Printed circuit board (PCB) with high multilayer interconnection structure
By installing heat-conducting and support devices on multilayer PCBs, the heat dissipation and bending resistance issues of multilayer PCBs are solved, resulting in better performance and extended lifespan.
Patent Information
- Application Number
- CN202520054901.2
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-01-10
- Publication Date
- 2026-02-17
- Estimated Expiration
- 2035-01-10
AI Technical Summary
High-multilayer PCBs are prone to heat buildup and lack protective structures after stacking many inner layers, which affects their performance and lifespan.
Heat conduction devices and support devices are installed on multilayer PCBs. The heat conduction devices quickly dissipate heat through heat conduction plates and heat conduction columns, while the support devices improve rigidity and enhance bending resistance through support frames and limit frames.
It effectively solves the heat dissipation problem of multilayer PCBs, improves their resistance to bending, and extends their service life.
Smart Images
Figure CN223928511U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of PCB board technology, and in particular to a PCB board with a high multilayer interconnect structure. Background Technology
[0002] A PCB, or Printed Circuit Board, is an indispensable electronic component in modern electronic devices. It serves as both the support for electronic components and the carrier for their electrical connections. The conductive tracks (traces) on the PCB connect various electronic components, such as resistors, capacitors, and integrated circuits, forming a complete circuit system. These traces not only transmit electrical signals but also handle power distribution, simplifying circuit design and improving circuit reliability.
[0003] However, high-multilayer PCBs are printed circuit boards with multiple inner and outer layers. Therefore, high-multilayer PCBs have more signal and power layers. Furthermore, they can achieve higher integration density by stacking more inner layers to meet the growing demands of electronic devices. However, while the increased number of inner layers improves the performance of high-multilayer PCBs, it also makes them more prone to heat buildup. Additionally, high-multilayer PCBs lack adequate protective structures, making them more susceptible to internal damage when subjected to bending forces, thus affecting their performance and lifespan. Utility Model Content
[0004] The main objective of this invention is to provide a PCB board with a high multilayer interconnect structure, which can effectively solve the problems in the background art.
[0005] To achieve the above objectives, the technical solution adopted by this utility model is as follows:
[0006] A high-multilayer interconnect PCB board includes a high-multilayer PCB board, a heat conduction device fixedly installed at the lower end of the high-multilayer PCB board, a first mounting bracket installed at the right end of the high-multilayer PCB board, a second mounting bracket installed at the left end of the high-multilayer PCB board, a support device fixedly installed between the first mounting bracket and the second mounting bracket, and two mounting holes opened at the upper end of the first mounting bracket and the second mounting bracket.
[0007] Preferably, the support device includes a support frame with two screw holes on its upper left and upper right sides. The support frame is fixedly installed between mounting bracket 1 and mounting bracket 2, and limit brackets are fixedly installed on the upper ends of both mounting bracket 1 and mounting bracket 2. The U-shaped support frame is attached to the lower end of the multilayer PCB board, and the two L-shaped limit brackets are attached to the upper end of the multilayer PCB board, thereby improving the rigidity of the multilayer PCB board and giving it better resistance to bending.
[0008] Preferably, the heat-conducting device includes a heat-conducting plate, an insulating thermally conductive adhesive is installed on the upper end of the heat-conducting plate, and a set of thermally conductive pillars are fixedly installed in the middle of the upper end of the heat-conducting plate. The heat-conducting plate is installed on the lower end of the multilayer PCB board through the insulating thermally conductive adhesive. The heat-conducting plate and the thermally conductive pillars are made of copper. The heat-conducting plate is attached to the lower end of the multilayer PCB board through the insulating thermally conductive adhesive, and the thermally conductive pillars on the heat-conducting plate are precisely aligned and inserted into the electroplated through holes, thereby allowing the heat generated inside the multilayer PCB board to be quickly dissipated through the thermally conductive pillars and the heat-conducting plate.
[0009] Preferably, a set of electroplated through holes is formed in the middle of the upper part of the multilayer PCB board. Two mounting screws are installed on both the left and right sides of the upper part of the multilayer PCB board, and the multilayer PCB board is fixedly mounted on the upper part of the support frame by the mounting screws. The electroplated through holes in the multilayer PCB board enable electrical connections between the layers of the PCB board by drilling holes between the layers and electroplating inside the holes.
[0010] Preferably, the support frame is U-shaped and the limiting frame is L-shaped.
[0011] Preferably, the heat-conducting pillars and the electroplated through holes have the same size and are positioned vertically correspondingly.
