Rotary semiconductor element storage structure

Abstract

The utility model discloses a rotary type semiconductor element storage structure, which is used for storing a plurality of exposed semiconductor elements and comprises a cabin body, a storage piece rotating tower and a driving device. The cabin body is a hollow structure which can be closed selectively and is provided with a plurality of partition plates, and the partition plates are used for selectively and spatially separating a containing space and a maintenance area. The wafer storage turret is pivoted in the accommodating space and is provided with a plurality of horizontally-arranged storage positions which are arranged up and down and are used for selectively placing the plurality of exposed semiconductor elements. And the driving device is arranged in the maintenance area and is used for driving the wafer storage rotating tower, so that the wafer storage rotating tower for placing the plurality of exposed semiconductor elements can rotate in situ relative to the cabin body.

Description

TECHNICAL FIELD

[0001] The utility model belongs to a kind of semiconductor element storage technical field, and specifically refers to a kind of rotary semiconductor element storage structure, to be able to be used for saving storage space, and can increase the storage capacity of semiconductor element, with easy access effect simultaneously. BACKGROUND

[0002] With the progress and promotion of network and communication technology, plus the development of smart phones, electric vehicles, IOT Internet of Things and AI intelligent technology, people have obtained more rich and convenient life. These technology products are mainly completed by semiconductor elements, including but not limited to wafer, mask and liquid crystal display panel. According to the current semiconductor element manufacturing technology, the circuit pattern of semiconductor element is transferred to the surface of wafer by photolithography process. Since the circuit pattern line diameter of the aforementioned semiconductor element has developed from micron level to nanometer level, in order to cope with the pollution of particles and harmful gas released in the process to semiconductor element, the pollution control measures in storage, transportation or process become more stringent.

[0003] In a semiconductor device manufacturing factory, in order to maintain the cleanliness of the process, the current approach is mainly through the design of a clean room to cope with, but due to the clean room environment is large, the air circulation between the devices interfere with each other, still easy to affect the cleanliness of the environment. Therefore, the semiconductor device in the non-process phase of storage, transportation need to use another independent clean environment of the device container. For example, the mask is affected by the aforementioned semiconductor device miniaturization, when the mask is contaminated, it will cause the circuit pattern on the wafer surface to be distorted or deformed. In order to maintain the cleanliness of the mask during storage or transportation, it is usually stored in a SEMI standard reticle SMIF pod (RSP) to reduce the attachment of harmful contaminants such as particles, chemicals or gas free molecules in the environment to the surface of the mask to form defects, and finally the mask pod containing the mask is stored in a large storage cabinet (Stocker) storage location. The storage location of the current storage cabinet is arranged in a matrix on one side of the surface, and a mechanical arm that can move forward, backward, left, right and up and down is used to take and place the reticle pod in different storage locations. This will increase the moving distance of the mechanical arm, increase the time of the mechanical arm in taking and placing the reticle pod, reduce the operation efficiency, and also greatly increase the space of each reticle pod storage location. The operation space and carrying capacity of the mechanical arm used to transfer the reticle pod also need to be improved, which increases the difficulty and cost of manufacturing and installing the mechanical arm. In order to maintain the cleanliness of the environment inside each reticle pod, an air charging plate connected to an air charging system is designed on each storage location of the storage cabinet to fill the reticle pod with clean gas, which complicates the structure of the storage cabinet, increases the manufacturing and maintenance cost, and also increases the volume of the storage cabinet. In the same volume, the storage capacity of the semiconductor device storage cabinet will be directly reduced.

[0004] In other words, the current storage cabinet has problems such as low efficiency of taking and placing semiconductor devices, complex structure, large volume and high cost due to the imperfect design of the storage location layout. Therefore, how to solve the above problems is the purpose of the utility model.

[0005] In view of the above shortcomings, the present inventors believe that it is necessary to correct, and based on years of experience in related technology and product design and manufacturing, and in accordance with the excellent design concept, the above-mentioned shortcomings are studied and improved. After continuous efforts, a rotary semiconductor device storage structure is successfully developed to overcome the problems caused by the matrix design of the current storage cabinet. Utility model content

[0006] Therefore, the main purpose of the utility model is to provide a rotary semiconductor element storage structure to move the semiconductor elements in a horizontal position by rotation, reduce the moving distance of the mechanical arm, shorten the time for taking and placing the semiconductor elements, and improve the operation efficiency.

[0007] In addition, the main purpose of the utility model is to provide a rotary semiconductor element storage structure which can greatly simplify the structure of the horizontal storage position, effectively increase the number of horizontal storage positions, save the volume and space of the storage cabinet, and further reduce the manufacturing and maintenance costs of the storage cabinet.

