Chip heat dissipation structure and electronic board card

Abstract

The utility model provides a chip heat dissipation structure and an electronic board card. The chip heat dissipation structure comprises a heat dissipation air channel, and a plurality of chips and a plurality of radiators which are arranged in the heat dissipation air channel. The heat dissipation air channel comprises an air inlet and an air outlet which are formed in the first direction, the multiple chips are sequentially arranged in the first direction, and the multiple radiators are arranged on the chips in a one-to-one correspondence mode. Wherein each radiator comprises a radiating substrate and a plurality of radiating fins arranged at equal intervals along a second direction, the plurality of radiating fins are connected with the corresponding chips through the radiating substrate, and the area ranges of the plurality of radiating fins of different radiators on the coverage area of the corresponding radiating substrate are different. Through fine structural design of the radiating fins of different radiators, the temperature between different chips can be effectively controlled, the temperature difference between the different chips is reduced to the greatest extent, and fine management and control of radiating of the different chips are realized.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of electronic equipment heat dissipation, and in particular to a chip heat dissipation structure and an electronic board card. BACKGROUND

[0002] With the continuous progress of semiconductor technology, the integration and operating frequency of electronic chips continue to rise, leading to a sharp increase in power density per unit area, thereby causing severe heat dissipation challenges. Effective heat dissipation design is the key to ensuring stable operation of electronic equipment, prolonging its service life, and exerting its best performance.

[0003] With the advent of the big data era and the increasing complexity of algorithms, high-performance computing (HPC) and artificial intelligence (AI) have become the core driving force for promoting technological progress and industrial transformation. While pursuing extreme computing power, high-performance computing chips also show an explosive growth trend in power consumption, especially the power consumption of chips, which is mostly converted into heat energy, causing the chip temperature to rise sharply. Excessive temperature can seriously affect the electrical performance of semiconductor devices, such as increasing leakage current and reducing carrier mobility, thereby causing the chip to run slower and the error rate to rise.

[0004] Therefore, how to efficiently dissipate the heat generated by the chip and control its temperature within a safe and reasonable range is a core technical problem that must be solved in the design of chip heat dissipation structure and electronic board card. CONTENT OF THE INVENTION

[0005] The present application aims to at least partially solve one of the technical problems in the related art.

[0006] To this end, the first purpose of the present application is to propose a chip heat dissipation structure and an electronic board card.

[0007] To achieve the above-mentioned purpose, the first aspect of the present application proposes a chip heat dissipation structure, comprising:

[0008] a heat dissipation air duct, the heat dissipation air duct comprising an air inlet and an air outlet arranged along a first direction;

[0009] a plurality of chips, the plurality of chips being arranged in sequence along the first direction between the air inlet and the air outlet;

[0010] a plurality of heat sinks, the plurality of heat sinks being arranged one-to-one on each of the chips;

[0011] wherein each of the heat sinks comprises a heat dissipation substrate and a plurality of heat dissipation fins arranged at equal intervals along a second direction, the plurality of heat dissipation fins being connected to the corresponding chip through the heat dissipation substrate, and the plurality of heat dissipation fins of different heat sinks have different area ranges of coverage intervals on the corresponding heat dissipation substrate.

[0012] Optionally, the heat dissipation substrate includes a core heat dissipation area corresponding to the chip position, and a non-core heat dissipation area surrounding the core heat dissipation area. In the second direction, the area range of the coverage area of ​​the multiple heat dissipation fins of different heat sinks arranged sequentially along the first direction in the non-core heat dissipation area increases sequentially.

[0013] Optionally, the plurality of chips include a first chip and a second chip, and the plurality of heat sinks include a first heat sink and a second heat sink; wherein, the first chip is disposed on the side near the air inlet, the first heat sink is disposed on the first chip, and the coverage area of ​​the plurality of heat dissipation fins of the first heat sink is located in the core heat dissipation area and extends along the first direction to the non-core heat dissipation area; the second chip is disposed on the side near the air outlet, the second heat sink is disposed on the second chip, and the coverage area of ​​the plurality of heat dissipation fins of the second heat sink is located in the core heat dissipation area and extends along the second direction to the non-core heat dissipation area.

