Optical sensor and electronic device

Abstract

The utility model discloses an optical sensor and an electronic device, the optical sensor comprises a substrate, a light-emitting source, an optical sensing chip and a transparent packaging layer, the light-emitting source and the optical sensing chip are arranged on the substrate and are respectively electrically connected with the substrate, a black glue light blocking wall is arranged between the light-emitting source and the optical sensing chip, and the transparent packaging layer is arranged on the substrate. The transparent packaging layer is arranged on the substrate, and the transparent packaging layer packages the side portions of the light-emitting light source, the optical sensing chip and the black glue light blocking wall. The electronic equipment comprises the optical sensor. According to the utility model, the black glue light-blocking wall is arranged between the light-emitting light source and the optical sensing chip, so that the packaging size of the optical sensor is reduced while the light-blocking requirement is met, the size of the optical sensor is minimized under the condition of process permission, and the application range of the optical sensor is wider.

Description

Technical Field

[0001] This utility model relates to the field of sensor technology, and more specifically, to an optical sensor and electronic device. Background Technology

[0002] The increasing thinness and lightness of electronic devices, along with the era of full-screen displays and narrow bezels, leaves less and less space for optical sensors. Furthermore, the applications of optical sensors are becoming increasingly widespread, extending beyond mobile phones to automotive electronics, medical devices, industrial applications, and even small devices like wearables and headphones. Wearable devices and headphones, with their smaller size, offer even more limited space for optical sensors. Currently, when optical sensors have both a transmitter and a receiver and require light shielding, most rely on irregular injection molding for secondary injection molding or using a bracket to achieve light shielding. Both of these methods require space, resulting in a larger sensor size compared to when light shielding is not needed. Therefore, minimizing the package size of optical sensors while still meeting light shielding requirements has become a pressing issue. Utility Model Content

[0003] To address this technical problem, this utility model innovatively provides an optical sensor and electronic device. A black adhesive light-blocking wall is set between the light source and the optical sensing chip, which not only meets the light-blocking requirements but also reduces the package size of the optical sensor. This allows the size of the optical sensor to be minimized within the limits of the manufacturing process, thus broadening its application range.

[0004] To achieve the aforementioned technical objectives, the first aspect of this utility model discloses an optical sensor, comprising a substrate, a light source, an optical sensing chip, and a transparent encapsulation layer.

[0005] The light source and the optical sensing chip are disposed on the substrate and electrically connected to the substrate respectively.

[0006] A black vinyl light-blocking wall is provided between the light source and the optical sensing chip.

[0007] The transparent encapsulation layer is disposed on the substrate, and the transparent encapsulation layer encapsulates the light source, the optical sensing chip, and the side of the black glue light-blocking wall.

[0008] Furthermore, the black glue light-blocking wall is formed by applying black glue through a dispensing process.

[0009] Furthermore, the dimensions of the black vinyl light-blocking wall are not uniform along the length of the substrate, and the maximum dimension of the black vinyl light-blocking wall along the length of the substrate is less than the distance between the light source and the optical sensing chip.

[0010] Furthermore, the black vinyl light-blocking wall includes an upper barrier wall and a lower barrier wall arranged vertically. The upper barrier wall has equal dimensions along the length of the substrate, while the lower barrier wall has unequal dimensions along the length of the substrate. The maximum dimension of the black vinyl light-blocking wall along the length of the substrate is less than the distance between the light-emitting source and the optical sensing chip.

[0011] Furthermore, the bottom dimension of the black vinyl light-blocking wall along the length direction of the substrate is 200-500 μm.

[0012] Furthermore, the top surface of the black vinyl light-blocking wall is higher than the top surface of the light-emitting source and the top surface of the optical sensing chip, and the height difference between the top surface of the black vinyl light-blocking wall and the higher top surface of the light-emitting source and the optical sensing chip is 90-110 μm.

[0013] Furthermore, the light source and the optical sensing chip are electrically connected to the substrate via bonding wires, and all the bonding wires are lower than the top surface of the black glue light-blocking wall. The height difference between the top surface of the black glue light-blocking wall and the highest point of all the bonding wires is 30-50 μm.

