Adsorption structure for micro LED chip transfer

Abstract

The utility model discloses an adsorption structure used for Micro LED chip transfer, which comprises an installation substrate with an adsorption cavity inside, a seal substrate arranged on the installation substrate and a seal adsorption head connected to the bottom of the seal substrate, and the bottom of the seal adsorption head is provided with an adsorption hole. The seal base plate is provided with an adsorption hole and an adsorption cavity, the seal base plate is provided with a vent hole communicated with the adsorption hole and the adsorption cavity, the installation base plate is provided with a threaded hole communicated with the adsorption cavity, and the threaded hole is used for installing an air pipe connector so as to be connected with external vacuum equipment. The adsorption structure provided by the utility model has the advantages of simple structure and long service life, and the chip cannot be damaged when the chip is adsorbed in the transfer process of the Micro LED chip.

Description

Technical Field

[0001] This utility model relates to the field of chip transfer technology, specifically to an adsorption structure for Micro LED chip transfer. Background Technology

[0002] Currently, in the field of Micro LED new displays, the following methods are commonly used to transfer Micro LED chips:

[0003] One method involves coating the organic insulating material of the stamp head with a layer of photosensitive organic material. This material has a structure similar to bristles, utilizing van der Waals forces. When the bristle structure comes into contact with the chip, the chip is adsorbed due to the intermolecular van der Waals forces. However, this structure has a significant drawback. Because the coating is a photosensitive organic material, when a laser passes through, the high temperature generated by the laser causes the material to easily fail. This limits the structure's lifespan to only 30 uses, greatly restricting its practical application value.

[0004] Another method uses electromagnetic adsorption. The specific structure involves creating a small window on the chip's surface during chip fabrication and depositing magnetic material within the window. Then, photolithographic lines are etched inside the stamp head, and the magnetic force is controlled by switching the circuit on and off, thus controlling the chip's adsorption. This method also has significant problems. First, depositing magnetic material on the chip increases the difficulty of chip fabrication, posing a challenge to the manufacturing process. Second, when adsorbed by electromagnetic force, the application of electricity charges the chip, and this charging process may damage the chip, affecting its performance and lifespan.

[0005] These existing technologies have many shortcomings in the Micro LED chip transfer process, including short lifespan, complex manufacturing processes, and potential damage to the chip. These problems severely restrict the development and application of Micro LED chip transfer technology and affect the promotion of this novel display technology. Therefore, developing a novel, efficient, and chip-free adsorption structure is of great significance for improving the efficiency and quality of Micro LED chip transfer.

[0006] To address the aforementioned issues, existing technologies urgently need improvement. Utility Model Content

[0007] To overcome the shortcomings of the existing technology, this utility model provides an adsorption structure for Micro LED chip transfer, which has the advantages of simple structure, simple manufacturing process, long service life, and will not damage the chip.

[0008] The technical solution adopted by this utility model to solve its technical problem is:

[0009] An adsorption structure for transferring Micro LED chips includes a mounting substrate with an internal adsorption cavity, a stamp substrate disposed on the mounting substrate, and a stamp adsorption head connected to the bottom of the stamp substrate. The bottom of the stamp adsorption head is provided with an adsorption hole. The stamp substrate is provided with a vent hole communicating with the adsorption hole and the adsorption cavity. The mounting substrate is provided with a threaded hole communicating with the adsorption cavity. The threaded hole is used to install a vent pipe connector for connection to an external vacuum device.

[0010] As a further improvement to the above technical solution, the adsorption hole includes an adsorption pattern disposed on the adsorption surface of the stamp adsorption head and a negative pressure hole connecting the adsorption pattern and the vent hole, and the stamp adsorption head absorbs the chip through the negative pressure generated by the adsorption pattern.

[0011] As a further improvement to the above technical solution, the adsorption texture is formed by laser processing of grooves on the adsorption surface.

[0012] As a further improvement to the above technical solution, the diameter of the negative pressure hole is smaller than the diameter of the vent hole.

[0013] As a further improvement to the above technical solution, the stamp substrate and the stamp adsorption head are welded into an integral structure using infrared femtosecond laser.

[0014] As a further improvement to the above technical solution, the top of the mounting substrate is provided with a first mounting hole, and a transparent sealing plate is embedded in the first mounting hole.

[0015] As a further improvement to the above technical solution, both the transparent sealing plate and the stamp substrate are made of transparent brittle materials.

[0016] As a further improvement to the above technical solution, the back side of both the transparent sealing plate and the stamp adsorption head is coated with a high-transparency film.

[0017] As a further improvement to the above technical solution, a second mounting hole is provided at the bottom of the mounting substrate, and the stamp substrate is embedded in the second mounting hole.

[0018] As a further improvement to the above technical solution, the ventilation holes on the stamp substrate are formed by laser processing.

[0019] The beneficial effects of this utility model are: when transferring Micro LED chips, the Micro LED chips are adsorbed by the stamp adsorption head, which has the advantages of simple structure and long service life, and the chip is picked up by the adsorption surface with adsorption texture, which will not damage the chip. Attached Figure Description

[0020] The present invention will be further described below with reference to the accompanying drawings and embodiments.