[0008] Furthermore, the main purpose of the utility model is to provide a rotary semiconductor element storage structure which can use the modular design of the horizontal storage position, be easy to install and maintain, remove the particles on the surface of the stored semiconductor elements, improve the cleanliness of the stored semiconductor elements, and reduce the chance of contamination of the stored semiconductor elements.

[0009] Therefore, the main purpose of the utility model is to provide a rotary semiconductor element storage structure to move the semiconductor elements in a horizontal position by rotation, reduce the moving distance of the mechanical arm, shorten the time for taking and placing the semiconductor elements, and improve the operation efficiency.

[0010] Preferably, the film storage turret further has a plurality of film basket groups arranged in an up-down direction, each film basket group has a back plate, two side plates arranged on both sides of the back plate, and a plurality of equal-distance film carriers, the plurality of film carriers are fixed between the back plate and the two side plates in layers to form a plurality of horizontal storage positions.

[0011] Preferably, the film carrier has a back carrier and two side carriers arranged on both sides of the back carrier, each side carrier has at least one supporting protrusion at both ends, which can support the bottom surface of the plurality of exposed semiconductor elements, and each side carrier has at least one side blocking piece on the outer side, which can be used to abut the side edges of the plurality of exposed semiconductor elements to limit the left and right positions of the plurality of exposed semiconductor elements, and each side carrier has a blocking block at the end, which can be used to abut the front and rear edges of the plurality of exposed semiconductor elements, so that the plurality of exposed semiconductor elements can be stably placed on the film carrier.

[0012] Preferably, the side stoppers of the storage board have a guide slope on the inner surface, so that the guide effect can be generated when the plurality of bare semiconductor elements are placed.

[0013] Preferably, each back plate has a plurality of air flow hole slots corresponding to the plurality of flat storage positions, so as to guide the air flow to the surface of the plurality of bare semiconductor elements, effectively reducing the particle adhesion on the surface of the plurality of bare semiconductor elements.

[0014] Preferably, the storage turret further has a shockproof device, which includes a pressing module and a shockproof touch module. The shockproof touch module can act on the pressing module to move up and down, so as to selectively limit the plurality of bare semiconductor elements in the flat storage position.

[0015] Preferably, the pressing module includes a guide column and a plurality of wings. The wings are locked on both sides of the guide column. When the guide column slides up and down, each wing can move relative to the upper surface of each bare semiconductor element between a release position and a limit position. The release position allows the plurality of bare semiconductor elements to move out of the storage board. The limit position limits the plurality of bare semiconductor elements from moving out of the storage board.

[0016] Preferably, each wing has a limit protrusion arranged at the end of each wing. The limit protrusion can be made of PEEK or PEI.

[0017] Preferably, the driving device has a motor element and a manual crank. The motor element can drive the storage turret to rotate relative to the cabin. The manual crank can indirectly drive the storage turret to rotate when the motor element fails.

[0018] Preferably, the driving device further includes a mechanical arm that can move up and down. When the driving device rotates the storage turret to a position corresponding to the mechanical arm, the mechanical arm can move up and down to place or pick up one of the plurality of bare semiconductor elements in one of the designated flat storage positions.

[0019] Preferably, the storage cabin has a receiving space inside, and the top and bottom of the receiving space are respectively provided with an upper convex shaft and a lower convex shaft. The top frame of the cage has a shaft seat supported by a plurality of radial ribs, and the shaft seat has a stepped shaft hole corresponding to the upper convex shaft. The bottom frame of the cage is provided with the bearing lining of the passive group between the lower convex shafts. The passive group is provided with a gear housing outside the bottom frame. The motor element of the driving device can act on a driving gear through a reduction group. The driving gear can engage with the gear housing, so that the storage turret can be actuated by the driving device.

[0020] Preferably, the plurality of shelves on the cage body can be in a segmented structure, and the cage body is provided with at least one middle ring frame between the bottom frame and the top frame, and the plurality of middle ring frames are respectively provided with first and second locking portions corresponding to the first and second mounting portions of the bottom frame and the top frame, so that the plurality of shelves in a segmented structure can be respectively locked between the first mounting portion of the bottom frame, the lower first locking portion of the middle ring frame, the upper second locking portion of the middle ring frame and the second mounting portion of the top frame.

