Diamond grinding disc beneficial to optimizing chip removal and heat dissipation effects

Abstract

The utility model belongs to the technical field of diamond grinding wheels, and particularly relates to a diamond grinding disc beneficial to optimization of chip removal and heat dissipation effects. The grinding wheel comprises a circular base and a plurality of abrasive particle groups, the abrasive particle group is fixedly arranged on the circular base; each abrasive particle group comprises at least two fan-shaped abrasive particles which are identical in structure and radian; the plurality of abrasive particle groups are fixedly arranged on the circular base in a concentric ring manner; the plurality of fan-shaped abrasive particles of each abrasive particle group are fixedly arranged on the circular base in a circular ring shape; an arc-shaped runner is arranged between every two adjacent abrasive particle groups; and a linear runner is arranged between two adjacent fan-shaped abrasive particles in each abrasive particle group. According to the diamond grinding disc, the chip removal and heat dissipation path is short, steric hindrance is small, and the chip removal and heat dissipation effects of the diamond grinding disc can be optimized.

Description

Technical Field

[0001] This application belongs to the field of diamond grinding wheel technology, specifically relating to a diamond grinding disc that helps optimize chip removal and heat dissipation. Background Technology

[0002] The chip removal and heat dissipation channels of existing diamond grinding discs have large resistance and long paths due to the presence of abrasive grains in the middle, which affects the chip removal and heat dissipation effect. Utility Model Content

[0003] In view of this, this application provides a diamond grinding disc that helps optimize chip removal and heat dissipation, in order to solve all or part of the technical problems described in the background section of this application.

[0004] The innovative concept of this application is:

[0005] By setting interconnected arc-shaped and straight flow channels between diamond abrasive grains, and making the straight flow channel extend from the center of the grinding disc base to the edge, the steric hindrance and path length for chip removal and heat dissipation during grinding are reduced, thereby optimizing the chip removal and heat dissipation effect of the diamond grinding disc.

[0006] The solution provided in this application to resolve its technical problem is as follows:

[0007] A diamond grinding disc that helps optimize chip removal and heat dissipation includes a circular base and several abrasive grain groups; the abrasive grain groups are fixedly disposed on the circular base; characterized in that: each abrasive grain group includes at least two fan-shaped abrasive grains with identical structure and curvature; several abrasive grain groups are fixedly disposed on the circular base in a concentric ring; multiple fan-shaped abrasive grains in each abrasive grain group are fixedly disposed on the circular base in a circular ring; an arc-shaped flow channel is provided between every two adjacent abrasive grain groups; and a straight flow channel is provided between two adjacent fan-shaped abrasive grains within each abrasive grain group.

[0008] Furthermore, multiple arc-shaped flow channels are arranged in concentric rings and have equal widths.

[0009] Furthermore, multiple straight flow channels extend from the center of the circular base to the edge and are evenly distributed.

[0010] Furthermore, the size of the fan-shaped abrasive grains within the multiple abrasive grain groups decreases sequentially from the edge of the circular base towards the center.

[0011] Furthermore, an assembly hole is provided at the center of the circular base.

[0012] Furthermore, the fan-shaped abrasive grains are fixedly mounted on a circular substrate through a sintering process.

[0013] Furthermore, the fan-shaped abrasive grains are diamond or CBN abrasive grains, and the circular substrate is a ceramic substrate.

[0014] Beneficial technical effects:

[0015] The diamond grinding disc disclosed in this application, which helps to optimize chip removal and heat dissipation, uses a fan-shaped abrasive structure for individual particles and forms a set of concentric ring abrasive particles in strict accordance with geometric relationships. The abrasive particles naturally define interconnected arc-shaped flow channels and straight flow channels. Furthermore, no abrasive particles are formed in the middle of the straight flow channels, which extend directly from the center of the grinding disc base to the edge. As a result, the chip removal and heat dissipation path is shorter and the steric hindrance is smaller, which helps to optimize the chip removal and heat dissipation effect of the diamond grinding disc.

[0016] The technical solution and technical effects of this application will be described in detail below with reference to the accompanying drawings and specific embodiments. Attached Figure Description

[0017] Figure 1 : A schematic diagram of a diamond grinding disc structure that helps optimize chip removal and heat dissipation;

[0018] Icon description:

[0019] 1- Circular base;

[0020] 2-Abrasive particle group;

[0021] 3-Fan-shaped abrasive grains;

[0022] 4-Arc-shaped flow channel;

[0023] 5-Straight flow channel;

[0024] 6-Assembly hole. Detailed Implementation

[0025] Please see Figure 1 The diamond grinding disc disclosed in this application, which helps to optimize chip removal and heat dissipation, includes a circular base 1 and several abrasive grain groups 2; each abrasive grain group 2 includes multiple fan-shaped abrasive grains 3 with identical structure and curvature.