[0014] Optionally, the number of the plurality of heat dissipation fins of the first heat sink is less than the number of the plurality of heat dissipation fins of the second heat sink.

[0015] Optionally, the gap distance between the plurality of heat dissipation fins of the first heat sink is greater than the gap distance between the plurality of heat dissipation fins of the second heat sink.

[0016] Optionally, in the second heat sink, the plurality of heat dissipation fins are arranged in an "I" shape on the corresponding heat dissipation substrate, and among the plurality of heat dissipation fins, the extension length of the heat dissipation fin that extends along the first direction to cover the core heat dissipation area is less than the extension length of the heat dissipation fin that does not extend to cover the core heat dissipation area.

[0017] Optionally, the heat sink further includes a first heat-conducting part embedded in the heat sink substrate. The first heat-conducting part is disposed at the edge of the heat sink substrate and extends from the edge of the heat sink substrate along the second direction to the center of the heat sink substrate, connecting the core heat sink area and the non-core heat sink area.

[0018] Optionally, a second heat-conducting part is provided between adjacent heat dissipation substrates, and the second heat-conducting part is connected to the first heat-conducting part in the adjacent heat dissipation substrate.

[0019] Optionally, it further includes a thermally conductive filling layer disposed between the heat dissipation substrate and the corresponding chip, and filling the gap between the heat dissipation substrate and the corresponding chip.

[0020] Optionally, each of the plurality of heat dissipation fins of each of the heat sinks is further provided with a wind blocking part, and the wind blocking part extends along the second direction and covers the plurality of heat dissipation fins of the corresponding heat sink.

[0021] To achieve the above object, the second aspect of the present application provides an electronic board card comprising the chip heat dissipation structure of the first aspect.

[0022] The chip heat dissipation structure and the electronic board card provided by the present application have at least the following beneficial effects:

[0023] The present application provides a chip heat dissipation structure and an electronic board card, comprising a heat dissipation air duct, and a plurality of chips and a plurality of heat sinks arranged in the heat dissipation air duct. The heat dissipation air duct comprises an air inlet and an air outlet arranged along a first direction, the plurality of chips are arranged in sequence along the first direction, and the plurality of heat sinks are arranged one by one on each chip. Each heat sink comprises a heat dissipation base plate and a plurality of heat dissipation fins arranged at equal intervals along a second direction, the plurality of heat dissipation fins are connected to the corresponding chip through the heat dissipation base plate, and the area range of the coverage interval of the plurality of heat dissipation fins of different heat sinks on the corresponding heat dissipation base plate is different. Through the fine structure design of the heat dissipation fins of different heat sinks, the temperature between different chips can be effectively controlled, and the temperature difference between different chips is minimized, realizing fine management and control of the heat dissipation of different chips.

[0024] Additional aspects and advantages of the present application will be made apparent by the following description and the accompanying drawings. BRIEF DESCRIPTION OF DRAWINGS

[0025] The above and / or additional aspects and advantages of the present application will become apparent and be readily understood from the following description, taken in conjunction with the accompanying drawings, in which:

[0026] Figure 1 FIG. 1 is a structural schematic diagram of a chip heat dissipation structure according to an embodiment of the present application.

[0027] Figure 2 FIG. 2 is a structural schematic diagram of another chip heat dissipation structure according to an embodiment of the present application.

[0028] 100 heat dissipation air duct; 200 chip; 300 heat sink; 301 core heat dissipation area; 302 non-core heat dissipation area; 310 heat dissipation base plate; 320 heat dissipation fin; 330 first heat conduction part; 340 second heat conduction part; 350 wind blocking part. DETAILED DESCRIPTION

[0029] Embodiments of the present application are described below in detail, examples of which are shown in the accompanying drawings, wherein the same or similar notations represent the same or similar elements or elements having the same or similar functions throughout. The embodiments described below by reference to the drawings are exemplary and are intended to explain the present application, and cannot be understood as limiting the present application.

