Solder paste thickness gauge

The automatic calibration and positioning of the solder paste thickness gauge is achieved by using a robotic arm and an automatic positioning device, which solves the problems of increased labor intensity and low efficiency caused by manual calibration in the existing technology, and improves the efficiency of solder paste thickness measurement.

CN223954896UActive Publication Date: 2026-02-27CHONGQING BAO YI ELECTRONIC CO LTD
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Patent Information

Application Number
CN202520610070.2
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2025-04-02
Publication Date
2026-02-27
Estimated Expiration
2035-04-02

AI Technical Summary

Technical Problem

Existing solder paste thickness gauges require manual placement and calibration of PCB boards, which increases labor intensity and reduces efficiency, especially when a large number of PCB boards need to be measured.

Method used

The system uses a robotic arm to drive a thickness detector, combined with a stop, support, and lifting wheel design to achieve automatic positioning and clamping of the PCB board. The PCB board is transported by a conveyor belt, and the robotic arm and telescopic rod work together to achieve automatic calibration and positioning of the PCB board.

Benefits of technology

It enables automatic positioning and clamping of PCB boards, reducing the labor intensity of workers and improving the efficiency of solder paste thickness measurement.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model provides a solder paste thickness gauge, which comprises a mounting rack, a thickness detector arranged on the mounting rack through a mechanical arm, a cavity arranged at the bottom of the mounting rack and used for a conveying belt to pass through, and two groups of backstop seats arranged oppositely and arranged on the mounting rack at intervals, the opposite faces of the two sets of stop seats are provided with inclined faces, stop blocks are arranged at the tops of the inclined faces, two sets of supporting seats are arranged on the inner side of the mounting frame in a lifting and relative sliding mode, two sets of rotatable lifting wheels are arranged on the supporting seats, annular grooves are formed in the outer circle faces of the lifting wheels, and the multiple sets of annular grooves are located in the same plane. The thickness of the solder paste on the PCB is detected through the solder paste thickness gauge, automatic positioning in the length direction of the PCB can be achieved, manual positioning by workers in the solder paste thickness measuring process is not needed, the labor intensity of the workers is effectively reduced, and the solder paste thickness measuring efficiency is improved.
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Description

TECHNICAL FIELD

[0001] The utility model relates to electronic component technical field, concretely relates to a tin cream thickness gauge. BACKGROUND

[0002] In the electronic manufacturing industry, tin cream printing is one of the key processes of surface mount technology (SMT). Accurate tin cream thickness is crucial for reliable welding of electronic components. If the tin cream thickness is too thin, it may lead to insufficient solder joint strength, resulting in problems such as loose soldering and open circuit during the use of electronic products, affecting product stability and service life; while the tin cream thickness is too thick, it may cause short circuit and other adverse phenomena, also reducing the quality and performance of electronic products, so it is necessary to detect the thickness of the tin cream on the PCB.

[0003] For example, the Chinese utility model patent with publication number CN221882385U provides a PCB tin cream thickness testing device. When in use, two clamping blocks are slidably arranged on a sliding plate. According to the size of the PCB, a driving mechanism drives the two clamping blocks to form a fixed clamping on the PCB. The entire fixed clamping process is not limited by the size of the PCB. For example, the Chinese utility model patent with publication number CN218765195U provides a tin cream thickness detection device. When in use, a motor controls the rotation of a lead screw, thereby realizing the opposite movement of four limiting plates to limit and clamp the four corners of the electronic component, so as to fix the PCB.

[0004] However, the current tin cream thickness gauge is mostly placed and positionally calibrated by manual operation when in use. When the number of PCBs that need to be measured is large, automatic calibration of the PCBs cannot be realized, resulting in increased labor intensity of the workers and reduced tin cream thickness measurement efficiency. UTILITY MODEL CONTENTS

[0005] In view of the deficiencies of the prior art, the utility model provides a tin cream thickness gauge to solve the technical problem that the current tin cream thickness gauge is mostly placed and positionally calibrated by manual operation when in use, and when the number of PCBs that need to be measured is large, automatic calibration of the PCBs cannot be realized, resulting in increased labor intensity of the workers and reduced tin cream thickness measurement efficiency.

