Chip testing device
By incorporating a knob lock and top cover design, the problem of not being able to quickly exit after chip testing was solved, enabling rapid exit and automatic power-off, thus improving testing efficiency and safety.
Patent Information
- Application Number
- CN202520342590.X
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-02-28
- Publication Date
- 2026-02-17
- Estimated Expiration
- 2035-02-28
AI Technical Summary
Existing chip testing equipment cannot quickly eject the chip from the test socket after testing, resulting in low testing efficiency and potential safety hazards.
A chip testing device was designed, which adopts a knob lock and top cover structure. The locking connection is released by rotating the knob lock, and the top cover is flipped upward. The elastic restoring force of the conductive post and spring is used to push the chip out of the placement slot quickly, and the electrical connection is disconnected during the exit process.
It enables rapid chip ejection, improving testing efficiency, and automatically cuts off power during the ejection process, ensuring testing safety.
Smart Images
Figure CN223926566U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model relates to a chip testing device belongs to chip testing equipment field. BACKGROUND
[0002] In the chip production process, due to manufacturing process and other factors, there may be some defective chips, and the chip testing device can be used to screen the chips on a large scale, distinguish qualified chips and unqualified chips, and ensure that only the chips of qualified quality can enter the next production link or be delivered to the customer, so that the chip testing device is needed to detect various performance parameters of the chip, for example, the working frequency, transmission delay, etc. of the digital chip can be detected, and for analog chips, the gain, bandwidth, noise and other indicators can be tested. Through these tests, it can be determined whether the chip can work normally under the specified performance requirements, and the manual cover test seat is a commonly used chip testing device.
[0003] The basic principle of the manual cover test seat is to connect the pins of the chip with the internal circuit of the test seat through physical contact, so as to realize the input and output of signals, and then test the function and performance of the chip. In the prior art, the positioning area of the manual cover test seat is in a groove shape, and the positioning area is provided with conductive contacts matched with the pins of the chip. When the chip is placed in the inside of the positioning area, the top cover of the manual cover test seat needs to be covered on the top of the test seat to provide insulation protection for the staff. However, after the test is completed, the chip cannot be quickly pushed out from the positioning area and is still in the state of being powered on, so the staff needs to turn off the power separately before taking out the chip, thereby reducing the chip testing efficiency.
[0004] Therefore, the utility model provides a chip testing device to solve the above problems. UTILITY MODEL CONTENTS
[0005] In view of the deficiencies in the prior art, the utility model aims to provide a chip testing device to solve the problem that the chip cannot be quickly withdrawn from the inside of the test seat after the chip testing is completed.
[0006] In order to achieve the above purpose, the utility model is implemented by the following technical scheme: a chip testing device, comprising a test seat, a top cover and a knob lock, the top cover is hinged to the top of the test seat, the knob lock is rotatably installed on the top of the top cover, a placing groove is formed in the inside of the test seat and at the bottom of the top cover, connecting columns are fixedly installed around the bottom of the test seat, and a power-on structure is embedded at the bottom of the inner wall of the placing groove.
[0007] Further, a through hole is formed between the top of the knob lock and the bottom of the top cover, and a conductive block is embedded at the top end of each connecting column.
[0008] Further, the power supply structure comprises a placing seat and two mounting grooves, the placing seat is embedded to the bottom of the placing groove, the bottom of the placing seat is embedded with a conductive ring, two mounting grooves are arranged in the inside of the test seat and below the conductive ring, the two sides of the bottom of the conductive ring and inside the two mounting grooves are fixedly installed with conductive columns, the bottom of the two conductive columns is fixedly installed with a conductive rod, the outside of the conductive rod and between the bottom of the conductive column and the top of the conductive block is sleeved with a spring.
[0009] Further, the outer surface of the conductive column and the inner wall of the mounting groove are matched with each other, and the placing groove is communicated with the through hole.
[0010] Further, the top center of the placing seat and the bottom center of the conductive ring are provided with a conductive groove, and the conductive groove is communicated with the placing groove.
[0011] Further, one end of the spring is fixedly connected with the bottom end of the conductive column, and the other end of the spring is fixedly connected with the top of the conductive block.
[0012] The beneficial effects of the utility model are as follows:
[0013] By rotating the knob lock in reverse, the locking connection between the top cover and the test seat is released, the top cover is turned up, the spring at the bottom of the conductive column is compressed due to the downward movement of the conductive column, when the top cover is turned up and the placing groove is opened, the two springs are elastically restored, so that the two conductive columns are pushed upward and the placing seat is pushed upward, so that the chip can be quickly pushed out from the inside of the placing groove, the chip can be quickly taken out by manual for next test, and the chip test work efficiency is effectively improved.