[0030] As a high-tech computing electronic board card, the computing card is the core hardware in the fields of artificial intelligence, deep learning, scientific computing, etc., and usually carries one or more high-performance computing chips (such as GPU, ASIC, etc.). In a multi-chip computing card, multiple chips work together to provide powerful parallel computing capability. However, this design also brings a unique heat dissipation problem. First, multiple chips will generate a lot of heat during operation, and if the heat is not dissipated in time, the chip temperature will be too high, triggering the frequency reduction protection mechanism, seriously affecting the computing performance, and even the hardware may be damaged due to overheating. Second, due to the differences in chip manufacturing processes, uneven load distribution, and different physical locations (for example, in the system air duct, respectively at the upper wind position and the lower wind position), the actual power consumption and heat dissipation conditions of different chips often differ, which will cause their working temperatures to differ significantly. The large temperature difference not only affects the performance consistency of different chips, but also may cause system instability.

[0031] Based on the above problems, the present application aims to provide a heat dissipation structure and an electronic board card with efficient heat dissipation, which effectively controls the temperature between different chips and minimizes the temperature difference between different chips, thereby ensuring the stability and efficiency of the overall performance of the board card.

[0032] According to a first aspect of the present application, a chip heat dissipation structure is provided, as shown in Figure 1 The structure includes a heat dissipation air duct 100, and a plurality of chips 200 and a plurality of heat sinks 300 arranged in the heat dissipation air duct 100. The heat dissipation air duct 100 includes an air inlet and an air outlet arranged along a first direction, the plurality of chips 200 are arranged in sequence along the first direction between the air inlet and the air outlet, and the plurality of heat sinks 300 are arranged one by one on each chip 200. Wherein, each heat sink 300 includes a heat dissipation base plate 310 and a plurality of heat dissipation fins 320 arranged at equal intervals along a second direction, the plurality of heat dissipation fins 320 are connected to the corresponding chip 200 through the heat dissipation base plate 310, and the area range of the coverage interval of the plurality of heat dissipation fins 320 of different heat sinks 300 on the corresponding heat dissipation base plate 310 is different.

[0033] It can be understood that, since the plurality of heat sinks 300 are arranged one by one on each chip 200, the heat generated by the operation of each chip 200 can be conducted out through the heat sink 300 in contact with it, thereby assisting the chip 200 to dissipate heat. At the same time, since the plurality of chips 200 are arranged in sequence along the first direction between the air inlet and the air outlet, the cooling air flowing from the air inlet can pass through the heat sink 300 on each chip 200 in sequence and then flow out from the air outlet, so as to continuously conduct the heat on the heat sink 300 out, achieving the purpose of dissipating heat for the chip 200.

[0034] In addition, each heat sink 300 includes a heat dissipation substrate 310 and a plurality of heat dissipation fins 320 arranged at equal intervals along the second direction, the plurality of heat dissipation fins 320 are connected to the corresponding chip 200 through the heat dissipation substrate 310, and the area range of the coverage interval of the plurality of heat dissipation fins 320 of different heat sinks 300 on the corresponding heat dissipation substrate 310 is different, so that the application can adjust the area range of the coverage interval of the plurality of heat dissipation fins 320 in each heat sink 300 on the corresponding heat dissipation substrate 310, so as to achieve temperature balance between different chips 200 while achieving the purpose of dissipating heat for the chip 200, thereby maximizing the performance and optimizing the energy efficiency of the chip 200.

[0035] It should be noted that the types of different chips 200 can be the same or different. For the same type of chip 200, the size of the corresponding heat dissipation substrate 310 arranged thereon is the same. For different types of chips 200, the size of the corresponding heat dissipation substrate 310 arranged thereon and the area range of the coverage interval of the plurality of heat dissipation fins 320 on the corresponding heat dissipation substrate 310 can be flexibly adjusted according to the size of the chip 200.

