Silicon photonic communication device and photonic communication component
By using cantilevered fasteners and chamfered edge designs in fiber optic cables and silicon photonics devices, the problem of fiber optic cable breakage has been solved, and the bonding strength and alignment stability have been enhanced.
Patent Information
- Application Number
- CN202422177516.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Priority Date
- 2024-08-28
- Filing Date
- 2024-09-05
- Publication Date
- 2026-02-24
- Estimated Expiration
- 2034-09-05
AI Technical Summary
In existing technologies, the connection between fiber optic cables and silicon photonic devices is prone to breakage due to bending or lateral forces, leading to separation.
A cantilevered fastening block is adopted, with the cantilever surface joining the fiber optic cable fitting. The cantilever area is at least as large as the joining area and is separated from the block surface by a chamfered edge. The fastening block material matches the thermal expansion coefficient of the silicon photonic integrated circuit structure to enhance the bonding strength.
This improves the bonding strength between fiber optic cables and silicon photonic devices, reduces the risk of separation due to bending or lateral forces, and ensures the alignment stability between fiber optic cables and optical transducers.
Smart Images
Figure CN223941136U_ABST
Abstract
Description
[0001] Cross-reference to related applications
[0002] This disclosure claims the benefit of U.S. Provisional Patent Application No. 63 / 536,809, filed September 6, 2023, which is co-pending and co-assigned, and is hereby incorporated herein by reference in its entirety. Technical Field
[0003] This disclosure relates to bonding optical fiber cables to silicon photonic devices. More specifically, this disclosure relates to a structure and method for bonding optical fiber cables to silicon photonic devices that is less sensitive to separation caused by bending or lateral forces. Background Technology
[0004] The background description provided herein is intended to generally present the context of this disclosure. The work of the inventors of this application (with respect to the scope of the work described in this background section) and descriptions that may not be prior art at the time of filing are neither expressly nor impliedly acknowledged as prior art relative to the subject matter of this disclosure.
[0005] Silicon photonics devices typically include a silicon integrated circuit die comprising optical transducers (e.g., photodetectors for receiving and laser diodes for emitting), which may be located on the edge surface of the die. Fiber optic cables (having one or more optical fibers terminating in fittings flush with the flat ends of each fiber) can be mounted with the fiber ends aligned with the optical transducers. In a typical method of attaching the fiber optic cable fitting to a silicon photonics device, after alignment, a rectangular solid block (e.g., made of glass) has one face (typically one of its two largest faces) of a main surface of the die (defined by a suitable epoxy or other adhesive) joined (e.g., by means of a suitable epoxy or other adhesive) orthogonal to the edge surface carrying the optical transducer. Another face of the rectangular solid block, parallel to the edge surface carrying the optical transducer (typically one of its two smallest faces), is joined to the end face of the fiber optic cable fitting. The joint between the facet of the rectangular solid block and the end face of the fiber optic cable fitting is susceptible to breakage by the application of any force that tends to push the fiber optic cable fitting away from the main plane of the core, specifically a bending or lateral force along the interface between the edge of the fiber optic cable fitting and the core. Summary of the Invention
[0006] According to embodiments of the present disclosure, a silicon photonics communication device is configured to fasten an optical fiber cable fitting to the device. The silicon photonics communication device includes: an integrated circuit structure having an optical transducer located on the integrated circuit structure and having a first surface; and a fastening block having a bonding region on the block surface and a cantilever, the bonding region bonding to the first surface, and the cantilever having a cantilever surface parallel to the first surface. The cantilever surface is configured to bond the optical fiber cable fitting to the cantilever region, which is at least as large as the bonding region, and the cantilever surface is spaced apart from the block surface by a stepped distance to accommodate alignment between the optical fiber cable fitting and the optical transducer.
[0007] In a first embodiment of this silicon photonics communication device, an optical transducer is located on a second surface perpendicular to a first surface, and a cantilever extends beyond the second surface and is configured to be coupled to an accessory for an optical fiber cable, such that the end face of the accessory for the optical fiber cable is held adjacent to the optical transducer on the second surface, at which the end of the optical fiber is exposed.
[0008] According to a first aspect of the first embodiment, the cantilever surface can be configured to: attach an accessory to an optical fiber cable at a cantilever area that is at least 150% the size of the joint area.
[0009] According to a second aspect of the first embodiment, the step distance can be selected, taking into account the thickness of the bonding layer, so that the exposed end of the optical fiber is aligned with the optical transducer.
