Multi-chip eutectic soldering universal clamp

Abstract

The utility model relates to a chip eutectic soldering clamp, in particular to a universal clamp for multi-chip eutectic soldering. Comprising a clamp base, and a packaging shell is arranged in the middle of the upper surface of the clamp base; two guide rail grooves distributed in the two sides of the packaging shell are formed in the upper surface of the clamp base, and one or more supporting tables are installed in the guide rail grooves in a sliding mode. A cross beam is rotationally mounted on the supporting table, and an ejector pin is arranged at one end of the cross beam and can extend into the packaging shell and abut against the chip; an inverted-U-shaped force application frame is detachably installed on the upper surface of the supporting table, a compression bolt is installed on the top of the force application frame in a threaded mode, and a stud of the compression bolt penetrates through the force application frame and abuts against the upper surface of the cross beam. According to the utility model, only the positions and the number of the supporting tables in the guide rail groove and the pressing force of the pressing bolts need to be adjusted, so that the chips of different types and sizes can be pressed and welded, the adaptability is higher, a corresponding clamp does not need to be customized, and the production and manufacturing cost can be reduced to a great extent.

Description

TECHNICAL FIELD

[0001] The utility model relates to chip eutectic welding fixture, concretely relates to a kind of multi-chip eutectic welding general fixture. BACKGROUND

[0002] Chip eutectic welding is the key technology in semiconductor packaging, and its basic requirement is to ensure that the shear strength of the chip is qualified, and reliable ohmic contact is formed between the chip and the substrate. The porosity of eutectic welding is an important indicator, and high porosity will increase the thermal resistance between the chip and the substrate, affecting the heat dissipation performance. In addition, the porosity will also cause current concentration effect, leading to local overheating, thereby affecting the long-term reliability of high-power chips and shortening the service life of the chip.

[0003] The control of chip eutectic welding porosity is mainly affected by the following factors: the selection of eutectic solder, welding pressure, welding temperature, welding time and protective atmosphere. Among them, the welding pressure is provided by the eutectic welding fixture, which functions to reduce the gap between the substrate and the high-power chip and the solder, and promote the melting reaction. Under the action of pressure, the solder can flow uniformly along the gap of the welding surface, which helps to expel the residual gas, thereby effectively reducing the formation of voids.

[0004] In the manufacture of hybrid integrated circuits, it is often necessary to eutectically weld a plurality of semiconductor bare chips of different sizes and thicknesses on a thick film substrate or housing. In order to ensure that these chips can be eutectically welded well, an adjustable pressure chip eutectic welding fixture is usually used to fix the chips.

[0005] However, the existing adjustable pressure fixture usually needs to be customized with a special positioning fixture according to the size and position of the chip, and different fixtures need to be customized for the welding of different types and sizes of chips, which has poor adaptability and high cost. SUMMARY

[0006] The utility model aims at solving the technical problem that the chip welding fixture in the prior art is difficult to adapt to the simultaneous welding of multiple chips of different types and sizes, and provides a multi-chip eutectic welding general fixture.

[0007] To solve the above technical problems, the technical solution provided by the utility model is as follows:

[0008] A multi-chip eutectic welding general fixture, comprising a fixture base, and a packaging shell placed on the middle part of the upper surface of the fixture base;

[0009] The upper surface of the fixture base is provided with two guide rail grooves distributed on both sides of the packaging shell, and one or more support tables are slidably installed in the guide rail grooves;

[0010] The support table is provided with a cross beam rotatably installed thereon, and a ejector pin is arranged at one end of the cross beam and can extend into the packaging shell and abut against the chip;

[0011] The upper surface of the support table is detachably provided with a force applying frame in inverted U shape, and a pressing bolt is threadedly installed at the top of the force applying frame, and the stud of the pressing bolt penetrates through the force applying frame and abuts against the upper surface of the cross beam.

[0012] Further, the upper surface of the support table is provided with support plates on both sides, and a fixing pin shaft is installed between the two support plates;

[0013] The cross beam is rotatably installed on the fixing pin shaft through a through groove arranged on the cross beam.

[0014] Further, the force applying frame is installed on the upper surface of the support table through an installation pin shaft.

[0015] Further, the upper surface of the jig base is provided with two groups of installation grooves arranged on both sides of the packaging shell;

[0016] Each group of installation grooves is composed of two parallel guide rail installation grooves;

[0017] An L-shaped guide rail is installed in the guide rail installation groove, and a guide rail groove in inverted T shape is formed between the two guide rails arranged on the same side of the packaging shell.

