Rapid cooling device for modified resin

Abstract

The utility model discloses a quick cooling device for modified resin, which comprises an accommodating tank, a cooling box arranged below the accommodating tank and a cooling mechanism arranged in the cooling box, the cooling mechanism comprises cooling liquid, a blanking pipe, a booster pump, a spiral pipe, a connecting pipe, a lifting pipe, an electric valve A, an electric valve B and a temperature sensor; modified resin is pressurized through a booster pump, enters a spiral pipe through a discharging pipe, rotationally advances through the spiral pipe, makes contact with cooling liquid and is subjected to heat dissipation through the cooling liquid, the heat dissipation uniformity is guaranteed, the modified resin enters a connecting pipe after being cooled, a temperature sensor measures the temperature of the modified resin at the moment, and when the temperature does not reach the specified temperature, the modified resin enters the spiral pipe. And the electric valve A is opened, the electric valve B is closed, the modified resin returns to the containing tank again through the lifting pipe to be cooled again, on the contrary, the modified resin is discharged through the connecting pipe, and the intelligent degree of the rapid cooling device for the modified resin is improved.

Description

TECHNICAL FIELD

[0001] The utility model relates to modified resin quick cooling technical field especially, a kind of quick cooling device for modified resin. BACKGROUND

[0002] Epoxy resin is a kind of high molecular polymer, molecular formula is (C11 H12O3) n, refers to the general term of a kind of polymer containing two or more epoxy groups in molecule. It is the polycondensation product of epichlorohydrin and bisphenol A or polyol. Due to the chemical activity of epoxy group, it can be ring-opened by various compounds containing active hydrogen, and crosslinking is cured to form a network structure, so it is a thermosetting resin. Bisphenol A type epoxy resin not only has the largest output, the most complete variety, and new modified variety is still increasing, and quality is constantly improved.

[0003] In the prior art, the Chinese utility model patent with the authorization announcement No.CN214266260U relates to a kind of quick cooling device for modified epoxy resin processing, including cooling box, fan and rotating shaft, the top of cooling box is equipped with opening, and opening both side wall surfaces are equipped with sliding slot, sliding fit has baffle in sliding slot, fan is set in the top of cooling box, and the output of fan is connected with wind pipe, and the end of wind pipe is equipped with air outlet plate, rotating shaft is transversely connected in cooling box, and rotating shaft is equipped with multiple connecting rods, and the end of connecting rod is equipped with stirring blade, the bottom of air outlet plate is equipped with multiple air outlet heads, the side of cooling box is equipped with motor, and the output shaft of motor is connected with rotating shaft by coupling. The utility model can make that epoxy resin raw materials in cooling box can be stirred and heat dissipation, cooperate air outlet head and blow out to cool epoxy resin raw materials in cooling box, improve cooling efficiency.

[0004] Compared with prior art, the problems are: the existing part of modified epoxy resin processing cooling device in the process of cooling modified resin is poor to the uniformity of resin cooling and cannot the temperature of resin is perceived in real time, causing the intelligent degree of modified resin cooling is poor.

[0005] Therefore, a kind of quick cooling device for modified resin is needed. UTILITY MODEL CONTENT

[0006] The utility model aims at overcoming the deficiencies of prior art, provide a kind of quick cooling device for modified resin.

[0007] The utility model solves its technical problem is through following technical scheme realization: including containing jar, the cooling box of installing in containing jar below and setting up in cooling box inside cooling mechanism, be used for to the quick cooling of modified resin, cooling mechanism includes cooling liquid, the cooling liquid fills in the inside of cooling box, the below of containing jar is provided with downcomer, one side of downcomer is provided with booster pump, one end of downcomer is provided with spiral pipe, one end of spiral pipe is provided with connecting pipe, one end of connecting pipe is provided with lift pipe, one end of lift pipe is provided with electric valve A, one end of connecting pipe is provided with electric valve B, the inside of connecting pipe is provided with temperature sensor.

[0008] As a further scheme of the utility model: the lower portion of the cooling box is provided with a cooling mechanism for cooling the cooling liquid, the cooling mechanism comprises a plurality of air outlet pipes, the air outlet pipes are fixed to the bottom of the cooling box by bolts, a booster box is arranged below the air outlet pipes, one end of the booster box is provided with a main air pipe, one end of the main air pipe is provided with an air pump, and a refrigeration machine is arranged outside the main air pipe.

[0009] As a further scheme of the utility model: a stirring mechanism is arranged on the top of the cooling box for stirring the cooling liquid, the stirring mechanism comprises a driving motor, the driving motor is fixed to the upper portion of the cooling box by bolts, a stirring rod is arranged at the rotating end of the driving motor, and a plurality of blades are uniformly arranged outside the stirring rod.