[0014] Furthermore, the optical sensor also includes a processing chip, which is disposed on the substrate. The light source and the optical sensing chip are electrically connected to the processing chip, and the transparent encapsulation layer encapsulates the processing chip.

[0015] The light source, the optical sensing chip, and the processing chip are laid flat on the substrate.

[0016] Alternatively, at least one of the light source and the optical sensing chip may be disposed on the processing chip.

[0017] Furthermore, the light source is electrically connected to the processing chip or the substrate via bonding wires, the optical sensing chip is electrically connected to the processing chip or the substrate via bonding wires, the processing chip is electrically connected to the substrate via bonding wires, all the bonding wires are lower than the top surface of the black glue light-blocking wall, and the height difference between the top surface of the black glue light-blocking wall and the highest point of all the bonding wires is 30-50 μm.

[0018] Furthermore, the height of the transparent encapsulation layer is 295–490 μm.

[0019] To achieve the above-mentioned technical objectives, the second aspect of this utility model discloses an electronic device, including the optical sensor described in the first aspect.

[0020] The beneficial effects of this utility model are as follows:

[0021] The optical sensor of this invention has a black glue light-blocking wall set between the light source and the optical sensing chip. While meeting the light-blocking requirements, the packaging size of the optical sensor is reduced, so that the size of the optical sensor can be minimized within the limits of the process, thus making its application range wider. Attached Figure Description

[0022] Figure 1 This is a front view of the optical sensor according to the first embodiment of this utility model.

[0023] Figure 2 This is a front view of the optical sensor according to the second embodiment of this utility model.

[0024] Figure 3 This is a front view of the optical sensor according to the third embodiment of this utility model.

[0025] Figure 4 This is a front view of the optical sensor according to the fourth embodiment of this utility model.

[0026] Figure 5 This is a front view of the optical sensor according to the fifth embodiment of this utility model.

[0027] Figure 6 This is a top view of the optical sensor according to the fifth embodiment of this utility model.

[0028] Figure 7 This is a flowchart illustrating the manufacturing process of the optical sensor according to the fifth embodiment of this utility model.

[0029] Figure 8 This is a front view of the optical sensor according to the sixth embodiment of this utility model.

[0030] Figure 9 This is a flowchart illustrating the manufacturing process of the optical sensor according to the sixth embodiment of this utility model.

[0031] In the picture,

[0032] 1. Substrate; 2. Light source; 3. Optical sensor chip; 4. Black glue light-blocking wall; 41. Upper light-blocking wall; 42. Lower light-blocking wall; 43. Light-blocking wall; 5. Transparent encapsulation layer; 51. Transparent EMC; 52. Groove; 6. Processing chip; 7. Wire bonding; 8. Silver paste or DAF film. Detailed Implementation

[0033] The optical sensor and electronic device provided by this utility model will be explained and described in detail below with reference to the accompanying drawings.

[0034] This embodiment specifically discloses an optical sensor, such as... Figure 1 and 2As shown, the system includes a substrate 1, a light source 2, an optical sensing chip 3, and a transparent encapsulation layer 5. The light source 2 and the optical sensing chip 3 are disposed on the substrate 1 and electrically connected to it. The light source 2 and the optical sensing chip 3 are bonded to the substrate 1 using silver paste or a DAF film 8 (Die Attach Film). A black adhesive light-blocking barrier 4 is provided between the light source 2 and the optical sensing chip 3. In this embodiment, the light source 2 and the optical sensing chip 3 are arranged along the length of the substrate 1. The substrate 11 has circuitry, enabling interconnection with external signals. The light source 2 serves as the emitter, emitting light. The light source 2 can be one or more of the following: an LED chip, an edge-emitting laser (EEL), or a vertical-cavity surface-emitting laser (VCSEL). The specific type of the light source 2 is determined as needed. There can be one or more light sources 2. The optical sensing chip 3 serves as the receiver, receiving optical signals and converting them into electrical signals. The black vinyl light-blocking wall 4 isolates the light source 2 and the optical sensor chip 3, preventing the light from the light source 2 from being directly received by the optical sensor chip 3, thus avoiding interference with the light signal received by the optical sensor chip 3 and improving the performance of the optical sensor.

