High and low temperature testing device

Abstract

The utility model discloses a high and low temperature testing device which comprises a testing container, an interface assembly and a temperature adjusting assembly, the interface assembly comprises a test interface; a heat preservation cavity is formed in the test container and is used for placing a circuit board assembled with a wireless module; the test interface is arranged on the outer wall of the test container, one end of the test interface is in communication connection with a circuit board in the heat preservation cavity through a wire harness, and the other end is in communication connection with circuit board test equipment; the temperature adjusting assembly is used for adjusting the temperature in the heat preservation cavity so that the temperature in the heat preservation cavity can be increased or decreased to the preset temperature. According to the scheme, performance testing can be carried out on the circuit board assembled with the wireless module at high and low temperatures, the real state of the circuit board assembled with the wireless module at the high and low temperatures can be reflected, and the state of the circuit board assembled with the wireless module at the high and low temperature testing can be simulated; and the performance, reliability and potential problems of the circuit board can be known.

Description

TECHNICAL FIELD

[0001] The utility model relates to electronic product technical field, especially a high and low temperature testing device. BACKGROUND

[0002] The current electronic product reliability requirement not only carries out high and low temperature test to module or electronic component, but also carries out high and low temperature test to circuit board, especially carries out high and low temperature test to the circuit board assembled with module (such as wireless module), so that the real use condition of circuit board under different temperatures can be simulated better. However, the existing high and low temperature testing device can only be used for high and low temperature test of module, cannot be used for high and low temperature test of the circuit board assembled with module (such as communication module), so the real use condition of the circuit board assembled with module under high and low temperature cannot be reflected. SUMMARY

[0003] Therefore, the utility model provides a high and low temperature testing device, can realize performance test to the circuit board assembled with wireless module under high and low temperature, and can reflect the real state of the circuit board assembled with wireless module under high and low temperature.

[0004] To achieve the above object, the utility model provides the following technical scheme:

[0005] A high and low temperature testing device, comprising: test container, interface assembly and temperature adjusting assembly;

[0006] The interface assembly comprises test interface;

[0007] The test container has a heat preservation cavity, and is used for placing the circuit board assembled with wireless module;

[0008] The test interface is arranged on the outer wall of the test container, and one end thereof is communicated with the circuit board in the heat preservation cavity through wire harness, and the other end is used for being communicated with circuit board test equipment;

[0009] The temperature adjusting assembly is used for adjusting the temperature in the heat preservation cavity, so that the temperature in the heat preservation cavity is increased or decreased to preset temperature.

[0010] Preferably, the test container comprises test box and shielding box;

[0011] The test box is arranged in the shielding box, and has the heat preservation cavity;

[0012] The test interface is arranged through the box wall of the shielding box, and the inner end thereof is communicated with the circuit board in the heat preservation cavity of the test box through the wire harness, and the outer end is used for being communicated with the circuit board test equipment; Wherein, the wire harness passes through the test box.

[0013] Preferably, the temperature adjusting assembly is used to flow hot or cold air with preset temperature into the incubation cavity of the test box.

[0014] Preferably, the temperature adjusting assembly comprises two pipe joints and two pipes.

[0015] The two pipe joints are respectively arranged through the wall of the test box and are in communication with the incubation cavity.

[0016] The first end of the two pipes is connected with the outer end of the two pipe joints respectively, and the second end is arranged through the wall of the shielding box; wherein the second end of one pipe is used to flow the hot or cold air, and the second end of the other pipe is used to flow out the hot or cold air.

[0017] Preferably, the test interface comprises a plurality of radio frequency interfaces.

[0018] The wire harness comprises a plurality of radio frequency lines.

[0019] The inner end of the plurality of radio frequency interfaces is connected with the circuit board through the plurality of radio frequency lines respectively, and the outer end is used to be connected with the circuit board test equipment respectively.

[0020] Preferably, the interface assembly further comprises a USB interface.

[0021] The USB interface is arranged through the wall of the shielding box, and the inner end thereof is connected with the circuit board in the incubation cavity through the USB cable, and the outer end thereof is used to be connected with the external computer; wherein the USB cable passes through the test box.

[0022] Preferably, the interface assembly further comprises a power interface.

[0023] The power interface is arranged through the wall of the shielding box, and the inner end thereof is connected with the circuit board in the incubation cavity through the power line, and the outer end thereof is used to be connected with the external power supply; wherein the power line passes through the test box.

