Special electronic packaging cover tape for single-row composite derivative packaging tape

Abstract

The utility model provides a special electronic packaging covering tape matched with a single-row composite type derivative packaging tape, which is of a multi-layer composite structure, comprises a light-transmitting base material layer, an adhesive and local (regional) pressure sensing adhesive layer and a light-transmitting base material layer which are sequentially stacked from top to bottom, and has light transmission and heat resistance; the bonding layer is stacked on the lower surface of the light-transmitting base material layer; the pressure sensing adhesive layer is partially stacked and / or arranged on the lower surface of the bonding layer; wherein the pressure sensing adhesive layer is provided with a transverse interval and / or a longitudinal interval, the range of the transverse interval and / or the longitudinal interval is set to be 0.5-50 mm, the transverse interval and / or the longitudinal interval are / is used for being matched with the pocket size of the single-row compound type derivative packaging tape, and the transverse interval and / or the longitudinal interval are / is smaller than the pocket size of the single-row compound type derivative packaging tape. According to the utility model, after heat sealing or press bonding, an independent sealing area can be formed on the packaging tape, thereby effectively preventing the electronic components from slipping or mixed loading, and having the technical effects of static electricity prevention, stable packaging and material cost reduction.

Description

TECHNICAL FIELD

[0001] The utility model relates to electronic component packaging field especially, relate to a kind of electronic packaging cover tape specially used for single-column complex type derived packaging tape. BACKGROUND

[0002] With the popularity of emerging technologies such as Internet of Things (IoT), 5G, artificial intelligence (AI), self-driving cars, electric vehicles (EV), and smart wearable devices, the market demand for electronic components, including active components such as transistors, diodes, integrated circuits, and passive components (such as resistors, capacitors, inductors, etc.), has rapidly increased.

[0003] As electronic components become smaller and smaller and performance requirements become more stringent, the demand for packaging technology also increases, especially in terms of component loading, packaging, storage, and protection, which requires breakthroughs in existing technology bottlenecks.

[0004] Currently, most common electronic component carrying tapes or packaging tapes use a single-column, single-recess, or single-empty-frame structure, which can only load one electronic component in a unit length, limiting the efficiency of the production line and the packaging speed.

[0005] In addition, even in some improved solutions with multiple columns, the sealing effect is not good, and there is a risk of incomplete sealing of the packaging pockets or mutual influence between adjacent pockets, which can cause components to slip out or mix during transportation or handling.

[0006] On the other hand, with the increasing emphasis on sustainable development and social responsibility worldwide, the demand and performance of corporate ESG [Environmental, Social, and Governance] have become one of the important indicators of corporate operations and gradually influence the decisions of investors, government agencies, consumers, and other stakeholders. The demand for the environment, such as reducing carbon footprint, energy efficiency, resource recycling, and waste reduction, has become a basic requirement for companies to comply with ESG requirements.

[0007] Therefore, there is a strong need for an innovative column complex derived packaging tape and its dedicated electronic packaging cover tape, which uses a single-column complex loading method to improve the use efficiency of unit packaging materials and reduce the material cost of unit packaging materials, thereby solving all the problems of the existing technology. SUMMARY

[0008] To solve the above problems, the utility model provides a single complex derivative packaging roll tape special electronic packaging covering tape, contains the light transmission base material layer, adhesive and pressure sensitive adhesive layer by order from top to bottom stacking, in the utility model, single complex derivative packaging roll tape special electronic packaging covering tape, for a multilayer composite structure, include: a light transmission base material layer, with light transmission and heat resistance, an adhesive layer, stack in the lower surface of the light transmission base material layer, and a pressure sensitive adhesive layer, partially stack and / or arrange in the lower surface of the adhesive layer, wherein, the pressure sensitive adhesive layer has a transverse interval and / or a longitudinal interval, the range of the transverse interval and / or the longitudinal interval is set to 0.5~50mm, to cooperate with the pocket size of a single complex derivative packaging roll tape, and the transverse interval and / or the longitudinal interval is less than the pocket size of the single complex derivative packaging roll tape.

[0009] In an embodiment of the utility model, the thickness of the light transmission base material layer is set to 10~50μm, the light transmission base material layer includes a plastic film material, and the plastic film material includes at least one of PET, PP, PE, PET / PE or PET / PP.

[0010] In an embodiment of the utility model, the thickness of the adhesive layer is set to 0.5~50mm, and is less than or equal to the thickness of the light transmission base material layer, and the adhesive layer includes at least one of acrylic glue, silica gel, PU glue, rubber or polymer glue.

