Efficient heat dissipation host case

Abstract

The utility model discloses an efficient heat dissipation host case, which relates to the technical field of vertical air duct cases, and comprises a rack, a first chamber is arranged in the rack, and a second chamber is arranged in the rack. When the first cavity is designed, the display cards with different heat dissipation modes are adapted, the display cards with three heat dissipation modes of lateral heat dissipation, back transmission and semi-back transmission are supported, the display cards conforming to SFF specifications are supported, the display cards are mainly fixed through screws and are fixed through PCIE extension lines in an auxiliary mode (or soft ribbons can be additionally arranged at the same time for auxiliary fixing), and the display cards are fixed through the screws. The second cavity is also provided with an air duct design during design, and the mainboard is transversely arranged below and is supported by the guide rail, so that the two advantages are that firstly, an I / O port is convenient to face backwards, secondly, air entering from the lower part is convenient to blow upwards through the radiator, and the air duct of the whole second cavity is divided into two branches from bottom to top and extracted by the main fan; and two auxiliary fans are arranged on the side surface of the other branch, so that different effects can be achieved by using various air inlet and outlet modes.

Description

Technical Field

[0001] This utility model relates to the field of vertical air duct chassis, and in particular to a high-efficiency heat dissipation host chassis. Background Technology

[0002] The computer case is an important component of a computer, primarily used to house and protect the internal hardware. ITX cases are small cases designed specifically for Mini-ITX motherboards, suitable for users seeking compactness and portability. The structure of an ITX case is similar to an A4 board, but it's horizontally oriented with a compact layout, making cable management difficult and lacking airflow. Heat buildup occurs after the case is sealed, and compatibility with various hardware components is very limited.

[0003] The existing vertical structure basically does not make any changes to the A4, but simply changes the horizontal frame to the vertical frame to make it easier to stand the chassis. Even if there are changes, the arrangement of the hardware positions is limited and cannot effectively take into account the convenience of interfaces, reasonable airflow, smooth cable routing, and efficient use of space. Utility Model Content

[0004] The purpose of this invention is to address the shortcomings of the unreasonable arrangement of hardware positions in the existing technology, and to propose a high-efficiency heat dissipation host chassis.

[0005] To address the problems existing in the prior art, the present invention adopts the following technical solution:

[0006] A high-efficiency heat dissipation host chassis includes a rack, a first chamber inside the rack, a second chamber inside the rack, a pair of guide rails inside the second chamber, multiple connecting holes at the upper end of the rack, multiple air inlets at the lower end of the rack, and three side plates at the upper end and sides of the rack.

[0007] Preferably, the top of the rack is used to house the main fan, the first chamber is used to house the graphics card, the second chamber is used to house the motherboard, graphics card and power supply, and the side of the second chamber near the side panel is used to house two auxiliary fans.

[0008] Preferably, a dustproof net can be installed on the outer side of each of the side panels.

[0009] Preferably, a central main support wall is fixedly provided inside the frame, and all guide rails are fixedly connected to the central main support wall. Two detachable side support walls are provided on the outside of the frame.

[0010] Preferably, a base is fixedly provided at the lower end of the frame.

[0011] Compared with the prior art, the beneficial effects of this utility model are:

[0012] 1. In this utility model, the first chamber is designed to accommodate graphics cards with different cooling methods, supporting graphics cards with side cooling, back-panel cooling, and semi-back-panel cooling methods, and also supporting graphics cards that conform to the SFF specification. The graphics card is mainly fixed by screws and further fixed by PCIe extension cables (soft cable ties can also be added for additional fixation). The second chamber is also designed with an airflow channel. The motherboard is placed horizontally below and supported by guide rails. This has two advantages: first, it makes it convenient for the I / O ports to face the rear, and second, it makes it convenient for the air intake from the bottom to blow upward through the heatsink. The airflow channel of the entire second chamber is divided into two streams. One stream is drawn from bottom to top by the main fan, and the other stream is drawn by two auxiliary fans on the side. Multiple air intake and exhaust methods can be used to achieve different effects. The arrangement of each hardware position is reasonable and can effectively take into account the convenience of interfaces, reasonable airflow channel, smooth cable routing, and efficient use of space.

