LED double-sided copper paste printed circuit board

Abstract

The utility model discloses an LED double-sided copper paste printed circuit board, which comprises a printed substrate, copper paste line layers, a bonding layer and a cover film layer, the top surface and the bottom surface of the printed substrate are respectively printed with the copper paste line layers, the printed substrate is provided with metalized via holes communicated with the two copper paste line layers, the copper paste line layer on the top surface of the printed substrate is provided with an LED bonding pad, and the bonding layer is provided with a plurality of LED bonding pads. The surface of each copper paste circuit layer is provided with a gold melting layer corresponding to the LED bonding pad, the pins of the lamp beads are welded on the LED bonding pad, the outer surfaces of the two copper paste circuit layers are respectively connected with a film covering layer through a bonding layer, and the film covering layer is provided with a window corresponding to the LED bonding pad, so that the LED bonding pad is exposed. According to the utility model, the copper paste printed circuit is adopted to replace a copper foil base material etching circuit, and the copper paste printed circuit is lower in cost, more environment-friendly, capable of reducing environmental pollution and improving product quality and production efficiency, remarkable in economic benefit and social benefit, and wide in application prospect in the field of manufacturing of LED related electronic products.

Description

Technical Field

[0001] This utility model relates to the technical field of circuit boards, and in particular to an LED double-sided copper paste printed circuit board. Background Technology

[0002] With the rapid development of electronic technology, printed circuit boards (PCBs), as key basic components of electronic devices, face increasingly higher performance requirements. Traditional copper foil etching processes for PCB manufacturing have many problems. The etching process uses large amounts of chemical etchants, which are not only costly but also pollute the environment. Copper paste printing, as an emerging PCB manufacturing technology, has potential advantages such as simple process, good environmental performance, and the ability to manufacture flexible circuits. However, improvements are still needed in copper paste printing processes and subsequent processing to meet higher performance requirements.

[0003] With the rapid development of electronic technology, LEDs are increasingly widely used in the display field. Traditional copper foil-based etched circuit boards face numerous challenges in manufacturing LED products, such as complex processes, high costs, and significant environmental impact. Copper paste printing technology offers a new solution to these problems. To meet market demand for LED printed circuit boards, the applicant has actively explored innovation and developed a new product that uses copper paste printing to replace copper foil-based etched circuits. Through in-depth research and development of this product, the aim is to improve the quality of LED circuit board products, reduce costs, and enhance market competitiveness, providing the electronics industry with a more advantageous LED printed circuit board manufacturing solution. Utility Model Content

[0004] The purpose of this invention is to provide a low-cost, environmentally friendly, and reliable double-sided copper paste printed circuit board for LEDs.

[0005] To achieve the above objectives, the solution of this utility model is:

[0006] A double-sided copper paste printed circuit board for LEDs includes a printed circuit board, copper paste circuit layers, an adhesive layer, and a cover film layer. The top and bottom surfaces of the printed circuit board are respectively printed with copper paste circuit layers. The printed circuit board has metallized vias connecting the two copper paste circuit layers. The copper paste circuit layer on the top surface of the printed circuit board has LED pads. The surface of the copper paste circuit layer has a gold plating layer at the position corresponding to the LED pads. The surface of the LED pads also has a gold plating layer. The leads of the LED chips are soldered to the LED pads, fixing the LED chips to the copper paste circuit layers. The outer surfaces of the two copper paste circuit layers are respectively connected to the cover film layer through the adhesive layer. The cover film layer has windows at the positions corresponding to the LED pads, exposing the LED pads.

[0007] Furthermore, the printed substrate is a PI substrate, and the PI substrate is made of light-shielding PI.

[0008] Furthermore, the printed substrate is made of transparent PI, and a layer of light-shielding ink is coated on the cover film layer at the bottom of the PI substrate.

[0009] Furthermore, the printed substrate is made of anti-static PI roll material, and the PI roll material is provided with positioning holes corresponding to the positioning pins of the printing machine.