[0024] Preferably, the test box comprises a box body, a box cover and a first driving assembly.

[0025] The top of the box body is an open structure, and the inside thereof is used as the incubation cavity.

[0026] The box cover is reversibly arranged on the top of the box body and has switchable first and second states; wherein the box cover covers the top of the box body in the first state, and uncovers the top of the box body in the second state.

[0027] The first driving assembly is arranged on the box body and is used for driving the box cover to switch between the first state and the second state.

[0028] Preferably, the shielding box comprises a box body, a box cover and a second driving assembly.

[0029] The top of the box body is an open structure.

[0030] The box cover is reversibly arranged on the top of the box body and has switchable first and second states; when the box cover is in the first state, the top of the box body is covered, and when the box cover is in the second state, the top of the box body is open.

[0031] The second driving assembly is arranged on the box body and is used for driving the box cover to switch between the first state and the second state.

[0032] Preferably, the first driving assembly or the second driving assembly comprises a cylinder assembly.

[0033] As can be seen from the above technical solutions, the high-low temperature testing device provided by the utility model can realize performance testing of the circuit board assembled with the wireless module under high-low temperature, can reflect the real state of the circuit board assembled with the wireless module under high-low temperature, and can simulate the real state of the circuit board assembled with the wireless module under high-low temperature testing. BRIEF DESCRIPTION OF DRAWINGS

[0034] In order to more clearly illustrate the technical solutions in the embodiments of the utility model or the prior art, the drawings needed to be used in the embodiment or the prior art description will be briefly introduced below, and obviously, the drawings in the following description are only some embodiments of the utility model, and for those skilled in the art, other drawings can also be obtained according to these drawings without creative labor.

[0035] Figure 1 The structure front view of the high-low temperature testing device provided by the embodiment of the utility model;

[0036] Figure 2 The structure side view of the high-low temperature testing device provided by the embodiment of the utility model;

[0037] Figure 3 The structure back view of the high-low temperature testing device provided by the embodiment of the utility model;

[0038] Figure 4 The installation schematic view of the circuit board assembled with the wireless module in the testing box provided by the embodiment of the utility model;

[0039] Figure 5 The structure top view of the testing box in the closed state provided by the embodiment of the utility model;

[0040] Figure 6 The structure side view of the test box in the closed state is provided for the embodiment of the utility model;

[0041] Figure 7 The connection schematic diagram of the high and low temperature test device and external computer, external power supply and circuit board test equipment is provided for the embodiment of the utility model.

[0042] Wherein, 1 is wireless module, 2 is circuit board, 3 is test box, 31 is box body, 32 is box cover, 4 is shielding box, 41 is box body, 42 is box cover, 51 is pipe joint, 6 is radio frequency interface, 7 is USB interface, 8 is external computer, 9 is power supply interface, 10 is external power supply, 11 is first air cylinder, 12 is second air cylinder, 13 is second button, 14 is safety grating, 15 is fixed plate, 16 is pipe interface, 17 is circuit board test equipment, 18 is radio frequency cable, 19 is USB cable, 20 is power line, 21 is hot air, 22 is first pipeline, 23 is first button. Specific implementation

[0043] The technical scheme in the embodiment of the utility model will be clearly and completely described in combination with the drawings in the embodiment of the utility model, and obviously, the described embodiment is only a part of the embodiment of the utility model, not all the embodiments. Based on the embodiment in the utility model, all other embodiments obtained by the person skilled in the art without creative labor belong to the protection scope of the utility model.

[0044] The high and low temperature test device provided by the embodiment of the utility model comprises a test container, an interface assembly and a temperature adjusting assembly.

[0045] The interface assembly comprises a test interface.

[0046] As shown in the drawing, Figure 4 The test container has a heat preservation cavity, and is used for placing the circuit board 2 assembled with the wireless module 1.

[0047] The test interface is arranged on the outer wall of the test container, and one end thereof is in communication connection with the circuit board 2 in the heat preservation cavity through a wire harness, and the other end is used for communication connection with the circuit board test equipment 17.

[0048] The temperature adjusting assembly is used for adjusting the temperature in the heat preservation cavity, so that the temperature in the heat preservation cavity is increased or decreased to a preset temperature.