[0010] In a second embodiment of this silicon photonics communication device, the block surface can be separated from the cantilever surface by a right-angle step.
[0011] In a third embodiment of this silicon photonics communication device, the block surface can be separated from the cantilever surface by a chamfered edge.
[0012] In a fourth embodiment of this silicon photonics communication device, the fastener may have a first coefficient of thermal expansion that matches the second coefficient of thermal expansion of the integrated circuit structure.
[0013] According to a first aspect of the fourth embodiment, the integrated circuit structure is a silicon die, and the fastener is glass.
[0014] According to embodiments of the subject matter of this disclosure, a method for fastening an optical fiber cable fitting to a silicon photonics communication device, wherein the silicon photonics communication device includes an integrated circuit structure having an optical transducer located on the integrated circuit structure and having a first surface, the method comprising: bonding a block surface of a fastening block to the first surface, the fastening block having a cantilever having a cantilever surface parallel to the block surface; configuring the cantilever surface for bonding an optical fiber cable fitting to a cantilever region at least as large as the bonding region; and spacing the cantilever surface from the block surface by a stepped distance to accommodate alignment of the optical fiber cable fitting with the optical transducer.
[0015] In a first embodiment of this method, wherein an optical transducer is located on a second surface perpendicular to a first surface, the method may include: extending a cantilever beyond the second surface; and configuring the cantilever for attachment to an accessory of an optical fiber cable, such that the end face of the accessory of the optical fiber cable is held adjacent to the optical transducer on the second surface, with the end of the optical fiber exposed at that end face.
[0016] According to a first aspect of the first embodiment, configuring a cantilever for joining an optical fiber cable fitting to hold the end face of the optical fiber cable fitting adjacent to an optical transducer on a second surface, with the end of the optical fiber exposed at the end face, may include: configuring the cantilever for joining the optical fiber cable fitting in a cantilever area at least 150% the size of the joining area.
[0017] A second aspect of the first embodiment may include selecting a step distance, taking into account the thickness of the bonding layer, such that the exposed end of the optical fiber is aligned with the optical transducer.
[0018] A second implementation of this method may include separating the block surface from the cantilever surface using right-angle steps.
[0019] A third implementation of this method may include separating the block surface from the cantilever surface by chamfering the edges.
[0020] A fourth implementation of this method may include matching the first coefficient of thermal expansion of the fastener to the second coefficient of thermal expansion of the integrated circuit structure.
[0021] According to embodiments of the subject matter of this disclosure, a photonic communication component includes: an optical fiber cable with cable fittings; a silicon photonic integrated circuit communication structure having an optical transducer located on the silicon photonic integrated circuit communication structure and having a first surface; and a fastening block having a bonding region on the block surface and a cantilever, the bonding region being bonded to the first surface, and the cantilever having a cantilever surface parallel to the first surface. The cantilever surface is bonded to the optical fiber cable fittings at a cantilever region at least as large as the bonding region, and the cantilever surface is spaced apart from the block surface by a stepped distance to accommodate alignment between the optical fiber cable fittings and the optical transducer.
[0022] In a first embodiment of this photonic communication component, an optical transducer may be located on a second surface perpendicular to the first surface, and a cantilever may extend beyond the second surface and may be configured to attach to an accessory for an optical fiber cable to keep the end face of the accessory adjacent to the second surface, in which the end of the optical fiber is exposed.
[0023] According to a first aspect of the first embodiment, the cantilever surface can be configured to: attach an accessory to an optical fiber cable at a cantilever area that is at least 150% the size of the joint area.
[0024] According to a second aspect of the first embodiment, the step distance can be selected, taking into account the thickness of the bonding layer, so that the exposed end of the optical fiber is aligned with the optical transducer.
[0025] In a second embodiment of this photonic communication component, the block surface can be separated from the cantilever surface by a right-angle step.
[0026] In a third embodiment of this photonic communication component, the block surface can be separated from the cantilever surface by a chamfered edge.
[0027] In a fourth embodiment of this photonic communication component, the fastener may have a first coefficient of thermal expansion that matches the second coefficient of thermal expansion of the integrated circuit structure.