[0021] Preferably, the tablet pressing module of the shockproof device is respectively provided with a corresponding guide seat on the bottom and top frames of the cage body, and the plurality of guide columns are commonly slidably arranged between the plurality of corresponding guide seats. In addition, the plurality of flaps can form at least one flap group, and the at least one flap group is provided with a sleeve that can be locked on the guide column. The shockproof touch module is provided with a plurality of equiangular driving elements around the periphery of the cage body. The plurality of driving elements are fixedly arranged on a fixed seat, and the plurality of driving elements are provided with actuating rods that can be extended and retracted relative to the fixed seat. In addition, the actuating rods of the plurality of driving elements commonly form a pressing ring around the cage body. The shockproof touch module is commonly provided with a linkage plate across the bottom ends of at least two adjacent guide columns, and the outer periphery of the plurality of linkage plates is respectively formed with at least one convex pressing piece that overlaps the pressing ring. A resilient pressing piece is arranged between the relative positions of the at least one convex pressing piece and the pressing ring. When the actuating rods of the plurality of driving elements are retracted to drive the plurality of pressing rings, the plurality of pressing rings can press down the plurality of linkage plates through the plurality of resilient pressing pieces, and the plurality of linkage plates can synchronously drive the relative guide columns to move downward, so as to drive the flap group of the tablet pressing module to move downward to the limiting position through the moving guide columns.

[0022] Preferably, the plurality of linkage plates are respectively provided with an upper buffer and a lower buffer above and below each guide column, so as to reduce the impact force of the flaps of the plurality of flap groups relative to the plurality of semiconductor elements.

[0023] Preferably, the top surface of the top frame of the cage body of the wafer storage turret is provided with a plurality of lifting rings for lifting the cage body upward, so as to facilitate the assembly or maintenance of the passive group at the bottom of the cage body.

[0024] In order to further understand the constitution, features and other purposes of the utility model, the preferred embodiments of the utility model are described below, and the drawings are used for detailed description as follows, and the general technical personnel skilled in the art can be specifically implemented. BRIEF DESCRIPTION OF DRAWINGS

[0025] Figure 1 The utility model discloses a rotating semiconductor element storage structure applied to a storage cabin body.

[0026] Figure 2 The utility model discloses a rotating semiconductor element storage structure, and its relative relationship is illustrated.

[0027] Figure 3 The partial exploded view of the bottom of the rotating semiconductor element storage structure of the utility model is provided for explaining the state of the bottom and the relative relationship thereof.

[0028] Figure 4 The partial exploded view of the bottom of the rotating semiconductor element storage structure of the utility model is provided for explaining the state of the bottom and the relative relationship thereof.

[0029] Figure 5 The partial exploded view of the bottom of the rotating semiconductor element storage structure of the utility model is provided for explaining the state of the bottom and the relative relationship thereof.

[0030] Figure 6 The partial exploded view of the bottom of the rotating semiconductor element storage structure of the utility model is provided for explaining the state of the bottom and the relative relationship thereof.

[0031] Figure 7 The partial exploded view of the bottom of the rotating semiconductor element storage structure of the utility model is provided for explaining the state of the bottom and the relative relationship thereof.

[0032] Figure 8 The partial exploded view of the bottom of the rotating semiconductor element storage structure of the utility model is provided for explaining the state of the bottom and the relative relationship thereof.

[0033] Figure 9 The partial exploded view of the bottom of the rotating semiconductor element storage structure of the utility model is provided for explaining the state of the bottom and the relative relationship thereof.

[0034] Figure 10 The partial exploded view of the bottom of the rotating semiconductor element storage structure of the utility model is provided for explaining the state of the bottom and the relative relationship thereof.

[0035] Figure 11 The partial exploded view of the bottom of the rotating semiconductor element storage structure of the utility model is provided for explaining the state of the bottom and the relative relationship thereof.

[0036] Figure 12 The partial exploded view of the bottom of the rotating semiconductor element storage structure of the utility model is provided for explaining the state of the bottom and the relative relationship thereof.

[0037] Figure 13 The partial exploded view of the bottom of the rotating semiconductor element storage structure of the utility model is provided for explaining the state of the bottom and the relative relationship thereof.

[0038] Figure 14 The partial exploded view of the bottom of the rotating semiconductor element storage structure of the utility model is provided for explaining the state of the bottom and the relative relationship thereof.

[0039] Figure 15 The partial exploded view of the bottom of the rotating semiconductor element storage structure of the utility model is provided for explaining the state of the bottom and the relative relationship thereof.

[0040] Figure 16It is the side view plane schematic diagram of the shockproof device in the rotating semiconductor element storage structure.

[0041] Figure 17 It is the action schematic diagram of the shockproof device in the rotating semiconductor element storage structure, which is used for describing the action state and the relative relationship of the shockproof touch module.