[0036] In addition, the first direction is the direction from the air inlet to the air outlet of the heat dissipation air duct 100, and the second direction is the direction perpendicular to the first direction.

[0037] In some embodiments, the heat dissipation substrate 310 can include a core heat dissipation area corresponding to the area of the chip 200, and a non-core heat dissipation area arranged around the side of the core heat dissipation area. And in the second direction, the area range of the coverage interval of the plurality of heat dissipation fins 320 of different heat sinks 300 arranged in sequence along the first direction in the non-core heat dissipation area increases in turn.

[0038] It can be understood that, since the non-core heat dissipation area is arranged around the side of the core heat dissipation area, and the area range of the plurality of heat dissipation fins 320 of different heat sinks 300 arranged in sequence along the first direction in the second direction increases in sequence in the coverage area of the non-core heat dissipation area, the heat dissipation fins 320 of different heat sinks 300 arranged in sequence along the first direction can be directly in contact with the cooling air flowing into the air inlet in the corresponding non-core heat dissipation area, so as to realize temperature balance between different chips 200 while dissipating heat for the chip 200, thereby maximizing the performance such as computing power of the chip 200 and optimizing energy efficiency.

[0039] In some embodiments, the plurality of chips 200 can specifically include a first chip and a second chip arranged in sequence along the first direction. Among them, the first chip is arranged on the side close to the air inlet, and the second chip is arranged on the side close to the air outlet. Correspondingly, the plurality of heat sinks 300 can include a first heat sink located on the first chip and a second heat sink located on the second chip. The coverage area of the plurality of heat dissipation fins 320 of the first heat sink is located in the core heat dissipation area thereof and extends to the non-core heat dissipation area thereof along the first direction; the coverage area of the plurality of heat dissipation fins 320 of the second heat sink is located in the core heat dissipation area thereof and extends to the non-core heat dissipation area thereof along the second direction.

[0040] It can be understood that, since the first chip is arranged on the side close to the air inlet, and the coverage area of the plurality of heat dissipation fins 320 of the first heat sink is located in the core heat dissipation area thereof and extends to the non-core heat dissipation area thereof along the first direction, the cooling air flowing into the air inlet will contact the first heat sink during flowing to the air outlet, and heat exchange is realized through the plurality of heat dissipation fins 320 of the first heat sink extending to cover the core heat dissipation area, thereby achieving the effect of dissipating heat for the first chip and inhibiting temperature rise of the first chip.

[0041] Since the second chip is arranged on the side close to the air outlet, the coverage area of the plurality of heat dissipation fins 320 of the second heat sink is located in the core heat dissipation area thereof and extends to the non-core heat dissipation area thereof along the second direction, so that the cooling air flowing into the air inlet will not only contact the first heat sink, but also flow through the non-core heat dissipation area on both sides of the first heat sink along the second direction without contacting the heat dissipation fins 320 of the first heat sink, and directly contact the heat dissipation fins 320 of the second heat sink extending to the non-core heat dissipation area along the second direction to realize high-efficiency heat exchange, thereby improving the heat dissipation efficiency of the second heat sink and reducing the influence of heat generated by the heat dissipation of the first chip on the heat dissipation process of the second chip.

[0042] Since the first heat sink removes the heat dissipation fins 320 on both sides of the core heat dissipation area along the second direction, and forms a pair of open channels on both sides of the core heat dissipation area along the second direction, the channels can guide most of the cooling air to flow directly to the second heat sink, so as to ensure that the second heat sink can obtain sufficient low-temperature cooling air while the first chip is dissipating heat, effectively control the temperature between different chips 200, and reduce the temperature difference between different chips 200, and realize fine management and control of heat dissipation of different chips 200.