[0011] In an embodiment of the utility model, the adhesive layer further includes an antistatic coating or antistatic particles.

[0012] In an embodiment of the utility model, the thickness of the pressure sensitive adhesive layer is set to 1~20μm, and is less than the thickness of the light transmission base material layer and the adhesive layer, the pressure sensitive adhesive layer includes at least one of acrylic glue, silica gel, PU glue, rubber or polymer glue, and the materials selected for the pressure sensitive adhesive layer and the adhesive layer can be the same or different.

[0013] In an embodiment of the utility model, the size of the transverse interval and the longitudinal interval of the pressure sensitive adhesive layer is less than the pocket size of the single complex derivative packaging roll tape.

[0014] In an embodiment of the utility model, the pressure sensitive adhesive layer is arranged in a strip-shaped manner, and uniformly extends along the longitudinal direction of the single complex derivative packaging roll tape special electronic packaging covering tape.

[0015] In an embodiment of the utility model, the pressure sensitive adhesive layer is arranged in a dot-shaped manner, or the pressure sensitive adhesive layer is arranged in a dot-shaped manner.

[0016] In an embodiment of the utility model, the pressure sensitive adhesive layer is arranged in a combination of strip-shaped and dot-shaped.

[0017] In an embodiment of the present application, the transverse interval and the longitudinal interval are set to be different.

[0018] The single-column complex derivative packaging roll tape special electronic packaging covering tape provided by the present application can maintain high light transmittance and heat resistance, and through the multi-layer structure and the special locally arranged pressure-sensitive adhesive layer, an independent sealing area is formed after heat sealing / pressure bonding with the packaging roll tape, thereby effectively preventing the electronic components from sliding out or being mixedly loaded, and the technical effects of anti-static protection, packaging stability and reduced material cost are achieved. BRIEF DESCRIPTION OF DRAWINGS

[0019] The present application will be further described in detail with reference to the accompanying drawings, in which:

[0020] Figure 1A Fig. 1 is a cross-sectional structure schematic diagram of a single-column complex derivative packaging roll tape special electronic packaging covering tape according to an embodiment of the present application;

[0021] Figure 1B Fig. 2 is a cross-sectional structure schematic diagram of the packaging covering tape pasted on the single-column complex derivative packaging roll tape according to an embodiment of the present application;

[0022] Figure 2 Fig. 3 is a schematic diagram of a strip-shaped interval arrangement of a pressure-sensitive adhesive layer of the electronic packaging covering tape according to an embodiment of the present application;

[0023] Figure 3 Fig. 4 is a schematic diagram of a dot-shaped interval arrangement of the pressure-sensitive adhesive layer of the electronic packaging covering tape according to an embodiment of the present application;

[0024] Figure 4 Fig. 5 is a schematic diagram of a mixed arrangement of the pressure-sensitive adhesive layer of the electronic packaging covering tape according to an embodiment of the present application;

[0025] Figure 5 Fig. 6 is a schematic diagram of a high-density arrangement of the pressure-sensitive adhesive layer of the electronic packaging covering tape according to an embodiment of the present application.

[0026] BRIEF DESCRIPTION OF DRAWINGS

[0027] 1: single-column complex derivative packaging roll tape special electronic packaging covering tape

[0028] 2: single-column complex derivative packaging roll tape

[0029] 10: light-transmitting base material layer

[0030] 20: adhesive layer

[0031] 30: pressure-sensitive adhesive layer

[0032] 40: pocket

[0033] 50: electronic component

[0034] L1: lateral interval

[0035] L2: longitudinal interval

[0036] S: independent sealing area DETAILED DESCRIPTION

[0037] The embodiments of the present application will be described in more detail with reference to the drawings and element symbols, so that those skilled in the art can implement the present application after reading the present specification.

[0038] Referring to Figure 1A , Figure 1B and Figure 3 , the electronic packaging cover tape 1 of the single-row complex type derivative packaging roll tape special use of the present application is a multi-layer structure, comprising a light-transmitting substrate layer 10, an adhesive layer 20 and a pressure-sensitive adhesive layer 30 stacked in order from top to bottom. The light-transmitting substrate layer 10 provides light-transmitting property and heat resistance, the adhesive layer 20 generates adhesion after heating or pressing, and can be attached to the single-row complex type derivative packaging roll tape 2, and the pressure-sensitive adhesive layer 30 has slight adhesion, which can ensure the independent sealing of each pocket 40, form an independent sealing area S, and prevent the electronic component 50 from sliding or mixed loading during transportation.

