Power module

Abstract

The utility model relates to the semiconductor technology, in particular to a power module. The power module comprises a power module body, and the power module body comprises a plastic package body (1). The plastic package body (1) is sequentially provided with a metal radiating surface (11) and a shell (12); grooves (16) are arranged at two ends of one surface of the plastic package body (1) close to the metal radiating surface (11). According to the utility model, the insulation design of the power module is enhanced, so that the power module can adapt to the high-voltage application requirement of the market. The method can be compatible with an existing user interface, is convenient for client installation and use, and reduces the product conversion cost.

Description

Technical Field

[0001] This utility model relates to semiconductor technology, and more particularly to a power module. Background Technology

[0002] To fully leverage the high efficiency, energy saving, and superior temperature tolerance of third-generation power semiconductors, and to meet the application requirements of higher voltage levels and switching frequencies from end-users, SiC power modules with plastic molding are gaining popularity in the market due to their simple structure and flexible application layout. For example, Tesla developed and uses the automotive-grade SiC power module Tpak in its electric vehicles. Tpak can be implemented in various flexible circuit topologies or layouts at the end-user level, similar to TO devices, while also achieving internal insulation and adapting to high-power applications. After Tesla announced the open-sourcing of its patents, Tpak has now become one of the most sought-after SiC power modules on the market.

[0003] Tesla's initial TPAK design, as seen in existing technology (patent number US11837523), was based on a 650V chip platform. This resulted in relatively low voltage and high current for user-end applications. The current market increasingly favors high-voltage, low-current power modules, especially with the growing demand for high voltage in fast charging technology. A high-voltage platform can reduce current under the same input or output power conditions, thereby reducing chip conduction losses and losses in the current path, thus reducing system heat generation and improving system safety and stability. However, Tesla's original design is somewhat incompatible with current high-voltage applications. Utility Model Content

[0004] This invention addresses the problem that existing power modules are not suitable for current high-voltage applications by providing a new power module.

[0005] To solve the above-mentioned technical problems, the present invention provides a solution through the following technical method:

[0006] A power module includes a power module body, which includes a molding compound; the molding compound has a metal heat dissipation surface and a housing in sequence; and grooves are provided at both ends of the side of the molding compound closest to the metal heat dissipation surface.

[0007] Preferably, the two ends of the encapsulation body are also connected to auxiliary terminals and busbar terminals; the auxiliary terminals include a first auxiliary terminal and a second auxiliary terminal, and the busbar terminals include a first busbar terminal and a second busbar terminal. The first busbar terminal, the first auxiliary terminal, and the second auxiliary terminal are located at one end of the encapsulation body in sequence, and the second busbar terminal is located at the other end of the encapsulation body.

[0008] Preferably, a molding compound sleeve is connected to the auxiliary terminal, the molding compound sleeve passes through the auxiliary terminal and is close to one end of the molding compound.

[0009] Preferably, the groove extends through the encapsulation.

[0010] Preferably, the metal heat dissipation surface is a step of height S.

[0011] Preferably, the shell is a step with a height of H.

[0012] This utility model, by adopting the above technical solution, has the following significant technical effects:

[0013] This invention enhances the insulation design of the power module, enabling it to meet the high-voltage application requirements of the market.

[0014] The power module designed in this invention is compatible with existing user interfaces, making it easy for clients to install and use, and reducing product conversion costs. Attached Figure Description

[0015] Figure 1 This is a schematic diagram of the power module body structure of Embodiment 2 of this utility model.

[0016] Figure 2 This is a schematic diagram of the power module structure of this utility model.

[0017] Figure 3 This is a side view of the power module of this utility model.

[0018] Figure 4 This is a schematic diagram of the power module body structure of Embodiment 1 of this utility model.

[0019] Among them, 1—the encapsulated body,

[0020] 11—Metal heat dissipation surface,

[0021] 12—Shell

[0022] 14—Auxiliary terminals

[0023] 15—Busbar terminal,

[0024] 16—Groove

[0025] 141—First auxiliary terminal

[0026] 142—Second auxiliary terminal

[0027] 151—First busbar terminal

[0028] 152—Second busbar terminal. Detailed Implementation

[0029] The present invention will now be described in further detail with reference to the accompanying drawings and embodiments. Example

[0030] A power module, Figure 1 and Figure 4 The power module body includes a plastic encapsulation 1. The plastic encapsulation 1 is provided with a metal heat dissipation surface 11 and a housing 12 in sequence. The plastic encapsulation 1 has grooves 16 at both ends on the side of the plastic encapsulation 1 closest to the metal heat dissipation surface 11.

[0031] The two ends of the molding compound 1 are also connected to auxiliary terminals 14 and busbar terminals 15; the auxiliary terminals 14 include a first auxiliary terminal 141 and a second auxiliary terminal 142, and the busbar terminals 15 include a first busbar terminal 151 and a second busbar terminal 152. The first busbar terminal 151, the first auxiliary terminal 141, and the second auxiliary terminal 142 are located at one end of the molding compound 1, and the second busbar terminal 152 is located at the other end of the molding compound 1.