[0042] Mark explanation: 100 - film storage turret;500 - driving device;510 - motor element;520 - speed reduction group;530 - driving gear;540 - manual wheel;550 - manual crank;800 - storage cabin body;801 - storage space;802 - upper convex shaft;803 - lower convex shaft;900 - semiconductor element;10 - cage;11 - bottom frame;110 - first mounting part;12 - top frame;120 - second mounting part;121 - support rib;122 - shaft seat;123 - step shaft hole;15 - basket plate;16 - middle section ring frame;161 - first locking part;162 - second locking part;163 - middle guide seat;18 - first airflow hole groove;19 - lifting ring;20 - passive group;21 - bearing lining;22 - gear sleeve;30 - film storage basket group;31 - film storage box;32 - box back plate;320 - second airflow hole groove;33 - box side plate;330 - through hole;35 - film loading plate;351 - back loading film;352 - side loading film;353 - sky bridge section;36 - limiting part;361 - support convex point;362 - side stop piece;363 - guide inclined surface;365 - stop block;366 - guide inclined surface;50 - shockproof device;51 - film pressing module;52 - guide seat;53 - guide seat;54 - guide column;55 - wing piece group;56 - sleeve;57 - wing piece;58 - limiting convex point;60 - shockproof touch module;61 - driving element;62 - actuator rod;63 - fixed seat;64 - pressing ring;65 - linkage plate;650 - convex pressing piece;66 - elastic pressing element;671 - upper buffer;672 - lower buffer. DETAILED DESCRIPTION

[0043] The utility model provides a kind of rotating semiconductor element storage structure, accompanying drawing example of the specific embodiment and its component of the rotating semiconductor element storage structure of the utility model, all about front and rear, left and right, top and bottom, upper and lower, and horizontal and vertical reference, only for facilitating description, not limit the utility model, also not limit its component to any position or spatial direction.The size specified in drawing and specification can be changed according to the design and demand of the specific embodiment of the utility model when can be within the scope of the utility model, so it is not limited by this structure on patent.

[0044] Please refer to Figure 1 、 Figure 2 And Figure 3As shown, the rotating semiconductor element storage structure of the utility model is composed of a storage piece rotating tower 100, which can be applied to a storage cabin 800 for accommodating a plurality of semiconductor elements 900. The semiconductor elements 900 can be mask dies, and the storage cabin 800 has a selectively closed hollow structure. The storage cabin 800 has a plurality of partitions for selectively isolating at least one accommodation space 801 and a maintenance area. The top and bottom of the accommodation space 801 are respectively provided with an upper convex shaft 802 and a lower convex shaft 803. The storage piece rotating tower 100 is pivotally arranged between the upper convex shaft 802 and the lower convex shaft 803 in the accommodation space 801, so that the storage piece rotating tower 100 can be rotated by a driving device 500. The storage piece rotating tower 100 is composed of a cage 10, a passive group 20, a plurality of longitudinally arranged storage piece baskets 30, and a shockproof device 50.

[0045] As shown in Figure 2 , Figure 3 and Figures 4-5 , the cage 10 is composed of at least a bottom frame 11, a top frame 12, and a plurality of basket plates 15 arranged between the outer profiles of the bottom frame 11 and the top frame 12 (as shown in Figure 3 ). The bottom frame 11 is pivotally arranged on the lower convex shaft 803 by the passive group 20, and the bottom frame 11 has a plurality of equiangular and equidistant first mounting portions 110 (as shown in Figure 5 ) for mounting the basket plates 15. The top frame 12 has an axle seat 122 supported by a plurality of radial support ribs 121, and the axle seat 122 has a stepped shaft hole 123 corresponding to the upper convex shaft 802 (as shown in Figure 6 ). The top frame 12 has a plurality of second mounting portions 120 corresponding to the first mounting portions 110 of the bottom frame 11, for longitudinally locking the basket plates 15 between the first and second mounting portions 110 and 120 of the bottom frame 11 and the top frame 12 (as shown in Figure 3 ). According to some embodiments, the plurality of basket plates 15 can be a segmented structure, as shown in Figure 3 , Figure 7 , wherein the cage 10 has at least one middle ring frame 16 between the bottom frame 11 and the top frame 12, and the middle ring frame 16 has a plurality of first and second locking portions 161 and 162 corresponding to the first and second mounting portions 110 and 120 of the bottom frame 11 and the top frame 12, respectively, for locking the segmented basket plates 15 between the first mounting portions 110 of the bottom frame 11, the lower first locking portions 161 of the middle ring frame 16, the upper second locking portions 162 of the middle ring frame 16, and the second mounting portions 120 of the top frame 12 (as shown in Figure 3Furthermore, according to some embodiments, the middle ring frame 16 can also be provided on the inner edge of the plurality of shelves 15 (not shown). In addition, the outer side surface of the plurality of shelves 15 can be respectively locked with the aforementioned cassette groups 30, and the plurality of shelves 15 are formed with a plurality of first airflow hole slots 18, which can correspond to the surface of each semiconductor element 900 placed in the flat storage position of the aforementioned cassette groups 30 (as shown in Figure 11 ), so as to guide the airflow to blow on the surface of the plurality of exposed semiconductor elements 900, effectively reducing the adhesion of particles on the surface of the plurality of exposed semiconductor elements 900. In addition, the top surface of the aforementioned top frame 12 is provided with a plurality of hanging rings 19 (as shown in Figure 2 、 Figure 6 ), for hanging the cage 10 upward, so as to facilitate the assembly or maintenance of the passive group 20 at the bottom of the cage 10.

