COB (Chip On Board) packaged LED (Light Emitting Diode) luminous panel

Abstract

The utility model discloses a COB-packaged LED light-emitting panel which is simple in structure and easy to realize, LED light-emitting unit areas can be conveniently enclosed by arranging a unit peripheral wall body part of a first insulating material layer, an independent color mixing space is formed, light color crosstalk between the LED light-emitting unit areas is avoided, and practicability is good. A first protruding part is arranged in the unit peripheral wall body part and used for separating two bonding pads of the same LED chip and supporting the bottom of the LED chip conveniently, the separating and supporting effects are achieved, welding flux on the two bonding pads of the same LED chip is not prone to being short-circuited together due to pressure when the LED chip is welded, practicability is good, and the service life of the LED chip is prolonged. And the welding flux is easy to fill the gap between the bonding pad and the first lug boss and expel air between the bonding pad and the first lug boss, so that the surface-mounting welding effect is improved, and the practicability is good.

Description

Technical Field

[0001] This utility model relates to a COB-packaged LED light-emitting panel. Background Technology

[0002] Mini LED displays commonly employ COB (Chip-on-Board) packaging technology. While existing Mini LED COB packaging technology offers advantages such as high efficiency and suitability for mass production, it still suffers from defects affecting product quality, including color crosstalk, pixel color defects, and "caterpillar" patterns on the display screen. The root cause of these defects lies in the fact that the COB packaging process does not provide each independent pixel (composed of LED RGB chips) with its own independent color mixing space, making it susceptible to interference from surrounding pixels. Furthermore, residual flux and gases remain at the bottom of the LED chip after COB packaging. If the surrounding seal is not tight, the LED chip electrodes are easily corroded and damaged, leading to defective products. Therefore, it is necessary to address these issues. Utility Model Content

[0003] This invention overcomes the shortcomings of the above-mentioned technologies and provides a COB-packaged LED light-emitting panel.

[0004] To achieve the above objectives, the present invention adopts the following technical solution:

[0005] A COB-packaged LED light-emitting panel includes a PCB board 1. The PCB board 1 has a circuit layer 2 and a first insulating material layer 3. The first insulating material layer 3 includes a unit peripheral wall portion 31 for enclosing an LED light-emitting unit area. The circuit layer 2 has a plurality of pads 21 located in the area enclosed by the unit peripheral wall portion 31 for electrically connecting a plurality of LED chips 4. The first insulating material layer 3 also includes a first protrusion 32 located in the area enclosed by the unit peripheral wall portion 31 and connected to the unit peripheral wall portion 31 for separating two pads 21 of the same LED chip 4 and facilitating the bottom support of the LED chip 4 thereon. The top height of the first protrusion 32 is higher than the top height of the pad 21 and lower than the top height of the unit peripheral wall portion 31.

[0006] Preferably, the first insulating material layer 3 further includes a first connecting portion 301 for connecting a plurality of adjacent unit peripheral wall portions 31 together.

[0007] Preferably, the back of the PCB board 1 is provided with a connection hole 11 that communicates with the first connection part 301, and the connection hole 11 is filled with a second connection part 302 that is connected to the first connection part 301.

[0008] Preferably, the connection hole 11 on the back of the PCB board 1 is a countersunk hole.

[0009] Preferably, the first insulating material layer 3 is an insulating plastic layer or an insulating ink layer.

[0010] Preferably, the first insulating material layer 3 is made of black PPA material.

[0011] Preferably, the pads 21 in the outer wall portion 31 of each unit are arranged in a 3*2 horizontal row of 6, with flip-chip LEDs connected between the left and right pads 21 in each row. Compared with the prior art, the beneficial effects of this utility model are:

[0012] 1. The structure of this design is simple and easy to implement. The outer wall of the first insulating material layer facilitates the enclosure of individual LED light-emitting unit areas, forming independent color mixing spaces and avoiding crosstalk between LED light-emitting unit areas, thus improving practicality. The first protrusion in the outer wall of the unit is used to separate the two pads of the same LED chip and facilitates the bottom support of the LED chip. It plays a role in separation and support, making it less likely that the solder on the two pads of the same LED chip will short-circuit together due to pressure when soldering the LED chip, thus improving practicality. Furthermore, the solder easily fills the gap between the pad and the first protrusion, forcing out the air, thereby improving the mounting and soldering effect, thus improving practicality. Attached Figure Description

[0013] Figure 1 This is one of the structural diagrams in this case.

[0014] Figure 2 This is the second structural diagram of this case.

[0015] Figure 3 This is the third structural diagram in this case.

[0016] Figure 4 This is the fourth structural diagram in this case.

