High-precision silicone grease coating clamp for enhancing heat dissipation efficiency of circuit board

Abstract

The utility model relates to the technical field of circuit board heat dissipation, and particularly discloses a high-precision silicone grease coating clamp for enhancing the heat dissipation efficiency of a circuit board, which comprises a silicone grease coating unit and an operation table, the silicone grease coating unit is connected with a lifting bracket, and the lifting bracket is connected with a lifting unit for driving the lifting bracket to move up and down; a circuit board body is arranged on the operation table. According to the utility model, the lifting unit drives the silicone grease coating unit to move downwards, so that the silicone grease coating meshes in the silicone grease coating unit are aligned with the area of the circuit board body needing to be coated with the silicone grease, the silicone grease is coated on the silicone grease coating mesh plate, and the silicone grease on the silicone grease coating mesh plate can only fall down from the silicone grease coating meshes and is pushed to the silicone grease coating meshes, so that the silicone grease is coated on the silicone grease coating mesh plate. And then the silicone grease falls from the silicone grease coating meshes and falls to the corresponding area on the circuit board body, the silicone grease is only applied to the area, aligned with the silicone grease coating meshes, on the circuit board body, and compared with a direct coating mode without limitation, coating is more accurate.

Description

Technical Field

[0001] This utility model belongs to the field of circuit board heat dissipation technology, specifically relating to a high-precision silicone grease application fixture for enhancing the heat dissipation performance of circuit boards. Background Technology

[0002] As electronic devices continue to evolve towards miniaturization and higher performance, the power density of electronic components on circuit boards continues to increase, making heat dissipation an increasingly critical issue.

[0003] There are various ways to improve heat dissipation performance, one of which is to apply thermal paste to the circuit board. However, traditional methods of applying thermal paste often fail to ensure that the paste is applied evenly and precisely to the critical heat dissipation areas of the circuit board, thus affecting the heat dissipation effect. Therefore, this application proposes a high-precision thermal paste application fixture for enhancing the heat dissipation performance of circuit boards. Utility Model Content

[0004] The purpose of this invention is to provide a high-precision silicone grease applicator for enhancing the heat dissipation performance of circuit boards, thereby solving the problems mentioned in the background art.

[0005] To achieve the above objectives, this utility model provides the following technical solution: a high-precision silicone grease applicator for enhancing the heat dissipation performance of circuit boards, comprising a silicone grease applicator unit and an operating table, wherein the silicone grease applicator unit is connected to a lifting bracket, and the lifting bracket is connected to a lifting unit for driving the lifting bracket to move up and down.

[0006] The control panel is equipped with a circuit board body, and the silicone grease application mesh in the silicone grease application unit is aligned with the circuit board body.

[0007] The silicone grease application unit is provided with a lateral moving unit, which is connected to a moving plate. The lateral moving unit is used to drive the moving plate to move along the silicone grease application mesh.

[0008] The movable plate is connected to the scraping plate, which has a scraping part and a storage groove.

[0009] The scraper is provided with an upward-lifting bevel.

[0010] Preferably, the silicone grease application unit includes an outer frame and a silicone grease application inner frame, the silicone grease application inner frame is located inside the outer frame, and there is a gap between the silicone grease application inner frame and the inner wall of the outer frame.

[0011] Preferably, two sets of left and right adjustment parts are screwed into the left and right sides of the outer frame, with one end of the left and right adjustment parts abutting against the outer wall of the inner frame coated with silicone grease.

[0012] Preferably, two sets of front and rear adjustment parts are screwed into the front and rear sides of the outer frame, with one end of the front and rear adjustment parts abutting against the outer wall of the silicone-greased inner frame.

[0013] Preferably, four insert rods are screwed into the four corners of the outer frame, and insertion holes are provided in the operation table at the positions corresponding to the insert rods. Four guide rods are inserted into the outer frame, and guide holes are provided in the operation table at the positions corresponding to the guide rods.

[0014] Preferably, a trapezoidal plate is installed in the storage groove. The trapezoidal plate has two inclined sides, one of which is parallel to the feed inlet of the storage groove, and the other inclined side is inclined downward.

[0015] Preferably, the vertical height of the upward-lifting inclined edge is greater than the depth of the silicone grease mesh.