[0013] 2. In this utility model, the middle main support wall provides a fixing surface for fixing the motherboard, power supply and graphics card. The graphics card can use straps to pass through the holes of the support surface to strengthen the lateral support force and prevent the graphics card circuit board from bending. The side support wall provides lateral support force, so that the overall center of gravity of the hardware is closer to vertical downward, which is not easy to cause structural deformation. At the same time, the side support wall also blocks part of the heat from the main air outlet and prevents the shell from deforming due to high temperature. Attached Figure Description

[0014] The accompanying drawings, which are included to provide a further understanding of the present invention and form part of this application, illustrate exemplary embodiments of the present invention and, together with the description thereof, serve to explain the present invention and do not constitute an undue limitation thereof. In the drawings:

[0015] Figure 1 This is a schematic diagram of the main structure of this utility model;

[0016] Figure 2 This is a schematic diagram of the frame structure of this utility model.

[0017] The numbers in the diagram are: 1. Frame; 11. First chamber; 12. Second chamber; 121. Guide rail; 13. Connecting hole; 14. Air inlet; 15. Side plate; 2. Middle main support wall; 21. Side support wall; 3. Base. Detailed Implementation

[0018] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0019] In the description of this utility model, it should be noted that, unless otherwise explicitly specified and limited, the terms "installed," "equipped with," "sleeved / connected," "connected," etc., should be interpreted broadly. For example, "connection" can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium; it can be a connection within two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.

[0020] Example: This example provides a high-efficiency heat dissipation computer case. See [link / reference]. Figure 1-2 Specifically, the rack 1 includes a first chamber 11 and a second chamber 12. The second chamber 12 contains a pair of guide rails 121. The upper end of the rack 1 has multiple connecting holes 13, and the lower end of the rack 1 has multiple air intake holes 14. The upper end and sides of the rack 1 have three side plates 15. The top of the rack 1 is used to house the main fan. The first chamber 11 is used to house the graphics card. The second chamber 12 is used to house the motherboard, graphics card, and power supply. The side of the second chamber 12 near the side plate 15 is used to house two auxiliary fans. Dust filters can be installed on the outside of each side plate 15.

[0021] The first chamber 11 was designed to accommodate graphics cards with different cooling methods, supporting graphics cards with three cooling methods: side cooling, back-paneling, and semi-back-paneling. It also supports graphics cards that conform to the SFF specification. The graphics card is mainly fixed with screws and further secured with PCIe extension cables (soft cable ties can also be added for additional fixation).

[0022] The graphics card's main airflow consists of two channels, one at the front and one at the back, designed to accommodate graphics cards with typical side-cooling. The front channel is enclosed by the central main support wall 2 and the side support wall 21, forming an upward-flowing airflow. The bottom surface has corresponding openings to increase air intake, while the top surface has corresponding openings for the main fan to exhaust air outwards. The rear channel primarily draws air in from the side of the casing, with air also entering from below, and similarly exhausts it from the top.

[0023] Graphics cards with back-transparent and semi-back-transparent cooling have additional cooling channels. These channels are formed by adding two vertical brackets to the main support wall 2 in the middle and the backplate of the graphics card to create an exhaust channel. Even without these two vertical brackets, there are shallow grooves on the main support wall 2 in the middle to achieve this function, but it is more suitable for thicker semi-back-transparent graphics cards.

[0024] The second chamber 12 is also designed with an airflow system. The motherboard is placed horizontally at the bottom and supported by the guide rail 121. This has two advantages: first, it makes it easier for the I / O ports to face the rear, and second, it makes it easier for the air to enter from the bottom and blow upward through the heatsink. The airflow of the entire second chamber 12 is divided into two streams. One stream is drawn from the bottom up by the main fan, and the other stream is drawn by two auxiliary fans on the side. Multiple air intake and exhaust methods can be used to achieve different effects.

[0025] The power supply is placed directly above the motherboard and fixed by the guide rail 121 and the screw holes on the top and bottom surfaces. This allows the center of gravity to be well transferred to the center of the entire component, preventing excessive strain on the structure. The power supply is also horizontally positioned with the power connector (exhaust vent) facing backward, the air intake side facing the auxiliary fan on the side, and the wiring side facing forward. This allows the cold air in the intake duct and the exhaust air to be directly drawn away by the main fan, and provides more space for the wiring to be unobstructed.