[0049] It should be noted that the test container can be opened and closed, facilitating the placing and taking out of the circuit board 2 assembled with the wireless module 1, and the heat preservation cavity is arranged in the test container and is used for placing the circuit board 2 assembled with the wireless module 1; wherein, Figure 4As shown, the number of wireless modules 1 (which can be 4G / 5G wireless modules) can be two, and can be welded on the circuit board 2, which is equivalent to the carrier board of the wireless module 1, and the circuit board 2 can be fixed in the insulation cavity of the test container through two fixing plates 15; of course, the test container can be designed according to the area and height of the circuit board 2;

[0050] The test interface can be disposed through the wall of the test container (such as the rear wall), and one end (such as the inner end) is in communication connection with the circuit board 2 in the insulation cavity of the test container through the wire harness, and the other end (such as the outer end) can also be in communication connection with the circuit board test equipment 17 through the wire harness, so that the circuit board 2 in the insulation cavity of the test container and the external circuit board test equipment 17 are in communication connection; wherein, the test interface can include a plurality of test sub-interfaces, and is in communication connection with the circuit board 2 and the circuit board test equipment 17 through the corresponding wire harness, which can be used to test the performance of the circuit board 2 under high and low temperature (different temperature conditions), and in fact can be used to test the performance of the wireless module 1 welded on the circuit board 2 under high and low temperature, such as output power, gain, phase noise and other performance, accordingly, the circuit board test equipment 17 is actually a test equipment for testing the performance of the wireless module 1 welded on the circuit board 2; of course, the circuit board test equipment 17 tests the performance of the circuit board 2, which can adopt the existing test method, which will not be described here;

[0051] The temperature adjusting assembly is used to adjust the temperature in the insulation cavity of the test container, so that the temperature in the insulation cavity of the test container rises or falls to the preset temperature (specified temperature); wherein, the temperature adjusting assembly can be a heating and cooling assembly arranged in the insulation cavity of the test container, and can also be used to circulate hot medium (such as hot gas) or cold medium (such as cold gas) with a preset temperature into the insulation cavity of the test container, details can be seen in the following description. In addition, the above-mentioned circuit board 2 can also be powered by an external power supply, details can be seen in the following description.

[0052] That is, the present scheme is designed in this way, so that the performance test of the circuit board 2 assembled with the wireless module 1 under high and low temperature can be realized, which can reflect the real state of the circuit board 2 assembled with the wireless module 1 under high and low temperature, and can also simulate the real state of the circuit board 2 assembled with the wireless module 1 under high and low temperature test; of course, it can also help to understand the performance, reliability and potential problems of the circuit board 2, and can also be beneficial to improve the quality and reliability of the circuit board 2, so as to obtain competitive advantage in the market. Of course, the high and low temperature test device can also be designed to test the performance of different models of the above-mentioned circuit board 2, so as to be compatible with the performance test of different models of the circuit board 2.

[0053] In the present scheme, as shown in Figure 1 The test container includes a test box 3 and a shielding box 4;

[0054] The test box 3 is arranged in the shielding box 4 and has a heat preservation cavity;

[0055] The test interface is arranged through the box wall of the shielding box 4, and the inner end thereof is connected in communication with the circuit board 2 in the heat preservation cavity of the test box 3 through a wire harness, and the outer end thereof is used for being connected in communication with the circuit board test equipment 17; wherein the wire harness passes through the test box 3.

[0056] It should be noted that, as shown in Figure 2 The shielding box 4 can be a square shielding box and can be opened and closed, so as to facilitate loading of the test box 3 and loading and unloading of the circuit board 2; wherein the shielding box 4 can be opened and closed through a support rod assembly (i.e. a second driving assembly described below); the test box 3 can be a square test box and can also be opened and closed, so as to facilitate loading and unloading of the circuit board 2, and has a heat preservation cavity inside; the test interface can be arranged through the side box wall (such as the rear side box wall) of the shielding box 4, and the inner end thereof can be connected in communication with the circuit board 2 in the heat preservation cavity of the test box 3 through the wire harness passing through the test box 3, and the outer end thereof can be connected in communication with the circuit board test equipment 17 through the externally arranged wire harness; wherein the side box wall (such as the rear side box wall) of the test box 3 can be provided with a wire harness passing hole.

