Chip mounting device and chip mounter
By introducing a vertical motion component and a preload adjustment component into the chip mounting device, and by using a heating tank and a heating rod to heat the chip and substrate, the problem of poor chip-substrate connection quality is solved, resulting in better connection tightness and improved substrate performance.
Patent Information
- Application Number
- CN202520507918.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-03-21
- Publication Date
- 2026-02-24
- Estimated Expiration
- 2035-03-21
AI Technical Summary
Existing semiconductor chip bonding machines suffer from poor connection quality between the chip and the substrate when fixing the chip to the substrate, which affects the performance of the substrate.
A chip mounting device is used, including a body, a mounting head module and a substrate heating module. A reliable connection between the chip and the substrate is achieved through a vertical motion component and a preload adjustment component. The chip and the substrate are heated by a heating tank and a heating rod to ensure the connection within the eutectic reaction temperature range.
This improves the tightness and reliability of the connection between the chip and the substrate, thereby enhancing the performance of the substrate.
Smart Images
Figure CN223943079U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of chip mounting technology, specifically to a mounting device and a mounting machine. Background Technology
[0002] Pick-and-place machines are core equipment in electronics manufacturing. Generally speaking, semiconductor die bonding involves picking up a chip from a wafer using a nozzle (or soldering head) through vacuum, and placing it, under visual guidance, into a designated area on a lead frame or packaging substrate, thus bonding (or soldering) the chip to the substrate. Die bonding is one of the key technologies in the back-end processes of semiconductor manufacturing. In this solution, "pick-and-place machine" refers specifically to a semiconductor chip die bonding machine.
[0003] In existing semiconductor chip bonding machines, the connection quality between the chip and the substrate is often poor when fixing the chip to the substrate, which in turn affects the performance of the substrate. Utility Model Content
[0004] In view of the above-mentioned shortcomings of the existing technology, the technical problem to be solved by this utility model is: how to provide a chip mounting device and chip mounting machine that can realize a reliable connection between the chip and the substrate, thereby improving the performance of the substrate.
[0005] To solve the above-mentioned technical problems, the present invention adopts the following technical solution:
[0006] A chip mounting apparatus includes a body, on which a chip mounting head module and a substrate heating module are provided;
[0007] The patch head module includes a mounting frame, a vertical motion component, a vertical preload adjustment component, and a patch head;
[0008] The fixed end of the vertical motion component is connected to the mounting frame, the moving end of the vertical motion component is connected to the fixed end of the vertical preload adjustment component, and the moving end of the vertical preload adjustment component is connected to the patch head; the patch head is provided with multiple heating grooves, and each heating groove is provided with a first heating rod;
[0009] The substrate heating module includes a placement platform and a substrate heating component. The substrate heating component is mounted on the placement platform and is used to place the substrate. The substrate heating component includes multiple heating seats, and each heating seat is connected to a second heating rod to heat the heating seat through the second heating rod, thereby heating the substrate.
[0010] The working principle of this utility model is as follows: When using the chip mounting device of this solution, the substrate to be mounted is placed on the substrate heating component. The substrate heating component is provided with multiple heating seats, and a second heating rod is provided on each heating seat. The second heating rod is used to heat the heating seat at the corresponding position, and the heating seat further heats the substrate at the corresponding position. Thus, the heating of the substrate by the heating seat is used to meet the temperature requirements of the substrate during die bonding.
[0011] In addition, the chip to be connected to the substrate is adsorbed by the chip mounting head. A vertical motion component drives a vertical preload adjustment component to indirectly move the chip mounting head vertically and attach it to the substrate. During chip bonding, to ensure a tight bond between the chip and the substrate, the chip mounting head needs to apply a certain preload force. Therefore, in this solution, a vertical preload adjustment component is used to apply a certain preload force to the chip, thereby ensuring a good tight bond between the chip and the substrate. Simultaneously, a heating groove is provided on the chip mounting head, containing a first heating rod. This first heating rod heats the chip on the chip mounting head, ensuring a high temperature during the connection process. By heating both the substrate and the chip on the chip mounting head separately, sufficient reaction temperature is ensured during the chip-substrate connection, thereby achieving a reliable connection and improving the substrate's performance.