[0018] The support table is slidably installed on the upper surface of the jig base through the guide rail groove.

[0019] Further, the guide rail is installed in the guide rail installation groove through a plurality of screws.

[0020] Further, a gasket is arranged between the ejector pin and the chip.

[0021] Compared with the prior art, the utility model has the advantages of:

[0022] 1. The universal jig for multi-chip eutectic welding of the utility model can move the position of the support table according to the position of the chip to be welded, so that the ejector pin can abut against the chip, and the force applying frame and the pressing bolt can be used to adjust the pressing force of the chip by adjusting the pressing bolt.

[0023] 2. The multi-chip eutectic solder universal clamp provided by the utility model, through the through groove arranged on the cross beam and the rotation connection of the cross beam and the fixed pin shaft through the through groove, the abutting position of the ejector pin on the chip can be adjusted by adjusting the relative position of the cross beam and the fixed pin shaft, and the gasket arranged between the ejector pin and the chip can guarantee that the pressing force of the ejector pin is uniformly distributed on the surface of the chip, so that the under-pressing and crushing of the chip are avoided. BRIEF DESCRIPTION OF DRAWINGS

[0024] Figure 1 It is a structure schematic view of the utility model embodiment;

[0025] Figure 2 It is a structure schematic view of the utility model embodiment;

[0026] Figure 3 It is a structure schematic view of the utility model embodiment;

[0027] Mark 1, clamp base; 2, package shell; 3, guide rail groove; 4, support table; 5, cross beam; 51, through groove; 6, ejector pin; 7, chip; 8, force frame; 9, pressing bolt; 10, support plate; 11, fixed pin shaft; 12, mounting pin shaft; 13, guide rail mounting groove; 14, guide rail; 15, screw; 16, gasket; 17, solder sheet. DETAILED DESCRIPTION

[0028] The technical solutions in the utility model will be described clearly and completely below in conjunction with the drawings, and obviously, the described embodiments are only part of the embodiments of the utility model, not all the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by the person skilled in the art without creative labor fall within the protection scope of the utility model.

[0029] As Figure 1 shown, a kind of multi-chip eutectic solder universal clamp, including clamp base 1, package shell 2 is placed in the middle portion of the upper surface of clamp base 1;Two guide rail grooves 3 are arranged on the upper surface of clamp base 1 and distributed in the both sides of package shell 2, one or more support tables 4 are slidably installed in guide rail groove 3;Cross beam 5 is rotatably installed on support table 4, and one end of cross beam 5 is equipped with ejector pin 6, and ejector pin 6 can be extended into package shell 2 and abuts chip 7;

[0030] As Figure 1 and Figure 2 shown, to make the pressing force of ejector pin 6 uniformly distributed on chip 7, gasket 16 is arranged between ejector pin 6 and chip 7;

[0031] As Figure 1As shown, the upper surface of the support platform 4 is detachably equipped with an inverted U-shaped force-applying frame 8. The top of the force-applying frame 8 is threaded with a clamping bolt 9. The stud of the clamping bolt 9 passes through the force-applying frame 8 and abuts against the upper surface of the crossbeam 5. By adjusting the length of the extension section of the clamping bolt 9 on the force-applying frame 8, the clamping force of the ejector pin 6 on the chip 7 can be adjusted.

[0032] like Figure 1 As shown, in order to install the crossbeam 5, support plates 10 are provided on both sides of the upper surface of the support platform 4, and a fixing pin 11 is installed between the two support plates 10; in order to make the pressing position of the ejector pin 6 on the chip 7 adjustable, and to adjust the position of the crossbeam 5 and the ejector pin 6 according to the change of the soldering position of the chip 7, a through groove 51 is provided on the crossbeam 5, and the crossbeam 5 is rotatably mounted on the fixing pin 11 through the through groove 51; when adjusting the position of the crossbeam 5 and the ejector pin 6, the crossbeam 5 is slid on the fixing pin 11 through the through groove 51 to achieve the adjustment.

[0033] like Figure 1 As shown, in order to install the force application frame 8 and facilitate disassembly, the force application frame 8 is installed on the upper surface of the support platform 4 via the mounting pin 12.