[0016] Preferably, a lifting rod is installed at the upper end of the scraper, the lifting rod penetrates the moving plate, and a spring is sleeved on the outside of the lifting rod.

[0017] Preferably, a lifting plate is installed on the scraper plate, and an adjusting rod is screwed into the lifting plate. The adjusting rod is connected to the lifting plate by a thread, and the bottom of the adjusting rod is screwed into the barrier plate.

[0018] Preferably, the scraper plate is inserted into the lifting plate, and the lifting plate is inserted into the groove in the scraper plate.

[0019] Compared with the prior art, the beneficial effects of this utility model are:

[0020] I. This utility model uses a lifting unit to move the grease-applying unit downwards, aligning the grease-applying mesh in the grease-applying unit with the area on the circuit board body where grease needs to be applied. The grease is then applied to the grease-applying mesh, and the grease can only fall from the mesh. The grease is pushed to the mesh and then falls from there onto the corresponding area on the circuit board body. The grease is applied only to the area aligned with the mesh, making the application more precise compared to applying grease directly without restriction.

[0021] Second, after the silicone grease falls into the silicone grease mesh holes, the horizontal moving unit is activated. The horizontal moving unit drives the moving plate to move from right to left. The scraper plate connected to the moving plate scrapes the remaining silicone grease on the silicone grease mesh plate into the silicone grease mesh holes and pushes the silicone grease on the circuit board body, so that the silicone grease on the surface of the circuit board body is of the same thickness and the silicone grease is applied more evenly. Such even and precise application of silicone grease improves the heat dissipation effect of the area on the circuit board body where silicone grease is applied. Attached Figure Description

[0022] Figure 1 This is a schematic diagram of the high-precision silicone grease application fixture used to enhance the heat dissipation performance of circuit boards in this utility model.

[0023] Figure 2 This is a schematic diagram of the structure of the silicone grease application unit in this utility model.

[0024] Figure 3 This is one of the internal structural schematic diagrams of the high-precision silicone grease applicator used to enhance the heat dissipation performance of circuit boards in this utility model.

[0025] Figure 4 This is the second schematic diagram of the internal structure of the high-precision silicone grease applicator used to enhance the heat dissipation performance of circuit boards in this utility model.

[0026] In the diagram: 1. Applying silicone grease unit; 101. Outer frame; 102. Applying silicone grease inner frame; 103. Applying silicone grease mesh; 104. Applying silicone grease mesh holes; 105. Left and right adjustment component; 106. Front and rear adjustment component; 107. Insert rod; 108. Guide rod; 2. Operating table; 3. Circuit board body; 4. Lifting bracket; 5. Lifting unit; 6. Lateral movement unit; 7. Moving plate; 8. Grease scraper; 801. Grease scraping part; 802. Storage slot; 803. Trapezoidal plate; 804. Lifting bevel; 9. Spring; 10. Lifting plate; 11. Adjusting rod. Detailed Implementation

[0027] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0028] Reference Figures 1-4 A high-precision silicone grease applicator for enhancing the heat dissipation performance of circuit boards includes a silicone grease applicator unit 1 and an operating table 2. The silicone grease applicator unit 1 is connected to a lifting bracket 4, and the lifting bracket 4 is connected to a lifting unit 5 for driving the lifting bracket 4 to move up and down.

[0029] The control panel 2 is equipped with a circuit board body 3. In order to enhance the heat dissipation performance of the circuit board body 3, it is necessary to apply thermal paste to the circuit board body 3. During the application of thermal paste, the thermal paste is applied by components such as the thermal paste application unit 1. Specifically, the thermal paste application unit 1 is moved down by the lifting unit 5 so that the thermal paste application mesh 104 in the thermal paste application unit 1 is aligned with the area of ​​the circuit board body 3 where thermal paste needs to be applied. The thermal paste is applied to the thermal paste application mesh 103. The thermal paste on the thermal paste application mesh 103 can only fall from the thermal paste application mesh 104. The thermal paste is pushed to the thermal paste application mesh 104 and then falls from the thermal paste application mesh 104 to the corresponding area on the circuit board body 3.

[0030] Specifically, the silicone grease application unit 1 includes an outer frame 101 and a silicone grease application inner frame 102. The silicone grease application inner frame 102 is located inside the outer frame 101, and there is a gap between the silicone grease application inner frame 102 and the inner wall of the outer frame 101. Two sets of left and right adjustment parts 105 are screwed into the left and right sides of the outer frame 101. The left and right adjustment parts 105 can be the first bolt, and one end of the left and right adjustment parts 105 abuts against the outer wall of the silicone grease application inner frame 102.

