Vertical pin card for reducing filter test parasitism

Abstract

The utility model relates to the technical field of probe cards, in particular to a vertical probe card for reducing filter test parasitism. Comprising a PCB substrate, metal circuit wires are laid on the upper surface and in the PCB substrate, and at least one metal disc is arranged on the upper surface of the PCB substrate; the non-metal cover plate is arranged on the PCB substrate in a covering manner and comprises at least one first mounting hole penetrating through a non-metal cover plate body; the head part of each probe penetrates through the first mounting hole and extends out of the non-metal cover plate, the tail part of each probe is propped against the PCB substrate through an elastic element, the elastic element is always in a compressed state so as to apply an upward thrust to the probe, and the first mounting hole is used for limiting the upward movement of the probe; according to the utility model, a signal path is realized through the probe and the flange rod or the shorter probe, so that the signal transmission distance is shortened, the signal loss in the probe transmission process is further reduced, the area of a grounding loop is reduced, and the parasitic influence caused by the signal loss is obviously improved.

Description

Technical Field

[0001] This utility model relates to the field of probe card technology, and in particular to a vertical probe card for reducing parasitic effects in filter testing. Background Technology

[0002] With the rapid development of the semiconductor industry, the size of chips on wafers is shrinking daily, and the size of solder balls used for soldering and testing on these chips has reached the micrometer level. In the chip production and testing phase, test pins need to ensure good contact with the solder balls to guarantee testing results, while avoiding damage to the shape of the solder balls to ensure the subsequent use of the chip. Therefore, the requirements for the size and installation accuracy of test pins are increasingly stringent.

[0003] Vertical probes, due to their vertical arrangement, can accommodate more pins, and their smaller size makes them widely applicable to high-end chips with small solder joints or bumps. However, in chip testing, especially filter CP testing, the influence of the probe card itself is difficult to calibrate perfectly, and the resulting parasitic effects can lead to filter performance distortion. Even small parasitic effects can cause significant changes in filter performance, such as deterioration of out-of-band rejection, resulting in a larger inner-passband reflection circle on the Smith chart, thus increasing the difficulty of matching. This paper proposes a vertical probe card to reduce parasitic effects in filter testing to address the problems existing in the prior art. Utility Model Content

[0004] The purpose of this invention is to provide a vertical pin card that reduces parasitic effects in filter testing, in order to solve the problem in the prior art where the influence of the pin card itself is difficult to be perfectly calibrated in chip testing, especially filter CP testing, and the resulting parasitic effects lead to filter performance distortion.

[0005] The technical solution of this utility model is: a vertical pin clip for reducing parasitic interference in filter testing, comprising:

[0006] A PCB substrate, wherein metal circuit traces are laid on the upper surface and inside of the PCB substrate, and at least one metal disk is provided on the upper surface of the PCB substrate.

[0007] A non-metallic cover plate is disposed on a PCB substrate and includes at least one first mounting hole penetrating the non-metallic cover plate body.

[0008] At least one probe, the head of each probe extends through a first mounting hole to the outside of a non-metallic cover plate, and the tail of each probe abuts against the PCB substrate through an elastic element. The elastic element is always in a compressed state to provide an upward thrust to the probe. The first mounting hole limits the upward movement of the probe. When the probe is conducting, the body of the probe contacts the metal disk. The elastic element is an insulator.

[0009] Preferably, the PCB substrate has at least one second mounting hole along a plane perpendicular to the PCB substrate; each metal disk is a metal ring and is arranged around the opening of the second mounting hole;

[0010] The second mounting hole is coaxially arranged with the first mounting hole, and the probe is installed in the first mounting hole and the second mounting hole;

[0011] The elastic element is located at the bottom of the second mounting hole and abuts against the probe.

[0012] Preferably, the probe includes a probe head, a flange rod, and a probe tail from top to bottom; the portion of the probe head between the probe head and the flange rod is a conductor, and the probe tail is an insulator;

[0013] The diameter of the second mounting hole is smaller than the outer diameter of the flange rod, and the minimum diameter of the first mounting hole is smaller than the outer diameter of the flange rod; the outer diameter of the flange rod is less than or equal to the outer diameter of the metal ring.

[0014] Preferably, the diameter of the flange rod is larger than the diameter of the probe, and the first mounting holes correspond to the probe and the flange rod respectively, including mounting hole A and mounting hole B, wherein the diameter of mounting hole B is larger than the diameter of mounting hole A; the probe tail is installed in the second mounting hole.