[0043] Further, considering that the first chip is close to the air inlet and can contact the lowest temperature cooling air, its heat dissipation condition is relatively superior, and the second chip is close to the air outlet and will be affected by the heat dissipation of the first chip, and can contact less low-temperature cooling air, resulting in a relatively poor heat dissipation condition.

[0044] Therefore, in order to optimize the cooling process of the cooling air on the first chip and avoid unnecessary thermal interference on the second chip, the plurality of heat dissipation fins 320 of the first heat sink can adopt a "loose" heat dissipation fin 320 design, that is, appropriately reducing the setting density of the heat dissipation fins 320 on the first chip. The low-density heat dissipation fins 320 not only can reduce the wind resistance, so that the cooling air can flow more smoothly and quickly take away the heat. At the same time, the low-density heat dissipation fins 320 can also reduce the heat dissipation area of the heat sink 300, thereby limiting the heat dissipation efficiency of the heat sink 300 to some extent, avoiding the excessive preheating of the cooling air flowing to the air outlet. That is, by reducing the setting density of the heat dissipation fins 320 on the first chip, the temperature between different chips 200 can also be effectively controlled, and the temperature difference between different chips 200 can be reduced, and fine management and control of heat dissipation of different chips 200 can be realized.

[0045] Exemplarily, the specific implementation of reducing the setting density of the heat dissipation fins 320 at least includes setting the number of the plurality of heat dissipation fins 320 of the first heat sink to be less than the number of the plurality of heat dissipation fins 320 of the second heat sink, or setting the gap distance between the plurality of heat dissipation fins 320 of the first heat sink to be greater than the gap distance between the plurality of heat dissipation fins 320 of the second heat sink.

[0046] It should be noted that the above specific implementation of reducing the setting density of the heat dissipation fins 320 is only illustrative as an example, and can be set according to actual needs, and the specific implementation can be one or a combination of the above examples.

[0047] In some embodiments, the plurality of heat dissipation fins 320 of the second heat sink are in the shape of an "I" on the corresponding heat dissipation substrate 310, and among the plurality of heat dissipation fins 320 of the second heat sink, the extension length of the heat dissipation fin 320 that extends along the first direction and covers the core heat dissipation area is less than the extension length of the heat dissipation fin 320 that does not extend to cover the core heat dissipation area.

[0048] Understandably, because the extension length of the heat dissipation fins 320 extending along the first direction and covering the core heat dissipation area on the second heat sink is less than the extension length of the heat dissipation fins 320 not extending to cover the core heat dissipation area, the heat dissipation fins 320 of the second heat sink can form air converging channels on both sides of the heat dissipation substrate 310 along the first direction, and are in an I-shape on the heat dissipation substrate 310. Therefore, as the cooling air flowing from the first heat sink flows into the second heat sink, the air converging channels located on both sides along the first direction can change the flow rate of the surrounding cooling air, and increase the flow rate of the cooling air flowing into the core heat dissipation area of ​​the second heat sink. This allows the second chip to maintain strong heat dissipation capacity even under unfavorable heat dissipation conditions, ensuring that the temperature of the second chip is effectively controlled.

[0049] In some embodiments, such as Figure 2 As shown, each heat sink 300 also includes an embedded first heat-conducting portion 330 within its heat dissipation substrate 310. The first heat-conducting portion 330 is disposed around the edge of the heat dissipation substrate 310 and extends from the edge of the heat dissipation substrate 310 along a second direction to the center of the heat dissipation substrate 310, connecting the core heat dissipation area and the non-core heat dissipation area.