[0012] Compared with the prior art, the present invention has the following beneficial effects:
[0013] 1. By pushing the multilayer PCB board between mounting bracket 1 and mounting bracket 2, and with limit brackets installed on both brackets, the multilayer PCB board can be limited. After the multilayer PCB board is pushed in, its mounting screws are aligned with the screw holes. Then, the mounting screws on the multilayer PCB board are screwed into the support frame. This not only facilitates the quick installation of the multilayer PCB board, but also improves the rigidity of the multilayer PCB board by having the U-shaped support frame attached to the lower end of the multilayer PCB board and the two L-shaped limit brackets attached to the upper end of the multilayer PCB board, thus giving the multilayer PCB board better resistance to bending.
[0014] 2. Electroplated through-holes are provided on the multilayer PCB. This is achieved by drilling holes between the various layers of the PCB and electroplating them. In addition, a heat-conducting plate is attached to the bottom of the multilayer PCB with insulating thermally conductive adhesive. The heat-conducting pillars on the heat-conducting plate are precisely aligned and inserted into the electroplated through-holes, so that the heat generated inside the multilayer PCB can be quickly dissipated through the heat-conducting pillars and the heat-conducting plate. Attached Figure Description
[0015] Figure 1This is a schematic diagram of the overall structure of a PCB board with a high multilayer interconnect structure according to the present invention;
[0016] Figure 2 This is a schematic diagram of the overall structure of a support device for a PCB board with a high multilayer interconnect structure according to the present invention.
[0017] Figure 3 This is a schematic diagram of the overall structure of a heat conduction device for a PCB board with a high multilayer interconnect structure according to this utility model.
[0018] Figure 4 This is a schematic diagram of the overall structure of a high-multilayer PCB board according to the present invention.
[0019] In the diagram: 1. High-multilayer PCB board; 2. Support device; 3. Heat conduction device; 4. Mounting bracket 1; 5. Mounting bracket 2; 6. Mounting hole; 20. Support frame; 21. Limiting bracket; 22. Screw hole; 30. Heat conduction plate; 31. Heat conduction column; 32. Insulating thermally conductive adhesive; 40. Electroplated through hole; 41. Mounting screw. Detailed Implementation
[0020] To make the technical means, creative features, objectives and effects of this utility model easier to understand, the present utility model will be further described below in conjunction with specific embodiments.
[0021] In the description of this utility model, it should be noted that the terms "upper," "lower," "inner," "outer," "front end," "rear end," "both ends," "one end," and "the other end," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model. In addition, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.
[0022] In the description of this utility model, it should be noted that, unless otherwise explicitly specified and limited, the terms "installed," "equipped with," and "connected," etc., should be interpreted broadly. For example, "connected" can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium; it can be a connection within two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.
[0023] like Figure 1-4As shown, a high-multilayer interconnect PCB board includes a high-multilayer PCB board 1, a heat conduction device 3 fixedly installed at the lower end of the high-multilayer PCB board 1, a first mounting bracket 4 installed at the right end of the high-multilayer PCB board 1, a second mounting bracket 5 installed at the left end of the high-multilayer PCB board 1, a support device 2 fixedly installed between the first mounting bracket 4 and the second mounting bracket 5, and two mounting holes 6 opened at the upper end of the first mounting bracket 4 and the second mounting bracket 5.
[0024] The support device 2 includes a support frame 20. Two screw holes 22 are opened on the upper left and upper right sides of the support frame 20. The support frame 20 is fixedly installed between mounting bracket 4 and mounting bracket 5. Limiting brackets 21 are fixedly installed on the upper ends of both mounting brackets 4 and 5. The support frame 20 is U-shaped, and the limiting brackets 21 are L-shaped. The U-shaped support frame 20 is attached to the lower end of the multilayer PCB board 1, and the two L-shaped limiting brackets 21 are attached to the upper end of the multilayer PCB board 1, thereby improving the rigidity of the multilayer PCB board 1 and giving it better resistance to bending.
[0025] The heat conduction device 3 includes a heat conduction plate 30, with insulating thermally conductive adhesive 32 installed on the upper end of the heat conduction plate 30. A set of thermally conductive pillars 31 are fixedly installed in the middle of the upper end of the heat conduction plate 30. The heat conduction plate 30 is installed on the lower end of the multilayer PCB board 1 through the insulating thermally conductive adhesive 32. The heat conduction plate 30 and the thermally conductive pillars 31 are made of copper. The heat conduction plate 30 is attached to the lower end of the multilayer PCB board 1 through the insulating thermally conductive adhesive 32, and the thermally conductive pillars 31 on the heat conduction plate 30 are precisely aligned and inserted into the electroplated through holes 40, thereby allowing the heat generated inside the multilayer PCB board 1 to be quickly dissipated through the thermally conductive pillars 31 and the heat conduction plate 30.
