IGBT (Insulated Gate Bipolar Translator) loading device

Abstract

The utility model discloses an IGBT (Insulated Gate Bipolar Transistor) mounting device, a suction nozzle main shaft is rotatably mounted and connected with a first fixed shaft and is provided with a plurality of rotary mounting positions, the front end of the first fixed shaft is mounted and connected with a second fixed shaft vertical to the suction nozzle main shaft, and the first fixed shaft is vertically mounted and connected with a third fixed shaft through a connector; the third fixing shaft is parallel to the suction nozzle main shaft, and the lower end of the third fixing shaft is connected with a baffle which is perpendicular to the lead frame slide holder. The side face of the baffle is located outside the side edge of the chip in the horizontal direction and is spaced from the side edge of the chip so as to accommodate overflowing welding flux. The lowest end of the third fixing shaft abuts against and makes contact with the lead frame slide holder, a contact blocking area is formed to block welding flux from overflowing outwards, and the third fixing shaft is provided with a plurality of horizontal and vertical axial installation positions. Meanwhile, a plurality of mounting and adjusting positions are arranged in a plurality of linear directions and circumferential directions, so that the device is suitable for different production application scenes, simple in structure, high in applicability and reliable in production quality.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor chip manufacturing, and in particular to an IGBT wafer mounting device. Background Technology

[0002] Die attach is a critical step in semiconductor manufacturing and packaging, where dies are attached to lead frames. The process involves melting a layer of solder in a designated area on a heated lead frame, pressing the molten solder into a regular rectangle using a die, picking up the ejected die from the die, placing it on top of the solder, and applying pressure to extrude the solder. The die attach process is complete once the product cools.

[0003] An IGBT single-tube package includes an IGBT chip and an FRD chip. When the overall size of the two chips approaches the maximum die size of the lead frame, the chip spacing is generally at a critical value of 0.7~1.5mm. Due to the small chip spacing, it is very easy for the soft solder between the two chips to connect after the die is assembled, resulting in poor die assembly, causing various performance problems of IGBT products, and reducing production efficiency and benefits. Utility Model Content

[0004] The purpose of this invention is to provide an IGBT die-loading device that solves the problem of lead-tin bonding of soft solder when assembling IGBT products with small chip spacing in the prior art. It enables fast and accurate die-loading production, thereby improving IGBT product die-loading issues, increasing production efficiency and packaging process yield, and optimizing product performance.

[0005] To achieve the above technical objectives, this utility model provides an IGBT die-loading device, comprising a nozzle spindle with a nozzle mounted on its bottom, wherein: above the nozzle, a first fixed shaft is rotatably connected to the nozzle spindle, the first fixed shaft having multiple rotatable mounting positions around the axis of the nozzle spindle; a second fixed shaft perpendicular to the nozzle spindle is mounted to the front end of the first fixed shaft; a third fixed shaft is vertically mounted to the second fixed shaft via a connector; the third fixed shaft is parallel to the nozzle spindle, and a baffle arranged vertically on a lead frame die-carrying stage is mounted to its lower end; the side of the baffle is horizontally located outside the side of the chip and has a distance between it and the chip, the distance being to accommodate overflowing solder; the lowermost end of the baffle abuts against the lead frame die-carrying stage, forming a contact barrier area. The domain prevents the overflowing solder from spilling outwards; the connector has multiple horizontal axial mounting positions along the axis of the second fixed shaft, and the third fixed shaft has multiple vertical axial mounting positions relative to the connector; the connector has two mutually perpendicular and non-planarly arranged connecting sleeves that are respectively sleeved and installed with the second fixed shaft and the third fixed shaft, and has multiple circumferential sleeve mounting positions; an upper spring and a lower spring are arranged on the nozzle spindle, and the first fixed shaft is arranged between the upper spring and the lower spring and is positioned and installed along the axis of the nozzle spindle by the axial biasing force of the upper spring and the lower spring; the first fixed shaft has multiple axial mounting positions along the axis of the nozzle spindle; the distance by which the lowest end of the baffle exceeds the nozzle should be approximately equal to the chip thickness plus the solder thickness, and it is in close contact with the lead frame die carrier.

[0006] This invention provides an IGBT die-loading device that can effectively block solder overflow during chip production. It also has multiple installation and adjustment positions in multiple linear and circumferential directions, making it suitable for different production application scenarios. The device has a simple structure, strong applicability, and reliable production quality.

[0007] As a further improvement, the first fixed shaft and the second fixed shaft are arranged on the same axis.

[0008] As a further improvement, the first fixed shaft and the second fixed shaft are integrally formed, and there is a tapered transition section between the first fixed shaft and the second fixed shaft.