[0012] Preferably, the vertical motion assembly includes a vertical motion power component and a vertical motion component, the vertical motion power component is mounted on the mounting frame, and the vertical motion component is connected to the vertical motion power component and the vertical preload adjustment assembly respectively;
[0013] The vertical preload adjustment assembly includes a vertical preload adjustment power component and a vertical preload adjustment part. The vertical preload adjustment power component is connected to the vertical motion component, and the vertical preload adjustment part is connected to both the vertical preload adjustment power component and the patch head.
[0014] In this way, during chip bonding, the vertical motion power component is activated, which drives the vertical motion component to move vertically. The vertical motion component then drives the placement head to move vertically via the vertical preload adjustment component to bond the chip to the substrate. To ensure a tight bond between the chip and the substrate, the placement head needs to apply a certain preload force to the chip. This is achieved by activating the vertical preload adjustment power component, which drives the vertical preload adjustment component to move. The vertical preload adjustment component then drives the placement head to move, applying a certain preload force to the chip. This allows the placement head to bond the chip with a certain preload force to the substrate, improving the tightness of the bond between the chip and the substrate.
[0015] Preferably, the vertical preload adjustment assembly further includes a guide component, which includes a guide post with a guide groove. The vertical preload adjustment component passes through the guide groove to guide the vertical movement of the vertical preload adjustment component.
[0016] In this way, by setting a guide post and opening a guide groove on the guide post, and passing the vertical preload adjustment component through the guide groove, the vertical movement of the vertical preload adjustment component can be guided by the guide groove.
[0017] Preferably, the guide component further includes two guide spring plates, which are respectively located on the vertical sides of the guide post. The vertical preload adjustment component passes through the two guide spring plates, and the inner diameter of the guide spring plates is adapted to the outer diameter of the vertical preload adjustment component at the corresponding position.
[0018] In this way, by setting two guide spring plates, the axial and longitudinal movements of the vertical preload adjustment component can be restricted, and the vertical movement of the vertical preload adjustment component can be achieved by the elastic deformation of the guide spring plates themselves. The method of using guide spring plates for guidance has the advantage of low friction.
[0019] Preferably, a first thermocouple is also provided on the patch head, and the first thermocouple detects the temperature of the patch head.
[0020] In this way, the temperature of the chip mounting head can be detected by the first thermocouple, thereby indirectly detecting the chip temperature. The temperature feedback from the first thermocouple keeps the chip temperature within the range that meets the requirements of the eutectic reaction, thus improving the effect of the eutectic reaction.
[0021] Preferably, a second thermocouple is also provided on the heating base, and the second thermocouple detects the temperature of the heating base.
[0022] In this way, by detecting the temperature of the heating seat through the second thermocouple, the temperature of the substrate can be indirectly detected. The temperature feedback from the second thermocouple keeps the substrate temperature within the range that satisfies the eutectic reaction, thereby improving the effect of the eutectic reaction.
[0023] Preferably, the heating temperature of the first heating rod is lower than the heating temperature of the second heating rod.
[0024] In this way, the heating temperature of the first heating rod is lower than that of the second heating rod, which is compatible with the temperature requirements of the chip and substrate for the eutectic reaction. By reasonably setting the temperatures of both the chip and the substrate, the effect of the eutectic reaction between the chip and the substrate can be better achieved.
[0025] Preferably, the plurality of heating seats in the substrate heating component correspond one-to-one with the plurality of materials on the substrate, so as to heat the materials at the corresponding positions on the substrate through the heating seats.
[0026] In this way, by matching the heating base with the materials on the substrate one by one, it can be ensured that each material on the substrate can be effectively heated, thereby further ensuring the effect of the eutectic reaction.
[0027] Preferably, both the vertical motion power component and the vertical preload adjustment power component are motors.