[0014] When the chip is pushed out by the upward movement of the conductive column, the conductive rod is driven away from the conductive block, so that the power connection between the conductive block, the conductive rod, the conductive column, the conductive ring and the chip is released, the chip is in power-off state, manual power-off is not needed, and the safety of chip test work is effectively improved. BRIEF DESCRIPTION OF DRAWINGS
[0015] Other features, objects and advantages of the utility model will become more apparent by reading the following detailed description of non-limiting embodiments with reference to the accompanying drawings:
[0016] Figure 1 It is a perspective view of the chip test device of the utility model;
[0017] Figure 2 It is a main sectional view of the chip test device of the utility model;
[0018] Figure 3 It is another structure schematic main sectional view of the chip test device of the utility model;
[0019] Figure 4 The utility model discloses a top view of a chip testing device.
[0020] In the figure: 1, test seat, 2, top cover, 3, knob lock, 4, placing groove, 5, connecting column, 6, conductive block, 7, power-on structure, 8, through -hole, 71, placing seat, 72, conductive ring, 73, conductive column, 74, installation groove, 75, conductive rod, 76, spring, 77, conductive groove. DETAILED DESCRIPTION
[0021] In order to make the technical means, creation features, purposes and effects realized by the utility model easy to understand, the utility model is further described below in combination with specific embodiments.
[0022] Please refer to Figures 1-4 The utility model provides a technical scheme: a chip testing device, including test seat 1, top cover 2 and knob lock 3, top cover 2 is hinged in the top of test seat 1, knob lock 3 is rotatably installed in the top of top cover 2, the inside of test seat 1 and the bottom of top cover 2 are equipped with placing groove 4, the bottom of the inner wall of placing groove 4 is embedded with power-on structure 7, placing groove 4 is the positioning area for placing chip, test seat 1 and top cover 2 are made of plastics, have good insulating property and mechanical property, can keep stable structure and performance under the adverse environment such as high temperature, high humidity, after the clockwise rotation of knob lock 3, can cooperate top cover 2 and press in the top of test seat 1 and then lock and fix, the knob outer surface of knob lock 3 is toothed, thereby improve the friction of the rotation of knob lock 3, and the knob top of knob lock 3 is all provided with steering arrow mark, convenient for prompting the switch state of knob lock 3 at this time, the size of placing groove 4 is adapted to the size of chip, the bottom of chip testing device is fixed on the chip testing platform through the connecting column 5 of the bottom of test seat 1, and the top of knob lock 3 and the bottom of top cover 2 are equipped with through -hole 8, and the top of each connecting column 5 is embedded with conductive block 6.
[0023] Please refer to Figures 2-4, the power-on structure 7 includes a placement seat 71 embedded to the bottom of the placement slot 4, and two installation grooves 74, the bottom of the placement seat 71 is embedded with a conductive ring 72, the two installation grooves 74 are both opened in the inside of the test seat 1 and below the conductive ring 72, the two sides of the bottom of the conductive ring 72 and inside the two installation grooves 74 are both fixedly installed with a conductive column 73, the bottom end of the two conductive columns 73 are both fixedly installed with a conductive rod 75, the outside of the conductive rod 75 and between the bottom end of the conductive column 73 and the top of the conductive block 6 is sleeved with a spring 76, the top of the conductive ring 72 is provided with a conductive contact matching the chip pin, the layout of the conductive contact is compatible with the pin layout of the common chip, different specifications of the contact arrangement mode are arranged on the top of the conductive ring 72 to adapt to different models and sizes of the chip, the outer surface of the conductive column 73 and the inner wall of the installation groove 74 are mutually matched, the placement slot 4 is communicated with the through hole 8, the conductive groove 77 is opened between the top center of the placement seat 71 and the bottom center of the conductive ring 72 and communicated with the placement slot 4, one end of the spring 76 is fixedly connected with the bottom end of the conductive column 73, the other end of the spring 76 is fixedly connected with the top of the conductive block 6, the conductive column 73, the conductive rod 75 and the conductive ring 72 are all made of brass and have good conductivity, when the chip is placed in the inside of the placement slot 4 and on the top of the placement seat 71, the bottom pin of the chip is aligned with the positioning contact on the top of the conductive ring 72 in the inside of the conductive groove 77, the top cover 2 is turned over, the top cover 2 is embedded on the top of the test seat 1, the knob lock 3 is rotated, the connection between the top cover 2 and the test seat 1 is locked, at this time, the chip is pressed downward by the top cover 2, so that the placement seat 71 can be moved downward, the placement seat 71 drives the conductive rod 75 to move downward through the conductive column 73 and contacts the conductive block 6 on the top of the connecting column 5, power-on is formed, the chip can be tested, the chip test condition can be directly observed through the through hole 8.