[0009] As a further improvement, the chip includes a first chip and a second chip arranged at intervals from each other, and a baffle is arranged between the first chip and the second chip to isolate solder overflowing from the first chip and the second chip respectively.

[0010] As a further improvement, the lower end of the third fixed shaft has a U-shaped mounting groove, the upper part of the baffle has mounting holes and is connected to the U-shaped mounting groove by bolts, and the baffle is a rectangular plate structure of high-purity aluminum alloy.

[0011] As a further improvement, the plurality of rotational mounting positions of the first fixed shaft include at least 0° and 180° relative angular positions.

[0012] As a further improvement, the plurality of circumferential socket mounting positions include at least 0° and 90° relative angular positions.

[0013] As a further improvement, the overflowing solder overflows around the perimeter of the chip.

[0014] As a further improvement, the outer edge of the overflowing solder contacts the side of the baffle and forms a straight edge.

[0015] As a further improvement, the contact barrier area is coplanar with the lead frame stage.

[0016] This invention can solve the problem of lead-tin connection of soft solder when assembling chips with two different chip pitches, and realize the assembly production quickly and accurately, so as to improve the assembly problem of IGBT products, improve production efficiency, packaging process yield, and optimize product performance. Attached Figure Description

[0017] Figure 1 This is a schematic diagram of the present invention;

[0018] Figure 2 This is a schematic diagram of the single-chip operation of this utility model;

[0019] Figure 3 This is a schematic diagram illustrating the operation of a single chip in this utility model.

[0020] Figure 4 This is a schematic diagram of the dual-chip operation of this utility model;

[0021] Figure 5 This is a schematic diagram illustrating the operation of the dual-chip system of this utility model.

[0022] Reference numerals: 1. First fixed axis, 2. Second fixed axis, 3. Third fixed axis, 4. Chip, 5. Connector, 6. Baffle, 7. Upper spring, 8. Lower spring, 9. Lead frame stage, 10. Nozzle spindle, 11. Solder. Detailed Implementation

[0023] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0024] like Figures 1 to 5 As shown, this utility model provides an IGBT die-loading device, which includes a suction nozzle spindle 10 with a suction nozzle mounted on its bottom. Above the suction nozzle, a first fixed shaft is rotatably connected to the suction nozzle spindle 10. The first fixed shaft has multiple rotatable mounting positions around the axis of the suction nozzle spindle 10. A second fixed shaft perpendicular to the suction nozzle spindle 10 is mounted to the front end of the first fixed shaft. A third fixed shaft is vertically connected to the second fixed shaft via a connector. The third fixed shaft is parallel to the suction nozzle spindle 10, and a baffle arranged vertically on a lead frame die-carrying stage is mounted to its lower end. The side of the baffle 6 is horizontally located outside the side of the chip 4 and has a distance between it and the side, the distance accommodating overflowing solder 11. The lowermost end of the baffle abuts against the lead frame die-carrying stage, forming a contact barrier area. The domain prevents the overflowing solder from spilling outwards; the connector has multiple horizontal axial mounting positions along the axis of the second fixed shaft, and the third fixed shaft has multiple vertical axial mounting positions relative to the connector; the connector has two mutually perpendicular and non-planarly arranged connecting sleeves that are respectively sleeved and installed with the second fixed shaft and the third fixed shaft, and has multiple circumferential sleeve mounting positions; an upper spring and a lower spring are arranged on the nozzle spindle 10, and the first fixed shaft is arranged between the upper spring and the lower spring and is positioned and installed along the axis of the nozzle spindle 10 by the axial biasing force of the upper spring and the lower spring; the first fixed shaft has multiple axial mounting positions along the axis of the nozzle spindle 10; the distance by which the lowest end of the baffle exceeds the nozzle should be approximately equal to the chip thickness plus the solder thickness, and it is in close contact with the lead frame substrate.

[0025] This invention provides an IGBT die-loading device that can effectively block solder overflow during chip production. It also has multiple installation and adjustment positions in multiple linear and circumferential directions, making it suitable for different production application scenarios. The device has a simple structure, strong applicability, and reliable production quality.

[0026] As a further improvement, the first fixed shaft and the second fixed shaft are arranged on the same axis.

[0027] As a further improvement, the first fixed shaft and the second fixed shaft are integrally formed, and there is a tapered transition section between the first fixed shaft and the second fixed shaft.

[0028] As a further improvement, the chip includes a first chip and a second chip arranged at intervals from each other, and a baffle is arranged between the first chip and the second chip to isolate solder overflowing from the first chip and the second chip respectively.