[0035] A transparent encapsulation layer 5 is disposed on the substrate 1. The transparent encapsulation layer 5 encapsulates the light source 2, the optical sensing chip 3 and the side of the black glue light-blocking wall 4. The top surface of the transparent encapsulation layer 5 is flush with the top surface of the black glue light-blocking wall 4. The transparent encapsulation layer 5 enables light transmission while protecting the light source 2, the optical sensing chip 3 and the black glue light-blocking wall 4.

[0036] Optionally, the transparent encapsulation layer 5 is a transparent EMC (Epoxy Molding Compound).

[0037] Optionally, the height G of the transparent encapsulation layer 5 is 295–490 μm, providing good protection.

[0038] Optionally, the black glue light-blocking wall 4 is formed by dispensing black glue. The dispensing method is simple and does not affect other manufacturing processes of the optical sensor.

[0039] like Figure 1As shown, the dimensions (i.e., the width of the black adhesive light-blocking wall 4) along the length of the substrate 1 are not uniform vertically. The maximum dimension of the black adhesive light-blocking wall 4 along the length of the substrate 1 is less than the distance between the light-emitting source 2 and the optical sensing chip 3. The black adhesive light-blocking wall 4 can contact the light-emitting source 2 or the optical sensing chip 3, but manufacturing tolerances must be allowed during fabrication. Therefore, preferably, a gap is maintained between the black adhesive light-blocking wall 4 and the light-emitting source 2, and between the black adhesive light-blocking wall 4 and the optical sensing chip 3. The black adhesive light-blocking wall 4 can be formed by stacking one or more layers of black adhesive along the width of the substrate 1, and can be irregularly shaped under the action of gravity.

[0040] like Figure 2 As shown, the black vinyl light-blocking wall 4 includes an upper barrier 41 and a lower barrier 42 arranged vertically. The upper barrier 41 has equal dimensions along the length of the substrate 1, while the lower barrier 42 has unequal dimensions along the length of the substrate 1. The maximum dimension of the black vinyl light-blocking wall 4 along the length of the substrate 1 is less than the distance between the light-emitting source 2 and the optical sensing chip 3. The regular shape of the upper barrier 41 makes the shape and appearance of the black vinyl light-blocking wall 4 highly consistent, especially the top surface of the black vinyl light-blocking wall 4.

[0041] Optionally, the bottom dimension H of the black vinyl light-blocking wall 4 along the length of the substrate 1 is 200-500 μm, which provides sufficient light-blocking capability.

[0042] Optionally, the top surface of the black vinyl light-blocking wall 4 is higher than the top surface of the light-emitting source 2 and the top surface of the optical sensing chip 3. The height difference I between the top surface of the black vinyl light-blocking wall 4 and the higher top surface of the light-emitting source 2 and the optical sensing chip 3 is 90-110μm, which has sufficient light-blocking ability and minimizes interference with the light signal received by the optical sensing chip 3.

[0043] Optionally, the light source 2 and the optical sensing chip 3 are electrically connected to the substrate 1 via bonding wires 7. All bonding wires 7 are lower than the top surface of the black adhesive light-blocking wall 4. The height difference F between the top surface of the black adhesive light-blocking wall 4 and the highest point of all bonding wires 7 is 30-50 μm. In subsequent applications, the black adhesive light-blocking wall 4 can support other structures and thus protect the bonding wires 7. The transparent encapsulation layer 5 encapsulates the bonding wires 7, sealing and protecting them.

[0044] In some embodiments, such as Figure 3-6As shown in Figure 8, the optical sensor also includes a processing chip 6, which is disposed on the substrate 1. The light source 2 and the optical sensing chip 3 are electrically connected to the processing chip 6. The processing chip 6 is bonded to the substrate 1 by silver paste or DAF film 8. The processing chip 6 can process the electrical signals transmitted from the optical sensing chip 3 and transmit the processing results externally. A transparent encapsulation layer 5 encapsulates the processing chip 6, sealing and protecting it. The processing chip 6 includes at least one of an analog front-end chip, a control chip, or a signal processing chip, and the type of processing chip 6 is determined as needed.

[0045] Optional, such as Figure 3 As shown, the light source 2, the optical sensor chip 3, and the processing chip 6 are laid flat on the substrate 1. The light source 2, the optical sensor chip 3, and the processing chip 6 are respectively bonded and fixed to the substrate 1 by silver paste or DAF film 8.