[0028] In addition, this solution also provides a pick-and-place machine, which includes the pick-and-place device described above. Attached Figure Description
[0029] Appendix Figure 1 This is a schematic diagram of the patch head module in the patch device of this utility model;
[0030] Appendix Figure 2 This is a front view of the patch head module in the patch device of this utility model;
[0031] Appendix Figure 3 for Figure 2 AA section view in the middle;
[0032] Appendix Figure 4 This is a schematic diagram of the substrate heating module in the patch mounting device of this utility model.
[0033] Explanation of reference numerals in the attached drawings: 1. Mounting frame; 2. Vertical motion assembly; 201. Vertical motion component; 3. Vertical preload adjustment assembly; 301. Vertical preload adjustment power component; 302. Vertical preload adjustment component; 303. Guide column; 304. Guide spring plate; 4. Patch head; 5. Heating groove; 6. Placement platform; 7. Heating seat; 8. Second heating rod. Detailed Implementation
[0034] To make the objectives, technical solutions, and advantages of the embodiments of this utility model clearer, the technical solutions of the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this utility model. The components of the embodiments of this utility model described and shown in the accompanying drawings can generally be arranged and designed in various different configurations. Therefore, the following detailed description of the embodiments of this utility model provided in the accompanying drawings is not intended to limit the scope of the claimed utility model, but merely represents selected embodiments of the utility model. All other embodiments obtained by those skilled in the art based on the embodiments of this utility model without inventive effort are within the scope of protection of this utility model.
[0035] In this specific embodiment, the chip mounting device of this solution can be used on a chip mounter. In addition to the chip mounting device of this solution, the chip mounter also includes a feeding device, a unloading device, etc. The substrate to be mounted is transported by the feeding device to the substrate heating module of the chip mounting device of this solution. At the same time, the chip to be mounted is adsorbed on the mounting head module of the chip mounting device of this solution. Then, the chip can be connected to the substrate using the chip mounting device of this solution.
[0036] Specifically, the chip mounting device of this solution includes a body, on which a chip mounting head module and a substrate heating module are provided.
[0037] As attached Figure 1 To the attached Figure 3 As shown, in this specific embodiment, the chip mounting head module includes a mounting frame 1, a vertical motion component 2, a vertical preload adjustment component 3, and a chip mounting head 4. The fixed end of the vertical motion component 2 is connected to the mounting frame 1, the moving end of the vertical motion component 2 is connected to the fixed end of the vertical preload adjustment component 3, and the moving end of the vertical preload adjustment component 3 is connected to the chip mounting head 4. The chip is bonded to the substrate by the vertical motion component 2 driving the chip mounting head 4 to move vertically, and a certain preload is applied to the chip by the vertical preload adjustment component 3 driving the chip mounting head 4 to move. The chip mounting head 4 is provided with multiple heating grooves 5, and each heating groove 5 is provided with a first heating rod.
[0038] As attached Figure 4As shown, in this specific embodiment, the substrate heating module includes a placement platform 6 and a substrate heating component. The substrate heating component is used to place the substrate and includes multiple heating seats 7. Each heating seat 7 is connected to a second heating rod 8 to heat the heating seat 7, thereby heating the substrate. Specifically, multiple materials are placed on the substrate, and the multiple heating seats 7 in the substrate heating component correspond one-to-one with the multiple materials on the substrate, so that the materials at the corresponding positions on the substrate are heated by the heating seats 7. By corresponding the heating seats 7 with the materials on the substrate one-to-one, it can be ensured that each material on the substrate can be effectively heated, thereby further ensuring the effect of the die-bonding reaction.
[0039] The heating temperature of the first heating rod is lower than that of the second heating rod 8. This lower heating temperature is adapted to the temperature requirements of the chip and substrate for the die bonding reaction. By reasonably setting the temperatures of both the chip and the substrate, a better connection effect between the chip and the substrate can be achieved.