[0029] As a further improvement, the lower end of the third fixed shaft has a U-shaped mounting groove, the upper part of the baffle has mounting holes and is connected to the U-shaped mounting groove by bolts, and the baffle is a rectangular plate structure of high-purity aluminum alloy.

[0030] As a further improvement, the plurality of rotational mounting positions of the first fixed shaft include at least 0° and 180° relative angular positions.

[0031] As a further improvement, the plurality of circumferential socket mounting positions include at least 0° and 90° relative angular positions.

[0032] As a further improvement, the overflowing solder spills irregularly around the perimeter of the chip.

[0033] As a further improvement, the outer edge of the overflowing solder contacts the side of the baffle and forms a straight edge.

[0034] As a further improvement, the contact barrier area is coplanar with the lead frame stage.

[0035] In a preferred embodiment of this invention, addressing the problem of lead-tin bonding in soft solder during IGBT chip mounting due to small chip spacing, this invention proposes a die bonder with a baffle device, wherein the baffle 6 is made of high-purity aluminum alloy. Figure 1 As shown, the first fixed shaft 1 and the main shaft 10 of the nozzle are connected and fixed in the Z direction by two springs, which can be rotated and adjusted according to the relative position of the main and auxiliary chips of the IGBT product. In addition, the baffle device can be adjusted in the X and Z directions according to the size and thickness of the chip 4 via the third fixed shaft 3 on the second fixed shaft 2. The baffle device operates when the nozzle applies loading pressure to extrude the solder. At this time, the third fixed shaft 3 is parallel to the main shaft of the nozzle. When the nozzle leaves the chip surface, the baffle device retracts, and at this time, the third fixed shaft 3 is perpendicular to the main shaft of the nozzle. When the baffle device is in operation, the distance of the lowest point of the baffle 6 beyond the nozzle should be approximately equal to the thickness of the chip 4 plus the thickness of the solder, and it should be in close contact with the lead frame stage 9.

[0036] Those skilled in the art will recognize that this invention can also employ automated equipment, actuators, and instruments, such as position and angle sensors, cylinders, gear drives, rack and pinion mechanisms, stepper motors, and servo motors, to achieve real-time monitoring and adjustment of position and angle, monitor forces such as downward pressure, and coordinate with the production system to achieve consistent actions in production steps.

[0037] The specific operating procedure of the baffle device is as follows: Figures 2 to 5 As shown:

[0038] (1) After the lead frame completes the dispensing and molding steps, it enters the die bonding area. When the nozzle picks up the IGBT chip and moves it above the soft solder, the baffle 6 is lowered at the pre-set position and height. During the process of the nozzle applying the die-loading pressure downward and extruding the solder, the baffle 6 is in close contact with the lead frame under the pressure applied by the upper and lower springs. At this time, the solder overflowing in the direction of the baffle stops flowing due to the obstruction.

[0039] (2) The baffle 6 retracts as the nozzle leaves the chip surface, the soft solder solidifies, and the solder overflow area inside the IGBT chip is controlled.

[0040] (3) The lead frame with the IGBT main chip installed enters the FRD chip mounting process. Rotate the first fixed shaft 1 and adjust the position of the baffle device in the X and Z directions on the second fixed shaft 2 according to the size and thickness of the FRD chip. The baffle device 6 is also lowered when the nozzle picks up the FRD chip and moves it above the soft solder. When the nozzle applies mounting pressure downward, the baffle 6 is in close contact with the lead frame. The solder overflowing from the inside of the FRD chip stops flowing due to obstruction.

[0041] (4) The baffle retracts as the nozzle leaves the surface of the FRD chip, the soft solder solidifies, the solder overflow area inside the FRD chip is effectively controlled, and the solder overflow between the IGBT and the FRD chip is effectively controlled.

[0042] During the main and auxiliary chip assembly process of IGBT products, the baffle device can be used to control the solder overflow area in a specific direction, thereby solving the problem of lead-tin connection of soft solder when the chip spacing is small, and effectively improving the assembly quality and packaging yield of IGBT products.

[0043] This invention solves the problem of lead-tin bonding between solder joints between chips, improving wafer assembly quality. It adds a baffle device to the nozzle of the soldering head of the die bonder to control solder overflow at specific locations on the IGBT chip. Furthermore, during the auxiliary chip assembly process, the baffle device not only controls solder overflow on the auxiliary chip side but also prevents molten solder from flowing from the IGBT chip to the auxiliary chip area, avoiding lead-tin bonding between the main and auxiliary chips, thus improving the yield of the wafer assembly process and enhancing the reliability of IGBT dual-chip products.