[0046] The structure of the passive group 20 is shown in Figure 3 、 Figure 4 and Figure 5 . The passive group 20 is provided with a bearing liner 21 between the lower protruding shaft 803 and the bottom frame 11, and the passive group 20 is locked with a gear cover 22 on the periphery of the bottom frame 11 of the cage 10, so that when the aforementioned driving device 500 engages the gear cover 22 of the bottom frame 11 of the cage 10 (as shown in Figure 8 ), it can synchronously drive the cage 10 to rotate in place relative to the upper and lower protruding shafts 802, 803 of the storage cabin 800 (as shown in Figure 1 、 Figure 2 ).

[0047] In addition, the aforementioned driving device 500 has a motor element 510, as shown in Figure 8As shown, the motor element 510 can drive a driving gear 530 through a reduction gear set 520, and the driving gear 530 can engage with the gear sleeve 22 of the driven set 20, so that the driven set 20 of the cage 10 can be driven by the motor element 510 of the driving device 500. Furthermore, according to some embodiments, the driving device 500 further has a manual crank 550, which can drive the driving gear 530 through a manual wheel 540 engaging the reduction gear set 520, so that when the motor element 510 of the driving device 500 fails, the manual crank 550 can still be manually operated to drive the manual wheel 540 and the reduction gear set 520 to drive the cage 10. In the preferred embodiment, the inside of the storage compartment 800 is further divided into a maintenance area and the aforementioned storage space 801 adjacent to each other and selectively isolated or connected by a plurality of partitions. The motor element 510 of the driving device 500 is arranged in the maintenance area and is spatially independent of the film storage turret 100 inside the storage space 801, which facilitates maintenance personnel to maintain the driving device 500 outside the storage space 801, reducing the risk of external deposition of contaminants polluting the inside of the storage space 801.

[0048] The film storage basket set 30 is arranged on the basket plate 15 of the cage 10, as shown in Figure 9 、 Figure 10 The film storage basket set 30 is arranged on the basket plate 15 of the cage 10, as shown in The plurality of film storage cassettes 31 include a cassette back plate 32 and two cassette side plates 33 arranged on both sides of the cassette back plate 32, wherein the cassette back plate 32 has a plurality of second airflow hole slots 320 corresponding to the first airflow hole slots 18 of the basket plate 15, and the two cassette side plates 33 are respectively formed with a plurality of through holes 330, which allow the shockproof device 50 to extend from the outside to the inside of the plurality of film storage cassettes 31. The plurality of film storage cassettes 31 are further arranged with a plurality of equidistant film loading plates 35 between the cassette back plate 32 and the two cassette side plates 33 to form a plurality of flat storage positions for selectively placing a plurality of bare semiconductor elements. The plurality of film loading plates 35 have a back loading plate 351 and two side loading plates 352 on both sides thereof, wherein the middle section of each side loading plate 352 is bent to form a bridge section 353 to increase the strength of the two sides of the film loading plate 35. A limiting member 36 is arranged on each side loading plate 352 at both ends of the bridge section 353. The plurality of limiting members 36 have at least one support protrusion 361 for supporting the bottom surface of the semiconductor element 900, and the outer edge of the limiting member 36 has at least one side blocking plate 362 for abutting against the side edge of the semiconductor element 900 to limit the left and right positions of the plurality of semiconductor elements 900. The end of the limiting member 36 has a blocking block 365 for abutting against the front and rear edges of the semiconductor element 900 to limit the front and rear positions of the plurality of semiconductor elements 900. The inner surfaces of the side blocking plate 362 and the blocking block 365 are respectively formed with a guide inclined surface 363, 366 (as shown inFigure 11 、 Figure 12 The multiple semiconductor elements 900 are placed to generate a guiding effect, so that the multiple semiconductor elements 900 can be supported by the supporting protrusions 361 of the multiple limiting members 36, and are stably placed on any of the multiple storage plate carriers 35 of the multiple storage cassettes 31, and the multiple limiting members 36 can be made of PEEK or PEI to reduce abrasion and have a conductive effect.