[0050] Understandably, since the core heat dissipation area of ​​the heat dissipation substrate 310 corresponds to the chip 200, the heat and temperature of the core heat dissipation area of ​​the heat dissipation substrate 310 are higher than those of the non-core heat dissipation area surrounding the core heat dissipation area. By surrounding the edge of the heat dissipation substrate 310 with the first heat-conducting part 330 and extending from the edge of the heat dissipation substrate 310 along the second direction to the center of the heat dissipation substrate 310, the core heat dissipation area and the non-core heat dissipation area are connected. This allows the high heat of the core heat dissipation area of ​​the heat dissipation substrate 310 to be quickly conducted to the non-core heat dissipation area through the first heat-conducting part 330, thereby reducing the temperature difference between the core heat dissipation area and the non-core heat dissipation area of ​​the heat dissipation substrate 310, ensuring the overall temperature uniformity of the heat sink 300, and further improving the heat dissipation capacity of the heat sink 300.

[0051] The first heat conduction part 330 can be composed of a high-thermal-conductivity heat conduction material. According to the power consumption distribution and position difference of the chips 200, the trend and number of the first heat conduction part 330 are reasonably set, so that the setting density of the first heat conduction part 330 is increased in the area where the chip 200 has high power consumption, so as to enhance the heat dissipation capacity of the area, and at the same time, the heat is quickly conducted to the area with low power consumption through the first heat conduction part 330, so as to realize the balanced distribution of heat. Exemplarily, the first heat conduction part 330 is composed of a high-thermal-conductivity metal sheet (block) or a heat pipe.

[0052] In some embodiments, as shown in Figure 2 The second heat conduction part 340 is further arranged between the adjacent heat dissipation substrates 310, and the second heat conduction part 340 is connected with the first heat conduction part 330 in the adjacent heat dissipation substrates 310.

[0053] It can be understood that, by arranging the second heat conduction part 340 between the adjacent heat dissipation substrates 310 and connecting the second heat conduction part 340 with the first heat conduction part 330 in the adjacent heat dissipation substrates 310, an efficient heat conduction path can be established between the adjacent heat dissipaters 300. When the temperature of one chip 200 is significantly higher than that of another chip 200, the heat can be quickly transferred from the heat dissipation substrate 300 in the high-temperature state to the heat dissipation substrate 300 in the low-temperature state through the heat conduction path, so as to realize the heat balance between the two heat dissipaters 300. The heat dissipation structure can independently and efficiently dissipate heat for each chip 200, and can also work cooperatively when necessary to jointly cope with the heat load, thereby further enhancing the stability and reliability of the heat dissipation structure.

[0054] In addition, by sequentially increasing the number and density of the first heat conduction part 330 arranged in the plurality of heat dissipaters 300 arranged in the first direction, the heat of the downstream heat dissipation substrate 300 located in an unfavorable heat dissipation environment can be quickly transferred to the upstream heat dissipation substrate 300 located in a favorable heat dissipation environment through the second heat conduction part 340, so as to realize the temperature balance of the adjacent chips 200.

[0055] It should be noted that the second heat conduction part 340 and the first heat conduction part 330 can be composed of the same material or different materials, but are composed of a high-thermal-conductivity material or part. Exemplarily, the second heat conduction part 340 is composed of a high-thermal-conductivity copper block.

[0056] In some embodiments, the heat dissipation structure provided in the present application further comprises a heat conduction filling layer arranged between the heat dissipation substrate 310 and the corresponding chip 200 and filling the gap between the heat dissipation substrate 310 and the corresponding chip 200.

[0057] It can be understood that, since the heat-conducting filling layer is arranged between the heat-dissipating substrate 310 and the corresponding chip 200 and fills the gap between the heat-dissipating substrate 310 and the corresponding chip 200, the heat-conducting substrate can be tightly attached to the corresponding chip 200, ensuring that the heat generated by the chip 200 can be efficiently conducted to the heat sink 300 and reducing the contact thermal resistance. At the same time, the heat-conducting filling layer can also optimize the contact area between the heat sink 300 and the chip 200, so that the heat can be evenly distributed on the entire surface of the heat sink 300, avoiding local overheating.

[0058] In some embodiments, the heat-conducting filling layer can be composed of a heat-conducting material with high thermal conductivity. For example, the heat-conducting filling layer can be a heat-conducting silicone grease or a heat-conducting gasket.