[0015] Preferably, the probe is integrally formed; or the probe and flange rod are integrally formed, and the flange rod and probe tail are fixedly connected.

[0016] Preferably, the first mounting hole is a multi-diameter hole with a gradually increasing diameter from top to bottom, including the mounting hole C at the bottom and the remaining mounting holes D;

[0017] The probe is a multi-diameter cylinder with a diameter that gradually increases from top to bottom, including a probe tail at the bottom and the remaining probe head; the probe tail is installed in the mounting hole C;

[0018] The probe is a conductor;

[0019] The diameter of the probe tail is smaller than the outer diameter of the metal disk, and the minimum diameter of the probe is smaller than the minimum diameter of the mounting hole D.

[0020] Preferably, the bottom surface of the probe has an inwardly recessed cylindrical mounting groove, and the elastic element is installed in the mounting groove and abuts against the PCB substrate.

[0021] Preferably, the metal disk is a metal disc, or the metal disc is a metal ring, wherein the inner diameter of the metal ring is larger than the diameter of the mounting groove.

[0022] Preferably, the non-metallic cover plate is fixed to the PCB substrate; or, the non-metallic cover plate is detachably fixed to the PCB substrate.

[0023] Preferably, it also includes a back plate, which is fixed to the bottom surface of the PCB substrate.

[0024] Compared with the prior art, the advantages of this utility model are:

[0025] This invention discloses a vertical pin clip for reducing parasitic effects in filter testing. It establishes a signal path via a probe and flange rod, or through a shorter probe, shortening the signal transmission distance and reducing signal loss during probe transmission. This reduces the grounding loop area, significantly improving parasitic effects. The separate design of the probe and spring makes the structure simpler than existing spring probes. This allows for easier probe replacement without needing to replace the entire spring probe, thus reducing maintenance costs. Attached Figure Description

[0026] The present invention will be further described below with reference to the accompanying drawings and embodiments:

[0027] Figure 1 This is a schematic diagram of the structure of a vertical pin card for reducing filter test parasitics as described in Embodiment 1;

[0028] Figure 2 This is a schematic diagram of the structure of a vertical pin card for testing filter chips to reduce parasitic effects during filter testing, as described in Embodiment 1.

[0029] Figure 3 This is a schematic diagram of the structure of a vertical pin card for reducing filter test parasitics as described in Embodiment 2;

[0030] Figure 4 This is a schematic diagram of the structure of a vertical pin card for reducing filter test parasitism as described in Embodiment 3;

[0031] Figure 5 This is a schematic diagram of the structure of a vertical pin card for reducing filter test parasitism as described in Example 4.

[0032] The components are: 1. PCB substrate, 2. First mounting hole, 3. Metal ring, 4. Spring, 5. Non-metallic cover plate, 6. Second mounting hole, 7. Probe, 8. Probe, 9. Flange rod, 10. Probe tail, 11. Metal disc, 12. Filter chip, 13. Mounting slot. Detailed Implementation

[0033] The present invention will be further described in detail below with reference to specific embodiments:

[0034] In the description of the utility model, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing the utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the utility model.

[0035] Example 1

[0036] like Figure 1 As shown, this embodiment provides a vertical pin card to reduce parasitic interference in filter testing, including: a PCB substrate 1, a non-metallic cover plate 5, and at least one probe 7, used to perform CP testing on the filter chip 12 before packaging to determine whether the filter chip 12 is qualified.

[0037] PCB substrate 1, with metal circuit traces laid on its upper surface and inside, and at least one metal disk disposed on its upper surface; in this embodiment, PCB substrate 1 can be made of FR4 material, metal substrate, ceramic substrate, polymer material, etc.

[0038] A non-metallic cover plate 5 is disposed on the PCB substrate 1 and includes at least one first mounting hole 2 penetrating the body of the non-metallic cover plate 5; that is, the non-metallic cover plate 5 is made of insulating material, or the inner wall of the first mounting hole 2 is made of insulating material. The non-metallic cover plate 5 is used to fix the probe 7 and at the same time increases the stability of the connection between the flange rod 9 of the probe 7 and the metal ring 3.