[0049] Further, the shockproof device 50 is arranged between the lower protruding shaft 803 of the cabin 800 and the cage 10, as shown in Figure 13 、 Figure 14 and Figure 15 The shockproof device 50 includes a pressing module 51 that can selectively limit the semiconductor elements 900 in the storage baskets 30, as shown in Figure 9 、 Figure 10 and a shockproof touch module 60 that can act on the pressing module 51, as shown in Figure 13 、 Figure 14 The pressing module 51 has a corresponding guide seat 52, 53 between the first and second mounting portions 110, 120 of the bottom and top frames 11, 12 of the cage 10, and the bottom and top frames 11, 12 have a guide column 54 that is slidably arranged between the corresponding guide seats 52, 53, so that the shockproof touch module 60 can act on the guide column 54 to selectively limit the exposed semiconductor elements in the storage position. According to some embodiments, as shown in Figure 7 The cage 10 has a middle ring frame 16, and the middle ring frame 16 has multiple middle guide seats 163 corresponding to the multiple guide seats 52, 53, so that the guide column 54 can slide through the middle guide seats 163. Further, the guide column 54 has at least one wing group 55 corresponding to the two side storage baskets 30, and the present application mainly uses the wing group 55 corresponding to the multiple storage cassettes 31 of the two side storage baskets 30, and as shown in Figure 10 The multiple wing groups 55 have a sleeve 56 that can be locked on the guide column 54, and the sleeve 56 has multiple wings 57 that can extend into the interior of the storage cassette 31, and the wings 57 have a limiting protrusion 58 corresponding to the multiple semiconductor elements 900, as shown in Figure 9 When the multiple wing groups 55 are driven by the guide column 54, the wings 57 of the multiple wing groups 55 can be in a release position, as shown in Figure 16 and a limiting position, as shown in Figure 17The semiconductor element 900 can be moved between the wafer carrier 35 at the restricted position, while the release position allows the semiconductor element 900 to be removed from the wafer carrier 35. Additionally, the fin assembly 55 or the restricting protrusion 58 can be selected from materials such as PEEK or PEI.

[0050] According to some embodiments, the aforementioned shock-absorbing trigger module 60 is provided with a plurality of equiangular driving elements 61 on the bottom surface of the cabin 800 or the lower convex shaft 803 relative to the periphery of the cage 10, such as... Figure 13 , Figure 14 and Figure 15 As shown, this utility model uses six sets of driving elements 61 as the main embodiment. These driving elements 61 are fixed on a fixed base 63, and each driving element 61 has an actuating rod 62 that can extend and retract relative to the fixed base 63. Furthermore, the actuating rods 62 of the driving elements 61 collectively form a pressure ring 64 surrounding the cage 10. Additionally, the shock-absorbing trigger module 60 has a connecting plate 65 spanning the bottom ends of at least two adjacent guide posts 54. This utility model uses a connecting plate 65 locked between every three guide posts 54 as the main embodiment, resulting in six sets of connecting plates 65 to drive the multiple guide posts 54 respectively, thereby reducing the occurrence of jamming. Furthermore, at least one convex pressure plate 650 is formed on the outer edge of the connecting plate 65, which overlaps with the pressure ring 64. An elastic clamping member 66 is provided between the convex pressure plate 650 and the pressure ring 64 at their relative positions, so that when the actuating rod 62 of the driving element 61 retracts and drives the pressure ring 64, the pressure ring 64 can press the connecting plate 65 downward through the elastic clamping member 66 (e.g., Figure 17 As shown in the figure, the linkage plate 65 can synchronously drive the corresponding guide post 54 to move downward, thereby actuating the blade assembly 55 of the aforementioned pressing module 51 to move downward through the moving guide post 54 (as shown in the figure). Figure 16 , Figure 17 As shown], this allows the vanes 57 of the vane assembly 55 to confine the opposing semiconductor element 900 [e.g., Figure 17 [As shown]. Additionally, the linkage plate 65 is provided with an upper buffer 671 and a lower buffer 672 respectively between each guide post 54 and the upper bottom frame 11 guide seat 52 and the lower gear sleeve 22 [as shown]. Figure 15 , Figure 16 and Figure 17 As shown, the blades 57 of the blade assembly 55 are arranged to reduce the impact force on the semiconductor element 900, thereby forming a rotary semiconductor element storage structure that can increase storage capacity and has shockproof function.

[0051] Through the aforementioned structural design, such as Figure 1 , Figure 2As shown, in operation, when a robotic arm (not shown) with a transfer module is needed to place or pick up an exposed semiconductor element 900 on the wafer storage turret 100, the motor element 510 of the drive unit 500 is activated, and the drive gear 530 is rotated through the reduction gear 520 (e.g., ...). Figure 8 As shown, since the active gear 530 can mesh with the gear sleeve 22 of the passive assembly 20 at the bottom of the cage 10 of the chip storage turret 100, the cage 10 of the chip storage turret 100 can be driven by the motor element 510 of the drive device 500. This allows the cage 10 of the chip storage turret 100 to rotate coaxially between the upper and lower convex shafts 802 and 803 of the compartment 800, so that the designated chip storage basket group 30 on the cage 10, which holds the aforementioned semiconductor element 900, can rotate to the position of the corresponding robotic arm. The robotic arm can then move up and down to the height of the chip storage carrier plate 35 corresponding to the chip storage box 31 containing the aforementioned semiconductor element 900 in the chip storage basket group 30, so that the robotic arm can place or grasp the semiconductor element 900 relative to the chip storage carrier plate 35.

