White LED light source with wide color gamut display and backlight light source
By vertically stacking blue-green light-emitting chips and designing a red light conversion layer, the color difference problem of LED light sources is solved, and efficient generation and stable output of wide color gamut white light are achieved.
Patent Information
- Application Number
- CN202423268266.2
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-29
- Publication Date
- 2026-02-24
- Estimated Expiration
- 2034-12-29
AI Technical Summary
Existing LED light sources are prone to color differences during the manufacturing process, especially blue-green differences, which limits the color gamut.
By employing a vertically stacked structure of blue-green light-emitting chips, combined with a red light conversion layer and an encapsulation layer, a wide color gamut white light is formed through the precise mixing of blue, green, and red light.
It significantly improves color gamut coverage and color performance, reduces the requirements for manufacturing process precision, reduces color deviation, and enhances the stability and consistency of the light source.
Smart Images
Figure CN223943118U_ABST
Abstract
Description
Technical Field
[0001] This application relates to the field of LED technology, and more specifically, to a white LED light source and backlight source with wide color gamut display. Background Technology
[0002] With the rapid development of semiconductor lighting technology, LEDs, as a new generation of high-efficiency and energy-saving light sources, have been widely applied in various fields such as daily lighting, display technology, and automotive lighting. In recent years, the performance improvement and cost reduction of LEDs have greatly promoted their market penetration. Due to their long lifespan and strong color performance, LED light sources are widely used in backlighting.
[0003] In existing LED light sources, most use a combination of blue LED chips and yellow phosphors to produce white LEDs by mixing blue and yellow light. However, this combination results in white light with limited energy distribution in the red and green wavelengths, restricting the color gamut. Therefore, a new method uses a combination of blue and green LED chips with red phosphors to create white LEDs. The green and red phosphors enhance the missing spectral components, improving the color gamut performance of the white backlight on displays. However, the packaging of blue and green LED chips requires high precision in the backlight manufacturing process, which can easily lead to blue-green color differences.
[0004] Therefore, existing technologies still need improvement and development. Utility Model Content
[0005] The purpose of this application is to propose a white LED light source with wide color gamut display to solve the technical problem of color difference that LED light sources in the prior art are prone to.
[0006] To achieve the above objectives, the technical solution adopted in this application is: to provide a white LED light source with wide color gamut display, comprising:
[0007] A substrate, on which a light-emitting circuit is provided;
[0008] The blue-green light-emitting chip includes a blue light-emitting component and a green light-emitting component, which are vertically stacked. The blue-green light-emitting chip is electrically connected to a light-emitting circuit.
[0009] The red light conversion layer covers at least the front side of the blue-green light-emitting chip. The red light conversion layer is used to convert and mix the light emitted by the blue-green light-emitting chip to emit white light.
[0010] The encapsulation layer is used to encapsulate and cover the red light conversion layer and the blue-green light-emitting chip on the substrate.
[0011] In some embodiments, the substrate includes a blue light-emitting circuit and a green light-emitting circuit, the blue light-emitting circuit and the green light-emitting circuit are isolated from each other, the blue light-emitting circuit is electrically connected to the blue light-emitting component, and the green light-emitting component is electrically connected to the green light-emitting circuit;
[0012] The encapsulation layer is used to encapsulate and cover the red light conversion layer and the blue-green light-emitting chip on the substrate.
[0013] In some embodiments, the substrate includes a blue light-emitting circuit and a green light-emitting circuit, the blue light-emitting circuit and the green light-emitting circuit are isolated from each other, the blue light-emitting circuit is electrically connected to the blue light-emitting component, and the green light-emitting component is electrically connected to the green light-emitting circuit.
[0014] Furthermore, the blue light-emitting component includes a blue light-emitting chip, and the green light-emitting component includes a green light-emitting structural layer grown on top of the blue light-emitting component.