[0010] Furthermore, the copper paste of the copper paste circuit layer is printed on the PI substrate using a fully automatic screen printing machine or a thermosetting ink printing machine, with a printing thickness of 14um-17um.

[0011] Furthermore, the cover layer on the top surface of the printed substrate is a white protective film.

[0012] Furthermore, the LED double-sided copper paste printed circuit board of this utility model is baked on a purple pad using high-temperature tape.

[0013] With the above structure, this utility model of a double-sided copper paste printed circuit board for LEDs uses copper paste printed circuits instead of copper foil substrate etched circuits. Copper paste printed circuits are lower in cost and more environmentally friendly, reducing environmental pollution, improving product quality and production efficiency, and have significant economic and social benefits. It has broad application prospects in the LED-related electronic product manufacturing field. Furthermore, this utility model uses a double-sided flexible circuit board, which offers greater wiring flexibility than a single-sided flexible circuit board. It can increase wiring channels, placing LED pads on the upper copper paste circuit layer, while the lower copper paste circuit layer can be designed with more complex circuits. Different types of circuits can be arranged on different layers, reducing mutual interference between circuits and improving circuit stability and reliability. For the same circuit function requirements, a double-sided flexible circuit board can achieve more circuit connections within the same area, or, while achieving the same circuit function, can use a smaller size compared to a single-sided flexible circuit board. This is crucial for space-constrained electronic devices, contributing to the miniaturization and thinning of electronic equipment. This invention employs a two-layer structure, which to a certain extent increases the overall strength and stability of the circuit board. Compared with a single-sided flexible circuit board, it is less prone to deformation or breakage when subjected to external forces such as bending and stretching, thus improving the reliability and service life of the circuit board. Attached Figure Description

[0014] Figure 1 This is a partial structural schematic diagram of the present invention. Detailed Implementation

[0015] To further explain the technical solution of this utility model, the following detailed description is provided through specific embodiments.

[0016] In the description of this utility model, it should be understood that the terms "center," "longitudinal," "lateral," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," and "outer," etc., indicating orientation or positional relationships, are based on the orientation or positional relationships shown in the accompanying drawings and are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model. In the description of this utility model, unless otherwise stated, "a plurality of" means two or more.

[0017] like Figure 1 As shown, this utility model discloses an LED double-sided copper paste printed circuit board, which includes a printed circuit board 1, a copper paste circuit layer 2, an adhesive layer 3, and a cover film layer 4. The top and bottom surfaces of the printed circuit board 1 are respectively printed with copper paste circuit layers 2. The printed circuit board 1 is provided with metallization 11 connecting the two copper paste circuit layers 2. The copper paste circuit layer 2 on the top surface of the printed circuit board 1 has LED pads. The surface of the copper paste circuit layer 2 has a gold plating layer corresponding to the position of the LED pads. The surface of the LED pads has a gold plating layer. The leads of the LED beads are soldered to the LED pads, so that the LED beads 5 are fixed on the copper paste circuit layer 2. The outer surfaces of the two copper paste circuit layers 2 are respectively connected to the cover film layer 4 through the adhesive layer 3. The cover film layer 4 has a window 41 corresponding to the position of the LED pads, so that the LED pads are exposed, making it convenient for the leads 51 of the LED beads 5 to be soldered to the LED pads.

[0018] In this embodiment, the printed circuit board 1 is a PI substrate, preferably a light-shielding PI substrate, such as a black PI substrate. Transparent PI or other PI substrates can also be used, but a layer of light-shielding ink 6 needs to be coated on the bottom cover layer 4. The PI substrate uses an anti-static PI film. During copper paste printing, PI rolls are used for printing. The PI rolls have positioning holes corresponding to the positioning pins of the printing press. Using an anti-static PI film on the PI rolls prevents the PI rolls from absorbing dust, debris, or sticking to equipment components, which could cause positional shifts during transport. Eliminating static electricity reduces the impact of these factors on the positioning of the PI rolls, improving printing accuracy. Before printing, the printing press accurately inserts the positioning pins into the positioning holes of the PI rolls, ensuring the PI rolls maintain an accurate position during unwinding and transport, thus guaranteeing printing position accuracy.