[0010] As a further scheme of the utility model: one end of the air outlet pipe is provided with a reverse blocking cover for preventing the cooling liquid from flowing back.

[0011] As a further scheme of the utility model: one end of the main air pipe is provided with an air filter.

[0012] As a further scheme of the utility model: a plurality of heat dissipation fins are arranged outside the cooling box, and a transparent observation window is arranged at the middle position of the cooling box.

[0013] As a further scheme of the utility model: an adding hopper is arranged above the containing jar.

[0014] As described above, due to the adoption of the above technical scheme, the utility model has the beneficial effects that:

[0015] 1. Through the setting of the booster pump, the modified resin is pressurized by the booster pump, enters the spiral pipe through the discharge pipe, and the modified resin rotates forward through the spiral pipe, contacts the cooling liquid, and is cooled by the cooling liquid, which ensures the uniformity of heat dissipation, and the modified resin enters the connecting pipe after cooling, the temperature sensor measures the temperature of the modified resin at this time, when the temperature does not reach the specified temperature, the electric valve A is opened, the electric valve B is closed, the modified resin returns to the containing tank through the lifting pipe again, and is cooled again, otherwise, the modified resin is discharged through the connecting pipe, which improves the intelligent degree of the modified resin rapid cooling device.

[0016] 2. Through the setting of the refrigeration machine, the refrigeration machine cools the air, under the pressurization of the air pump, the high-pressure cooling air is sprayed out through the booster box and multiple air outlet pipes, so as to cool the cooling liquid, the driving motor drives multiple blades to rotate through the stirring rod, and the cooling liquid is stirred, so that the cooling liquid is prevented from being heated, and the cooling effect of the modified resin is ensured. BRIEF DESCRIPTION OF DRAWINGS

[0017] Figure 1 An isometric structure schematic diagram is shown according to the embodiment of the utility model;

[0018] Figure 2 An isometric structure schematic diagram is shown according to the embodiment of the utility model; Figure 1 A partial enlarged structure schematic diagram at A in the middle is shown;

[0019] Figure 3 A side view cross-sectional structure schematic diagram is shown according to the embodiment of the utility model;

[0020] Figure 4 A front view cross-sectional structure schematic diagram is shown according to the embodiment of the utility model;

[0021] Figure 5 An isometric structure schematic diagram is shown according to the embodiment of the utility model; Figure 3 A partial enlarged structure schematic diagram at B in the middle is shown.

[0022] LEGEND:

[0023] 100, containing tank; 200, cooling box; 300, reverse cover; 400, air filter; 500, heat dissipation fin; 600, transparent observation window; 700, adding hopper;

[0024] 101, cooling liquid; 102, discharge pipe; 103, booster pump; 104, spiral pipe; 105, connecting pipe; 106, lifting pipe; 107, electric valve A; 108, electric valve B; 109, temperature sensor;

[0025] 201, air outlet pipe; 202, booster box; 203, main air pipe; 204, air pump; 205, refrigeration machine;

[0026] 301. Drive motor; 302. Stirring rod; 303. Blade. Detailed Implementation

[0027] In the following description, only certain exemplary embodiments are briefly described. As those skilled in the art will recognize, the described embodiments can be modified in various ways without departing from the spirit or scope of this invention. Therefore, the drawings and description are considered exemplary in nature and not restrictive.

[0028] In this invention, unless otherwise explicitly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature directly above or diagonally above the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0029] The embodiments of this utility model will now be described in detail with reference to the accompanying drawings.

[0030] Example 1:

[0031] like Figures 1-4 As shown, a rapid cooling device for modified resin includes a container tank 100, a cooling box 200 installed below the container tank 100, and a cooling mechanism disposed inside the cooling box 200 for rapid cooling of the modified resin. The cooling mechanism includes a coolant 101, which is filled inside the cooling box 200. A feed pipe 102 is welded to the bottom of the container tank 100. A booster pump 103 is bolted to one side of the feed pipe 102. A spiral tube 104 is bolted to one end of the feed pipe 102. A connecting pipe 105 is bolted to one end of the spiral tube 104. A lifting pipe 106 is bolted to one end of the connecting pipe 105. An electric valve A107 is bolted to one end of the lifting pipe 106. An electric valve B108 is bolted to one end of the connecting pipe 105. A temperature sensor 109 is bolted inside the connecting pipe 105. An adding hopper 700 is bolted to the top of the container tank 100.

[0032] In this embodiment, a booster pump 103 is provided to pressurize the modified resin, which then enters the spiral tube 104 through the feed pipe 102. The modified resin rotates and advances through the spiral tube 104, contacting the coolant 101 and dissipating heat through the coolant 101, ensuring uniform heat dissipation. After cooling, the modified resin enters the connecting pipe 105, where the temperature sensor 109 measures the temperature. If the temperature does not reach the specified temperature, the electric valve A107 opens and the electric valve B108 closes, allowing the modified resin to return to the receiving tank 100 through the riser pipe 106 for further cooling. Conversely, if the temperature reaches the specified temperature, the modified resin is discharged through the connecting pipe 106, improving the intelligence level of the rapid cooling device for modified resin.