[0015] Furthermore, the blue-green light-emitting chip also includes an isolation layer, which is disposed between the blue light-emitting chip and the green light-emitting structural layer.
[0016] In some embodiments, the blue light emitting component includes a blue light emitting chip, and the green light emitting component includes a green light emitting chip stacked on top of the blue light emitting component.
[0017] Furthermore, the flatness range between the blue and green light-emitting chips is 0.1 μm to 0.5 μm.
[0018] In some embodiments, a heat sink is provided at the bottom of the substrate and is attached to the substrate; an insulating layer and a circuit layer are sequentially provided at the top of the substrate, and the circuit layer includes a light-emitting circuit.
[0019] In some embodiments, the red light conversion layer contains red phosphor particles, including KSF phosphor particles.
[0020] In some embodiments, the encapsulation layer includes a diffusion layer and a reflective layer, with the diffusion layer located between the red light conversion layer and the reflective layer. The diffusion layer contains diffusion particles, and the reflective layer contains reflective particles.
[0021] Secondly, this utility model provides a backlight source, including the white LED light source with wide color gamut display in the above embodiments.
[0022] The beneficial effects of the white LED light source with wide color gamut display provided in this application are at least as follows: The blue-green light-emitting chip includes a blue light-emitting component and a green light-emitting component, which are vertically stacked. This stacking ensures that the blue and green light are fully mixed, avoiding uneven mixing and thus reducing the stringent requirements for manufacturing precision. When light is emitted from the blue-green light-emitting chip, a mixture of blue and green light is first obtained. This mixed light then passes through a red light conversion layer, converting a portion of the mixed light into red light, resulting in a composite white light beam containing blue, green, and red light. Finally, the white light is emitted through the encapsulation layer. By precisely mixing blue, green, and red light, the peak widths of the blue, green, and red light exhibit a more concentrated and pure wavelength range because the blue and green light are directly generated by the blue and green light-emitting components. This means that the blue and green light have a wider peak width and a higher purity level. The fine fusion of these high-purity blue, green, and red lights together produces white light suitable for wide color gamut displays, significantly improving the color gamut coverage and color performance of the light source, thus enabling the display of a wider range of colors. Attached Figure Description
[0023] To more clearly illustrate the technical solutions in the embodiments of this application, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.
[0024] Figure 1 One of the structural diagrams of a high color gamut LED light source provided in the embodiments of this application;
[0025] Figure 2 A second structural diagram of a high color gamut LED light source provided in an embodiment of this application;
[0026] Figure 3 A third structural diagram of a high color gamut LED light source provided in the embodiments of this application;
[0027] Figure 4 The fourth structural diagram is of a high color gamut LED light source provided in the embodiments of this application.
[0028] The following are the labeling elements in the figure:
[0029] 101. Substrate;
[0030] 102. Blue light-emitting components;
[0031] 103. Green light-emitting component;
[0032] 104. Red light conversion layer;
[0033] 105. Isolation layer;
[0034] 106. Diffusion layer;
[0035] 107. Reflective layer. Detailed Implementation
[0036] To make the technical problems, technical solutions, and beneficial effects to be solved by this application clearer, the following detailed description is provided in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and are not intended to limit the scope of this application.
[0037] It should be noted that when a component is referred to as "fixed to" or "set on" another component, it may be directly or indirectly located on that other component. When a component is referred to as "connected to" another component, it may be directly or indirectly connected to that other component. The terms "upper," "lower," "left," "right," "front," "rear," "vertical," "horizontal," "top," "bottom," "inner," and "outer," etc., indicate orientations or positions based on the accompanying drawings, and are for ease of description only, and should not be construed as limiting the technical solution. The terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features. "A plurality" means two or more, unless otherwise explicitly defined.
[0038] The following description, in conjunction with the accompanying drawings, describes a white LED light source with a wide color gamut display according to an embodiment of this application.
[0039] Please see Figure 1 , Figure 1 This diagram illustrates the structure of the white LED light source with wide color gamut display according to this application.