[0039] At least one probe 7, the head of each probe 7 extends out of the non-metallic cover plate 5 through the first mounting hole 2, and the tail of each probe 7 abuts against the PCB substrate 1 through an elastic element. The elastic element is always in a compressed state to give the probe 7 an upward thrust. The first mounting hole 2 limits the upward movement of the probe 7. When the probe 7 is conducting, the body of the probe 7 contacts the metal disk 11. The elastic element is an insulator. In this embodiment, the elastic element is a spring 4.

[0040] In this embodiment, probe 7 is an integrated unit, while probe 7 and spring 4 are separate, unlike the spring probes used in the prior art. The integrated probe 7 reduces assembly parts and connection points, thus reducing errors caused by loose or worn parts and improving detection accuracy. In some cases, spring probes may introduce contact impedance errors due to inconsistent contact areas with the chip under test caused by spring compression. The integrated probe 7, through precise design and control, ensures that the contact area between probe 7 and the chip under test is consistent, reducing contact impedance errors. The separate design of spring 4 and probe 7 makes it easier to replace probe 7 without replacing the entire spring probe, thereby reducing maintenance costs. Moreover, the separate arrangement of spring 4 and probe 7 in this embodiment is structurally simpler than spring probes in the prior art.

[0041] The PCB substrate 1 has at least one second mounting hole 6 along a plane perpendicular to the PCB substrate 1; the at least one second mounting hole 6 is arranged in an array on the PCB substrate 1; each metal disc is a metal ring 3, and is arranged around the opening of the second mounting hole 6; the second mounting hole 6 is coaxially arranged with the first mounting hole 2, and the probe 7 is installed in the first mounting hole 2 and the second mounting hole 6; the elastic element is located at the bottom of the second mounting hole 6 and abuts against the probe 7. The probe 7 includes a probe 8, a flange rod 9, and a probe tail 10 from top to bottom; the part of the probe 7 from the probe 8 to the flange rod 9 is a conductor, and the probe tail 10 is an insulator; the diameter of the second mounting hole 6 is smaller than the outer diameter of the flange rod 9, and the minimum diameter of the first mounting hole 2 is smaller than the outer diameter of the flange rod 9; the outer diameter of the flange rod 9 is less than or equal to the outer diameter of the metal ring 3. The diameter of the flange rod 9 is larger than the diameter of the probe 8, and the first mounting holes 2 respectively correspond to the probe 8 and the flange rod 9, including mounting hole A and mounting hole B, the diameter of mounting hole B is larger than the diameter of mounting hole A; the probe tail 10 is installed in the second mounting hole 6.

[0042] The non-metallic cover plate 5 is fixed to the PCB substrate 1; or, the non-metallic cover plate 5 is detachably fixed to the PCB substrate 1. The non-metallic cover plate 5 can be fixed to the PCB substrate 1 by adhesive bonding; or, the non-metallic cover plate 5 can be detachably fixed to the PCB substrate 1 by a connector. In this embodiment, the connector is at least one bolt, but clips and screws are also feasible. A vertical pin clip for reducing parasitic filter testing also includes a back plate (not shown in the figure), which is fixed to the bottom surface of the PCB substrate 1 and is used to enhance the strength of the PCB substrate 1.

[0043] When it is necessary to test the filter chip 12, a downward pressure can be applied to the filter chip 12, causing the probe 8 to contact the solder balls of the filter chip 12. Due to the pressure, the spring 4 is compressed, and the probe 8 and flange rod 9 move downward until the bottom surface of the flange rod 9 contacts the metal ring 3 (e.g., Figure 2As shown, a signal path is established to detect whether the filter chip 12 is qualified. This invention eliminates the need for the signal to travel the entire length of the probe 7, shortening the signal transmission distance and reducing signal loss during probe 7 transmission. This also reduces the ground loop area, significantly improving parasitic effects. The out-of-band rejection of the probe 7 in this invention is approximately 10 dB better than that of the probe 7 in the prior art (where the signal needs to travel the entire length of the probe 7).

[0044] Example 2

[0045] The difference between this embodiment and Embodiment 1 is that, Figure 3 As shown, the probe 8 and flange rod 9 are integrally formed, and the flange rod 9 and probe tail 10 are fixedly connected. The fixed connection between the flange rod 9 and probe tail 10 can be achieved by threads, interference fits, etc. Since the probe 8 and flange rod 9 are conductors and the probe tail 10 is an insulator, in this embodiment, the probe 8 and flange rod 9 and probe tail 10 are manufactured separately and then fixedly connected, which makes production and assembly very convenient.