[0033] Example 2:

[0034] like Figures 1-5 As shown, a rapid cooling device for modified resins includes a cooling mechanism located below a cooling tank 200 for cooling a coolant 101. The cooling mechanism includes multiple vent pipes 201, which are bolted to the bottom of the cooling tank 200. One end of each vent pipe 201 is bolted to a backflow preventer 300 to prevent backflow of the coolant 101. A booster box 202 is bolted below each vent pipe 201. A main air pipe 203 is welded to one end of the booster box 202, and an air pump 204 is bolted to one end of the main air pipe 203. The outer side of the main air pipe 203 is bolted... A refrigeration unit 205 is provided. An air filter 400 is fixed to one end of the main air pipe 203 by bolts. A stirring mechanism is provided on the top of the cooling box 200 for stirring the coolant 101. The stirring mechanism includes a drive motor 301, which is fixed to the top of the cooling box 200 by bolts. A stirring rod 302 is fixed to the rotating end of the drive motor 301 by bolts. Multiple blades 303 are evenly welded to the outside of the stirring rod 302. Multiple heat dissipation fins 500 are fixed to the outside of the cooling box 200 by bolts. A transparent observation window 600 is fixed to the middle position of the cooling box 200 by bolts.

[0035] In this embodiment, a chiller 205 is provided to cool the air. Under the pressure boosting action of the air pump 204, the high-pressure cooling air is sprayed out through the pressurization box 202 and multiple air outlet pipes 201, thereby cooling the coolant 101. The drive motor 301 drives multiple blades 303 to rotate through the stirring rod 302 to stir the coolant 101, preventing heat accumulation in the coolant 101 and ensuring the cooling effect of the modified resin.

[0036] The above merely describes a preferred embodiment of the present application, and the protection scope of the present application is not limited thereto, and any skilled person in the art, according to the technical scheme and the inventive concept of the present application, makes equivalent replacement or change within the technical range disclosed by the present application, which should be covered within the protection scope of the present application.

Claims

1. A rapid cooling device for modifying a resin, characterized by, The application discloses a modified resin cooling device, which comprises a containing tank (100), a cooling box (200) installed below the containing tank (100), and a cooling mechanism arranged inside the cooling box (200) and used for rapid cooling of the modified resin, The cooling mechanism comprises cooling liquid (101) filled in the inside of the cooling box (200), a discharging pipe (102) arranged below the containing tank (100), a booster pump (103) arranged on one side of the discharging pipe (102), a spiral pipe (104) arranged at one end of the discharging pipe (102), a connecting pipe (105) arranged at one end of the spiral pipe (104), a lifting pipe (106) arranged at one end of the connecting pipe (105), an electric valve A (107) arranged at one end of the lifting pipe (106), an electric valve B (108) arranged at one end of the connecting pipe (105), and a temperature sensor (109) arranged in the inside of the connecting pipe (105).

2. A device for rapid cooling of a modified resin according to claim 1, characterized in that, A cooling mechanism is arranged below the cooling box (200) and used for cooling of the cooling liquid (101), The cooling mechanism comprises a plurality of air outlet pipes (201) fixed on the bottom of the cooling box (200) through bolts, a booster box (202) arranged below the air outlet pipe (201), a main air pipe (203) arranged at one end of the booster box (202), an air pump (204) arranged at one end of the main air pipe (203), and a refrigerating machine (205) arranged on the outer side of the main air pipe (203).

3. A device for rapid cooling of a modified resin according to claim 1, characterized in that, A stirring mechanism is arranged on the top of the cooling box (200) and used for stirring of the cooling liquid (101), The stirring mechanism comprises a driving motor (301) fixed above the cooling box (200) through bolts, and a stirring rod (302) arranged at the rotating end of the driving motor (301), wherein a plurality of blades (303) are uniformly arranged on the outer side of the stirring rod (302).

4. A rapid cooling device for modifying resin according to claim 2, characterized in that, One end of the air outlet pipe (201) is provided with a reverse blocking cover (300) for preventing the cooling liquid (101) from flowing backward.

5. A rapid cooling device for modifying resin according to claim 2, characterized in that, One end of the main air pipe (203) is provided with an air filter (400).

6. A rapid cooling device for modifying resin according to claim 1, characterized in that, The outer side of the cooling box (200) is provided with a plurality of heat dissipation fins (500), and a transparent observation window (600) is arranged at the middle position of the cooling box (200).

7. A rapid cooling device for modifying resin according to claim 1, characterized in that, An adding hopper (700) is arranged above the containing tank (100).

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