[0021] Figure 1 This is a schematic diagram of an adsorption structure for Micro LED chip transfer according to an embodiment of the present invention. Figure 1 ;

[0022] Figure 2 This is a schematic diagram of an adsorption structure for Micro LED chip transfer according to an embodiment of the present invention. Figure 2 ;

[0023] Figure 3 This is a bottom view of an adsorption structure for transferring Micro LED chips according to an embodiment of the present invention;

[0024] Figure 4 This is a cross-sectional view of an adsorption structure for transferring Micro LED chips according to an embodiment of the present invention.

[0025] Reference numerals: 1. Mounting substrate; 2. Stamp substrate; 3. Stamp suction head; 4. Suction surface; 5. Negative pressure hole; 6. Suction texture; 7. Vent hole; 8. Suction cavity; 9. Threaded hole; 10. Transparent sealing plate. Detailed Implementation

[0026] The following will clearly and completely describe the concept, specific structure, and technical effects of this utility model in conjunction with embodiments and accompanying drawings, so as to fully understand the purpose, features, and effects of this utility model. Obviously, the described embodiments are only a part of the embodiments of this utility model, not all of them. Other embodiments obtained by those skilled in the art based on the embodiments of this utility model without creative effort are all within the scope of protection of this utility model. Furthermore, all connections / connections involved in the patent do not simply refer to direct contact between components, but rather to the ability to form a better connection structure by adding or reducing connecting accessories according to specific implementation conditions. For example, fixed connections / fixed installations can use screw connections, bolt connections, pin connections, key connections, adhesive connections, mortise and tenon connections, welding, riveting, etc., as needed. For detachable connections, screw connections, bolt connections, threaded connections, snap-fit ​​connections, mortise and tenon connections, Velcro connections, etc., can be used as needed. The various technical features in this utility model can be combined interactively without contradicting each other.

[0027] Reference Figures 1-4, an embodiment of the present utility model provides an adsorption structure for Micro LED chip transfer, including a mounting substrate 1, a stamp substrate 2 and a stamp adsorption head 3. An adsorption cavity 8 is provided inside the mounting substrate 1, and a threaded hole 9 is provided on the mounting substrate 1. The threaded hole 9 is communicated with the adsorption cavity 8, and the threaded hole 9 is used to install an air pipe joint, which is connected to an external vacuum device through the air pipe joint, so as to control the air pressure in the adsorption cavity 8. An adsorption hole is provided at the bottom of the stamp adsorption head 3, and a ventilation hole 7 communicated with the adsorption hole and the adsorption cavity 8 is provided on the stamp substrate 2. The ventilation hole 7 on the stamp substrate 2 is formed by laser processing.

[0028] Among them, through the adjustment of the external vacuum device, a negative pressure is formed in the adsorption cavity 8, and the negative pressure is transmitted to the adsorption hole through the ventilation hole 7, so as to realize the firm adsorption of the chip. Specifically, the adsorption hole provided at the bottom of the stamp adsorption head 3 can ensure the stability and reliability of the adsorption process. Compared with the photosensitive organic material and electromagnetic adsorption methods in the prior art, the adsorption structure of this embodiment avoids the problems of material failure and high manufacturing difficulty. Through the structural design of vacuum adsorption, not only the service life is extended, but also the electromagnetic damage to the chip is avoided. Therefore, the adsorption structure of this embodiment has obvious advantages in MicroLED chip transfer.

[0029] In specific applications, the external vacuum device is connected to the threaded hole 9 of the mounting substrate 1 through an air pipe joint to form a negative pressure adsorption environment. The adsorption hole at the bottom of the stamp adsorption head 3 is communicated with the adsorption cavity 8 through the ventilation hole 7 to ensure the effective transmission of negative pressure, so as to realize the effective adsorption of the chip and improve the efficiency and reliability of Micro LED chip transfer.

[0030] In this embodiment, referring to Figure 1 , Figure 3 and Figure 4 , the adsorption hole includes an adsorption pattern 6 and a negative pressure hole 5. The adsorption pattern 6 is formed by a groove laser-processed on the adsorption surface 4. The adsorption pattern 6 has a structure in the shape of a Chinese character 'ri'. The negative pressure hole 5 communicates the adsorption pattern 6 with the ventilation hole 7. When the external vacuum device is connected to the adsorption cavity 8 through an air pipe joint, a negative pressure can be generated in the adsorption pattern 6 to suck the chip. The negative pressure in the adsorption pattern 6 is stable and the adsorption force is uniform, which improves the adsorption effect of the stamp adsorption head 3 on the Micro LED chip and effectively ensures that the Micro LED chip will not be damaged.

[0031] In the above embodiments, the adsorption texture 6 can be formed using various laser processing techniques, such as laser etching and laser cutting. These techniques can precisely form the required grooves on the adsorption surface 4. The depth and width of the grooves can be adjusted according to actual needs to ensure the best adsorption effect. The grooves formed by laser processing have high precision and high consistency, which can significantly improve the adsorption effect of the adsorption surface 4 on the Micro LED chip.