[0026] The frame 1 is fixedly provided with a central main support wall 2, and the guide rails 121 are all fixedly connected to the central main support wall 2. The frame 1 is provided with two detachable side support walls 21 on the outside.

[0027] The main support wall 2 in the middle provides a fixing surface for fixing the motherboard, power supply and graphics card. The graphics card can use straps to pass through the holes in the support surface to strengthen the lateral support force and prevent the graphics card circuit board from bending. The side support wall 21 provides lateral support force, so that the overall center of gravity of the hardware is closer to vertical downward, which is not easy to cause structural deformation. At the same time, the side support wall 21 also blocks some of the heat from the main air outlet to prevent the casing from deforming due to high temperature.

[0028] A base 3 is fixedly installed at the lower end of the frame 1;

[0029] The base 3 is designed to accommodate different HDMI / DP cables of varying heights, preventing the chassis from being unable to stand upright. It also provides more hidden air intake space to ensure air circulation within the chassis.

[0030] Specifically, the working principle and operation method of this utility model are as follows:

[0031] The first chamber 11 was designed to accommodate graphics cards with different cooling methods, supporting graphics cards with three cooling methods: side cooling, back-paneling, and semi-back-paneling. It also supports graphics cards that conform to the SFF specification. The graphics card is mainly fixed with screws and further secured with PCIe extension cables (soft cable ties can also be added for additional fixation).

[0032] The second chamber 12 is also designed with an airflow system. The motherboard is placed horizontally at the bottom and supported by the guide rail 121. This has two advantages: first, it makes it convenient for the I / O ports to face the back, and second, it makes it convenient for the air to enter from the bottom and blow upward through the heatsink. The airflow of the entire second chamber 12 is divided into two streams. One stream is drawn from the bottom up by the main fan, and the other stream is drawn by two auxiliary fans on the side. Multiple air intake and exhaust methods can be used to achieve different effects.

[0033] The main support wall 2 in the middle provides a fixing surface for fixing the motherboard, power supply and graphics card. The graphics card can use straps to pass through the holes in the support surface to strengthen the lateral support force and prevent the graphics card circuit board from bending. The side support wall 21 provides lateral support force, so that the overall center of gravity of the hardware is closer to vertical downward, which is not easy to cause structural deformation. At the same time, the side support wall 21 also blocks some of the heat from the main air outlet to prevent the casing from deforming due to high temperature.

[0034] The base 3 is designed to accommodate different HDMI / DP cables of varying heights, preventing the chassis from being unable to stand upright. It also provides more hidden air intake space to ensure air circulation within the chassis.

[0035] The above description is only a preferred embodiment of the present utility model, but the protection scope of the present utility model is not limited thereto. Any equivalent substitutions or changes made by those skilled in the art within the technical scope disclosed in the present utility model, based on the technical solution and the inventive concept of the present utility model, should be included within the protection scope of the present utility model.

Claims

1. A high-efficiency heat dissipation host chassis, comprising a rack (1), characterized in that: The frame (1) is provided with a first chamber (11) and a second chamber (12). The second chamber (12) is provided with a pair of guide rails (121). The upper end of the frame (1) is provided with multiple connecting holes (13). The lower end of the frame (1) is provided with multiple air inlets (14). The upper end and the side of the frame (1) are provided with three side plates (15).

2. The high-efficiency heat dissipation host chassis according to claim 1, characterized in that: The top of the rack (1) is used to place the main fan, the first chamber (11) is used to place the graphics card, the second chamber (12) is used to place the motherboard, graphics card and power supply, and the side of the second chamber (12) near the side plate (15) is used to place two auxiliary fans.

3. The high-efficiency heat dissipation host chassis according to claim 1, characterized in that: A dustproof net can be installed on the outside of each of the side panels (15).

4. The high-efficiency heat dissipation host chassis according to claim 1, characterized in that: The frame (1) is fixedly provided with a central main support wall (2), and the guide rails (121) are all fixedly connected to the central main support wall (2). The frame (1) is provided with two detachable side support walls (21) on the outside.

5. The high-efficiency heat dissipation host chassis according to claim 1, characterized in that: The lower end of the frame (1) is fixedly provided with a base (3).

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