[0046] Example 3

[0047] like Figure 4 As shown, this embodiment provides a vertical pin card for reducing parasitic filter testing, including: a PCB substrate 1, a non-metallic cover plate 5, and at least one probe 7. Metal circuit traces are laid on the upper surface and inside of the PCB substrate 1, and at least one metal disk is disposed on the upper surface of the PCB substrate 1. In this embodiment, the PCB substrate 1 can be made of FR4 material, a metal substrate, a ceramic substrate, a polymer material, etc.

[0048] A non-metallic cover plate 5 is disposed on the PCB substrate 1 and includes at least one first mounting hole 2 penetrating the body of the non-metallic cover plate 5; that is, the non-metallic cover plate 5 is made of insulating material, or the inner wall of the first mounting hole 2 is made of insulating material. The non-metallic cover plate 5 is used to fix the probe 7 and at the same time increases the stability of the connection between the flange rod 9 of the probe 7 and the metal ring 3.

[0049] At least one probe 7 is provided, with the head of each probe 7 extending through the first mounting hole 2 to the outside of the non-metallic cover plate 5, and the tail of each probe 7 abutting against the PCB substrate 1 via an elastic element (it should be noted that the metal disk in this application is also part of the structure of the PCB substrate 1). The elastic element is always in a compressed state to provide an upward thrust to the probe 7, and the first mounting hole 2 limits the upward movement of the probe 7. When the probe 7 is conductive, the body of the probe 7 contacts the metal disk 11. The elastic element is an insulator; in this embodiment, the elastic element is a spring 4. The first mounting hole 2 is a multi-diameter hole with a gradually increasing diameter from top to bottom, including the mounting hole C at the bottom and the remaining mounting holes D. The probe 7 is a multi-diameter cylinder with a gradually increasing diameter from top to bottom, including the probe tail 10 at the bottom and the remaining probe 8. The probe tail 10 is installed in the mounting hole C. The probe 7 is a conductor. The diameter of the probe tail 10 is smaller than the outer diameter of the metal ring 3, and the minimum diameter of the probe 8 is smaller than the minimum diameter of the mounting hole D. The bottom surface of probe 7 has an inwardly recessed cylindrical mounting groove 13. An elastic element is installed in the mounting groove 13 and abuts against the PCB substrate 1. The metal disk is a metal ring 3, and the inner diameter of the metal ring 3 is larger than the diameter of the mounting groove 13.

[0050] The non-metallic cover plate 5 is fixed to the PCB substrate 1; or, the non-metallic cover plate 5 is detachably fixed to the PCB substrate 1. The non-metallic cover plate 5 can be fixed to the PCB substrate 1 by adhesive bonding; or, the non-metallic cover plate 5 can be detachably fixed to the PCB substrate 1 by a connector. In this embodiment, the connector is at least one bolt, but clips and screws are also feasible. A vertical pin clip for reducing parasitic filter testing also includes a back plate, which is fixed to the bottom surface of the PCB substrate 1 and is used to enhance the strength of the PCB substrate 1.

[0051] In this embodiment, when the filter chip 12 needs to be tested, a downward pressure can be applied to the filter chip 12, causing the probe 8 to contact the solder balls of the filter chip 12. Due to the pressure, the spring 4 is compressed, and the probe 8 and probe tail 10 move downward until the bottom surface of the probe tail 10 contacts the metal ring 3, thus establishing a signal path to detect whether the filter chip 12 is qualified. In this embodiment, the probe 7 is shorter, which shortens the signal transmission distance and reduces signal loss during the transmission of the probe 7, thereby reducing the ground loop area and significantly improving the parasitic effects. Furthermore, it is not necessary to open holes in the PCB substrate 1 to install the probe 7, making the structure simpler.

[0052] Example 4

[0053] The difference between this embodiment and embodiment three is that, Figure 5As shown, the metal disk is a metal disc 11. The metal disc 11 has a larger area than the metal ring 3, which can ensure the contact stability between the probe tail 10 and the metal disc 11, thereby ensuring the stable transmission of the signal. In this embodiment, the spring 4 is installed in the mounting groove 13 and abuts against the metal disc 11 on the upper surface of the PCB substrate 1.