[0059] In some embodiments, as shown in FIG. 4, the heat-conducting filling layer 330 is arranged between the heat-dissipating substrate 310 and the corresponding chip 200. Figure 1 As shown in FIG. 5, the heat-conducting filling layer 330 is arranged between the heat-dissipating substrate 310 and the corresponding chip 200.

[0060] It can be understood that, since the heat-conducting filling layer is arranged between the heat-dissipating substrate 310 and the corresponding chip 200 and fills the gap between the heat-dissipating substrate 310 and the corresponding chip 200, the heat-conducting substrate can be tightly attached to the corresponding chip 200, ensuring that the heat generated by the chip 200 can be efficiently conducted to the heat sink 300 and reducing the contact thermal resistance. At the same time, the heat-conducting filling layer can also optimize the contact area between the heat sink 300 and the chip 200, so that the heat can be evenly distributed on the entire surface of the heat sink 300, avoiding local overheating.

[0061] It can be understood that, since the heat-conducting filling layer is arranged between the heat-dissipating substrate 310 and the corresponding chip 200 and fills the gap between the heat-dissipating substrate 310 and the corresponding chip 200, the heat-conducting substrate can be tightly attached to the corresponding chip 200, ensuring that the heat generated by the chip 200 can be efficiently conducted to the heat sink 300 and reducing the contact thermal resistance. At the same time, the heat-conducting filling layer can also optimize the contact area between the heat sink 300 and the chip 200, so that the heat can be evenly distributed on the entire surface of the heat sink 300, avoiding local overheating.

[0062] According to a second aspect of the present application, an electronic board card is provided, which comprises the chip heat-dissipating structure of any of the above embodiments.

[0063] The electronic board card includes but is not limited to a double-chip PCIe computing power card.

[0064] As an example, under the conditions of an inlet temperature of 48.6 / 44.2 / 43.5℃ and a total card air volume of 10.4 CFM, the temperatures of two computing chips (Chip1 and Chip2) with the same or different power consumptions in the heat-dissipating air duct 100 were tested by reasonably designing the chip heat-dissipating structure of the double-chip PCIe computing power card, and the results are shown in the following table.

[0065]

[0066] The test results show that when the heat dissipation structure provided by the application is adapted to the PCIe computing power card, the temperature difference is ≤3℃ under a power consumption difference of 5W, verifying the wide adaptability of the heat dissipation structure, and solving the problem that the performance of the computing power card electronic board is limited due to the large temperature difference between different chips and uneven heat dissipation in the prior art.

[0067] In summary, the application provides a chip heat dissipation structure and an electronic board card, which include a heat dissipation air duct 100, and a plurality of chips 200 and a plurality of heat sinks 300 arranged in the heat dissipation air duct 100. The heat dissipation air duct 100 includes an air inlet and an air outlet arranged along a first direction, the plurality of chips 200 are arranged in sequence along the first direction, and the plurality of heat sinks 300 are arranged one by one on each chip 200. Wherein, each heat sink 300 includes a heat dissipation base plate 310 and a plurality of heat dissipation fins 320 arranged at equal intervals along a second direction, the plurality of heat dissipation fins 320 are connected with the corresponding chip 200 through the heat dissipation base plate 310, and the area range of the coverage interval of the plurality of heat dissipation fins 320 of different heat sinks 300 on the corresponding heat dissipation base plate 310 is different. Through the fine structure design of the heat dissipation fins 320 of different heat sinks 300, the temperature between different chips 200 can be effectively controlled, and the temperature difference between different chips 200 is minimized, realizing fine management and control of the heat dissipation of different chips 200.

[0068] In the foregoing embodiment descriptions, the description of the terms "one embodiment", "some embodiments", "an example", "a specific example", or "some examples" and the like means that the specific features, structures, materials or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of the application. In the description, the illustrative description of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any appropriate manner in any one or more embodiments or examples. In addition, the person skilled in the art can combine and combine the different embodiments or examples described in the description and the features of the different embodiments or examples without contradiction.