[0040] A white LED light source with wide color gamut display includes a substrate 101, a blue-green light-emitting chip, and a red light conversion layer 104. A light-emitting circuit is disposed on the substrate 101. The blue-green light-emitting chip includes a blue light-emitting component 102 and a green light-emitting component 103, which are vertically stacked and electrically connected to the light-emitting circuit. The red light conversion layer 104 covers at least the front surface of the blue-green light-emitting chip and is used to convert and mix the light emitted by the blue-green light-emitting chip to emit white light. An encapsulation layer is used to encapsulate and cover the red light conversion layer 104 and the blue-green light-emitting chip on the substrate.
[0041] Specifically, the substrate 101 is a component that supports and connects the light-emitting chip, fixing the light-emitting chip onto the substrate 101, determining the installation position of the light-emitting chip, and improving the light-emitting effect of the light-emitting chip. When the light-emitting circuit provided on the substrate 101 is a printed circuit, the printed circuit is connected to the light-emitting chip on the substrate 101 to form an electrical circuit to provide power to the light-emitting chip.
[0042] The blue-green light-emitting chip refers to a structure in which a blue light-emitting component 102 and a green light-emitting component 103 are vertically stacked. During operation, the blue light-emitting component 102 emits blue light first, followed by the green light-emitting component 103 emitting green light. The blue and green light superimpose in space to form a mixed blue-green light. Since the wavelength of blue light is shorter, between 450-495 nanometers, and the wavelength of green light is between 495-570 nanometers, by placing the blue light-emitting component 102 below the green light-emitting component, blue light can directly illuminate the green light-emitting component 103 and the red light conversion layer 104 above it, thereby promoting spectral complementarity and achieving a wider spectral coverage, which in turn helps improve the lighting quality and color performance of white LEDs.
[0043] The red light conversion layer 104 is a functional structural layer that converts input blue light into red light, thus facilitating the packaging of LED light sources. The red light conversion layer 104 can be a transparent adhesive layer containing red phosphor particles. The chip can be packaged directly using a transparent adhesive layer containing red phosphor particles, simplifying the production process and protecting the chip from the influence of the external environment.
[0044] In addition, such as Figure 2 As shown, the red light conversion layer 104 can be a transparent dielectric layer containing red phosphor, which covers the front of the blue-green light-emitting chip, so that the blue-green light-emitting chip and the red light conversion layer 104 have the same structure after completion.
[0045] When blue light shines on the red light conversion layer 104, some of the blue light is absorbed by the red phosphor particles and converted into red light. Subsequently, the converted red light mixes with the original blue and green light in space to form white light with a wide spectral distribution.
[0046] The encapsulation layer protects the internal components from external environmental influences such as moisture and dust. It can be a transparent adhesive layer, specifically applied by dispensing or coating, to encapsulate the aforementioned blue-green light-emitting chips and red light conversion layer. This can be achieved through Chip Scale Package (CSP) packaging, where the packaged chip size is close to the bare chip size, reducing the overall chip volume. In existing technologies, the blue and green light-emitting chips are arranged horizontally, requiring a large space to achieve a uniform white light effect when the blue and green light are mixed, causing localized color shifts. According to the technical solution proposed in this application, by adopting a vertical stacking design of blue and green light-emitting chips, the blue light-emitting component 102 and the green light-emitting component 103 are placed vertically, so that the light emitted by the blue light-emitting component 102 and the green light-emitting component 103 propagates on the same path. This significantly reduces the time difference between different colors of light reaching the target point, effectively reducing color shift caused by differences in optical path. The vertical stacking structure also allows blue and green light to mix rapidly in a more compact space, improving mixing efficiency and enabling more uniform and natural white light output even in a limited space. In addition, the vertical stacking design eliminates the need for precise control of the distance between the blue and green light-emitting chips, which not only simplifies the complexity of the optical system but also lowers the difficulty threshold of the manufacturing process, significantly improving the uniformity and color consistency of the light.