[0054] The above embodiments are only for illustrating the technical concept and features of this utility model, and are intended to enable those skilled in the art to understand the content of this utility model and implement it accordingly. They should not be construed as limiting the scope of protection of this utility model. It is obvious to those skilled in the art that this utility model is not limited to the details of the above exemplary embodiments, and that it can be implemented in other specific forms without departing from the spirit or basic characteristics of this utility model. Therefore, the embodiments should be considered exemplary and non-limiting in all respects. The scope of this utility model is defined by the appended claims rather than the foregoing description, and therefore, all changes falling within the meaning and scope of the equivalents of the claims are intended to be included within this utility model.

Claims

1. A vertical pin clip for reducing parasitic interference in filter testing, characterized in that, include: A PCB substrate, wherein metal circuit traces are laid on the upper surface and inside of the PCB substrate, and at least one metal disk is provided on the upper surface of the PCB substrate. A non-metallic cover plate is disposed on a PCB substrate and includes at least one first mounting hole penetrating the non-metallic cover plate body. At least one probe, the head of each probe extends through a first mounting hole to the outside of a non-metallic cover plate, and the tail of each probe abuts against the PCB substrate through an elastic element. The elastic element is always in a compressed state to provide an upward thrust to the probe. The first mounting hole limits the upward movement of the probe. When the probe is conducting, the body of the probe contacts the metal disk. The elastic element is an insulator.

2. The vertical pin clip for reducing parasitic filter testing according to claim 1, characterized in that: The PCB substrate has at least one second mounting hole along a plane perpendicular to the PCB substrate; each metal disk is a metal ring and is arranged around the opening of the second mounting hole. The second mounting hole is coaxially arranged with the first mounting hole, and the probe is installed in the first mounting hole and the second mounting hole; The elastic element is located at the bottom of the second mounting hole and abuts against the probe.

3. A vertical pin clip for reducing parasitic filter testing according to claim 2, characterized in that: The probe includes a probe, a flange rod, and a probe tail from top to bottom; the portion of the probe from the probe to the flange rod is a conductor, and the probe tail is an insulator. The diameter of the second mounting hole is smaller than the outer diameter of the flange rod, and the minimum diameter of the first mounting hole is smaller than the outer diameter of the flange rod; the outer diameter of the flange rod is less than or equal to the outer diameter of the metal ring.

4. A vertical pin clip for reducing parasitic filter testing according to claim 3, characterized in that: The diameter of the flange rod is larger than the diameter of the probe. The first mounting holes correspond to the probe and the flange rod, including mounting hole A and mounting hole B, respectively. The diameter of mounting hole B is larger than the diameter of mounting hole A. The probe tail is installed in the second mounting hole.

5. A vertical pin clip for reducing parasitic filter testing according to claim 4, characterized in that: The probe is integrated into one piece; or the probe and flange rod are integrated into one piece, and the flange rod and probe tail are fixedly connected.

6. A vertical pin clip for reducing parasitic filter testing according to claim 1, characterized in that: The first mounting hole is a multi-diameter hole with the diameter gradually increasing from top to bottom, including the mounting hole C at the bottom and the remaining mounting holes D; The probe is a multi-diameter cylinder with a diameter that gradually increases from top to bottom, including a probe tail at the bottom and the remaining probe head; the probe tail is installed in the mounting hole C; The probe is a conductor; The diameter of the probe tail is smaller than the outer diameter of the metal disk, and the minimum diameter of the probe is smaller than the minimum diameter of the mounting hole D.

7. A vertical pin clip for reducing parasitic filter testing according to claim 6, characterized in that: The probe has a cylindrical mounting groove recessed upwards on its bottom surface, and the elastic element is installed in the mounting groove and abuts against the PCB substrate.

8. A vertical pin clip for reducing parasitic filter testing according to claim 7, characterized in that: The metal disk is a metal disc, or the metal disc is a metal ring, wherein the inner diameter of the metal ring is larger than the diameter of the mounting groove.

9. A vertical pin clip for reducing parasitic filter testing according to claim 5 or 8, characterized in that: The non-metallic cover plate is fixed to the PCB substrate; or, the non-metallic cover plate is detachably fixed to the PCB substrate.

10. A vertical pin clip for reducing filter test parasitics according to claim 5 or 8, characterized in that: It also includes a backplate, which is fixed to the bottom surface of the PCB substrate.

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