[0069] In addition, the terms "first", "second" are only for descriptive purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined with "first", "second" can explicitly or implicitly include at least one of the features. In the description of the application, the meaning of "a plurality of" is at least two, for example, two, three, etc., unless otherwise specifically limited.

Claims

1. A chip heat dissipation structure, characterized in that, include: A heat dissipation duct, the heat dissipation duct including an air inlet and an air outlet arranged along a first direction; Multiple chips are arranged sequentially between the air inlet and the air outlet along the first direction; Multiple heat sinks are provided, with each heat sink corresponding to one of the chips; Each heat sink includes a heat sink substrate and a plurality of heat sink fins arranged at equal intervals along a second direction. The plurality of heat sink fins are connected to the corresponding chip through the heat sink substrate, and the area range of the coverage area of ​​the plurality of heat sink fins on the corresponding heat sink substrate is different for different heat sinks.

2. The chip heat dissipation structure according to claim 1, characterized in that, The heat dissipation substrate includes a core heat dissipation area corresponding to the chip position, and a non-core heat dissipation area surrounding the core heat dissipation area. In the second direction, the area range of the coverage area of ​​the multiple heat dissipation fins of different heat sinks arranged sequentially along the first direction in the non-core heat dissipation area increases sequentially.

3. The chip heat dissipation structure according to claim 2, characterized in that, The plurality of chips include a first chip and a second chip, and the plurality of heat sinks include a first heat sink and a second heat sink; wherein, the first chip is disposed on the side near the air inlet, the first heat sink is disposed on the first chip, and the coverage area of ​​the plurality of heat dissipation fins of the first heat sink is located in the core heat dissipation area and extends along the first direction to the non-core heat dissipation area; the second chip is disposed on the side near the air outlet, the second heat sink is disposed on the second chip, and the coverage area of ​​the plurality of heat dissipation fins of the second heat sink is located in the core heat dissipation area and extends along the second direction to the non-core heat dissipation area.

4. The chip heat dissipation structure according to claim 3, characterized in that, The number of heat dissipation fins in the first heat sink is less than the number of heat dissipation fins in the second heat sink; the gap between the heat dissipation fins in the first heat sink is greater than the gap between the heat dissipation fins in the second heat sink.

5. The chip heat dissipation structure according to claim 3, characterized in that, In the second heat sink, the plurality of heat dissipation fins are arranged in an "I" shape on the corresponding heat dissipation substrate, and among the plurality of heat dissipation fins, the extension length of the heat dissipation fin that extends along the first direction to cover the core heat dissipation area is less than the extension length of the heat dissipation fin that does not extend to cover the core heat dissipation area.

6. The chip heat dissipation structure according to claim 2, characterized in that, The heat sink further includes a first heat-conducting part embedded in the heat sink substrate. The first heat-conducting part is disposed at the edge of the heat sink substrate and extends from the edge of the heat sink substrate along the second direction to the center of the heat sink substrate, connecting the core heat sink area and the non-core heat sink area.

7. The chip heat dissipation structure according to claim 6, characterized in that, A second heat-conducting part is provided between adjacent heat dissipation substrates, and the second heat-conducting part is connected to the first heat-conducting part in the adjacent heat dissipation substrate.

8. The chip heat dissipation structure according to claim 1, characterized in that, It also includes a thermally conductive filling layer, which is disposed between the heat dissipation substrate and the corresponding chip, and fills the gap between the heat dissipation substrate and the corresponding chip.

9. The chip heat dissipation structure according to claim 2, characterized in that, Each of the heat sinks has a windbreak portion on its plurality of heat dissipation fins, and the windbreak portion extends along the second direction and covers the plurality of heat dissipation fins corresponding to the heat sink.

10. An electronic circuit board, characterized in that, Includes the chip heat dissipation structure as described in any one of claims 1 to 9.

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