[0028] According to a first aspect of the fourth embodiment, the integrated circuit structure includes a silicon die, and the fastener is glass. Attached Figure Description
[0029] Further features, nature, and various advantages of this disclosure will become apparent upon consideration of the following detailed description, taken in conjunction with the accompanying drawings, wherein similar reference numerals consistently denote similar parts, and wherein:
[0030] Figure 1 This is a plan view of a silicon photonic integrated circuit device, which can be used with embodiments of the subject matter of this disclosure;
[0031] Figure 2yes Figure 1 Bottom perspective view of a silicon photonic integrated circuit device;
[0032] Figure 3 This is a perspective view of an optical cable assembly, which can be used with embodiments of the subject matter of this disclosure;
[0033] Figure 4 This is a bottom perspective view of a fastening block according to a first embodiment of the subject matter of this disclosure;
[0034] Figure 5 yes Figure 4 A side view of the fastening block, which will appear as follows. Figure 3 The optical cable assembly in the middle is fastened to such Figure 1 and Figure 2 Silicon photonic integrated circuit devices;
[0035] Figure 6 This is a bottom perspective view of a fastening block according to a second embodiment of the subject matter of this disclosure;
[0036] Figure 7 yes Figure 6 A side view of the fastening block, which will resemble... Figure 3 The optical cable assembly is fastened to such Figure 1 and Figure 2 Silicon photonic integrated circuit devices; and
[0037] Figure 8 This is a flowchart illustrating a method according to an embodiment of the subject matter of this disclosure. Detailed Implementation
[0038] As described above, silicon photonics devices typically include a silicon integrated circuit die comprising optical transducers (e.g., photodetectors for receiving and laser diodes for emitting), which may be located on the edge surface of the die. Fiber optic cables (having one or more optical fibers terminating in fittings flush with the flat ends of each fiber) can be mounted with the fiber ends aligned with the optical transducers. In a typical method of attaching the fiber optic cable fitting to the silicon photonics device, after alignment, a rectangular solid block (e.g., made of glass) has one face (typically one of its two largest faces) of a main surface of the die (defined by epoxy resin or other suitable adhesive) joined (e.g., by epoxy resin or other suitable adhesive) to the edge surface carrying the optical transducer, which is orthogonal to the edge surface carrying the optical transducer. Another face of the rectangular solid block, parallel to the edge surface carrying the optical transducer (typically one of its two smallest faces), is joined to the end face of the fiber optic cable fitting. The joint between the facet of the rectangular solid block and the end face of the fiber optic cable fitting is susceptible to breakage by the application of any force that tends to push the fiber optic cable fitting away from the main plane of the core. In particular, the force is a bending or lateral force along the interface between the edge of the fiber optic cable fitting and the core, especially considering that the joint area between the facet of the rectangular solid block and the end face of the fiber optic cable fitting is relatively small.
[0039] In known alternatives for rectangular solid blocks, cantilevers can extend from fiber optic cable fittings in a direction parallel to the fiber to bond to the main surface of a silicon photonics integrated circuit die. However, during active alignment of the fiber optic cable fitting with the optical transducers on the edge face of the silicon photonics integrated circuit die, the fiber optic cable fitting must be able to move relative to the silicon photonics integrated circuit die in all directions. Therefore, the bonding surface of the cantilever must be relatively far from the bonding area on the main surface of the silicon photonics integrated circuit die to allow movement of the fiber optic cable fitting during the active alignment process. Consequently, the cantilever does not serve an alignment function, and a relatively thick layer of adhesive or epoxy is required between the cantilever and the bonding area on the main surface of the silicon photonics integrated circuit die.
[0040] According to embodiments of the subject matter of this disclosure, a strong bond can be formed between the fiber optic cable fitting and a fastening block bonded to the surface of a silicon photonics integrated circuit die. This surface of the silicon photonics die is parallel to the main plane of the silicon photonics die and perpendicular to the edge of the silicon photonics die containing the optical transducer. The fastening block has a cantilever or overhang extending beyond the edge of the silicon photonics integrated circuit die. The surface of the cantilever closer to the plane of the silicon photonics die surface to which the fastening block is bonded provides a bonding surface for attaching the fiber optic cable fitting, which is substantially the same area as, or at least substantially the same as, the bonding area between the fastening block and the silicon photonics die surface, and in some embodiments is at least about 150% of that bonding area. Therefore, the attachment of the fiber optic cable fitting to the surface of the silicon photonics die is less likely to fail due to bending forces or other lateral forces compared to attachment relying on the facets of a rectangular solid block.
[0041] The material of the fastener according to the subject matter of this disclosure can be selected to have a coefficient of thermal expansion similar to that of a silicon photonic integrated circuit die. In this way, the fastener and the die will expand and contract similarly with temperature fluctuations, so that the bond between the fastener and the die will not weaken due to expansion and contraction. For example, the fastener can be made of a glass material that is primarily silicon, so that it has a coefficient of thermal expansion similar to that of a silicon photonic die, which is also primarily silicon.