[0052] Taking the placement of a semiconductor element 900 on a flat storage position of the wafer carrier 35 in the wafer cassette 31 as an example, such as Figures 9-12 As shown, when the semiconductor element 900 is placed from top to bottom on the wafer carrier plate 35 of the corresponding wafer cassette 31, the side baffle 362 of the upper limit member 36 of the wafer carrier plate 35 and the guiding inclined surfaces 363 and 366 of the stop block 365 can be used to effectively guide the placement position of the semiconductor element 900, and allow the lower surface of the semiconductor element 900 to be supported by the support protrusion 361 of the limit member 36, so that the semiconductor element 900 can be stably placed in the corresponding wafer carrier plate 35. Since the cage plate 15 of the cage body 10 and the back plate 32 of the wafer cassette 31 have corresponding first and second airflow slots 18 and 320 (as shown in the figure), the semiconductor element 900 can be effectively guided by the side baffle 362 of the upper limit member 36 of the wafer carrier plate 35 and the guiding inclined surfaces 363 and 366 of the stop block 365. Figure 12 As shown, the first and second airflow slots 18 and 320 correspond to the upper surface of the semiconductor element 900 on the chip carrier plate 35 of the chip storage box 31, so that when the gas passes through the aforementioned first and second airflow slots 18 and 320, it can generate a blowing airflow relative to the upper surface of the semiconductor element 900, which can effectively reduce the adhesion of particles to the semiconductor element 900 during the storage process.

[0053] Furthermore, such as Figures 13-17As shown, during the process of storing the semiconductor elements 900 in the storage cassette turret 100, if an earthquake occurs and the earthquake intensity exceeds the system setting value, the shockproof device 50 can start the driving element 61 of the pressing cassette module 51 to drive the pressing ring 64 to displace downward through the actuating rod 62, so that the pressing ring 64 can press the elastic pressing catch 66 on the convex pressing cassette 650 of the linkage plate 65 synchronously, so that the linkage plate 65 can synchronously drive the relative guide column 54 to displace downward. When the guide column 54 displaces downward, the guide column 54 can synchronously actuate the fin group 55 locked thereon to displace downward. Since the fin group 55 has a plurality of equidistant fins 57 on both sides, and the plurality of fins 57 are above the semiconductor elements 900 located on the opposite storage cassette carrier 35 of the storage cassette 31 (as shown in Figure 16 ), the fins 57 of the fin group 55 can limit the relative semiconductor elements 900. Furthermore, since the upper and lower sides of the plurality of linkage plates 65 are respectively provided with upper and lower buffer members 671 and 672 (as shown in Figure 15 ), the impact force of the plurality of fins 57 of the fin group 55 on the plurality of semiconductor elements 900 can be reduced. When the earthquake intensity exceeds the setting value, the shockproof device 50 can start the pressing cassette module 51 to actuate the shockproof triggering module 60 to limit the semiconductor elements 900 (as shown in Figure 16 , Figure 17 ), so as to avoid the semiconductor elements 900 from falling out of the storage cassette turret 100.

[0054] According to the above description, the rotary semiconductor element storage structure can be actuated by the driving device 500 to rotate in place, so that the storage basket group 30 on the cage 10 of the storage cassette turret 100 can correspond to the mechanical arm, so that the mechanical arm can move up and down to grab the semiconductor elements 900 in the storage cassette 31 of the storage cassette carrier 35. Not only can the structure be simplified, but also the semiconductor elements 900 can be conveniently placed and grabbed, and the storage capacity of the storage cassette turret 100 can be greatly increased.

[0055] At the same time, since the basket plate 15 of the cage 10 and the plurality of storage cassettes 31 have opposite first and second airflow hole grooves 18 and 320 (as shown in Figure 12As shown, and the first, second airflow hole groove 18, 320 can be corresponding to the semiconductor device 900 surface on the relative storage plate carrier 35, so that the gas can be blown to the semiconductor device 900 through the first, second airflow hole groove 18, 320, can effectively reduce the plurality of semiconductor device 900 particle adhesion, while using the plurality of storage plate carrier 35 on the storage plate magazine 31 design, the plurality of limiting member 36 can be used with side stop sheet 362 and stop block 365 to correct the position relative to the semiconductor device 900, and using the plurality of limiting member 36 support convex point 361 to reduce the area of contact with the plurality of semiconductor device 900, effectively reduce the friction relative to the semiconductor device 900, effectively improve the plurality of semiconductor device 900 in the storage process of cleanliness.