[0046] Optionally, at least one of the light source 2 and the optical sensing chip 3 is disposed on the processing chip 6. For example... Figure 4 As shown, one of the light source 2 and the optical sensing chip 3 is disposed on the processing chip 6, and the other is disposed on the substrate 1. Figure 5 , 6 As shown in Figure 8, both the light source 2 and the optical sensor chip 3 are disposed on the processing chip 6. This minimizes the area of ​​the substrate 1, thereby reducing the size of the optical sensor. When multiple light sources 2 are provided, some of the light sources 2 can be disposed on the processing chip 6, and the remaining light sources 2 can be disposed on the substrate 1. Preferably, all the light sources 2 are disposed on the processing chip 6.

[0047] Optionally, the light source 2 is electrically connected to the processing chip 6 or the substrate 1 via bonding wires 7, the optical sensing chip 3 is electrically connected to the processing chip 6 or the substrate 1 via bonding wires 7, and the processing chip 6 is electrically connected to the substrate 1 via bonding wires 7. All bonding wires 7 are lower than the top surface of the black adhesive light-blocking wall 4, and the top surface of the black adhesive light-blocking wall 4 is higher than the highest point of all bonding wires 7. The height difference F between the two is 30-50 μm. In subsequent applications, the black adhesive light-blocking wall 4 can support other structures and thus protect the bonding wires 7. The light source 2 and the optical sensing chip 3 can be electrically connected to the processing chip 6 via bonding wires 7, and the processing chip 6 is electrically connected to the substrate 1 via bonding wires 7. The light source 2, the optical sensing chip 3, and the processing chip 6 can all be electrically connected to the substrate 1 via bonding wires 7. The light source 2 and the optical sensing chip 3 are electrically connected to the processing chip 6 through the circuit of the substrate 1. The specific form of electrical connection is not specifically limited in this application.

[0048] Figure 5The total thickness A of the optical sensor in the illustrated embodiment is 395–890 μm; the thickness B of the substrate 1 is 100–400 μm; preferably, the substrate 1 consists of two layers; the height G of the transparent encapsulation layer 5 is 295–490 μm; the thickness C of the processing chip 6 is 75–150 μm; the thickness of the silver paste is 10 μm; the thickness of the DAF film is 20 μm; the thickness D of the light source 2 is 100–200 μm; the thickness D of the optical sensing chip 3 is 100–200 μm; the maximum arc height E of the bonding wire 7 is 60 μm; the top surface of the black glue light-blocking wall 4 is higher than the highest point of all bonding wires 7, and the height difference F between the two is 30–50 μm; the bottom dimension H of the black glue light-blocking wall 4 along the length direction of the substrate 1 is 200–500 μm; the width of the black glue light-blocking wall 4 can be controlled by selecting the appropriate dispensing head according to design requirements.

[0049] like Figure 6 As shown, the length of substrate 1 (the dimension in the X direction in the figure) is as follows: the edge of substrate 1 in the non-bonding direction (the left edge in the figure) extends outward by 50-100 μm from the edge of processing chip 6 in the non-bonding direction; the edge of substrate 1 in the bonding direction (the right edge in the figure) extends outward by 400-500 μm from the edge of processing chip 6 in the bonding direction; the width of substrate 1 (the dimension in the Y direction in the figure) is as follows: it extends outward by 50-100 μm from the edge of processing chip 6 on one side, that is, the width of substrate 1 = the width of processing chip 6 + 100-200 μm, and the length and width of substrate 1 can be less than 2mm*2mm.

[0050] like Figure 5 and 6 As shown, the dimensions of the black vinyl light-blocking wall 4 are uneven along the length of the substrate 1. The fabrication process of this optical sensor is as follows: Figure 7 As shown:

[0051] S1. A processing chip 6 is bonded to the substrate 1 using silver paste or DAF film 8. Then, a light source 2 and an optical sensor chip 3 are bonded and fixed to the processing chip 6 using silver paste or DAF film 8 respectively. Electrical connections between the light source 2, the optical sensor chip 3, the processing chip 6, and the substrate 1 are achieved using bonding wires 7. Figure 7 The structure shown in 'a';