[0026] A set of electroplated through holes 40 is opened in the middle of the upper end of the multilayer PCB board 1. Two mounting screws 41 are installed on the upper left and upper right sides of the multilayer PCB board 1. The multilayer PCB board 1 is fixedly installed on the upper end of the support frame 20 by the mounting screws 41. The heat conduction pillars 31 are the same size as the electroplated through holes 40 and are positioned vertically correspondingly. The electroplated through holes 40 on the multilayer PCB board 1 are used to achieve electrical connection between the layers of the PCB board by drilling holes between the layers and electroplating in the holes.
[0027] It should be noted that this utility model is a PCB board with a high multilayer interconnection structure. The high multilayer PCB board 1 has electroplated through holes 40, which are drilled between the various layers of the PCB and electroplated inside the holes, thereby achieving electrical connection between the layers. Additionally, a heat-conducting plate 30 is attached to the lower end of the high multilayer PCB board 1 with insulating thermally conductive adhesive 32, and the heat-conducting pillars 31 on the heat-conducting plate 30 are precisely aligned and inserted into the electroplated through holes 40. This allows the heat generated inside the high multilayer PCB board 1 to be quickly dissipated through the heat-conducting pillars 31 and the heat-conducting plate 30. Then, the high multilayer PCB board 1 is pushed into mounting bracket 4 and mounting bracket 5. Between the mounting brackets 5, and with limit brackets 21 installed on both mounting brackets, not only can the multilayer PCB board 1 be limited, but also, after the multilayer PCB board 1 is pushed in, the mounting screws 41 on it are aligned with the screw holes 22. At this time, the mounting screws 41 on the multilayer PCB board 1 are screwed into the support frame 20, which not only facilitates the quick installation of the multilayer PCB board 1, but also, the U-shaped support frame 20 is attached to the lower end of the multilayer PCB board 1, and the two L-shaped limit brackets 21 are attached to the upper end of the multilayer PCB board 1, thereby improving the rigidity of the multilayer PCB board 1 and giving it better bending resistance when bent.
[0028] The foregoing has shown and described the basic principles, main features, and advantages of this utility model. Those skilled in the art should understand that this utility model is not limited to the above embodiments. The embodiments and descriptions in the specification are merely illustrative of the principles of this utility model. Various changes and modifications can be made to this utility model without departing from its spirit and scope, and all such changes and modifications fall within the scope of the claims. The scope of protection of this utility model is defined by the appended claims and their equivalents.
Claims
1. A PCB board of a high multi-layer interconnection structure, comprising a high multi-layer PCB board (1), characterized in that: The high multilayer PCB (1) lower end fixed mounting has heat conduction device (3), the high multilayer PCB (1) right end is installed with one mounting frame (4), the high multilayer PCB (1) left end is installed with two mounting frames (5), one mounting frame (4) and two mounting frames (5) between fixed mounting have supporting device (2), one mounting frame (4) and two mounting frames (5) upper end are all opened with two mounting holes (6).
2. A PCB board of a high multi-layer interconnection structure according to claim 1, characterized in that: The supporting device (2) includes a support frame (20), the support frame (20) upper end left part and upper end right part are all opened with two screw holes (22), the support frame (20) is fixedly installed between one mounting frame (4) and two mounting frames (5), one mounting frame (4) and two mounting frames (5) upper end are all fixedly installed with limit frame (21).
3. The PCB board of claim 1, wherein: The heat conduction device (3) includes a heat conduction plate (30), the heat conduction plate (30) upper end is installed with insulating heat conduction glue (32), the heat conduction plate (30) upper end middle part is fixedly installed with a group of heat conduction columns (31), the heat conduction plate (30) is installed in the high multilayer PCB (1) lower end through insulating heat conduction glue (32), the heat conduction plate (30) and heat conduction column (31) material is copper.
4. The PCB board of claim 3, wherein: The high multilayer PCB (1) upper end middle part is opened with a group of electroplated through holes (40), the high multilayer PCB (1) upper end left part and upper end right part are all installed with two mounting screws (41), the high multilayer PCB (1) is fixedly installed on the support frame (20) upper end through mounting screw (41).
5. The PCB board of claim 2, wherein: The support frame (20) shape is mouth-shaped, and the limit frame (21) shape is L-shaped.
6. The PCB board of claim 4, wherein: The heat conduction column (31) and electroplated through hole (40) size are consistent and position is up and down corresponding.