Laser processing equipment capable of switching light paths
By introducing a switchable optical path structure and rodless cylinder into laser processing equipment, the problem of poor flexibility of traditional equipment has been solved, enabling rapid switching of optical paths and efficient processing, thus improving the adaptability and transmission efficiency of the equipment.
Patent Information
- Application Number
- CN202520593037.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-03-31
- Publication Date
- 2026-02-24
- Estimated Expiration
- 2035-03-31
AI Technical Summary
Traditional laser processing equipment uses a single-system, single-optical-path architecture, which is inflexible and has an unadjustable beam energy distribution, making it unable to adapt to different materials or processing depth requirements.
The laser processing equipment employs a switchable optical path, which achieves rapid switching of the optical path through the cooperation of a beam splitter and a drive source. Combined with an optical path dustproof tube and a rodless cylinder, the accuracy and stability of the optical path are ensured.
It improves the flexibility and adaptability of the optical path, ensures that the laser beam accurately acts on the processed object, improves the working efficiency of the equipment and the transmission efficiency of the optical path, and extends the service life of the equipment.
Smart Images
Figure CN223932815U_ABST
Abstract
Description
Technical Field
[0001] This application relates to the technical field of laser processing equipment, and in particular to a laser processing equipment with switchable optical paths. Background Technology
[0002] Laser processing equipment is widely used in industrial manufacturing, particularly demonstrating significant advantages in precision machining and materials processing. As modern manufacturing demands ever higher processing efficiency and precision, laser technology has gradually become an indispensable core tool. Currently, laser processing equipment not only enables efficient cutting, welding, and marking, but also plays a crucial role in aerospace, automotive manufacturing, and other fields, greatly promoting technological progress and development in related industries.
[0003] Currently, traditional laser processing systems generally adopt a "single system-single optical path" architecture, meaning that each laser generating system independently controls a processing optical path. While this approach ensures the independence of processing parameters, it has significant limitations, such as poor flexibility and fixed beam splitting leading to unadjustable beam energy distribution, making it unable to adapt to different materials or processing depth requirements. Utility Model Content
[0004] To address the shortcomings of existing technologies, this application provides a laser processing device with switchable optical paths.
[0005] The laser processing equipment with switchable optical paths provided in this application adopts the following technical solution:
[0006] A laser processing device with switchable optical paths, comprising:
[0007] A laser is used to emit a laser beam for processing.
[0008] A first reflecting mirror is positioned in the light-emitting direction of the laser.
[0009] An optical path switching structure includes a beam splitter and a second reflector, wherein the beam splitter and the second reflector are arranged in parallel and one of them can be selectively located on the optical path of the first reflector; and
[0010] The optical path receiving unit includes a third reflector and a fourth reflector. The third reflector can receive the light beam from the beam splitter and reflect it onto the workpiece, and the fourth reflector can receive the light beam from the second reflector and reflect it onto the workpiece.
[0011] By adopting the above technical solution and setting the optical path switching structure, the optical path can be switched quickly to meet different processing needs, further improving the flexibility and adaptability of the optical path and ensuring that the laser beam can accurately act on the processed object.
[0012] Optionally, the optical path switching structure further includes a driving source, the beam splitter is fixed to the driving source, and the driving source can carry the beam splitter to move along a one-dimensional direction to be located in the reflected optical path of the first reflector or to leave the reflected optical path of the first reflector.
[0013] By adopting the above technical solution, dynamic switching of the optical path is achieved. This design makes optical path switching more convenient and rapid, improves the working efficiency of the equipment, and adapts to different processing needs.
[0014] Optionally, the laser processing equipment with switchable optical paths further includes an installation platform, on which a first support platform and a second support platform are fixedly installed. The optical path switching structure and the optical path receiving unit are respectively placed on the first support platform and the second support platform. The laser is connected to the first support platform and the second support platform through an optical path dustproof tube.
[0015] By adopting the above technical solution, the optical path switching structure and optical path receiving unit are protected and fixed, effectively preventing dust and other impurities from entering the optical path system, protecting optical components, and extending the service life of the equipment.