[0057] That is to say, the test container not only has the test container body (i.e. the test box 3), but also has the shielding box 4 externally arranged on the test container body, so that the test container body has an electromagnetic wave shielding function, can prevent electromagnetic wave leakage in the test container body, or can prevent the test container body from being interfered by external electromagnetic waves, and ensures the precision of performance test of the circuit board 2 under high and low temperatures; wherein the shielding level of the shielding box 4 can be 60-70dB; of course, the above test container is thus designed, and the structure and function are clear.

[0058] Specifically, the temperature adjusting assembly is used for circulating hot air or cold air with a preset temperature into the heat preservation cavity of the test box 3, so that the temperature in the heat preservation cavity of the test box 3 can be raised or lowered to the preset temperature, and the heating and cooling assembly can be additionally arranged in the heat preservation cavity of the test box 3, which not only makes the temperature adjustment in the heat preservation cavity of the test box 3 convenient, but also makes the high and low temperature test device simple in structure.

[0059] Further, as shown in Figure 4 The temperature adjusting assembly comprises two pipe joints 51 and two pipes;

[0060] The two pipe joints 51 are arranged through the box wall of the test box 3 respectively and are in communication with the heat preservation cavity;

[0061] The first ends of the two pipes are connected with the outer ends of the two pipe joints 51 respectively, and the second ends thereof are arranged through the box wall of the shielding box 4; wherein the second end of one pipe is used for inflow of hot air or cold air, and the second end of the other pipe is used for outflow of hot air or cold air.

[0062] It should be noted that, as shown in Figure 3 , the interface assembly can further include two pipe interfaces 16, which are respectively arranged through the side walls (such as the rear side walls) of the shielding box 4, and the inner ends of the two pipe interfaces 16 are connected with the second ends of the two pipes one by one, and the outer ends are used to be connected with the two first pipes 22 (such as Figure 7 ) one by one; wherein the outer end of one pipe interface 16 is used for flowing in hot gas (such as hot air) or cold gas (such as cold air), and the outer end of the other pipe interface 16 is used for flowing out hot gas or cold gas, so that the hot gas or cold gas realizes circulating flow in the heat preservation cavity of the test box 3, and then the temperature in the heat preservation cavity of the test box 3 is raised or lowered to the preset temperature; of course, the above temperature adjusting assembly is designed to have the characteristics of simple structure and convenient temperature adjustment.

[0063] Further, as shown in Figure 3 , the test interface includes a plurality of radio frequency interfaces 6;

[0064] The wire harness includes a plurality of radio frequency lines;

[0065] The inner ends of the plurality of radio frequency interfaces 6 are connected with the circuit board 2 one by one through the plurality of radio frequency lines, and the outer ends are used to be connected with the circuit board test equipment 17 one by one.

[0066] It should be noted that the radio frequency interface 6 can be used as a test sub-interface of the test interface, and is used to transmit the radio frequency signal of the circuit board 2, and the inner ends of the plurality of radio frequency interfaces 6 are connected with the circuit board 2 one by one through the plurality of radio frequency lines, and the outer ends are also connected with the circuit board test equipment 17 one by one through the plurality of radio frequency lines, so that the plurality of performances of the circuit board 2 under high and low temperature conditions can be tested, and in fact the plurality of performances of the wireless module 1 soldered on the circuit board 2 can be tested, such as the frequency offset of GPS, the power / spectrum of GSM, and the power / spectrum of EDGE; wherein, as shown in Figure 3 , the number of radio frequency interfaces 6 can be 20, and they can be arranged in two rows through the side walls (such as the rear side walls) of the shielding box 4, and the number of radio frequency lines is also 20, that is, the inner ends of the 20 radio frequency interfaces 6 are connected with the circuit board 2 one by one through the 20 radio frequency lines, and the outer ends are also connected with the circuit board test equipment 17 one by one through the 20 radio frequency lines, to ensure the stability of the plurality of performance tests of the circuit board 2 under high and low temperature conditions; wherein, as shown in Figure 7 , the radio frequency line is a radio frequency cable 18, the circuit board test equipment 17 can be CMW100 (wireless communication test equipment), and the circuit board 2 can be provided with 20 communication ports (such as USB ports) Figure 7(not shown in the image), one half of the communication ports serves as the communication port of one wireless module 1, and the other half serves as the communication port of another wireless module 1. Each communication port of the circuit board 2 is connected to the inner end of the corresponding RF interface 6 via a corresponding RF cable 18. Of course, the test container includes a shielding box 4, which can prevent the RF signal of the circuit board 2 from leaking and can also prevent the RF signal of the circuit board 2 from being interfered with by external electromagnetic waves.