[0040] For example, see appendix. Figure 1 To the attached Figure 3 As shown, in this specific embodiment, the vertical motion assembly 2 includes a vertical motion power component and a vertical motion component 201. The vertical motion power component is mounted on the mounting frame 1, and both ends of the vertical motion component 201 are connected to the vertical motion power component and the vertical preload adjustment assembly 3, respectively. The vertical preload adjustment assembly 3 includes a vertical preload adjustment power component 301 and a vertical preload adjustment component 302. The vertical preload adjustment power component 301 and the vertical preload adjustment component 302 are connected, and both ends of the vertical preload adjustment component 302 are connected to the vertical preload adjustment power component 301 and the chip mounter 4, respectively. The vertical preload adjustment power component 301 drives the vertical preload adjustment component 302 to move, and the vertical preload adjustment component 302 drives the chip mounter 4 to move, thereby applying a certain force to the chip. Both the vertical motion power component and the vertical preload adjustment power component 301 are motors. In specific use, the vertical preload adjustment power component is a voice coil motor. It should be noted that the vertical motion component 2 and the vertical preload adjustment component 3 of this solution respectively realize coarse linear motion adjustment and fine linear motion adjustment in the vertical direction. This linear motion can be achieved by adopting a structure of linear motor plus linear guide rail, or a structure of slider plus guide rail, etc. These structures for realizing linear motion are all existing technologies. For those skilled in the art, the specific structure can be selected according to the actual design needs. Moreover, the implementation of this linear structure will not have a substantial impact on this solution and is not a technical solution that needs to be protected by this solution. Therefore, it will not be discussed in detail in this solution.
[0041] In this way, during chip bonding, the vertical motion power component is activated, which drives the vertical motion component 201 to move vertically. The vertical motion component 201 further drives the bonding head 4 to move vertically to bond the chip onto the substrate via the vertical preload adjustment component 3. To ensure a tight bond between the chip and the substrate, the bonding head 4 needs to apply a certain preload force to the chip. This is achieved by activating the vertical preload adjustment power component 301, which drives the vertical preload adjustment component 302 to move. The vertical preload adjustment component 302 further drives the bonding head 4 to move to apply a certain preload force to the chip. This allows the bonding head 4 to bond the chip with a certain preload force onto the substrate, improving the tightness of the bond between the chip and the substrate.
[0042] In this specific embodiment, the vertical preload adjustment assembly 3 further includes a guide component, which includes a guide post 303 and two guide spring plates 304. A guide groove is formed on the guide post 303, through which the vertical preload adjustment assembly 302 passes to guide its vertical movement. The two guide spring plates 304 are located on opposite vertical sides of the guide post 303, and the vertical preload adjustment assembly 302 passes through both guide spring plates 304. The inner diameter of each guide spring plate 304 is adapted to the outer diameter of the corresponding vertical preload adjustment assembly 302.
[0043] Thus, by setting a guide post 303 and creating a guide groove on it, and passing the vertical preload adjusting component 302 through the guide groove, the vertical movement of the vertical preload adjusting component 302 can be guided using the guide groove. By setting two guide spring plates 304, the axial and longitudinal movement of the vertical preload adjusting component 302 can be restricted, and the vertical movement of the vertical preload adjusting component 302 is achieved by utilizing the elastic deformation of the guide spring plates 304 themselves. This method of guiding using guide spring plates 304 has the advantage of low friction.
[0044] In this specific embodiment, a first thermocouple is also provided on the patch head 4 to detect the temperature of the patch head 4. A second thermocouple is also provided on the heating base 7 to detect the temperature of the heating base 7.
[0045] In this way, the temperature of the mounting head 4 can be detected by the first thermocouple, thereby indirectly detecting the chip temperature. The temperature feedback from the first thermocouple keeps the chip temperature within the range that satisfies the eutectic reaction, improving the effectiveness of the eutectic reaction. Similarly, the temperature of the heating base 7 can be detected by the second thermocouple, thereby indirectly detecting the substrate temperature. The temperature feedback from the second thermocouple keeps the substrate temperature within the range that satisfies the eutectic reaction, improving the effectiveness of the eutectic reaction.
[0046] In use, the mounting device of this solution places the substrate to be mounted on the substrate heating component. The substrate heating component is provided with multiple heating seats 7, and a second heating rod 8 is provided on each heating seat 7. The second heating rod 8 is used to heat the heating seat 7 at the corresponding position, and the heating seat 7 further heats the substrate at the corresponding position. Thus, the heating of the substrate by the heating seat 7 is used to meet the temperature requirements of the eutectic reaction on the substrate.