[0031] More specifically, two sets of front and rear adjustment pieces 106 are screwed into the front and rear sides of the outer frame 101. The front and rear adjustment pieces 106 can be made of second bolts. One end of the front and rear adjustment pieces 106 abuts against the outer wall of the inner frame 102 for applying silicone grease. The left and right adjustment pieces 105 and the front and rear adjustment pieces 106 can adjust the front and rear and left and right positions of the inner frame 102 for applying silicone grease, so that the silicone grease mesh 104 is aligned with the designated area of ​​the circuit board body 3. This is suitable for the alignment of different working areas of various types of circuit board bodies 3. After alignment, silicone grease is applied.

[0032] It should be noted that four insert rods 107 are screwed into the four corners of the outer frame 101, and the corresponding insertion holes are provided in the operating table 2 at the positions of the insert rods 107. Four guide rods 108 are inserted into the outer frame 101, and guide holes are provided in the operating table 2 at the positions of the guide rods 108.

[0033] After the thermal paste is applied to the circuit board body 3, it is necessary to ensure that the thickness of the thermal paste is the same in all places. The same thickness means that the heat dissipation performance is the same in all places. The outer surface of the circuit board is smooth after the thermal paste is applied. Therefore, a horizontal moving unit 6 is provided at the thermal paste application unit 1. The horizontal moving unit 6 is connected to the moving plate 7. The horizontal moving unit 6 is used to drive the moving plate 7 to move along the thermal paste application mesh 103. During the movement, the thermal paste on the thermal paste application mesh 103 can be pushed to the thermal paste mesh holes 104.

[0034] Specifically, the movable plate 7 is connected to the scraper plate 8, which has a scraping part 801. The scraping part 801 is a smooth plane. The scraper plate 8 has a collection groove 802 for storing excess silicone grease. A trapezoidal plate 803 is installed in the collection groove 802. The trapezoidal plate 803 has two inclined sides, one of which is parallel to the feed inlet of the collection groove 802, and the other inclined side is inclined downward. After the silicone grease enters the collection groove 802, it can prevent the silicone grease from flowing out and keep the silicone grease inside the collection groove 802, thus preventing the silicone grease from falling out during the feeding process.

[0035] More specifically, the scraper plate 8 is provided with an upward lifting bevel 804, the vertical height of which is greater than the depth of the silicone grease mesh 104. A lifting rod is installed at the upper end of the scraper plate 8, which penetrates the moving plate 7. A spring 9 is sleeved on the outside of the lifting rod. The scraper plate 8 is connected to the moving plate 7 through the lifting rod. The scraper plate 8 can move up and down relative to each other, that is, it can move up and down during the lateral movement of the scraper plate 8, which can scrape the silicone grease on the upper surface of the circuit board body 3. The scraper plate 8 can enter into the silicone grease mesh 104 during its movement, and it can also move out of the silicone grease mesh 104.

[0036] Different circuit board bodies 3 require different thicknesses of silicone grease, and the height of the lower end of the scraper 8 also varies when the grease needs to be smoothed. Therefore, a lifting plate 10 is inserted into the scraper 8, and an adjusting rod 11 is screwed into the lifting plate 10. The adjusting rod 11 is connected to the lifting plate 10 by a thread, and the bottom of the adjusting rod 11 is screwed into a barrier plate. The barrier plate is located on the upper side of the moving plate 7 and is used to limit the minimum height that the scraper 8 can move downward, thereby limiting the height of the flat surface that the scraper 8 can smooth.

[0037] Working principle:

[0038] The lifting unit 5 drives the grease application unit 1 to move downward, so that the grease application mesh 104 in the grease application unit 1 is aligned with the area of ​​the circuit board body 3 where grease needs to be applied. The grease is applied to the grease application mesh 103. The grease on the grease application mesh 103 can only fall from the grease application mesh 104. The grease is pushed to the grease application mesh 104, and then the grease falls from the grease application mesh 104 to the corresponding area on the circuit board body 3.