[0017] Figure 5 This is the fifth structural diagram in this case. Detailed Implementation

[0018] The following examples provide a more detailed description of the features and other related characteristics of this utility model, to facilitate understanding by those skilled in the art:

[0019] like Figures 1 to 5As shown, a COB-packaged LED light-emitting panel includes a PCB board 1. The PCB board 1 has a circuit layer 2 and a first insulating material layer 3. The first insulating material layer 3 includes a unit peripheral wall portion 31 for enclosing an LED light-emitting unit area. The circuit layer 2 has a plurality of pads 21 located in the area enclosed by the unit peripheral wall portion 31 for electrically connecting a plurality of LED chips 4. The first insulating material layer 3 also includes a first protrusion 32 located in the area enclosed by the unit peripheral wall portion 31 and connected to the unit peripheral wall portion 31 for separating two pads 21 of the same LED chip 4 and facilitating the bottom support of the LED chip 4 thereon. The top height of the first protrusion 32 is higher than the top height of the pad 21 and lower than the top height of the unit peripheral wall portion 31.

[0020] As described above, the structure of this invention is simple and easy to implement. The setting of the unit outer wall portion 31 of the first insulating material layer 3 facilitates the enclosure of individual LED light-emitting unit areas, forming independent color mixing spaces, avoiding crosstalk between LED light-emitting unit areas, and has good practicality. The setting of the first protrusion portion 32 in the unit outer wall portion 31 is used to separate the two pads 21 of the same LED chip 4 and facilitate the bottom support of the LED chip 4 on it. It plays a role in separation and support, so that the solder on the two pads 21 of the same LED chip 4 is not prone to short-circuiting together due to pressure when soldering the LED chip 4, which has good practicality. In addition, the solder can easily fill the gap between the pads 21 and the first protrusion portion 32 and force out the air between them, thereby improving the mounting and soldering effect, which has good practicality.

[0021] As described above, when the encapsulation is completed, encapsulation adhesive is filled in the area surrounded by the outer wall portion 31 of the unit or encapsulation adhesive is covered on the entire surface of the LED light-emitting panel to make the product encapsulation more reliable and stable.

[0022] like Figure 3 As shown, in a specific implementation, the first insulating material layer 3 also includes a first connecting portion 301 for connecting several adjacent unit peripheral wall portions 31 together, which helps to enhance the stability of the connection.

[0023] like Figure 3 , Figure 4 As shown, in a specific implementation, the back of the PCB board 1 is provided with a connection hole 11 that communicates with the first connection part 301. The connection hole 11 is filled with a second connection part 302 that is connected to the first connection part 301, which helps to enhance the connection stability and reduce the detachment of the unit outer wall part 31 and the first connection part 301.

[0024] As described above, in a specific implementation, the connection hole 11 on the back of the PCB board 1 is a countersunk hole.

[0025] As described above, in a specific implementation, the first insulating material layer 3 is an insulating plastic layer, which can be injection molded, and preferably uses black PPA material.

[0026] As described above, in a specific implementation, the pads 21 in the area of ​​the outer wall portion 31 of each unit are arranged in a 3*2 horizontal row of 6, and flip-chip LEDs are connected between the left and right pads 21 of each horizontal row.

[0027] As stated above, this case protects a COB-packaged LED light-emitting panel, and all technical solutions with the same or similar structure as this case should be considered to fall within the protection scope of this case.

Claims

1. A COB-packaged LED light-emitting panel, characterized in that... The PCB board (1) is provided with a circuit layer (2) and a first insulating material layer (3). The first insulating material layer (3) includes a unit outer wall portion (31) for enclosing an LED light-emitting unit area. The circuit layer (2) is provided with a plurality of pads (21) located in the area enclosed by the unit outer wall portion (31) for electrically connecting a plurality of LED chips (4). The first insulating material layer (3) also includes a first protrusion (32) located in the area enclosed by the unit outer wall portion (31) and connected to the unit outer wall portion (31) for separating two pads (21) of the same LED chip (4) and facilitating the bottom support of the LED chip (4) thereon. The top height of the first protrusion (32) is higher than the top height of the pad (21) and lower than the top height of the unit outer wall portion (31).

2. The COB-packaged LED light-emitting panel according to claim 1, characterized in that... The first insulating material layer (3) also includes a first connecting portion (301) for connecting several adjacent unit peripheral wall portions (31) together.

3. The COB-packaged LED light-emitting panel according to claim 2, characterized in that... The PCB board (1) has a connection hole (11) on the back side that communicates with the first connection part (301), and the connection hole (11) is filled with a second connection part (302) that is connected to the first connection part (301).

4. The COB-packaged LED light-emitting panel according to claim 3, characterized in that... The connecting hole (11) on the back of the PCB board (1) is a countersunk hole.

5. A COB-packaged LED light-emitting panel according to claim 1, characterized in that... The first insulating material layer (3) is an insulating plastic layer or an insulating ink layer.

6. A COB-packaged LED light-emitting panel according to claim 5, characterized in that... The first insulating material layer (3) is made of black PPA material.

7. A COB-packaged LED light-emitting panel according to any one of claims 1-6, characterized in that... The pads (21) in the outer wall section (31) of each unit are arranged in 3*2 rows of 6, and flip-chip LEDs are connected between the left and right pads (21) of each row.

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