[0067] In this plan, such as Figure 3 As shown, the interface component also includes a USB interface 7;

[0068] The USB interface 7 is installed through the wall of the shielded box 4, and its inner end is connected to the circuit board 2 located in the heat preservation cavity via a USB cable, while its outer end is used to connect to an external computer 8; the USB cable passes through the test box 3.

[0069] It should be noted that the USB interface 7 can be installed through the side wall (such as the rear side wall) of the shielding box 4. The inner end of the USB interface 7 is connected to the circuit board 2 located in the insulation cavity via the USB cable 19. Figure 7 As shown, the external end of the USB interface 7 can also be connected to an external computer 8 via a USB cable 19, so that various data of the circuit board 2 can be quickly transmitted to the external computer 8; wherein, the USB cable 19 located in the shielded box 4 passes through the test box 3 and is connected to the USB port of the circuit board 2.

[0070] Specifically, such as Figure 3 As shown, the interface component also includes a power interface 9;

[0071] The power interface 9 is installed through the wall of the shielded box 4, and its inner end is electrically connected to the circuit board 2 located in the heat preservation cavity via the power cord 20, while its outer end is used to electrically connect to the external power supply 10; wherein, the power cord 20 passes through the test box 3.

[0072] It should be noted that, as Figure 3 As shown, the power interface 9 can be installed through the side wall (such as the rear side wall) of the shielded box 4. The inner end of the power interface 9 is electrically connected to the circuit board 2 located in the insulation cavity via the power cable 20. Figure 7 As shown, the external end of the power interface 9 can also be electrically connected to the external power supply 10 via the power cord 20, thereby powering the circuit board 2 and enabling better performance testing of the circuit board 2 under high and low temperature conditions; wherein, the power cord 20 passes through the side wall of the test box 3 and is electrically connected to the power port of the circuit board 2.

[0073] Furthermore, such as Figure 6 As shown, the test box 3 includes: a box body 31, a box cover 32, and a first drive assembly;

[0074] As shown in Figure 4 , the top of the box body 31 is an open structure, and its inner cavity is used as a heat preservation cavity;

[0075] The box cover 32 is reversibly arranged on the top of the box body 31, and has a first state and a second state which can be switched; wherein, the box cover 32 covers the top of the box body 31 in the first state, and opens the top of the box body 31 in the second state;

[0076] The first driving assembly is arranged on the box body 31, and is used to drive the box cover 32 to switch between the first state and the second state.

[0077] It should be noted that, as shown in Figure 4 , the top of the box body 31 is an open structure, and its inner cavity is used as a heat preservation cavity; the box cover 32 is reversibly arranged on the top of the rear side wall of the box body 31 through a hinge, and has a first state (i.e. closed state) and a second state (i.e. open state) which can be switched; the first driving assembly is arranged on the box body 31, and is used to drive the box cover 32 to flip, so that the box cover 32 switches between the first state and the second state, thereby realizing automatic closing and automatic opening of the box cover 32; wherein, the first driving assembly can be a first telescopic rod assembly. That is to say, the above test box 3 is designed to have the characteristics of simple structure, convenient opening and closing, etc. As shown in Figure 4 , two pipe joints 51 are respectively arranged through the opposite two side walls (such as the left side wall and the right side wall) of the box body 31.

[0078] Further, as shown in Figure 2 , the shielding box 4 includes a box body 41, a box cover 42, and a second driving assembly;

[0079] The top of the box body 41 is an open structure;

[0080] The box cover 42 is reversibly arranged on the top of the box body 41, and has a first state and a second state which can be switched; wherein, the box cover 42 covers the top of the box body 41 in the first state, and opens the top of the box body 41 in the second state;

[0081] The second driving assembly is arranged on the box body 41, and is used to drive the box cover 42 to switch between the first state and the second state.