[0052] S2. Apply black adhesive directly between the light source 2 and the optical sensor chip 3 to form a black adhesive light-blocking wall 4, resulting in... Figure 7 The structure shown in b;

[0053] S3. Using a transparent EMC51 injection molding process, the light source 2, optical sensor chip 3, processing chip 6, bonding wire 7, and black adhesive light-blocking wall 4 are sealed and protected on substrate 1. Figure 7 The structure shown in c;

[0054] S4. Using a strip-grinding process, grind down the transparent EMC51 to a certain height until the black adhesive of the black adhesive light-blocking wall 4 is completely exposed on the surface of the transparent EMC51, resulting in... Figure 7 The structure shown by d in the figure is... Figure 5 and Figure 6 The optical sensor shown.

[0055] Figure 5 and Figure 6 The black vinyl light-blocking wall 4 shown has a somewhat irregular shape. By polishing, the top surface of the black vinyl light-blocking wall 4 can be made uniform.

[0056] like Figure 8 As shown, the black vinyl light-blocking wall 4 includes an upper blocking wall 41 and a lower blocking wall 42 arranged vertically. The upper blocking wall 41 has equal dimensions along the length of the substrate 1, while the lower blocking wall 42 has unequal dimensions along the length of the substrate 1. The fabrication process of this optical sensor is as follows: Figure 9 As shown:

[0057] S1. A processing chip 6 is bonded to the substrate 1 using silver paste or DAF film 8. Then, a light source 2 and an optical sensor chip 3 are bonded and fixed to the processing chip 6 using silver paste or DAF film 8 respectively. Electrical connections between the light source 2, the optical sensor chip 3, the processing chip 6, and the substrate 1 are achieved using bonding wires 7. Figure 8 The structure shown in 'a';

[0058] S2. A barrier 43 is formed by directly applying black adhesive between the light source 2 and the optical sensor chip 3. The top surface of the barrier 43 does not need to be higher than the top surfaces of the light source 2 and the optical sensor chip 3. Figure 8 The structure shown in b;

[0059] S3. Using a transparent EMC51, injection molding is performed on substrate 1 to seal and protect the light source 2, optical sensor chip 3, processing chip 6, bonding wire 7, and barrier 43, resulting in... Figure 8 The structure shown in c;

[0060] S4. Using a strip-grinding process, the transparent EMC51 is ground down to a certain height until the required height for the optical sensor product is reached, resulting in... Figure 8 The structure shown in d is such that the top surface of the transparent EMC51 is higher than the top surface of the retaining wall 43.

[0061] S5. Make a half-cut groove 52 in the transparent EMC 51 above the retaining wall 43, cutting to the position of the retaining wall 43. Part of the arc-shaped top of the retaining wall 43 can be cut off, so that the vertical difference in the dimension of the retaining wall 43 along the length of the substrate 1 is not large, forming the lower retaining wall 42, thus obtaining... Figure 8 The structure shown by 'e' in the diagram;

[0062] S6. Fill the groove 52 with black glue using a dispensing process to form the upper barrier wall 41, ultimately forming a complete black glue light-blocking wall 4. Figure 8 The structure shown in f is as follows.

[0063] Figure 8 The black vinyl light-blocking wall shown in Figure 4 has a high degree of consistency in shape and appearance, especially the top surface, resulting in a better light-blocking effect.

[0064] The optical sensor described in this application can be used in all products involving optical sensing chip 3, such as under-display proximity sensors, ambient light sensors, color temperature sensors, imaging sensors, etc. It has a small package size and a wide range of applications.

[0065] This application also discloses an electronic device including the optical sensor described in the above embodiments. The electronic device may be a laptop computer, mobile phone, tablet computer, projector, desktop computer, gaming device, in-vehicle electronic device, wearable smart device, etc.

[0066] The optical sensor of this application has a small package size, which can be made to the smallest size under the limit of process allowance, and has a wide range of applications and small space requirements for electronic devices; the small-sized optical sensor can also meet the light shielding requirements. Figure 8 The optical sensor shown has better surface appearance consistency, and the overall design of electronic devices can eliminate or reduce foam, reduce module size and lower costs.

[0067] In the description of this utility model, it should be understood that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc., indicating the orientation or positional relationship are based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this utility model and simplifying the description, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model.