[0039] In an embodiment of the present application, the thickness of the light-transmitting substrate layer 10 is 10-50 μm, preferably 12-40 μm, and more preferably 15-30 μm. The light-transmitting substrate layer 10 can be made of at least one of PET (polyethylene terephthalate), PP (polypropylene), PE (polyethylene), PET / PE or PET / PP, etc. In addition, the light-transmitting substrate layer 20 has a visible light transmittance of more than 85% and can withstand an environmental temperature of more than 90°C, so as to ensure the stability of the component packaging.

[0040] In an embodiment of the present application, the thickness of the adhesive layer 20 is 10-50 μm, preferably 12-40 μm, and more preferably 15-20 μm. In a preferred embodiment of the present application, the thickness of the adhesive layer 20 is less than that of the light-transmitting substrate layer 10. The adhesive layer 20 can be made of at least one of acrylic glue, silicone glue, PU glue, rubber or polymer glue. Preferably, the adhesive layer 20 comprises an antistatic coating or antistatic particles (such as one of PEDOT, carbon black and conductive polymer), so as to reduce the accumulation of static electricity and prevent the electronic component 50 from being damaged due to static electricity. In addition, the adhesive layer 20 is reserved with an attachment space for the single-row complex type derivative packaging roll tape 2.

[0041] In an embodiment of the present application, the thickness of the pressure-sensitive adhesive layer 30 is 1-20 microns, preferably 1-15 microns, and more preferably 1-10 microns. In a preferred embodiment of the present application, the thickness of the pressure-sensitive adhesive layer 30 is less than the thickness of the light-transmitting substrate layer 10 and the adhesive layer 20. The pressure-sensitive adhesive layer 30 can be made of at least one of acrylic adhesive, silicone adhesive, PU adhesive, rubber adhesive, or polymeric adhesive. Preferably, the pressure-sensitive adhesive layer 30 and the adhesive layer 20 can be made of the same or different materials. In addition, the pressure-sensitive adhesive layer 30 can be modified by chemical and physical methods to change the microstructure of the film surface, thereby adjusting the surface energy and producing moderate adhesion to ensure sealing efficiency.

[0042] Further, the pressure-sensitive adhesive layer 30 has a lateral spacing L1 and a longitudinal spacing L2, which have a size ranging from 0.5 to 50 mm and are less than the size of the pocket 40 of the single-row complex derivative packaging web 2 to ensure sealing integrity. The spacing size of the lateral spacing L1 and the longitudinal spacing L2 can be the same or different, and can be adjusted according to packaging requirements. When the adhesive layer 20 is stacked on the lower surface of the light-transmitting substrate layer 10 and sequentially stacked with the pressure-sensitive adhesive layer 30, it can be slightly adhered to the surface of the single-row complex derivative packaging web 1 to form an independent sealing area S. This can ensure the independent sealing properties between the pockets 40 of each single-row complex derivative packaging web, which are not affected by adjacent pockets, effectively preventing the sliding or mixed loading of electronic components.

[0043] Further, in the present application, the lateral spacing L1 and the longitudinal spacing L2 of the pressure-sensitive adhesive layer 30 are usually designed to be less than 5% to 15% of the size of the pocket 40 in the single-row complex derivative packaging web 2, and preferably less than 10%.

[0044] Reference Figure 2 In an embodiment of the present application, the pressure-sensitive adhesive layer 30 is arranged in a strip-like manner with a lateral spacing L1 ranging from 0.5 to 50 mm. The strip-like pressure-sensitive adhesive layer 30 extends uniformly along the longitudinal direction of the single-row complex derivative packaging web special electronic packaging cover tape 1, and the adhesive layers 20 on both sides can be firmly adhered to the carrier tape after heat sealing or pressure bonding, ensuring that the electronic components 50 will not fall off due to shaking during storage. The strip-like arrangement can reduce the use of adhesive materials and reduce manufacturing costs while ensuring appropriate sealing strength.

[0045] Reference Figure 3In another embodiment of the present application, the pressure-sensitive adhesive layer 30 is arranged in a dot pattern, and the horizontal and vertical intervals of the dot pattern are 0.5-50 mm. The dot pattern design improves the uniformity of the seal, enables the pockets 40 of the single-column complex derivative packaging tape 2 to be independently sealed, and accommodates electronic components 50 of different sizes and shapes. At the same time, the dot pattern reduces the bonding area, further reduces the amount of material used, and improves environmental protection and recyclability.