[0082] It should be noted that the structures of the box body 41 and the box cover 42 can refer to Figure 1 and Figure 2 , the top of the box body 41 is an open structure, and its inner cavity is used for placing the test box 3; wherein, as shown in Figure 2As shown, the top of the box body 41 is inclined, and the bottom of the box cover 42 is also inclined and can be closed with the inclined structure of the top of the box body 41; the box cover 42 is reversibly arranged on the top of the rear side wall of the box body 41 through a hinge and has a switchable first state (i.e. closed state) and a second state (i.e. open state); the second driving assembly is arranged on the box body 41 and is used to drive the box cover 42 to reverse, so that the box cover 42 switches between the first state and the second state, thereby realizing automatic closing and automatic opening of the box cover 42; wherein the second driving assembly can be a second telescopic rod assembly. That is, the shielding box 4 is designed as above, which has the characteristics of simple structure, convenient opening and closing, etc.

[0083] In the present scheme, the first driving assembly and / or the second driving assembly includes a cylinder assembly. Wherein, as shown in Figure 6 The first driving assembly includes two first cylinders 11, as shown in Figure 5 One end (fixed end) of the two first cylinders 11 is rotatably arranged on the opposite two side walls (such as left and right side walls) of the box body 31, and the other end (movable end) is rotatably connected with the opposite two side walls of the box cover 32, that is, through the extension and contraction of the movable end of the two first cylinders 11, the box cover 32 can be realized by reversing opening and closing; in addition, as shown in Figure 1 The second driving assembly includes two second cylinders 12, as shown in Figure 1 One end (fixed end) of the two second cylinders 12 is rotatably arranged on the opposite two side walls (such as left and right side walls) of the box body 41, and the other end (movable end) is rotatably connected with the opposite two side walls (such as left and right side walls) of the box cover 42, that is, through the extension and contraction of the movable end of the two second cylinders 12, the box cover 42 can be realized by reversing opening and closing.

[0084] In addition, an electromagnetic valve can be provided for each first cylinder 11 and each second cylinder, that is, the opening and closing of the above-mentioned cylinder is controlled through the electromagnetic valve; in addition, in order to control the above-mentioned two second cylinders 12, as shown in Figure 1 A first button 23 (which can be a red button) and two second buttons 13 (which can both be green buttons) are arranged on the outer wall (such as the front side wall) of the box body 41; wherein the operation of the electromagnetic valve of the two second cylinders 12 is controlled through the first button 23, so that the two second cylinders 12 are elongated, that is, the box cover 42 can be controlled to open by pressing the first button 23; in addition, the other operation of the electromagnetic valve of the two second cylinders 12 is controlled through the two second buttons 23, so that the two second cylinders 12 are shortened, that is, the box cover 42 can be controlled to close by pressing the two second cylinders 12 at the same time. At the same time, as shown in Figure 1 In order to ensure the safe closing of the shielding box, a safety light barrier 14 can be arranged on the top of the left and right side walls of the box body 41; wherein the safety light barrier 14 is arranged to prevent the shielding box 4 from clamping the hands of the operator when closing during the process of taking and placing the circuit board 2.

[0085] That is, the first driving assembly and the second driving assembly can be both double-cylinder assemblies, having the characteristics of simple structure and convenient driving; of course, the first driving assembly and the second driving assembly can also adopt hydraulic rod assemblies.

[0086] In addition, it also needs to be explained that the working process of the high and low temperature test device is as follows:

[0087] 1. Press the first button 23 to open the shielding box, and place the to-be-tested circuit board into the test box;

[0088] 2. Close the test box cover through the first cylinder, and then press the two second buttons 13 with both hands;

[0089] 3. Close the shielding box cover and perform the test, and then press the first button 23 after the test is completed;

[0090] 4. The shielding box cover is in an open state;

[0091] 5. Open the test box cover through the first cylinder;

[0092] 6. Take out the to-be-tested circuit board.

[0093] In addition, during the high and low temperature test process, the performance test of the to-be-tested circuit board is usually realized through the following steps:

[0094] 1. Test preparation

[0095] Equipment selection: select the RF test equipment CMW100 and use a computer for recording;

[0096] Sample installation: install the to-be-tested circuit board into the temperature test box, and ensure that all connections are normal;

[0097] 2. Room temperature baseline test (25°C)

[0098] Initial test: test and record the performance indicators of the to-be-tested circuit board, such as output power, frequency stability and signal integrity, at room temperature;

[0099] Real-time monitoring: continuously record the RF performance indicators, including output power, gain, phase noise, etc., during the entire test process;