[0032] A molding compound sleeve is connected to the auxiliary terminal 14. The molding compound sleeve passes through the auxiliary terminal 14 and is close to one end of the molding body 1.

[0033] exist Figure 4 In the middle, the groove 16 does not penetrate through the plastic seal 1, and there is a certain distance between the two ends of the plastic seal 1. Example

[0034] A power module includes a power module body, which includes a molding compound 1. The molding compound 1 is provided with a metal heat dissipation surface 11 and a housing 12 in sequence. The molding compound 1 has grooves 16 at both ends on the side of the molding compound 1 closest to the metal heat dissipation surface 11.

[0035] The two ends of the molding compound 1 are also connected to auxiliary terminals 14 and busbar terminals 15; the auxiliary terminals 14 include a first auxiliary terminal 141 and a second auxiliary terminal 142, and the busbar terminals 15 include a first busbar terminal 151 and a second busbar terminal 152. The first busbar terminal 151, the first auxiliary terminal 141, and the second auxiliary terminal 142 are located at one end of the molding compound 1, and the second busbar terminal 152 is located at the other end of the molding compound 1.

[0036] A molding compound sleeve is connected to the auxiliary terminal 14. The molding compound sleeve passes through the auxiliary terminal 14 and is close to one end of the molding body 1.

[0037] Unlike Example 1, Figure 1 In this embodiment, the groove 16 penetrates the encapsulation body 1. The groove 16 passes directly through the encapsulation body 1. Example

[0038] A power module includes a power module body, which includes a molding compound 1. The molding compound 1 is provided with a metal heat dissipation surface 11 and a housing 12 in sequence. The molding compound 1 has grooves 16 at both ends on the side of the molding compound 1 closest to the metal heat dissipation surface 11.

[0039] The two ends of the molding compound 1 are also connected to auxiliary terminals 14 and busbar terminals 15; the auxiliary terminals 14 include a first auxiliary terminal 141 and a second auxiliary terminal 142, and the busbar terminals 15 include a first busbar terminal 151 and a second busbar terminal 152. The first busbar terminal 151, the first auxiliary terminal 141, and the second auxiliary terminal 142 are located at one end of the molding compound 1, and the second busbar terminal 152 is located at the other end of the molding compound 1.

[0040] A molding compound sleeve is connected to the auxiliary terminal 14. The molding compound sleeve passes through the auxiliary terminal 14 and is close to one end of the molding body 1.

[0041] Figure 3 The metal heat dissipation surface 11 is a step of height S. An insulating groove is provided near the power module terminal pins; there is a height difference of S between this groove and the metal heat dissipation surface of the module. Example

[0042] A power module includes a power module body, which includes a molding compound 1. The molding compound 1 is provided with a metal heat dissipation surface 11 and a housing 12 in sequence. The molding compound 1 has grooves 16 at both ends on the side of the molding compound 1 closest to the metal heat dissipation surface 11.

[0043] The two ends of the molding compound 1 are also connected to auxiliary terminals 14 and busbar terminals 15; the auxiliary terminals 14 include a first auxiliary terminal 141 and a second auxiliary terminal 142, and the busbar terminals 15 include a first busbar terminal 151 and a second busbar terminal 152. The first busbar terminal 151, the first auxiliary terminal 141, and the second auxiliary terminal 142 are located at one end of the molding compound 1, and the second busbar terminal 152 is located at the other end of the molding compound 1.

[0044] A molding compound sleeve is connected to the auxiliary terminal 14. The molding compound sleeve passes through the auxiliary terminal 14 and is close to one end of the molding body 1.

[0045] Figure 3 The housing 12 is a step of height H. There is a height difference of H between the housing and the encapsulated body; relative to the bottom of the encapsulated body, both sides are recessed, thus forming a step of height H.

Claims

1. A power module, comprising a power module body, the power module body including a molding compound (1); the molding compound (1) having a metal heat dissipation surface (11) and a housing (12); characterized in that, The molding compound (1) has grooves (16) at both ends on the side near the metal heat dissipation surface (11); the molding compound (1) is also connected to auxiliary terminals (14) and busbar terminals (15); the auxiliary terminal (14) includes a first auxiliary terminal (141) and a second auxiliary terminal (142), and the busbar terminal (15) includes a first busbar terminal (151) and a second busbar terminal (152). The first busbar terminal (151), the first auxiliary terminal (141), and the second auxiliary terminal (142) are located at one end of the molding compound (1) in sequence, and the second busbar terminal (152) is located at the other end of the molding compound (1); a molding material sleeve is connected to the auxiliary terminal (14), and the molding material sleeve passes through the auxiliary terminal (14) and is close to one end of the molding compound (1).

2. A power module according to claim 1, characterized in that, The groove (16) penetrates the encapsulated body (1).

3. A power module according to claim 1, characterized in that, The metal heat dissipation surface (11) is a step of height S.

4. A power module according to claim 1, characterized in that, The shell (12) is a step of height H.

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