Housing structure of light module embedded in vapor chamber

Abstract

The utility model relates to the technical field of optical communication, in particular to a soaking plate embedded optical module shell structure, which comprises a shell, second solder paste is arranged at the upper end of the shell, a soaking plate is arranged at the upper end of the second solder paste, first solder paste is arranged at the upper end of the soaking plate, and buckle type fins are arranged at the upper end of the first solder paste. Through the welding of the vapor chamber and the buckle type fins, the requirements of different heights of the heat sink on the shell are met, and through the embedded structure of the vapor chamber, the temperature equalization is performed on the buckle type fins and the shell, so that the temperature of the core device of the optical module is effectively reduced.

Description

TECHNICAL FIELD

[0001] The utility model relates to optical communication technical field, concretely is a kind of heat plate embedded in optical module shell structure. BACKGROUND

[0002] At present in optical communication market, zinc alloy and aluminum alloy scheme are generally used as heat sink heat conduction, or heat pipe and heat plate mode are used to carry out uniform temperature design. However, the heat conduction of different devices of printed circuit board needs shell heat sink to adapt to different height devices, and the currently used scheme is to use special-shaped heat sink to weld heat plate and shell, adapt to the heat dissipation of printed circuit board device, and the process is complex, and the cost is higher.

[0003] Therefore, it is necessary to design a heat plate embedded optical module shell structure to solve the problems in the above background art. UTILITY MODEL CONTENTS

[0004] The utility model aims at solving the problems in the prior art and provides a heat plate embedded optical module shell structure.

[0005] To achieve the above object, the utility model provides the following technical scheme:

[0006] A kind of heat plate embedded optical module shell structure, including shell, the second tin paste is equipped on the shell upper end, the second tin paste upper end is equipped with heat plate, the first tin paste is equipped on the heat plate upper end, the first tin paste upper end is equipped with buckle type fin.

[0007] As the preferred scheme of the utility model, the heat plate is welded with the shell by the second tin paste.

[0008] As the preferred scheme of the utility model, the buckle type fin is welded with heat plate and shell by the first tin paste.

[0009] As the preferred scheme of the utility model, the buckle type fin is completed by aluminum alloy or copper alloy stamping and welding.

[0010] As the preferred scheme of the utility model, the heat plate is flat plate type heat plate.

[0011] In summary, the technical effects and advantages of the utility model: the heat plate embedded light module shell structure, the heat plate is welded with the shell through the second tin paste, the buckle type fin is welded with the heat plate and the shell through the first tin paste, the embedded design of the heat plate can be realized through the design of the different thickness heat sink of the shell, the buckle type fin is completed through aluminum alloy stamping and welding, the heat plate is the flat plate type heat plate with good heat conduction efficiency, the welding of the heat plate and the buckle type fin meets the needs of different heights of the heat sink, and the embedded structure of the heat plate is used to evenly heat the buckle type fin and the shell, effectively reducing the temperature of the core device of the light module, since the high-temperature points of the high-power chip and the buckle type fin are consistent, the buckle type fin and the heat sink can be cooled synchronously, and since the different height devices in the module need to be adapted, the buckle type fin, the heat plate and the shell with different heat sink thicknesses can be combined for cooling, wherein the shell can be made of zinc alloy, aluminum alloy or copper alloy, through the use of the buckle type fin, the fin, the heat plate and the shell can be integrally welded, the process flow of the shell is simplified while meeting the appearance of the light module, the embedded structure of the heat plate and the buckle type fin is formed, the shell structure with the heat plate is simplified, the heat dissipation performance of the shell is improved through the flat heat plate, the synchronous heat of the buckle type fin and the shell is realized, and the process of the light module shell is simplified under the condition of ensuring the performance of the module. BRIEF DESCRIPTION OF DRAWINGS

[0012] Figure 1 It is the overall structure diagram of the utility model.

[0013] In the drawing: 1, buckle type fin; 2, first tin paste; 3, heat plate; 4, second tin paste; 5, shell. DETAILED DESCRIPTION

[0014] The technical scheme in the embodiments of the utility model will be clearly and completely described below with reference to the drawings in the embodiments of the utility model, and obviously, the described embodiments are only part of the embodiments of the utility model, not all the embodiments.

[0015] Referring to Figure 1 A heat plate embedded light module shell structure, including shell 5, the second tin paste 4 is equipped on the upper end of shell 5, the heat plate 3 is equipped on the upper end of second tin paste 4, the first tin paste 2 is equipped on the upper end of heat plate 3, and the buckle type fin 1 is equipped on the upper end of first tin paste 2.