[0024] Specific implementation: the knob lock 3 is rotated according to the rotation mark on the top of the knob lock 3, the locked connection between the top cover 2 and the test seat 1 is released, the top cover 2 is turned over upward, the placement slot 4 is opened, when the chip is placed in the inside of the placement slot 4 and on the top of the placement seat 71, the bottom pin of the chip is aligned with the positioning contact on the top of the conductive ring 72 in the inside of the conductive groove 77, the top cover 2 is turned over, the top cover 2 is embedded on the top of the test seat 1, the knob lock 3 is rotated, the connection between the top cover 2 and the test seat 1 is locked, at this time, the chip is pressed downward by the top cover 2, so that the placement seat 71 can be moved downward, the placement seat 71 drives the conductive rod 75 to move downward through the conductive column 73 and contacts the conductive block 6 on the top of the connecting column 5, power-on is formed, the chip can be tested, the chip test condition can be directly observed through the through hole 8.
[0025] After the test is completed, the knob lock 3 is rotated reversely to release the locking connection between the top cover 2 and the test seat 1, and the top cover 2 is turned up. Since the springs 76 at the bottom of the conductive columns 73 are compressed by the downward movement of the conductive columns 73, when the top cover 2 is turned up and the placing groove 4 is opened, the two springs 76 are elastically restored, so as to push the two conductive columns 73 to move upward and push the placing seat 71 to move upward, so that the chip can be quickly pushed out from the inside of the placing groove 4, and the chip can be quickly taken out by manual operation for the next test, and the chip test work efficiency is effectively improved.
[0026] Since the upward movement of the conductive columns 73 pushes out the chip and drives the conductive rods 75 away from the conductive blocks 6, the power connection between the conductive blocks 6, the conductive rods 75, the conductive columns 73, the conductive ring 72 and the chip can be released, and the chip is in a power-off state, so that the power supply does not need to be manually cut off, and the safety of the chip test work is effectively improved.
[0027] In addition, it should be understood that although the present specification is described in terms of embodiments, not every embodiment contains only one independent technical solution, and the description of the specification is only for the sake of clarity, and those skilled in the art should consider the specification as a whole, and the technical solutions in each embodiment can be combined appropriately to form other embodiments that those skilled in the art can understand.
Claims
1. A chip testing device, comprising a test socket (1), a top cover (2), and a rotary lock (3), characterized in that: The top cover (2) is hinged to the top of the test seat (1), the knob lock (3) is rotatably installed on the top of the top cover (2), the test seat (1) is provided with a placement groove (4) inside and at the bottom of the top cover (2), the bottom of the test seat (1) is fixedly installed with connecting columns (5), and the bottom of the inner wall of the placement groove (4) is embedded with an electric structure (7).
2. The chip testing device according to claim 1, characterized in that: A through hole (8) is provided between the top of the knob lock (3) and the bottom of the top cover (2), and a conductive block (6) is embedded at the top of each connecting post (5).
3. The chip testing device according to claim 2, characterized in that: The energized structure (7) includes a placement seat (71) and two mounting slots (74). The placement seat (71) is embedded in the bottom of the placement slot (4). A conductive ring (72) is embedded in the bottom of the placement seat (71). The two mounting slots (74) are both opened inside the test seat (1) and located below the conductive ring (72). Conductive posts (73) are fixedly installed on both sides of the bottom of the conductive ring (72) and inside the two mounting slots (74). A conductive rod (75) is fixedly installed at the bottom end of the two conductive posts (73). A spring (76) is sleeved on the outside of the conductive rod (75) and between the bottom end of the conductive post (73) and the top of the conductive block (6).
4. The chip testing device according to claim 3, characterized in that: The outer surface of the conductive post (73) is in contact with the inner wall of the mounting groove (74), and the placement groove (4) is connected to the through hole (8).
5. A chip testing device according to claim 3, characterized in that: A conductive groove (77) is provided between the top center of the placement seat (71) and the bottom center of the conductive ring (72), and the conductive groove (77) is connected to the placement groove (4).
6. The chip testing device according to claim 3, characterized in that: One end of the spring (76) is fixedly connected to the bottom end of the conductive post (73), and the other end of the spring (76) is fixedly connected to the top of the conductive block (6).