber (13) on both sides. The second shock absorber (8) and the fourth shock absorber (13) are each provided with a first oil separator (9) and a second oil separator (39) on one side.

6. The integrated high and low temperature semiconductor multi-field machine according to claim 4, characterized in that: The second pipeline connected to the evaporator condenser (10) is sequentially equipped with an unloading valve (5), an energy regulating valve (14), and an expansion container (38).

7. The integrated high and low temperature semiconductor multi-field machine according to claim 3, characterized in that: The connecting pipe between the regenerator (25) and the evaporator-condenser (10) includes a liquid spraying capillary tube (22), a liquid spraying solenoid valve (21), a first drying filter (20), a first electronic expansion valve (23), and a hot gas bypass (24).

8. The integrated high and low temperature semiconductor multi-field machine according to claim 3, characterized in that: The evaporator condenser (10) is connected to the condenser (15) via a fourth pipe (40), and the fourth pipe (40) is sequentially provided with a second electronic expansion valve (19), a second drying filter (18) and a liquid storage tank (17).

9. The integrated high and low temperature semiconductor multi-field machine according to claim 1, characterized in that: The medium inlet pipe (33) and the medium outlet pipe (34) are respectively provided with a medium inlet valve (30) and a medium outlet valve (28). A connecting pipeline is provided between the medium inlet pipe (33) and the medium outlet pipe (34), and a first proportional regulating valve (29) is provided on it. A circulating pump (27) is also provided on the medium outlet pipe (34). A temperature sensor (31) and a second proportional regulating valve (32) are sequentially provided on the medium inlet pipe (33).

10. The integrated high and low temperature semiconductor multi-field machine according to claim 1, characterized in that: The third pipe (37) is respectively equipped with a first solenoid valve (3) and a second solenoid valve (4) connected thereto.

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