[0016] Referring to Figure 1The heat spreader 3 is soldered to the housing 5 via the second solder paste 4, and the snap-on fins 1 are soldered to the heat spreader 3 and the housing 5 via the first solder paste 2. By designing heat sinks of different thicknesses in the housing 5, the heat spreader 3 can be embedded. The snap-on fins 1 are made by aluminum alloy stamping and welding. The heat spreader 3 is a flat heat spreader with good thermal conductivity. The welding of the heat spreader 3 and the snap-on fins 1 meets the needs of different heat sink heights. Through the embedded structure of the heat spreader 3, the snap-on fins 1 and the housing 5 are homogenized, effectively reducing the temperature of the core components of the optical module. Since the high-power chip and the snap-on fins 1 have relatively similar high-temperature points, the snap-on fins 1 and the heat sink can be cooled synchronously. Since it is necessary to adapt to components of different heights within the module, heat dissipation can be achieved by combining snap-fit ​​fins 1, a heat spreader 3, and a housing 5 with different heat sink thicknesses. The housing 5 can be made of zinc alloy, aluminum alloy, or copper alloy. By utilizing the snap-fit ​​fins 1, the fins, heat spreader 3, and housing 5 can be integrally welded, which simplifies the manufacturing process of the housing 5 while satisfying the appearance of the optical module. The resulting embedded structure of the heat spreader 3 and snap-fit ​​fins 1 simplifies the structure of the housing 5 with the heat spreader 3. By flattening the heat spreader 3, the heat dissipation performance of the housing 5 is improved, and the snap-fit ​​fins 1 and housing 5 are synchronously heated. This simplifies the manufacturing process of the optical module housing while ensuring module performance.

[0017] Working Principle: The heat spreader 3, embedded in the optical module housing structure, is soldered to the housing 5 via a second solder paste 4. The snap-on fins 1 are soldered to both the heat spreader 3 and the housing 5 via a first solder paste 2. By designing heat sinks of varying thicknesses within the housing 5, the heat spreader 3 can be embedded. The snap-on fins 1 are formed by stamping and welding aluminum or copper alloy. The heat spreader 3 is a flat plate with good thermal conductivity. The welding of the heat spreader 3 and the snap-on fins 1 meets the requirements for different heat sink heights. The embedded structure of the heat spreader 3 homogenizes the temperature of the snap-on fins 1 and the housing 5, effectively reducing the temperature of the core components of the optical module. Since the high-power chip and the snap-on fins 1 have relatively similar high-temperature points, the temperature of the snap-on fins can be reduced. The fins 1 and heat sink provide synchronous heat dissipation. Since the heights of different components within the module need to be adapted, heat dissipation can be achieved by combining snap-fit ​​fins 1, a heat spreader 3, and a housing 5 with different heat sink thicknesses. The housing 5 can be made of zinc alloy, aluminum alloy, or copper alloy. By utilizing snap-fit ​​fins 1, the fins, heat spreader 3, and housing 5 can be integrally welded, which simplifies the manufacturing process of the housing 5 while satisfying the appearance of the optical module. The resulting embedded structure of the heat spreader 3 and snap-fit ​​fins 1 simplifies the structure of the housing 5 with the heat spreader 3. By flattening the heat spreader 3, the heat dissipation performance of the housing 5 is improved, achieving synchronous temperature equalization of the snap-fit ​​fins 1 and the housing 5. This simplifies the manufacturing process of the optical module housing while ensuring module performance.

[0018] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A heat spreader embedded light module housing structure comprising a housing (5), characterized in that: The upper end of the shell (5) is provided with a second tin paste (4), the upper end of the second tin paste (4) is provided with a vapor chamber (3), the upper end of the vapor chamber (3) is provided with a first tin paste (2), and the upper end of the first tin paste (2) is provided with a buckle type fin (1).

2. The vapor chamber embedded optical module housing structure according to claim 1, wherein: The vapor chamber (3) is welded with the shell (5) through the second tin paste (4).

3. The vapor chamber inlaid light module housing structure of claim 1, wherein: The buckle type fin (1) is welded with the vapor chamber (3) and the shell (5) through the first tin paste (2).

4. The vapor chamber inlaid light module housing structure of claim 1, wherein: The buckle type fin (1) is completed through aluminum alloy stamping and welding.

5. The vapor chamber inlaid light module housing structure of claim 1, wherein: The vapor chamber (3) is a flat plate type vapor chamber.

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