[0016] Optionally, the drive source includes a base and a cylinder, the cylinder being fixed to the base.
[0017] By adopting the above technical solution, the base provides stable support for the cylinder, ensuring its normal operation.
[0018] Optionally, the base is provided with two limiting blocks, which are installed at both ends of the base, and the protruding surface of the limiting blocks is covered with a rubber buffer layer.
[0019] By adopting the above technical solution, the movement range of the mobile platform is limited, preventing excessive movement from causing optical path misalignment or other mechanical failures. The rubber buffer layer can reduce the impact force when the mobile platform collides with the limit block, protecting equipment components and reducing wear.
[0020] Optionally, the cylinder is connected to a moving platform, the base is provided with two guide rails, and the bottom of the moving platform has a sliding groove corresponding to the guide rails. The cylinder drives the moving platform to move along the guide rails.
[0021] By adopting the above technical solutions, the movement of the mobile platform becomes smoother and more accurate, and the precision of optical path switching is improved.
[0022] Optionally, the mobile platform is equipped with an induction switch, and slotted photoelectric sensors corresponding to the induction switch are provided at both ends of the guide rail. The induction switch moves with the mobile platform and triggers the slotted photoelectric sensors to provide feedback on the extreme position signal of the mobile platform.
[0023] By adopting the above technical solution, the position of the mobile platform can be accurately monitored, and the reflection direction of the light beam can be determined.
[0024] Optionally, a convex mirror is disposed directly below the third and fourth reflecting mirrors.
[0025] By adopting the above technical solution, the laser beam was enhanced, thus meeting greater processing requirements.
[0026] Optionally, the cylinder is a rodless cylinder.
[0027] By adopting the above technical solution, the requirements of the equipment for fast and accurate optical path switching can be better met, and it has the advantages of compact structure, light weight and fast response speed.
[0028] Optionally, the inner wall of the optical path dustproof cylinder is coated with an anti-reflective coating.
[0029] By adopting the above technical solution, the reflection loss of laser on the cylinder wall during the propagation process can be reduced, the transmission efficiency of laser can be improved, and more laser energy can be ensured to reach the processed object, thereby improving the processing effect.
[0030] In summary, this application includes at least one of the following beneficial technical effects:
[0031] 1. By combining the beam splitter with the driving source, the optical path can be quickly switched to form a single processing optical path or dual processing optical paths to meet different processing needs and ensure that the laser beam can accurately act on the processed object;
[0032] 2. The inner wall of the optical path dustproof cylinder is coated with an anti-reflection coating, which can reduce the reflection loss of laser on the cylinder wall during the propagation process, improve the transmission efficiency of laser, and ensure that more laser energy reaches the processed object, thereby improving the processing effect;
[0033] 3. Rodless cylinders can better meet the equipment's requirements for fast and precise optical path switching, and have advantages such as compact structure, light weight, and fast response speed. Attached Figure Description
[0034] Figure 1 This is a schematic diagram of the overall structure of a laser processing device with switchable optical paths provided in an embodiment of the present invention;
[0035] Figure 2 This is a schematic diagram of the optical path in operation of the system;
[0036] Figure 3 yes Figure 1 A partially enlarged schematic diagram of the optical path switching structure;
[0037] Figure 4 This is a two-dimensional simplified diagram of the optical path switching structure.
[0038] Explanation of reference numerals in the attached drawings: 1. Laser; 2. First reflector; 3. Optical path switching structure; 31. Driver source; 32. Beam splitter; 33. Second reflector; 311. Base; 312. Cylinder; 313. Limiting block; 314. Moving platform; 315. Guide rail; 316. Inductive switch; 317. Slotted photoelectric sensor; 4. Optical path receiving unit; 41. Third reflector; 42. Fourth reflector; 43. Convex mirror; 5. Mounting platform; 6. First support platform; 7. Second support platform; 8. Optical path dustproof cylinder. Detailed Implementation
[0039] The following is in conjunction with the appendix Figure 1-4 This application will be described in further detail.