[0034] like Figure 1 and Figure 3 As shown, to achieve the sliding installation of the support platform 4, two sets of mounting grooves distributed on both sides of the encapsulation housing 2 are provided on the upper surface of the fixture base 1; each set of mounting grooves consists of two parallel guide rail mounting grooves 13; an L-shaped guide rail 14 is installed in the guide rail mounting groove 13, and an inverted T-shaped guide rail groove 3 is formed between the two guide rails 14 located on the same side of the encapsulation housing 2; the support platform 4 is slidably installed in the upper surface of the fixture base 1 through the guide rail groove 3. The support platform 4 is provided with an I-shaped slider that can be adapted to the guide rail groove 3.

[0035] like Figure 1 As shown, in order to fix the guide rail 14 in the guide rail mounting groove 13, the guide rail 14 is installed in the guide rail mounting groove 13 by a plurality of screws 15.

[0036] The multi-chip eutectic bonding universal fixture provided by this utility model is used by placing the package housing 2 of the chip 7 to be welded in the middle of the upper surface of the fixture base 1, placing the chip 7 to be welded in the package housing 2 according to the welding position, and at the same time, a pad 16 matching the size of the chip 7 is provided on the top of the chip 7, and a solder pad 17 for welding the chip 7 is provided on the bottom of the chip 7.

[0037] According to the number and position of the chip 7, the corresponding support table 4 is installed in the guide groove 3, the position of the support table 4 in the guide groove 3 is adjusted, and the relative position between the cross beam 5 and the fixed pin shaft 11 is adjusted, so that the end of the top pin 6 can abut against the center position of the gasket 16; the pressing bolt 9 is adjusted, so that the end of the pressing bolt 9 presses the cross beam 5, and the pressing and fixing of the chip 7 are realized; the size of the pressing force can be adjusted by adjusting the pressing bolt 9 according to different chips 7; thereby the welding of the chip 7 and the packaging shell 2 is facilitated.

[0038] The above merely describes the specific implementation of the present application, but the protection scope of the present application is not limited to this. Any change or replacement within the technical range disclosed in the present application should be covered in the protection scope of the present application. Therefore, the protection scope of the present application should be subject to the protection scope of the claims.

Claims

1. A universal jig for multi-chip eutectic soldering, characterized by: It includes a clamp base (1), and a packaging shell (2) is arranged on the middle of the upper surface of the clamp base (1); Two guide rail grooves (3) are arranged on the upper surface of the clamp base (1) and distributed on both sides of the packaging shell (2), and one or more supporting tables (4) are slidably arranged in the guide rail grooves (3); A cross beam (5) is rotatably arranged on the supporting table (4), one end of the cross beam (5) is provided with a thimble (6), the thimble (6) can extend into the packaging shell (2) and abut against a chip (7); A force applying frame (8) in inverted U shape is detachably arranged on the upper surface of the supporting table (4), a pressing bolt (9) is threadedly arranged on the top of the force applying frame (8), the threaded shank of the pressing bolt (9) penetrates through the force applying frame (8) and abuts against the upper surface of the cross beam (5).

2. The universal fixture for multi-chip eutectic soldering according to claim 1, wherein: Supporting plates (10) are arranged on both sides of the upper surface of the supporting table (4), and a fixed pin shaft (11) is arranged between the two supporting plates (10); A through groove (51) is formed in the cross beam (5), and the cross beam (5) is rotatably arranged on the fixed pin shaft (11) through the through groove (51).

3. The universal fixture for multi-chip eutectic soldering according to claim 1, wherein: The force applying frame (8) is arranged on the upper surface of the supporting table (4) through a mounting pin shaft (12).

4. The universal fixture for multi-chip eutectic soldering according to claim 1, wherein: Two groups of mounting grooves are formed on the upper surface of the clamp base (1) and distributed on both sides of the packaging shell (2); Each group of mounting grooves is composed of two parallel guide rail mounting grooves (13); An L-shaped guide rail (14) is arranged in the guide rail mounting groove (13), and the two guide rails (14) arranged on the same side of the packaging shell (2) form a reversed T-shaped guide rail groove (3); The supporting table (4) is slidably arranged on the upper surface of the clamp base (1) through the guide rail groove (3).

5. The universal fixture for multi-chip eutectic soldering according to claim 4, wherein: The guide rail (14) is arranged in the guide rail mounting groove (13) through a plurality of screws (15).

6. The universal fixture for multi-chip eutectic soldering according to claim 1, wherein: A gasket (16) is arranged between the thimble (6) and the chip (7).

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