[0068] In this utility model, unless otherwise explicitly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise explicitly limited. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0069] In the description of this specification, the references to terms such as "this embodiment," "an embodiment," "some embodiments," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the present invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in a suitable manner in any at least one embodiment or example. Moreover, without contradiction, those skilled in the art can combine and integrate the different embodiments or examples described in this specification, as well as the features of different embodiments or examples.

[0070] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this utility model, "a plurality of" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0071] The above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Any modifications, equivalent substitutions and simple improvements made on the substantive content of the present utility model should be included within the protection scope of the present utility model.

Claims

1. An optical sensor, characterized in that, It includes a substrate (1), a light source (2), an optical sensing chip (3), and a transparent encapsulation layer (5). The light source (2) and the optical sensing chip (3) are disposed on the substrate (1) and electrically connected to the substrate (1) respectively. A black vinyl light-blocking wall (4) is provided between the light source (2) and the optical sensing chip (3). The transparent encapsulation layer (5) is disposed on the substrate (1), and the transparent encapsulation layer (5) encapsulates the light source (2), the optical sensing chip (3) and the side of the black glue light-blocking wall (4).

2. The optical sensor according to claim 1, characterized in that, The black glue light-blocking wall (4) is formed by applying black glue through a dispensing method.

3. The optical sensor according to claim 1, characterized in that, The dimensions of the black glue light-blocking wall (4) along the length of the substrate (1) are not uniform vertically. The maximum dimension of the black glue light-blocking wall (4) along the length of the substrate (1) is smaller than the distance between the light-emitting light source (2) and the optical sensing chip (3).

4. The optical sensor according to claim 1, characterized in that, The black glue light-blocking wall (4) includes an upper barrier wall (41) and a lower barrier wall (42) arranged vertically. The upper barrier wall (41) has equal dimensions along the length of the substrate (1), while the lower barrier wall (42) has unequal dimensions along the length of the substrate (1). The maximum dimension of the black glue light-blocking wall (4) along the length of the substrate (1) is smaller than the distance between the light-emitting light source (2) and the optical sensing chip (3).

5. The optical sensor according to any one of claims 1-4, characterized in that, The bottom dimension of the black vinyl light-blocking wall (4) along the length direction of the substrate (1) is 200-500 μm.

6. The optical sensor according to any one of claims 1-4, characterized in that, The top surface of the black vinyl light-blocking wall (4) is higher than the top surface of the light-emitting light source (2) and the top surface of the optical sensing chip (3). The height difference between the top surface of the black vinyl light-blocking wall (4) and the higher top surface of the light-emitting light source (2) and the optical sensing chip (3) is 90-110 μm.

7. The optical sensor according to claim 1, characterized in that, The light source (2) and the optical sensing chip (3) are electrically connected to the substrate (1) via bonding wires (7). All the bonding wires (7) are lower than the top surface of the black glue light-blocking wall (4). The height difference between the top surface of the black glue light-blocking wall (4) and the highest point of all the bonding wires (7) is 30-50 μm.

8. The optical sensor according to claim 1, characterized in that, The optical sensor also includes a processing chip (6), which is disposed on the substrate (1). The light source (2) and the optical sensing chip (3) are electrically connected to the processing chip (6) respectively. The transparent encapsulation layer (5) encapsulates the processing chip (6). The light source (2), the optical sensing chip (3), and the processing chip (6) are laid flat on the substrate (1). Alternatively, at least one of the light source (2) and the optical sensing chip (3) may be disposed on the processing chip (6).

9. The optical sensor according to claim 8, characterized in that, The light source (2) is electrically connected to the processing chip (6) or the substrate (1) via bonding wires (7). The optical sensing chip (3) is electrically connected to the processing chip (6) or the substrate (1) via bonding wires (7). The processing chip (6) is electrically connected to the substrate (1) via bonding wires (7). All the bonding wires (7) are lower than the top surface of the black glue light-blocking wall (4). The height difference between the top surface of the black glue light-blocking wall (4) and the highest point of all the bonding wires (7) is 30-50 μm.

10. The optical sensor according to claim 1, characterized in that, The height of the transparent encapsulation layer (5) is 295–490 μm.

11. An electronic device, characterized in that, Includes the optical sensor described in any one of claims 1-10.

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