[0047] Furthermore, the substrate 101 also includes a metal printed circuit board. The substrate 101 uses metal as a substrate, which further increases the structural strength of the substrate 101. Additionally, the high thermal conductivity of the metal reduces the operating temperature of the blue-green light-emitting chip, preventing light deflection caused by excessively high temperatures during operation.
[0048] During LED operation, the chip continuously generates heat. If the heat cannot be dissipated in time, the temperature will continue to rise, which will not only accelerate the aging of materials, but also cause color chromatographic shift, seriously affecting the color quality and stability of the light source. In this embodiment, a metal printed circuit board is used as the substrate 101. By utilizing the high thermal conductivity of metal materials, the heat emitted by the light-emitting chip can be dissipated in time, reducing the operating temperature of the light-emitting chip and thus maintaining the stability of the emitted color.
[0049] In some embodiments, the substrate 101 includes a blue light-emitting circuit and a green light-emitting circuit, the blue light-emitting circuit and the green light-emitting circuit are isolated from each other, the blue light-emitting circuit is electrically connected to the blue light-emitting component 102, and the green light-emitting component 103 is electrically connected to the green light-emitting circuit.
[0050] Specifically, the blue light-emitting circuit refers to the circuit system connected to the blue light-emitting component 102, and the green light-emitting circuit refers to the circuit system connected to the green light-emitting component 103. The blue and green light-emitting circuits are independent of each other and do not interfere with each other. This is achieved by adding an isolation layer 107 between the blue and green light-emitting circuits. The isolation layer 107 uses physical isolation and insulating material to prevent electrical leakage between the blue and green light-emitting circuits, ensuring the normal operation of both the blue and green light-emitting components 102 and 103. Furthermore, the separate control of the blue and green light-emitting components 102 and 103 by the blue and green light-emitting circuits allows for more precise and flexible control of parameters such as brightness and color temperature of the blue and green light, contributing to higher quality color mixing and dynamic lighting effects. Through two independent light-emitting systems and separate control of the blue and green light-emitting components 102 and 103, the performance of the blue and green light-emitting components 102 and 103 can be optimized, avoiding problems such as unstable light color and power reduction caused by circuit interference.
[0051] According to the technical solution provided in this application, by isolating the blue and green light-emitting circuits and individually controlling the blue light-emitting component 102 and the green light-emitting component 103, the blue and green light can be individually controlled after LED packaging is completed, thereby optimizing the white light emission effect of the LED light source and reducing the color difference of the LED light source. Furthermore, the individual control of blue and green light also allows packaging errors generated during the packaging process to be compensated through circuit adjustments, reducing excessive reliance on packaging precision and improving product consistency.
[0052] Furthermore, the blue light emitting component 102 includes a blue light emitting chip, and the green light emitting component 103 includes a green light emitting structural layer grown on top of the blue light emitting component.
[0053] The green light-emitting structure layer can be directly grown using a blue light-emitting chip as a substrate. By controlling the band gap width of the green light-emitting structure layer, which specifically includes an N-type semiconductor layer, a P-type semiconductor layer, and an active layer, when current passes through the green light-emitting structure layer, electrons move from the N-type semiconductor layer to the active layer, and holes move from the P-type semiconductor layer to the active layer. In the active layer, electrons and holes combine in the quantum well and release energy to generate photons, emitting light. Since the active layer is mainly composed of indium gallium nitride, by controlling the indium content in indium gallium nitride, the band gap width of the quantum well can be adjusted, thereby controlling the emission wavelength and realizing the generation of green light.