[0040] refer to Figure 1 and Figure 2 This application discloses a laser processing device with switchable optical paths. The laser processing device with switchable optical paths includes a laser 1, a first reflector 2, an optical path switching structure 3, and an optical path receiving unit 4.
[0041] Laser 1 is used to emit a laser beam for processing, and the emitted laser beam first illuminates the first reflecting mirror 2.
[0042] The first reflector 2 is positioned in the light-emitting direction of the laser 1 to reflect the laser beam to the subsequent optical path switching structure 3.
[0043] The optical path switching structure 3 includes a beam splitter 32, a second reflector 33, and a driving source 31. The beam splitter 32 and the second reflector 33 are arranged in parallel and can be selectively located on the optical path of the first reflector 2. The driving source 31 is used to control the movement of the beam splitter 32, causing it to enter or leave the reflected optical path of the first reflector 2, thereby realizing the switching of the optical path.
[0044] refer to Figure 3 and Figure 4 The drive source 31 includes a base 311 and a cylinder 312, with the cylinder 312 fixed to the base 311. A beam splitter 32 is fixedly connected to the cylinder 312, which drives the beam splitter 32 to move along a one-dimensional direction on the guide rail 315, causing it to enter or leave the reflected light path of the first reflecting mirror 2. When the slotted photoelectric sensor 317 detects the limit position signal of the inductive switch 316, the control system controls the moving platform 314 to stop. Limit blocks 313 are provided at both ends of the base 311, and the protruding surfaces of the limit blocks 313 are covered with a rubber buffer layer to limit the movement range of the moving platform 314 and reduce the impact force during collisions.
[0045] The optical path receiving unit 4 includes a third reflector 41 and a fourth reflector 42. The third reflector 41 can receive the light beam from the beam splitter 32 and reflect it onto the workpiece, and the fourth reflector 42 can receive the light beam from the second reflector 33 and reflect it onto the workpiece.
[0046] In a further embodiment, the third reflector 41 and the fourth reflector 42 are further provided with a convex mirror 43 in the light-emitting direction. The convex mirror 43 can converge and collimate the emitted light, making the light spot smaller and the energy more concentrated, thereby achieving better technical results.
[0047] refer to Figure 1 In a further embodiment, a first support platform 6 and a second support platform 7 are fixedly mounted on the mounting platform 5, respectively accommodating the optical path switching structure 3 and the optical path receiving unit 4, serving a protective and fixing function. The laser 1 is connected to the first support platform 6 and the second support platform 7 via an optical path dustproof tube 8. The inner wall of the optical path dustproof tube 8 is coated with an anti-reflective coating, which not only prevents dust from entering the optical path system but also improves the transmission efficiency of the laser.
[0048] The implementation principle of this application embodiment is as follows: In actual operation, the laser 1 emits a laser beam onto the first reflecting mirror 2, and the first reflecting mirror 2 reflects the laser beam onto the optical path switching structure 3. When the first power of light is required to process the object, the control system sends a command to the cylinder 312 of the drive source 31. The cylinder 312 drives the beam splitter 32 to move along the guide rail 315, so that it leaves the reflected light path of the first reflecting mirror 2. The fourth reflecting mirror 42 can receive the beam of light from the second reflecting mirror 33 and reflect it onto the processed object through the convex mirror 43.
[0049] When a second power light is needed to process two objects simultaneously, the control system sends a command to the cylinder 312 of the drive source 31. The cylinder 312 drives the beam splitter 32 to move along the guide rail 315, so that it enters the reflection light path of the first reflector 2. The beam splitter 32 partially reflects and partially transmits the incident beam. The reflected light is incident on the third reflector 41 to form the first processing light path. The transmitted light enters the second reflector 33 and is reflected by the second reflector 33 to reach the fourth reflector 42 of the light path receiving unit 4 to form the second processing light path.