[0042] The fastening block of the type just described can be L-shaped, wherein the cantilever is the upright portion of the L-shape and has a mating surface for fastening the optical fiber end fitting. The portion of the L-shaped fastening block used for fastening to the silicon photonics integrated circuit die serves as the "base" or "foot" of the L-shape and has a mating surface for fastening to the silicon photonics integrated circuit die. Since the L-shaped fastening block is not placed after the active alignment of the optical fiber end fitting and the optical transducer is completed, meaning the L-shaped fastening block does not interfere with the active alignment of the optical fiber end fitting and the optical transducer, the distance between the mating surface of the base or foot of the L-shape and the mating surface of the upright portion of the L-shape can be approximately the same as the height of the optical fiber end fitting above the mating surface of the silicon photonics integrated circuit die. This allows for better adhesion between the L-shaped fastening block and both the surfaces of the optical fiber end fitting and the silicon photonics integrated circuit die. In some embodiments, the thickness of each adhesive layer in each of these joints can be approximately 60 µm or less.
[0043] In some implementations, the edge of the base or foot of the L-shaped fastener, adjacent to the upright portion or cantilever of the L-shaped fastener, is chamfered to create a ramp, rather than a right-angle step, between the mating surface of the cantilever and the mating surface of the base or foot. For example, the chamfer angle can be between 20° and 70°. Fiber optic cable end fittings can be chamfered above the cable end face to match the chamfered surface of the L-shaped fastener.
[0044] The chamfered surface or ramp reduces stress at the junction of the cantilever and the base or foot, further strengthening the bond between the fiber optic end fitting and the silicon photonics die against bending or lateral forces. Furthermore, since the adhesive or epoxy bonding layer is weakest in the direction perpendicular to the bonding layer plane and strongest in the shear direction parallel to the bonding layer plane, the chamfered surface of the fastening block allows the adhesive or bonding layer between this chamfered surface and the corresponding chamfered surface of the fiber optic end fitting to contribute to increased bond strength between the fiber optic end fitting and the silicon photonics die against bending or lateral forces. In contrast, in the case of a right-angle step, bending or lateral forces tend to attempt to separate the bonding layer in the direction perpendicular to the bonding layer.
[0045] By reference Figures 1-8 This will allow for a better understanding of the subject matter of this disclosure.
[0046] Figure 1 and Figure 2 A silicon photonics integrated circuit die 100 is shown, and the subject matter of this disclosure can be used with die 100. The silicon photonics integrated circuit die 100 includes an assembly of functional circuitry 101 and transceiver circuitry 111 coupled to an electro-optic transceiver 102, which may include a laser diode or other light-emitting element for emission and a photodiode or other photodetector element for reception. Figure 2 As best shown in this embodiment, the electro-optic transducer 102 is mounted in the edge surface 201 of the silicon photonics integrated circuit die 100 for edge connection to the fiber optic cable assembly 300 (including the fiber optic cable 301 and the fiber optic end fitting 302), as described below. However, in other embodiments (not shown), the connection to the fiber optic cable 300 can be made on one of the upper main surface 103 or the lower main surface 104 of the silicon photonics integrated circuit die 100. The fastening block 400 can be used to align and fasten the fiber optic end fitting 302 and its fiber optic cable to the electro-optic transducer 102, as discussed in more detail below.
[0047] like Figure 3 As shown, the fiber optic cable 300 includes a plurality of (e.g., four in the illustrated embodiment) optical fibers 301, which terminate near the face 312 of the cable end fitting 302. The cable end fitting 302 keeps the individual optical fibers 301 spaced apart to match the spacing of the electro-optic transducers 102.
[0048] Figure 4 and Figure 5The image shows a first embodiment 400 of an L-shaped fastening block according to the subject matter of this disclosure, used to fasten an optical fiber end fitting 302 to a silicon photonics integrated circuit die 100, such that the end of the optical fiber 301 adjacent to the face 312 of the optical fiber end fitting 302 is aligned with an electro-optic transducer 102. The L-shaped fastening block 400 has a first fastening surface 411 on a base or foot 401, the first fastening surface 411 serving as a mating region 421 for mating the L-shaped fastening block 400 to the "upper" (based on) the silicon photonics integrated circuit die 100. Figure 4 (Orientation) Main surface 103. The cantilever 403 of the L-shaped fastener 400 has a second fastening surface 412, which includes an engagement area 422 for engaging the L-shaped fastener 400 to the optical cable end fitting 302.