[0054] According to the technical solution provided in the embodiments of this application, a blue-green light-emitting chip obtained by directly using blue light-emitting material and a new green light-emitting structure layer is used to encapsulate the light source. Since the blue-green light-emitting chip directly emits blue-green mixed light, there is no need to set up an additional light-emitting chip, which reduces the difficulty of chip encapsulation process. In addition, growing a green light-emitting structure layer directly on the blue light-emitting chip can ensure the spatiotemporal consistency of blue-green light and avoid the blue-green difference caused by positional offset or optical path difference during the encapsulation process.
[0055] The current generated by the blue light-emitting circuit passes through the blue light-emitting chip to produce blue light, and the current generated by the green light-emitting circuit passes through the green light-emitting structure layer to produce green light. The blue and green light initially mix in the green light-emitting structure layer to form a blue-green mixture. Subsequently, the material in the red light conversion layer 104 absorbs the blue light, exciting the electrons inside to jump to a higher energy level. When the electrons return to a lower energy level, they release energy and produce red light. The blue, green, and red light mix in the red light conversion layer to form a white light source with a wide color gamut.
[0056] Furthermore, such as Figure 3 As shown, the blue-green light-emitting chip also includes an isolation layer 107, which is disposed between the blue light-emitting chip and the green light-emitting structure layer.
[0057] Specifically, the isolation layer 107 is a transparent structural layer that physically isolates the green light-emitting structural layer and the blue light-emitting chip. When the green light-emitting structural layer is a transparent substrate, the blue light-emitting chip and the green light-emitting structural layer are electrically isolated through the isolation layer 107, effectively preventing current from flowing from the blue light-emitting chip to the green light-emitting structural layer. This ensures that the current only flows in their respective light-emitting areas, avoiding unnecessary energy loss and a decrease in luminous efficiency. The isolation layer 107 helps reduce mutual interference between blue and green light, ensuring the purity of their respective luminous characteristics, which is conducive to achieving more precise color control and higher quality light output.
[0058] In addition, in some embodiments, the blue light-emitting component includes a blue light-emitting chip, and the green light-emitting component 103 includes a green light-emitting chip stacked on top of the blue light-emitting component.
[0059] Specifically, a green light-emitting chip is a transparent substrate light-emitting chip, meaning it uses a transparent material as its supporting substrate. This transparent substrate material includes, but is not limited to, sapphire, quartz, and glass. By using a transparent substrate, the blue light emitted by the blue light-emitting chip can mix with the green light emitted by the green light-emitting chip, resulting in mixed blue-green light. The transparent substrate green light-emitting chip can be used with the blue light-emitting chip without additional processing steps, simplifying the production process and reducing the production cost of the light-emitting chip.
[0060] According to the technical solution provided in the embodiments of this application, the blue light-emitting circuit controls the blue light-emitting chip to emit blue light; the green light-emitting circuit controls the green light-emitting chip to emit green light. The blue light and green light are initially mixed by the green light-emitting chip to obtain blue-green mixed light. Subsequently, the blue-green mixed light enters the red light conversion layer 104, where some of the blue light is converted into red light. Finally, the mixed light contains three color spectra: blue, green, and red, which together constitute white light. By stacking the green light-emitting chip and the blue light-emitting chip, it is not necessary to strictly control the relative positions of the blue light-emitting chip and the green light-emitting chip. While increasing the spectral range of white light by using blue light, green light, and red light, the requirements for the packaging precision of the light source are reduced, further reducing the packaging cost and improving the product qualification rate.
[0061] Furthermore, the flatness range between the blue and green light-emitting chips is 0.1 μm to 0.5 μm.
[0062] Specifically, flatness directly affects the propagation path and efficiency of light. When light propagates from one medium to another, if the angle of incidence exceeds the critical angle, total internal reflection will occur, causing the light to be trapped in the original medium and unable to enter the new medium. Therefore, in the case of stacked blue and green light-emitting chips, by maintaining a flatness range of 0.1μm to 0.5μm between the blue and green chips, total internal reflection between them is reduced. This ensures that the light path from the blue chip to the green chip is direct and unobstructed, reducing unnecessary scattering and reflection, thereby improving the light propagation efficiency.