[0050] The sliding groove at the bottom of the mobile platform 314 cooperates with the guide rail 315 to ensure the smooth movement of the mobile platform 314. When the mobile platform 314 moves to the limit position, the inductive switch 316 triggers the slot-shaped photoelectric sensors 317 at both ends of the guide rail 315. The slot-shaped photoelectric sensors 317 feed back the limit position signal to the control system, and the control system controls the mobile platform 314 to stop, thereby realizing the precise switching of the optical path.
[0051] In this embodiment, the beam splitter 32 moves linearly along the guide rail 315. In other embodiments, the beam splitter 32 can be driven to rotate, thereby adjusting the beam splitting angle of the beam splitter 32 so that the laser beam reflected onto the workpiece can be processed at different positions.
[0052] The embodiments described in this specific implementation are preferred embodiments of this application and are not intended to limit the scope of protection of this application. Therefore, all equivalent changes made in accordance with the structure, shape and principle of this application should be covered within the scope of protection of this application.
Claims
1. A laser processing device with switchable optical paths, characterized in that, include: Laser (1), used to emit a laser beam for processing; The first reflector (2) is positioned in the light-emitting direction of the laser (1); The optical path switching structure (3) includes a beam splitter (32) and a second reflector (33), wherein the beam splitter (32) and the second reflector (33) are arranged in parallel and can be selectively located on the optical path of the first reflector (2); as well as The optical path receiving unit (4) includes a third reflector (41) and a fourth reflector (42). The third reflector (41) can receive the beam of the beam splitter (32) and reflect it onto the workpiece. The fourth reflector (42) can receive the beam of the second reflector (33) and reflect it onto the workpiece.
2. The laser processing equipment with switchable optical paths according to claim 1, characterized in that: The optical path switching structure (3) further includes a driving source (31), the beam splitter (32) is fixed to the driving source (31), and the driving source (31) can carry the beam splitter (32) to move along a one-dimensional direction to be located in the reflected optical path of the first reflector (2) or leave the reflected optical path of the first reflector (2).
3. The laser processing equipment with switchable optical paths according to claim 1, characterized in that: The laser processing equipment with switchable optical paths further includes an installation platform (5), on which a first support platform (6) and a second support platform (7) are fixedly installed. The optical path switching structure (3) and the optical path receiving unit (4) are respectively placed on the first support platform (6) and the second support platform (7). The laser (1) is connected to the first support platform (6) and the second support platform (7) through an optical path dustproof tube (8).
4. The laser processing equipment with switchable optical paths according to claim 2, characterized in that: The drive source (31) includes a base (311) and a cylinder (312), the cylinder (312) being fixed on the base (311).
5. A laser processing device with switchable optical paths according to claim 4, characterized in that: The base (311) is provided with two limiting blocks (313), which are installed at both ends of the base (311) and the protruding surface of the limiting blocks (313) is covered with a rubber buffer layer.
6. The laser processing equipment with switchable optical paths according to claim 4, characterized in that: The cylinder (312) is connected to the moving platform (314), the base (311) is provided with two guide rails (315), the bottom of the moving platform (314) has a sliding groove corresponding to the guide rail (315), and the cylinder (312) drives the moving platform (314) to move along the guide rail (315).
7. A laser processing device with switchable optical paths according to claim 6, characterized in that: The mobile platform (314) is equipped with an induction switch (316), and the guide rail (315) is equipped with slotted photoelectric sensors (317) corresponding to the induction switch (316) at both ends. The induction switch (316) moves with the mobile platform (314) and triggers the slotted photoelectric sensor (317) to provide feedback on the extreme position signal of the mobile platform (314).
8. The laser processing equipment with switchable optical paths according to claim 1, characterized in that: A convex mirror (43) is provided directly below the third reflector (41) and the fourth reflector (42).
9. A laser processing device with switchable optical paths according to claim 4, characterized in that: The cylinder (312) is a rodless cylinder.
10. A laser processing device with switchable optical paths according to claim 3, characterized in that: The inner wall of the optical path dustproof cylinder (8) is coated with an anti-reflective coating.