[0019] The copper paste for the copper paste circuit layer 2 is selected according to the sample preparation requirements. Suitable copper paste materials are chosen to ensure the conductivity and adhesion of the copper paste during sample preparation. Performance tests are performed on the selected copper paste materials, including conductivity, adhesion, and chemical resistance. Copper pastes that do not meet the requirements are eliminated to ensure that the copper paste meets the sample preparation requirements. Through comparison of several copper pastes, the copper paste used in this embodiment is from the Bairou brand, model PHP9000-5F-P4. Compared with other comparative copper pastes, this model has good fluidity, good chemical resistance, voltage resistance, and can be properly pre-treated. Gold plating and resistivity all meet the requirements. The copper paste can be printed using a fully automatic screen printing machine or a thermosetting ink printing machine, with a printing thickness of 14um-17um.

[0020] The cover layer 4 on the top surface of the printed circuit board 1 uses a white protective film. This white protective film has a high reflectivity, allowing it to reflect some of the light emitted by the LED back to the effective light-emitting direction, thereby improving the overall light-emitting efficiency of the LED, making the light distribution more uniform, and enhancing the display or lighting effect. After applying the protective film, the PI is attached to a purple pad with high-temperature tape and then placed on a baking rack to prevent warping of the LED copper paste printed circuit board.

[0021] The above embodiments and figures are not intended to limit the product form and style of this utility model. Any appropriate changes or modifications made by those skilled in the art should be considered as not departing from the patent scope of this utility model.

Claims

1. An LED double-sided copper paste printed circuit board, characterized by, It includes: Printed substrate, copper paste circuit layer, adhesive layer and cover film layer, the top and bottom surfaces of the printed substrate are printed with copper paste circuit layer respectively, the printed substrate is provided with a metallized via hole communicating with the two copper paste circuit layers, the copper paste circuit layer on the top surface of the printed substrate has an LED pad, the surface of the copper paste circuit layer has a gold layer corresponding to the position of the LED pad, the surface of the LED pad has a gold layer, the pins of the lamp bead are welded on the LED pad to fix the lamp bead on the copper paste circuit layer, the outer surfaces of the two copper paste circuit layers are connected with the cover film layer through the adhesive layer respectively, the cover film layer is provided with a window corresponding to the position of the LED pad to expose the LED pad.

2. An LED double-sided copper paste printed circuit board as claimed in claim 1, characterized in that: The printed substrate is a PI base material, and the PI base material adopts light shielding PI.

3. The LED double-sided copper paste printed circuit board of claim 1, wherein: The printed substrate adopts light-transmitting PI base material, and a layer of light shielding ink is coated on the cover film layer at the bottom of the light-transmitting PI base material.

4. The LED double-sided copper paste printed circuit board of claim 1, wherein: The printed substrate adopts anti-static PI roll material, and the PI roll material is provided with a positioning hole corresponding to a positioning pin of a printing machine.

5. An LED double-sided copper paste printed circuit board as defined in claim 1, wherein: The copper paste of the copper paste circuit layer is printed on the PI base material by using a full-automatic screen printing machine or a hot-set ink printing machine, and the printing thickness is 14-17 um.

6. An LED double-sided copper paste printed circuit board as defined in claim 1, wherein: The cover film layer on the top surface of the printed substrate adopts a white protective film.

7. An LED double-sided copper paste printed circuit board as defined in claim 1, wherein: The LED double-sided copper paste printed circuit board is pasted on a purple pad plate by using high-temperature adhesive tape and placed on a layer rack for baking.

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