[0063] According to the technical solution provided in the embodiments of this application, the flatness between the blue light-emitting chip and the green light-emitting chip on the transparent substrate is in the range of 0.1μm to 0.5μm. Due to the high flatness between the blue light-emitting chip and the green light-emitting chip on the transparent substrate, the light loss of blue light emitted by the blue light-emitting chip when entering the green light-emitting chip on the transparent substrate is reduced. In addition, the high flatness helps to optimize the spatial distribution of blue and green light, ensuring that the blue and green light are fully mixed before entering the red light conversion layer 104, improving the degree of spectral overlap, reducing the blue-green difference, and thus improving the overall color quality of the light source.
[0064] In addition, the refractive index difference between the blue light-emitting chip and the green light-emitting chip on the transparent substrate ranges from 0 to 1.5.
[0065] When light travels from one medium to another, it refracts according to Snell's law. The angle of refraction depends on the refractive index ratio of the two media. When the refractive index difference is large and the angle of incidence approaches the critical angle, total internal reflection occurs at the interface, causing light to be reflected back to the original medium and reducing light extraction efficiency. To improve light extraction efficiency, reflection and scattering between the blue LED and the green LED on the transparent substrate should be minimized, allowing more light to escape into the green LED. Therefore, the refractive index difference between the blue LED and the green LED on the transparent substrate should be in the range of 0-1.5. This reduces light loss between the two media, thereby increasing the mixing of blue light in the green LED and reducing the loss of blue-green light.
[0066] In some embodiments, a heat sink is provided at the lower part of the substrate 101, and the heat sink is attached to the substrate 101; an insulating layer and a circuit layer are sequentially provided at the upper part, and the circuit layer includes a light-emitting circuit.
[0067] Specifically, the heat sink refers to the thermally conductive layer disposed below the substrate 101. When the blue-green light-emitting chip generates heat during operation, this heat is conducted to the heat sink through the substrate 101. Based on the excellent thermal conductivity of the heat sink, the heat generated by the blue-green light-emitting chip can be quickly transferred. Subsequently, the heat on the heat sink diffuses to the surrounding air through its large surface area via convection and radiation, thereby effectively controlling the temperature of the blue-green light-emitting chip, maintaining the blue-green light-emitting chip at a constant temperature, and ensuring the consistency of the emitted color and brightness.
[0068] According to the technical solution provided in this application, by adding a heat sink under the substrate 101, the heat sink is separated from the circuit layer by an insulating layer to achieve electrical isolation and prevent short circuits between the circuit layer and the heat sink. The light-emitting circuit of the circuit layer provides power to the blue-green light-emitting chip. The heat sink dissipates the heat generated by the blue-green light-emitting chip in a timely manner, keeping the temperature of the blue-green light-emitting chip constant and ensuring that the light emission color of the blue-green light-emitting chip is consistent. This avoids inconsistent light emission color caused by temperature fluctuations, thereby improving the overall color quality.
[0069] In addition, the heat sink structure includes fin-type heat dissipation; specifically, it includes a parallel fin structure with fins extending vertically or obliquely from the heat sink body, which increases the surface area of the heat sink, promotes convection heat transfer, improves heat dissipation efficiency, and thus improves the working stability of the blue-green light-emitting chip and reduces the generation of color difference.
[0070] In some embodiments, the red light conversion layer 104 contains red phosphor particles, including KSF phosphor particles.
[0071] Specifically, phosphor particles refer to inorganic powder particles that can absorb light of a specific wavelength and convert it into light of a longer wavelength. KSF phosphor particles are a special type of phosphor particle based on scandate and fluoride. KSF phosphor particles can absorb the blue light emitted by the blue-green light-emitting chip and convert it into narrow-band red light, a process that achieves extremely high color purity. The blue-green light-emitting chip simultaneously outputs narrow-band blue and green light, which are mixed with the narrow-band red light generated by the excitation of KSF phosphor particles in the red light conversion layer 104, ultimately resulting in high-quality white light with high color fidelity and good color rendering. By using white light with high color fidelity and good color rendering as the backlight source, richer color levels and wider color gamut coverage can be achieved, thereby improving the color performance and visual experience of display devices.