[0049] The height of step 404 is selected such that when the optical cable end fitting 302 is fastened to the engagement area 422 of the L-shaped fastener 400, and taking into account that the thickness of the adhesive or epoxy resin 406 does not exceed 60 μm (in this embodiment) at each engagement area in the engagement areas 421, 422, the end of the optical fiber 301 adjacent to the face 312 of the optical cable end fitting 302 is aligned with the electro-optic transducer 102 in a direction perpendicular to the main plane of the silicon photonic integrated circuit die 100.
[0050] To provide the required resistance to joint failure under bending or lateral forces, the engagement area 422 of the surface 412 on the cantilever 403 of the L-shaped fastener 400 should be at least the same as, and in some embodiments at least 150% of, the engagement area 421 of the surface 411 of the base or foot 401. Adhesive or epoxy 406 may be present along step 414 of step 404; however, since adhesive bonding has low shear strength in the engagement plane, any adhesive or epoxy present along step 414 of step 404 will not significantly contribute to resistance to joint failure caused by lateral or bending forces.
[0051] It can be observed that during the application of bending or lateral forces, a relatively large amount of stress exists at the corner 405 where the cantilever 403 meets the step 404. Therefore, according to other embodiments of the subject matter of this disclosure, instead of the step 404, the transition between the mating surfaces of the base or foot of the L-shaped fastener 600 (see...) Figure 6 and Figure 7 The can be chamfered so that there is a ramp 604 between the engagement area 622 on the surface 612 of the cantilever 603 and the engagement area 621 on the surface 611 of the base or foot 601, instead of a right-angle step 404.
[0052] In addition to reducing stress, the chamfer or ramp 604 can also improve the bonding strength between the fiber optic end fitting 602 (similar to the fiber optic end fitting 302, but with a chamfered surface 614) and the silicon photonic integrated circuit die 100 against bending or lateral forces. Since the adhesive or epoxy bonding layer has the weakest adhesive strength in the direction perpendicular to the bonding layer plane and the strongest in the shear direction parallel to the bonding layer plane, the chamfered surface or ramp 604 of the L-shaped fastener 600 allows the portion 616 of the adhesive or bonding layer 606 between the chamfered surface 604 and the corresponding chamfered surface 614 of the fiber optic end fitting 602 to help increase the attachment strength between the fiber optic end fitting 602 and the silicon photonic integrated circuit die 100 against bending or lateral forces (in contrast, in the case of the right-angle step 404, bending or lateral forces tend to attempt to separate the bonding layer 414 in the direction perpendicular to it), because the component 701 of the lateral force 700 will be parallel to the chamfer or ramp 604 where the bonding is strongest.
[0053] As described above, according to the subject matter of this disclosure, the material of the L-shaped fastener 400 or 600 can be selected to have a similar coefficient of thermal expansion to the silicon photonics integrated circuit die 100. In this way, the L-shaped fasteners 400, 600 and the silicon photonics integrated circuit die 100 will expand and contract similarly with temperature fluctuations, so that the bond between the L-shaped fasteners 400, 600 and the silicon photonics integrated circuit die 100 will not weaken due to expansion and contraction. For example, the L-shaped fasteners 400, 600 can be made of a glass material that is primarily silicon, so that it has a similar coefficient of thermal expansion to the silicon photonics integrated circuit die 100, which is also primarily silicon.
[0054] According to embodiments of the present disclosure, by aligning the face 312 of the fiber optic cable end fitting 302 with the edge face 201 of the silicon photonics integrated circuit die 100, the fiber optic cable 300 can be aligned with and coupled to the silicon photonics integrated circuit die 100. When an optical signal is applied to the electro-optic transducer 102, the fiber optic cable end fitting 302 can move laterally across the main plane of the silicon photonics integrated circuit die 100. The lateral movement of the fiber optic cable end fitting 302 stops when the strongest signal is detected at the other end (not shown) of the fiber optic cable 300.
[0055] exist Figure 8Method 800 according to an embodiment of the subject matter of this disclosure is illustrated. Method 800 begins at 801, where, in order to fasten an optical fiber cable fitting to a silicon photonics device (the silicon photonics device includes an integrated circuit structure having an optical transducer located on the integrated circuit structure and having a first surface), a block surface of a fastening block is bonded to the first surface. The fastening block has a cantilever with a cantilever surface parallel to the block surface. At 802, the cantilever surface is configured to bond the optical fiber cable fitting to a cantilever area at least as large as the bonding area. At 803, the cantilever surface is spaced apart from the block surface by a stepped distance to accommodate alignment of the optical fiber cable fitting with the optical transducer. Method 800 then ends.