[0032] In some embodiments, refer to Figure 2 and Figure 4 The stamp substrate 2 and the stamp adsorption head 3 are welded into an integral structure using infrared femtosecond laser welding. The diameter of the negative pressure hole 5 is smaller than that of the vent hole 7, so that the laser can enter through the vent hole 7 to weld the connection between the stamp substrate 2 and the stamp adsorption head 3. Infrared femtosecond laser welding technology can achieve high-precision welding effect and ensure a firm connection between the stamp substrate 2 and the stamp adsorption head 3. Specifically, infrared femtosecond laser welding technology forms a tiny molten pool on the material surface through an ultra-short pulse laser, thereby achieving material welding. It has the advantages of small heat-affected zone, high welding precision, and fast welding speed, which can effectively improve the service life of the stamp adsorption head 3.

[0033] Furthermore, the top of the mounting substrate 1 is provided with a first mounting hole, in which a transparent sealing plate 10 is embedded. After the transparent sealing plate 10 is embedded in the first mounting hole, it ensures the sealing of the adsorption cavity 8. In this way, the infrared femtosecond laser can pass through the transparent sealing plate 10 to realize the welding work between the stamp substrate 2 and the stamp adsorption head 3.

[0034] In some embodiments, the transparent sealing plate 10 and the stamp substrate 2 are made of a transparent brittle material. This material has good light transmittance and mechanical strength, facilitating the penetration of infrared femtosecond lasers, while not failing due to the high temperature of the laser. Specifically, the transparent sealing plate 10 and the stamp substrate 2 can be made of transparent brittle materials such as glass, quartz, calcium fluoride, or arsenic sulfide. These materials have excellent optical properties and mechanical strength, and can withstand the high temperatures during laser processing. In addition, the transparent sealing plate 10 is coated with a high-transmittance film, further improving its light transmittance and durability. The back side of the stamp adsorption head 3 is also coated with a high-transmittance film to improve light transmittance, reduce glare and reflection, ensure the smooth progress of laser welding processing, and improve welding quality.

[0035] In some embodiments, the bottom of the mounting substrate 1 is provided with a second mounting hole, the stamp substrate 2 is embedded in the second mounting hole, and the stamp substrate 2 is embedded in the second mounting hole to ensure the sealing of the adsorption cavity 8. This can ensure the tight connection between the stamp substrate 2 and the mounting substrate 1, thereby improving the stability and reliability of the entire adsorption structure.

[0036] The above is a detailed description of the preferred embodiments of the present utility model. However, the present utility model is not limited to the described embodiments. Those skilled in the art can make various equivalent modifications or substitutions without departing from the spirit of the present utility model. All such equivalent modifications or substitutions are included within the scope defined by the claims of this application.

Claims

1. An adsorption structure for transferring Micro LED chips, characterized in that: The device includes a mounting base plate with an internal adsorption chamber, a stamp base plate disposed on the mounting base plate, and a stamp adsorption head connected to the bottom of the stamp base plate. The bottom of the stamp adsorption head is provided with an adsorption hole. The stamp base plate is provided with a vent hole communicating with the adsorption hole and the adsorption chamber. The mounting base plate is provided with a threaded hole communicating with the adsorption chamber. The threaded hole is used to install an air pipe connector for connection to an external vacuum device.

2. The adsorption structure for Micro LED chip transfer according to claim 1, characterized in that: The adsorption hole includes an adsorption pattern on the adsorption surface of the stamp adsorption head and a negative pressure hole connecting the adsorption pattern and the vent hole. The stamp adsorption head draws the chip in through the negative pressure generated by the adsorption pattern.

3. The adsorption structure for Micro LED chip transfer according to claim 2, characterized in that: The adsorption texture is formed by laser-processed grooves on the adsorption surface.

4. The adsorption structure for Micro LED chip transfer according to claim 2, characterized in that: The diameter of the negative pressure hole is smaller than the diameter of the vent hole.

5. The adsorption structure for Micro LED chip transfer according to claim 4, characterized in that: The stamp substrate and the stamp adsorption head are welded into a single structure using infrared femtosecond laser welding.

6. The adsorption structure for Micro LED chip transfer according to claim 5, characterized in that: The top of the mounting substrate is provided with a first mounting hole, and a transparent sealing plate is embedded in the first mounting hole.

7. The adsorption structure for Micro LED chip transfer according to claim 6, characterized in that: Both the transparent sealing plate and the stamp base plate are made of transparent and brittle materials.

8. The adsorption structure for Micro LED chip transfer according to claim 7, characterized in that: The back of both the transparent sealing plate and the stamp adsorption head are coated with a high-transparency film.

9. The adsorption structure for Micro LED chip transfer according to claim 1, characterized in that: The bottom of the mounting substrate is provided with a second mounting hole, and the stamp substrate is embedded in the second mounting hole.

10. The adsorption structure for Micro LED chip transfer according to claim 1, characterized in that: The ventilation holes on the stamp substrate are formed by laser processing.

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