[0100] Stability test: maintain the test at room temperature for a period of time (such as 8 minutes) to evaluate long-term stability;

[0101] 3. High temperature test

[0102] Set high temperature: set the temperature of the test box to the required high temperature (85°C);

[0103] Step-up temperature: Gradually increase the temperature and perform performance tests at the high temperature (85°C) point;

[0104] Real-time monitoring: Continuously record RF performance indicators, including output power, gain, phase noise, etc., throughout the test process;

[0105] Stability test: Keep the test at high temperature for a period of time (e.g. 17 minutes) to evaluate long-term stability;

[0106] 4. Low temperature test

[0107] Set low temperature: Adjust the incubation cavity of the test box to the required low temperature (-40°C);

[0108] Step-down temperature: Similar to high temperature test, gradually reduce the temperature and perform performance tests at the low temperature (-40°C);

[0109] Real-time monitoring: Continuously record RF performance indicators, including output power, gain, phase noise, etc., throughout the test process;

[0110] Stability test: Keep the test at low temperature for a period of time (e.g. 20 minutes) to observe performance changes; where each RF channel is tested for 40 seconds;

[0111] 5. Result analysis

[0112] Data comparison: Compare the performance data at high and low temperatures with the set data;

[0113] Identify degradation: Observe for any signs of performance degradation, such as signal distortion, output power drop, or frequency drift.

[0114] Among them, the circuit board assembled with the communication module is generally first tested at room temperature, then at high temperature, and finally at low temperature. If the test fails at room temperature, there is no need to test at high and low temperatures.

[0115] In addition, in a continuous reliability test, the following 23 failure cases were found:

[0116]

[0117] In addition, high and low temperature performance tests on circuit boards assembled with modules are very important for the design and production of electronic equipment:

[0118] 1. Ensure that the circuit board can operate normally under different temperature conditions, which is crucial for long-term reliability;

[0119] 2. Can identify potential failure points that are not easily found under normal operating conditions;

[0120] 3. Test the compatibility of PCBs and their components under temperature changes, ensuring they do not degrade or fail under thermal stress;

[0121] 4. Help identify any gas outgassing or thermal expansion issues that could affect solder joints and other connections;

[0122] 5. Identify vulnerabilities early in the design process, allowing for modifications to prevent costly recalls or failures in the field;

[0123] 6. Minimize warranty claims by ensuring products are robust and durable;

[0124] 7. Verify that circuit boards meet performance specifications within the expected temperature range;

[0125] 8. Ensure that critical functions of the circuit board, such as signal integrity and power delivery, are maintained at high and low temperatures;

[0126] 9. Provide insights into the thermal behavior of the circuit board, facilitating better design decisions and improvements in overall system performance.

[0127] That is, the core improvement of the present proposal is to realize the design and application of a high-low temperature test device for circuit boards assembled with wireless communication modules, and has the following effects:

[0128] 1. Reliability assessment: Ensuring that the circuit board functions properly under different temperature conditions and identifying potential failure points early, which helps to extend product life;

[0129] 2. Thermal management: Effective thermal management not only improves heat dissipation but also optimizes component placement and PCB layout, reducing the risk of hotspots;

[0130] 3. Performance verification: By verifying the performance of the circuit board under extreme temperatures, ensure the reliability of its key functions under various operating conditions;

[0131] 4. Material compatibility: Testing the performance of materials under thermal stress can identify potential issues affecting solder joints and connections early, avoiding subsequent failures;

[0132] 5. Compliance and standards: Following industry standards can improve market acceptance of products and provide necessary compliance documents to meet customer and regulatory requirements;

[0133] 6. Cost reduction: Identifying vulnerabilities early in the design process can not only avoid costly field failures but also minimize warranty claims and reduce overall costs;

[0134] 7. Market competitiveness: Improving product quality and reliability can provide a competitive advantage in the market and increase customer trust;

[0135] 8. Design optimization: Provides insights into thermal behavior to help make more effective design decisions, resulting in improved overall system performance.

[0136] Overall, temperature performance testing is a critical step in ensuring that electronic devices operate reliably under a variety of environmental conditions, ultimately leading to better product quality and customer satisfaction.

[0137] The various embodiments described in this specification are presented for the purpose of illustration and description. Each of the embodiments highlights a different aspect of the disclosure, and the embodiments are not mutually exclusive. The same or similar elements are denoted by the same or similar reference signs.