[0046] Reference Figure 4 In another embodiment of the present application, the pressure-sensitive adhesive layer 30 is arranged in a combination of a strip pattern and a dot pattern, the strip pattern provides strong sealing, and the dot pattern ensures that the local seal is not affected.

[0047] Reference Figure 5 In another embodiment of the present application, the pressure-sensitive adhesive layer 30 is arranged in a combination of a strip pattern and a dot pattern, the strip pattern provides strong sealing, and the dot pattern ensures that the local seal is not affected.

[0048] The present application uses a multi-layer composite structure and a local pressure-sensitive adhesive layer arrangement to achieve the following technical effects: the light-transmitting substrate layer has excellent light-transmitting and heat-resistant properties; the adhesive layer has good adhesion after heating or pressing and has an anti-static function, so that the cover tape can be firmly attached to the carrier tape, ensuring stable and reliable packaging.

[0049] The special arrangement of the pressure-sensitive adhesive layer can form an independent sealing area on the packaging tape after being arranged in a dot pattern, a strip pattern, or an interlaced pattern, effectively preventing the electronic components from sliding or being mixed during transportation or storage due to incomplete sealing.

[0050] In addition, by reasonably controlling the thickness of each layer of material and the local arrangement, the amount of material used is reduced, and the overall packaging efficiency is improved, thereby reducing production costs and achieving environmental protection.

[0051] The above description is only intended to explain the preferred embodiments of the present application and is not intended to limit the present application in any form. Therefore, any modification or change related to the present application made under the same creative spirit should still be included in the scope intended to be protected by the present application.

Claims

1. A single-ply complex derivative packaging web-specific electronic packaging cover tape, of a multilayer composite structure, characterized in that, The application relates to a light-transmitting adhesive layer, which comprises the following parts: a light-transmitting substrate layer with light-transmitting and heat-resistant properties; an adhesive layer stacked on the lower surface of the light-transmitting substrate layer; and a pressure-sensitive adhesive layer partially stacked and / or arranged on the lower surface of the adhesive layer. The pressure-sensitive adhesive layer has lateral and / or longitudinal intervals, the range of which is set to 0.5-50 mm to match the pocket size of a single-column complex derivative packaging roll tape, and the lateral and / or longitudinal intervals are smaller than the pocket size of the single-column complex derivative packaging roll tape. The thickness of the light-transmitting substrate layer is set to 10-50 mu m, and the light-transmitting substrate layer comprises plastic film materials, which include at least one of PET, PP, PE, PET / PE or PET / PP. The thickness of the adhesive layer is set to 0.5-50 mm and is smaller than or equal to the thickness of the light-transmitting substrate layer, and the adhesive layer comprises at least one of acrylic glue, silica gel, PU glue, rubber or polymer glue. The adhesive layer further comprises an antistatic coating or antistatic particles. The thickness of the pressure-sensitive adhesive layer is set to 1-20 mu m and is smaller than the thickness of the light-transmitting substrate layer and the adhesive layer, the pressure-sensitive adhesive layer comprises at least one of acrylic glue, silica gel, PU glue, rubber or polymer glue, and the materials selected for the pressure-sensitive adhesive layer and the adhesive layer can be the same or different.

2. The electronic packaging cover tape according to claim 1, characterized by, The size of the lateral and longitudinal intervals of the pressure-sensitive adhesive layer is smaller than the pocket size of the single-column complex derivative packaging roll tape.

3. The electronic packaging cover tape according to claim 1, characterized by, The pressure-sensitive adhesive layer is arranged in a strip-shaped manner and uniformly extends along the longitudinal direction of the single-column complex derivative packaging roll tape special electronic packaging cover tape.

4. The electronic packaging tape of claim 3, wherein, The pressure-sensitive adhesive layer is arranged in a dot-shaped manner or is arranged in a dot-shaped manner in an interlaced manner.

5. The electronic packaging cover tape according to claim 1, wherein The pressure-sensitive adhesive layer is arranged in a combination of a strip-shaped and a dot-shaped manner.

6. The electronic packaging cover tape according to claim 1, wherein The range of the lateral and longitudinal intervals is different.

7. The electronic packaging tape of claim 1, wherein, ​ 8. The electronic packaging tape of claim 1, wherein, ​ 9. The electronic packaging tape of claim 1, wherein, ​ 10. The electronic packaging cover tape according to claim 1, wherein ​

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