[0039] After the silicone grease falls into the silicone grease mesh 104, the lateral movement unit 6 is activated. The lateral movement unit 6 drives the moving plate 7 to move from right to left. The scraper plate 8 connected to the moving plate 7 scrapes the remaining silicone grease on the silicone grease mesh 103 into the silicone grease mesh 104 and pushes the silicone grease on the circuit board body 3 so that the silicone grease on the upper surface of the circuit board body 3 is of uniform thickness. The excess silicone grease is collected into the storage groove 802.

[0040] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A high-precision silicone grease applicator for enhancing the heat dissipation performance of circuit boards, comprising a silicone grease applicator unit (1) and an operating table (2), characterized in that, The silicone grease application unit (1) is connected to the lifting bracket (4), and the lifting bracket (4) is connected to the lifting unit (5) used to drive the lifting bracket (4) to move up and down; The control panel (2) is equipped with a circuit board body (3), and the grease application mesh (104) in the grease application unit (1) is aligned with the circuit board body (3); A transverse moving unit (6) is provided at the silicone grease application unit (1). The transverse moving unit (6) is connected to the moving plate (7). The transverse moving unit (6) is used to drive the moving plate (7) to move along the silicone grease application mesh (103). The movable plate (7) is connected to the scraper plate (8), and the scraper plate (8) is provided with a scraping part (801) and a storage groove (802). The scraper (8) is provided with an upward lifting bevel (804).

2. The high-precision silicone grease application fixture for enhancing the heat dissipation performance of circuit boards according to claim 1, characterized in that, The silicone grease application unit (1) includes an outer frame (101) and a silicone grease application inner frame (102). The silicone grease application inner frame (102) is located inside the outer frame (101), and there is a gap between the silicone grease application inner frame (102) and the inner wall of the outer frame (101).

3. A high-precision silicone grease application fixture for enhancing the heat dissipation performance of circuit boards according to claim 2, characterized in that, Two sets of left and right adjustment parts (105) are screwed into the left and right sides of the outer frame (101), and one end of the left and right adjustment parts (105) abuts against the outer wall of the silicone grease-coated inner frame (102).

4. A high-precision silicone grease application fixture for enhancing the heat dissipation performance of circuit boards according to claim 3, characterized in that, Two sets of front and rear adjustment parts (106) are screwed into the front and rear sides of the outer frame (101), with one end of the front and rear adjustment parts (106) abutting against the outer wall of the silicone grease-coated inner frame (102).

5. A high-precision silicone grease application fixture for enhancing the heat dissipation performance of a circuit board according to claim 4, characterized in that, Four insert rods (107) are screwed into the four corners of the outer frame (101), and insertion holes are provided in the operating table (2) at the positions corresponding to the insert rods (107). Four guide rods (108) are inserted into the outer frame (101), and guide holes are provided in the operating table (2) at the positions corresponding to the guide rods (108).

6. A high-precision silicone grease application fixture for enhancing the heat dissipation performance of circuit boards according to claim 1, characterized in that, A trapezoidal plate (803) is installed inside the storage groove (802). The trapezoidal plate (803) is set inside the storage groove (802). The trapezoidal plate (803) has two inclined sides, one of which is parallel to the feed inlet of the storage groove (802), and the other inclined side is inclined downward.

7. A high-precision silicone grease application fixture for enhancing the heat dissipation performance of circuit boards according to claim 1, characterized in that, The vertical height of the upward inclined edge (804) is greater than the depth of the silicone grease mesh (104).

8. A high-precision silicone grease application fixture for enhancing the heat dissipation performance of circuit boards according to claim 1, characterized in that, The upper end of the scraper (8) is equipped with a lifting rod, which penetrates the moving plate (7), and a spring (9) is sleeved on the outside of the lifting rod.

9. A high-precision silicone grease application fixture for enhancing the heat dissipation performance of circuit boards according to claim 1, characterized in that, A lifting plate (10) is installed on the scraper plate (8). An adjusting rod (11) is screwed into the lifting plate (10). The adjusting rod (11) is connected to the lifting plate (10) by a thread. The bottom of the adjusting rod (11) is screwed into the barrier plate.

10. A high-precision silicone grease application fixture for enhancing the heat dissipation efficiency of a circuit board according to claim 9, characterized in that, The scraper plate (8) is inserted into the lifting plate (10), and the lifting plate (10) is inserted into the groove in the scraper plate (8).

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