[0044] This invention effectively increases the maximum wafer-mountable area of ​​a wafer carrier stage, optimizing packaging capabilities. The invention provides a two-step solder blocking device for IGBT products. By limiting the solder overflow area between the main and auxiliary chips, it addresses the problem of limited minimum spacing between chips due to the risk of solder lead-tin bonding, which previously restricted the maximum wafer-mountable chip area of ​​the wafer carrier stage. With the same wafer carrier area, using the blocking device allows for the accommodating of larger chip sizes, effectively improving IGBT product packaging capabilities.

[0045] This invention can solve the problem of lead-tin connection of soft solder when assembling chips with two different chip pitches, and realize the assembly production quickly and accurately, so as to improve the assembly problem of IGBT products, improve production efficiency, packaging process yield, and optimize product performance.

[0046] It should be understood that the scope of protection sought by this utility model is not limited to the non-limiting embodiments, which are merely illustrative examples. The substantive scope of protection claimed in this application is further embodied in the scope provided by the independent claims and their dependent claims.

Claims

1. An IGBT mounting device comprising a suction nozzle main shaft (10) with a suction nozzle mounted on the bottom, characterized in that: a first fixed shaft (1) is rotatably mounted on the suction nozzle main shaft (10) above the suction nozzle, the first fixed shaft (1) has a plurality of rotational mounting positions around the axis of the suction nozzle main shaft (10), the front end of the first fixed shaft (1) is mounted with a second fixed shaft (2) perpendicular to the suction nozzle main shaft (10), the second fixed shaft (2) is mounted with a third fixed shaft (3) perpendicularly through a connector (5), the third fixed shaft (3) is parallel to the suction nozzle main shaft (10) and its lower end is mounted with a baffle (6) of a lead frame carrier arrangement, the side of the baffle (6) is located horizontally outside the side of the chip with a spaced distance, which accommodates the overflow of the solder; the lowermost end of the baffle (6) is in abutting contact with the lead frame carrier and forms a contact barrier area, which prevents the overflow of the solder from overflowing outward; the connector (5) has a plurality of horizontal axial mounting positions along the axis of the second fixed shaft (2), the third fixed shaft (3) has a plurality of vertical axial mounting positions relative to the connector (5), the connector (5) has two mutually perpendicular and out-of-plane arranged connecting sleeves and is respectively sleeved and mounted with the second fixed shaft (2) and the third fixed shaft (3) and has a plurality of circumferential sleeve mounting positions; an upper spring (7) and a lower spring (8) are arranged on the suction nozzle main shaft (10), the first fixed shaft (1) is arranged between the upper spring (7) and the lower spring (8) and is positioned and mounted along the axis of the suction nozzle main shaft (10) by the axial biasing force of the upper spring (7) and the lower spring (8), the first fixed shaft (1) has a plurality of axial mounting positions along the axis of the suction nozzle main shaft (10), the distance from the lowermost end of the baffle to the suction nozzle should be approximately equal to the thickness of the chip plus the thickness of the solder, and is in close abutting contact with the lead frame carrier. The first fixed shaft (1) and the second fixed shaft (2) are arranged on the same axis.

2. The IGBT mounting device according to claim 1, characterized by: The first fixed shaft (1) and the second fixed shaft (2) are integrally formed, and the first fixed shaft (1) and the second fixed shaft (2) have a tapered transition section therebetween.

3. An IGBT mounting device according to claim 2, characterized in that: The chip comprises a first chip and a second chip arranged at a distance from each other, and the baffle (6) is arranged between the first chip and the second chip and isolates the overflow of the solder of the first chip and the second chip respectively.

4. The IGBT mounting device according to claim 1, characterized by: The lower end of the third fixed shaft (3) has a U-shaped mounting slot, the upper part of the baffle (6) has a mounting hole and is mounted with the U-shaped mounting slot through a bolt, and the baffle (6) is a rectangular plate structure of high-purity aluminum alloy.

5. The IGBT mounting device according to claim 1, characterized by: The plurality of rotational mounting positions of the first fixed shaft (1) at least include 0° and 180° relative angle positions.

6. The IGBT mounting device according to claim 1, characterized by: The plurality of circumferential sleeve mounting positions at least include 0° and 90° relative angle positions.

7. The IGBT mounting device according to claim 1, characterized by: The overflow of the solder is overflowed around the chip.

8. The IGBT mounting device according to claim 1, characterized by: ​ 9. The IGBT mounting device according to claim 1, characterized by: The outer edge of the overflowed solder is in contact with the side of the baffle (6) and forms a straight arrangement edge.

10. The IGBT mounting device according to claim 1, characterized by: The contact barrier region is coplanar with the lead frame carrier table.

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