[0072] In some embodiments, such as Figure 4 The white LED light source shown has an encapsulation layer including a diffusion layer and a reflective layer. The diffusion layer is located between the red light conversion layer and the reflective layer. The diffusion layer contains diffusion particles, and the reflective layer contains reflective particles.
[0073] Specifically, the scattering particles are high-refractive-index material particles, such as silicon dioxide, titanium dioxide, or other types of inorganic or organic particles. When light passes through the diffusion layer containing the scattering particles, these particles randomly scatter the light, resulting in a more uniform distribution of light in all directions, which in turn increases the surrounding emitted light and increases the light diffusion angle of the LED light source.
[0074] The reflective particles are placed at the center of the reflective layer, reflecting part of the generated white light back to the diffusion layer, reducing the central light intensity. By increasing the number of light reflections, some of the light that might have been emitted directly forward is redirected to the side, thus increasing the amount of light emitted from the side and further expanding the diffusion angle of the light.
[0075] The above are merely preferred embodiments of this application and are not intended to limit this application. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of this application should be included within the protection scope of this application.
Claims
1. A white LED light source with wide color gamut display, characterized in that, include: A substrate, wherein a light-emitting circuit is provided on the substrate; A blue-green light-emitting chip, comprising a blue light-emitting component and a green light-emitting component, wherein the blue light-emitting component and the green light-emitting component are vertically stacked, and the blue-green light-emitting chip is electrically connected to the light-emitting circuit; A red light conversion layer is provided, which at least covers the front surface of the blue-green light-emitting chip. The red light conversion layer is used to convert and mix the light emitted by the blue-green light-emitting chip to emit white light. An encapsulation layer is used to encapsulate and cover the red light conversion layer and the blue-green light-emitting chip on the substrate.
2. The white LED light source with wide color gamut display according to claim 1, characterized in that, The substrate includes a blue light-emitting circuit and a green light-emitting circuit. The blue light-emitting circuit and the green light-emitting circuit are isolated from each other. The blue light-emitting circuit is electrically connected to the blue light-emitting component, and the green light-emitting component is electrically connected to the green light-emitting circuit.
3. The white LED light source with wide color gamut display according to claim 2, characterized in that, The blue light-emitting component includes a blue light-emitting chip, and the green light-emitting component includes a green light-emitting structural layer grown on top of the blue light-emitting component.
4. The white LED light source with wide color gamut display according to claim 3, characterized in that, The blue-green light-emitting chip also includes an isolation layer, which is disposed between the blue light-emitting chip and the green light-emitting structural layer.
5. The white LED light source with wide color gamut display according to claim 2, characterized in that, The blue light-emitting component includes a blue light-emitting chip, and the green light-emitting component includes a green light-emitting chip stacked on top of the blue light-emitting component.
6. The white LED light source with wide color gamut display according to claim 5, characterized in that, The flatness between the blue light-emitting chip and the green light-emitting chip ranges from 0.1 μm to 0.5 μm.
7. The white LED light source with wide color gamut display according to claim 1, characterized in that, The substrate has a heat sink at the bottom, which is attached to the substrate; the substrate has an insulating layer and a circuit layer at the top, and the circuit layer includes a light-emitting circuit.
8. The white LED light source with wide color gamut display according to claim 1, characterized in that, The encapsulation layer includes a diffusion layer and a reflective layer, with the diffusion layer located between the red light conversion layer and the reflective layer.
9. A backlight source, characterized in that, Includes the white LED light source with wide color gamut display as described in any one of claims 1-8.