[0026] The circular substrate 1 can be a ceramic substrate or a metal substrate, and the abrasive grain group 2 can be diamond or CBN abrasive grains. The fan-shaped abrasive grains 3 are fastened to the circular substrate 1 by a sintering process.

[0027] Several abrasive grain groups 2 are fixedly arranged in concentric rings on a circular base 1, and the spacing between the abrasive grain rings formed by two adjacent abrasive grain groups 2 is equal. That is, an arc-shaped flow channel 4 is provided between every two adjacent abrasive grain groups 2; multiple arc-shaped flow channels 4 are arranged in concentric rings and have equal widths.

[0028] Multiple fan-shaped abrasive grains 3 in each abrasive grain group 2 are fixedly arranged in a ring on a circular base 1; the size of the fan-shaped abrasive grains 3 in the multiple abrasive grain groups 2 decreases sequentially from the edge of the circular base 1 to the center.

[0029] Unlike the abrasive structures in the prior art, the size of the fan-shaped abrasive grains 3 in this application gradually decreases from the edge to the center. Since all abrasive grains rotate synchronously with the circular base 1 during grinding, the grinding area of ​​the abrasive grains at the edge is larger than that of the inner abrasive grains. The use of larger outer abrasive grains helps to extend the service life of the diamond grinding disc.

[0030] A straight flow channel 5 is naturally defined between two adjacent fan-shaped abrasive grains 3 within each abrasive grain group 2. Multiple straight flow channels 5 extend from the center of the circular base 1 to the edge and are evenly distributed, and there are no fan-shaped abrasive grains 3 in the middle of the straight flow channels 5.

[0031] A mounting hole 6 is provided at the center of the circular base 1. The mounting hole 6 is used to mount and fix the diamond grinding disc to a grinding tool such as an angle grinder.

[0032] Principle and Effect Explanation: Because the individual particles adopt a fan-shaped abrasive structure and are arranged in a standard concentric ring layout according to several relationships, the diamond abrasive particles naturally define interconnected arc-shaped flow channels 4 and straight flow channels 5; and there are no abrasive particles in the middle of the straight flow channel 5, which extends directly from the center of the grinding disk base to the outer edge; the chips generated during grinding can enter the straight flow channel 5 from the arc-shaped flow channel 4 and be directly thrown to the edge by centrifugal force without the resistance of the abrasive particles; thus, the chip removal and heat dissipation path is shorter and the resistance is smaller.

[0033] The technical solutions and effects of this application have been described in detail above with reference to the accompanying drawings and specific embodiments. It should be noted that those skilled in the art can develop other embodiments based on this. Any simple modifications and equivalent substitutions that do not depart from the innovative concept of this application are covered by this application and fall within the protection scope of this patent.

Claims

1. A diamond grinding disc that helps optimize chip removal and heat dissipation, comprising a circular base (1) and a plurality of abrasive grain groups (2); the abrasive grain groups (2) are fixedly disposed on the circular base (1); characterized in that: Each abrasive group (2) includes at least two fan-shaped abrasive grains (3) with identical structure and curvature; Several abrasive grain groups (2) are fixedly arranged in a concentric ring on the circular base (1); The plurality of fan-shaped abrasive grains (3) of each abrasive grain group (2) are fixedly arranged in a ring on the circular base (1); An arc-shaped flow channel (4) is provided between every two adjacent abrasive grain groups (2); A straight flow channel (5) is provided between two adjacent fan-shaped abrasive grains (3) in each abrasive grain group (2).

2. The diamond grinding disc according to claim 1, which helps optimize chip removal and heat dissipation, is characterized in that: The multiple arc-shaped flow channels (4) are arranged in concentric rings and have equal widths.

3. The diamond grinding disc according to claim 1, which helps optimize chip removal and heat dissipation, is characterized in that: Multiple straight channels (5) extend from the center of the circular base (1) to the edge and are evenly distributed.

4. The diamond grinding disc according to claim 1, which helps optimize chip removal and heat dissipation, is characterized in that: The size of the fan-shaped abrasive grains (3) in the plurality of abrasive grain groups (2) decreases sequentially from the edge of the circular base (1) toward the center.

5. The diamond grinding disc according to claim 1, which helps optimize chip removal and heat dissipation, is characterized in that: The circular base (1) has an assembly hole (6) at its center.

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