[0056] Therefore, it can be seen that a structure and method for splicing optical fiber cables to silicon photonic devices has been provided, which is less sensitive to separation caused by bending or lateral forces.
[0057] As used herein and in the appended claims, the structure “one of A and B” shall mean “A or B”.
[0058] Note that the foregoing is only for illustrating the principles of the present invention. The present invention can be practiced through other embodiments besides the described embodiments. The described embodiments are presented for illustrative purposes only and not for limiting purposes. The present invention is limited only by the appended claims.
Claims
1. A silicon photonics communication device, configured to secure an optical fiber cable accessory to the silicon photonics communication device, characterized in that, The silicon photonics communication device includes: An integrated circuit structure having an optical transducer located on the integrated circuit structure and having a first surface; and A fastening block having a mating area on its surface and a cantilever, the mating area mating to the first surface, the cantilever having a cantilever surface parallel to the first surface, wherein: The cantilever surface is configured to attach to the fitting of the fiber optic cable at a cantilever area at least as large as the engagement area, and The cantilever surface is spaced apart from the block surface by a stepped distance to accommodate the alignment of the fiber optic cable fittings with the optical transducer.
2. The silicon photonics communication device according to claim 1, characterized in that, The optical transducer is located on a second surface perpendicular to the first surface; and The cantilever extends beyond the second surface and is configured to engage with the fitting of the optical fiber cable to hold the end face of the fitting adjacent to the optical transducer on the second surface, with the end of the optical fiber exposed at the end face.
3. The silicon photonics communication device according to claim 2, characterized in that, The cantilever surface is configured to engage the fitting of the optical fiber cable at a cantilever area that is at least 150% the size of the engagement area.
4. The silicon photonics communication device according to claim 2, characterized in that, Taking into account the thickness of the bonding layer, the step distance is selected such that the exposed end of the optical fiber is aligned with the optical transducer.
5. The silicon photonics communication device according to claim 1, characterized in that, The block surface and the cantilever surface are separated by a right-angle step.
6. The silicon photonics communication device according to claim 1, characterized in that, The block surface and the cantilever surface are separated by a chamfered edge.
7. The silicon photonics communication device according to claim 1, characterized in that, The fastener has a first coefficient of thermal expansion, which matches the second coefficient of thermal expansion of the integrated circuit structure.
8. The silicon photonics communication device according to claim 7, characterized in that, The integrated circuit structure includes a silicon die; and The fastening block includes glass.
9. A photonic communication component, characterized in that, include: Fiber optic cables, with cable accessories; A silicon photonic integrated circuit communication structure having an optical transducer located on the silicon photonic integrated circuit communication structure and having a first surface; as well as A fastening block having a mating area on its surface and a cantilever, the mating area mating to the first surface, the cantilever having a cantilever surface parallel to the first surface, wherein: The cantilever surface is joined to the fitting of the optical fiber cable at a cantilever area at least as large as the joint area, and The cantilever surface is spaced apart from the block surface by a stepped distance to accommodate the alignment of the fiber optic cable fittings with the optical transducer.
10. The photonic communication component according to claim 9, characterized in that, The optical transducer is located on a second surface perpendicular to the first surface; and The cantilever extends beyond the second surface and is configured to engage with the fitting of the optical fiber cable to keep the end face of the fitting adjacent to the second surface, with the end of the optical fiber exposed in the end face.
11. The photonic communication component according to claim 10, characterized in that, The cantilever surface is configured to engage the fitting of the optical fiber cable at a cantilever area that is at least 150% the size of the engagement area.
12. The photonic communication component according to claim 10, characterized in that, Taking into account the thickness of the bonding layer, the step distance is selected such that the exposed end of the optical fiber is aligned with the optical transducer.
13. The photonic communication component according to claim 9, characterized in that, The block surface is separated from the cantilever surface by a right-angle step.
14. The photonic communication component according to claim 9, characterized in that, The block surface is separated from the cantilever surface by a chamfered edge.
15. The photonic communication component according to claim 9, characterized in that, The fastener has a first coefficient of thermal expansion, which matches the second coefficient of thermal expansion of the integrated circuit structure.
16. The photonic communication component according to claim 15, characterized in that, The integrated circuit structure includes a silicon die; and The fastening block includes glass.