[0056] Furthermore, the storage carousel 100 is additionally provided with a shockproof device 50, so that when the earthquake intensity exceeds the set value, the pressing plate module 51 can be actuated by the shockproof touch module 60, so that the wing plate 57 of the wing plate group 55 on the guide column 54 of the pressing plate module 51 can limit the semiconductor device 900 on the plurality of storage plate carrier 35, to avoid the plurality of semiconductor device 900 from falling out of the storage carousel 100 when the earthquake occurs, effectively improving the safety of the plurality of semiconductor device 900 in the storage process.

[0057] The above-mentioned embodiments are only preferred embodiments of the present application, and should not be used to limit the protection scope of the present application, but any modification or polishing without substantial meaning made in the main design idea and spirit of the present application, the technical problems solved are still consistent with the present application, and should be included in the protection scope of the present application.

[0058] In summary, it can be understood that the present application is a very good creative utility model, which effectively solves the problems faced by the prior art, greatly improves the efficiency, and has not seen the same or similar products or public use in the same technical field, while improving the efficiency.

Claims

1. A rotating semiconductor device storage structure for storing multiple exposed semiconductor devices, characterized in that, The rotating semiconductor device storage structure includes: A cabin is a hollow structure that can be selectively enclosed, with multiple partitions to selectively separate a storage space and a maintenance area; A wafer storage turret is pivotally mounted within the storage space and has multiple horizontally arranged storage positions for selective placement of the multiple exposed semiconductor devices. and A drive unit, located within the maintenance area, is used to drive the wafer turret so that the wafer turret, which holds the plurality of exposed semiconductor components, can rotate in place relative to the compartment.

2. The rotating semiconductor device storage structure according to claim 1, characterized in that, The storage turret also has multiple storage baskets arranged vertically. Each storage basket has a back plate, two side plates located on both sides of the back plate, and multiple equidistant storage plates. The multiple storage plates are fixed in layers between the back plate and the two side plates to form multiple flat storage positions.

3. The rotating semiconductor device storage structure according to claim 2, characterized in that, The multiple chip carriers have a back carrier and two side carriers disposed on both sides of the back carrier. Each side carrier has a limiting member at both ends. Each limiting member has at least one supporting protrusion to support the bottom surface of the multiple exposed semiconductor elements. Each limiting member has at least one side baffle on its outer edge for the side of the multiple exposed semiconductor elements to abut against, thereby limiting the left and right position of the multiple exposed semiconductor elements. Each limiting member has a stop block at its end for the front and rear rear edges of the multiple exposed semiconductor elements to abut against, so that the multiple exposed semiconductor elements can be stably placed on the multiple chip carriers.

4. The rotating semiconductor element storage structure according to claim 3, characterized in that, The side baffles and the block of the multiple chip carriers each have a guiding slope on their inner surfaces to provide a guiding effect when the multiple exposed semiconductor devices are placed.

5. The rotating semiconductor device storage structure according to claim 2, characterized in that, Each of the backplates has multiple airflow slots corresponding to the multiple flat storage positions to guide airflow toward the multiple exposed semiconductor device surfaces, thereby effectively reducing particle adhesion to the multiple exposed semiconductor device surfaces.

6. The rotating semiconductor device storage structure according to claim 2, characterized in that, The wafer storage turret also has a shock-absorbing device, which includes a wafer pressing module and a shock-absorbing trigger module. The shock-absorbing trigger module can actuate the wafer pressing module to move up and down, so as to selectively restrict the multiple exposed semiconductor elements in the multiple horizontal storage positions.

7. The rotating semiconductor device storage structure according to claim 6, characterized in that, The pressing module includes a guide post and multiple blades. The multiple blades are locked on both sides of the guide post so that when the guide post slides up and down, each blade can move between a release position and a restriction position relative to the upper surface of each exposed semiconductor element. The release position allows the multiple exposed semiconductor elements to be removed from the wafer carrier, and the restriction position prevents the multiple exposed semiconductor elements from being removed from the wafer carrier.

8. The rotating semiconductor device storage structure according to claim 7, characterized in that, Each of the blades has a limiting protrusion disposed at the end of each blade, the limiting protrusion being made of PEEK or PEI material.

9. The rotating semiconductor device storage structure according to claim 1, characterized in that, The drive unit has a motor element and a manual crank. The motor element can drive the turret to rotate in place relative to the compartment. The manual crank can indirectly drive the turret to rotate manually when the motor element fails.

10. The rotating semiconductor device storage structure according to claim 9, characterized in that, It also includes a robotic arm that can move up and down, so that when the drive device rotates the chip storage turret to the position corresponding to the robotic arm, the robotic arm can move up and down to place or pick up one of the plurality of exposed semiconductor components at one of the designated flat storage positions.

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