[0047] Furthermore, the chip to be connected to the substrate is adsorbed by the placement head 4. The vertical motion component 2 drives the vertical preload adjustment component 3 to indirectly move the placement head 4 vertically and attach the chip to the substrate. During chip bonding, in order to ensure a tight bond between the chip and the substrate, the placement head 4 needs to apply a certain preload force to the chip. Therefore, in this solution, a vertical preload adjustment component 3 is provided. The vertical preload adjustment component 3 drives the placement head 4 to apply a certain preload force to the chip, thereby ensuring a good tight bond between the chip and the substrate. In practical use, the vertical preload adjustment component 3 can be used to preload the chip onto the chip, and then the vertical motion component 2 can be used to move the chip onto the substrate vertically. Alternatively, the vertical motion component 2 can be used to move the chip to the position corresponding to the substrate, and then the vertical preload adjustment component 3 can be used to apply a certain force to the chip onto the chip. The specific operation method is not limited in this solution, and the operator can choose the appropriate method according to the actual situation. At the same time, a heating groove 5 is provided on the chip onto ...
[0048] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this utility model and not to limit the technical solutions. Those skilled in the art should understand that any modifications or equivalent substitutions to the technical solutions of this utility model that do not depart from the spirit and scope of this technical solution should be covered within the scope of the claims of this utility model.
Claims
1. A patch mounting device, comprising a body, characterized in that, The machine body is equipped with a patch head module and a substrate heating module; The patch head module includes a mounting frame, a vertical motion component, a vertical preload adjustment component, and a patch head; The fixed end of the vertical motion component is connected to the mounting frame, the moving end of the vertical motion component is connected to the fixed end of the vertical preload adjustment component, and the moving end of the vertical preload adjustment component is connected to the patch head; the patch head is provided with multiple heating grooves, and each heating groove is provided with a first heating rod; The substrate heating module includes a placement platform and a substrate heating component. The substrate heating component is mounted on the placement platform and is used to place the substrate. The substrate heating component includes multiple heating seats, and each heating seat is connected to a second heating rod to heat the heating seat through the second heating rod, thereby heating the substrate.
2. The patch assembly according to claim 1, characterized in that, The vertical motion assembly includes a vertical motion power component and a vertical motion component. The vertical motion power component is mounted on the mounting frame, and the vertical motion component is connected to both the vertical motion power component and the vertical preload adjustment assembly. The vertical preload adjustment assembly includes a vertical preload adjustment power component and a vertical preload adjustment part. The vertical preload adjustment power component is connected to the vertical motion component, and the vertical preload adjustment part is connected to both the vertical preload adjustment power component and the patch head.
3. The patch assembly according to claim 2, characterized in that, The vertical preload adjustment assembly further includes a guide component, which includes a guide post with a guide groove. The vertical preload adjustment component passes through the guide groove to guide its vertical movement.
4. The patch assembly device according to claim 3, characterized in that, The guide component also includes two guide spring plates, which are located on the vertical sides of the guide post. The vertical preload adjustment component passes through the two guide spring plates, and the inner diameter of the guide spring plates is adapted to the outer diameter of the vertical preload adjustment component at the corresponding position.
5. The patch assembly according to claim 1, characterized in that, A first thermocouple is also provided on the patch head, which detects the temperature of the patch head.
6. The patch assembly according to claim 1, characterized in that, A second thermocouple is also provided on the heating base, which detects the temperature of the heating base.
7. The patch assembly according to claim 1, characterized in that, The heating temperature of the first heating rod is lower than that of the second heating rod.
8. The patch assembly apparatus according to claim 1, characterized in that, The heating element of the substrate has multiple heating seats that correspond one-to-one with multiple materials on the substrate, so as to heat the materials at the corresponding positions on the substrate through the heating seats.
9. The patch assembly according to claim 2, characterized in that, Both the vertical motion power component and the vertical preload adjustment power component are electric motors.
10. A pick-and-place machine, characterized in that, The placement machine includes the placement apparatus as described in any one of claims 1 to 9.