[0138] The above description of disclosed embodiments is intended to enable those skilled in the art to make or use the application. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein can be applied to other embodiments without departing from the spirit or scope of the application. Thus, the present application is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A high-low temperature test device, characterized by, The application relates to a test container, an interface assembly and a temperature adjusting assembly. The interface assembly comprises a test interface. The test container has a heat preservation cavity, and is used for placing a circuit board (2) assembled with a wireless module (1); The test interface is arranged on the outer wall of the test container, and one end of the test interface is connected with the circuit board (2) in the heat preservation cavity through a wire harness, and the other end is used for being connected with a circuit board test equipment (17); The temperature adjusting assembly is used for adjusting the temperature in the heat preservation cavity, so that the temperature in the heat preservation cavity is increased or decreased to a preset temperature. The test container comprises a test box (3) and a shielding box (4).

2. The high-low temperature test device of claim 1, wherein, The test box (3) is arranged in the shielding box (4) and has the heat preservation cavity; The test interface is arranged through the box wall of the shielding box (4), and the inner end of the test interface is connected with the circuit board (2) in the heat preservation cavity of the test box (3) through the wire harness, and the outer end is used for being connected with the circuit board test equipment (17); wherein the wire harness passes through the test box (3). The temperature adjusting assembly is used for circulating hot air or cold air with a preset temperature into the heat preservation cavity of the test box (3).

3. The high-low temperature test device of claim 2, wherein, The temperature adjusting assembly comprises two pipe joints (51) and two pipes.

4. The high-low temperature test device of claim 3, wherein, The two pipe joints (51) are arranged through the box wall of the test box (3) respectively, and are communicated with the heat preservation cavity; The first ends of the two pipes are connected with the outer ends of the two pipe joints (51) respectively, and the second ends are arranged through the box wall of the shielding box (4); wherein the second end of one pipe is used for inflowing the hot air or the cold air, and the second end of the other pipe is used for outflowing the hot air or the cold air. The test interface comprises a plurality of radio frequency interfaces (6).

5. The high-low temperature test device of claim 2, wherein, The wire harness comprises a plurality of radio frequency lines. The inner ends of the plurality of radio frequency interfaces (6) are connected with the circuit board (2) through the plurality of radio frequency lines respectively, and the outer ends are used for being connected with the circuit board test equipment (17) respectively. The interface assembly further comprises a USB interface (7).

6. The high-low temperature test device of claim 2, wherein, The USB interface (7) is arranged through the box wall of the shielding box (4), and the inner end of the USB interface (7) is connected with the circuit board (2) in the heat preservation cavity through a USB cable, and the outer end is used for being connected with an external computer (8); wherein the USB cable passes through the test box (3). The interface assembly further comprises a power interface (9).

7. The high-low temperature test device of claim 2, wherein, The power interface (9) is arranged through the box wall of the shielding box (4), and the inner end of the power interface (9) is connected with the circuit board (2) in the heat preservation cavity through a power line (20), and the outer end is used for being connected with an external power supply (10); wherein the power line (20) passes through the test box (3). The test box (3) comprises a box body (31), a box cover (32) and a first driving assembly.

8. The high-low temperature test device of claim 2, wherein, The top of the box body (31) is of an open structure, and the inside of the box body (31) is used as the heat preservation cavity. ​ The box cover (32) is reversibly arranged on the top of the box body (31) and has switchable first and second states; when in the first state, the box cover (32) covers the top of the box body (31), and when in the second state, the box cover (32) uncovers the top of the box body (31); The first driving assembly is arranged on the box body (31) and is used to drive the box cover (32) to switch between the first and second states.

9. The high-low temperature test device of claim 2, wherein, The shielding box (4) comprises a box body (41), a box cover (42) and a second driving assembly. The top of the box body (41) is of an open structure; The box cover (42) is reversibly arranged on the top of the box body (41) and has switchable first and second states; when in the first state, the box cover (42) covers the top of the box body (41), and when in the second state, the box cover (42) uncovers the top of the box body (41); The second driving assembly is arranged on the box body (41) and is used to drive the box cover (42) to switch between the first and second states.

10. The high-low temperature test device of claim 8 or 9, wherein, The first driving assembly or the second driving assembly comprises a cylinder assembly.

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