[0006] To achieve the above-mentioned purpose, the utility model provides the following technical scheme. A tin cream thickness gauge comprises:

[0007] A mounting frame is provided with a thickness detector installed by a mechanical arm on the mounting frame. The bottom of the mounting frame is provided with a cavity for the conveying belt to pass through.

[0008] The stop seats are oppositely arranged and are arranged on the mounting frame at intervals, opposite surfaces of the two groups of stop seats are arranged with inclined surfaces, and the top of the inclined surfaces is provided with a stop block.

[0009] The support seats are oppositely arranged and are arranged on the mounting frame at intervals, opposite surfaces of the two groups of stop seats are arranged with inclined surfaces, and the top of the inclined surfaces is provided with a stop block.

[0010] In a preferred embodiment, the mounting frame is provided with a vertically arranged first telescopic rod, and the telescopic end of the first telescopic rod is provided with a receiving frame, and the support seat is arranged on the receiving frame.

[0011] In a preferred embodiment, the receiving frame is provided with a horizontally arranged second telescopic rod, and the support seat is arranged at the telescopic end of the second telescopic rod.

[0012] In a preferred embodiment, one group of the stop seats is slidably and fixedly arranged on the mounting frame.

[0013] In a preferred embodiment, the two ends of the mounting frame are provided with positioning grooves, the two ends of the stop seat are slidably clamped in the positioning grooves, and the two ends of the stop seat are screwed with a threaded knob, and the inner side of the threaded knob abuts against the mounting frame.

[0014] In a preferred embodiment, the support seat is provided with a mounting frame, one side of the mounting frame is slidably provided with a rack, the lifting wheel is provided with a gear, the gear is engaged with the rack, the rack is provided with a baffle, the baffle is provided with elastic members on both sides, and the end of the elastic member abuts against the inner wall of the mounting frame.

[0015] Compared with the prior art, the utility model has the following beneficial effects:

[0016] The thickness detector can be driven by the mechanical arm to move to measure the thickness of the solder paste on the PCB, in use, it is installed above the conveying belt conveying the PCB, and the two ends of the PCB are extended out of the conveying belt, the PCB is intermittently conveyed by the conveying belt, when the PCB to be detected is conveyed to the inner side of the mounting frame, the two groups of support seats are simultaneously controlled to slide inward by a specified distance to clamp the two ends of the PCB by the lifting wheels, the PCB is located in the annular groove, so that the PCB is automatically positioned in the width direction, then the two groups of support seats are controlled to move upward to drive the PCB to ascend by a specified distance, in the process of ascending, one end of the PCB is abutted by the inclined surface and slides in the annular groove, until the PCB is abutted by the stop block, so that the automatic positioning of the PCB in the length direction is realized, so that the workers do not need to manually position in the process of measuring the thickness of the solder paste, the labor intensity of the workers is effectively reduced, and the efficiency of measuring the thickness of the solder paste is improved. BRIEF DESCRIPTION OF DRAWINGS

[0017] In order to more clearly illustrate the specific embodiments of the present application, the drawings needed in the specific embodiments will be briefly introduced below. In all the drawings, various elements or parts are not necessarily drawn according to the actual proportion.

[0018] Figure 1 A perspective structural schematic view of the solder paste thickness detector provided by the present application is provided.

[0019] Figure 2 A sectional view of the solder paste thickness detector of the present application is provided.

[0020] Figure 3 A structure schematic view of the solder paste thickness detector of the present application after part disassembly is provided.

[0021] Reference signs:

[0022] 1, mounting frame; 2, thickness detector; 3, stop seat; 4, inclined surface; 5, stop block; 6, first telescopic rod; 7, receiving frame; 8, second telescopic rod; 9, mounting frame; 10, support seat; 11, lifting wheel; 12, annular groove; 13, gear; 14, rack; 15, baffle; 16, elastic member; 17, positioning groove; 18, threaded knob. DETAILED DESCRIPTION

[0023] The present application will be further described in detail below with reference to the drawings, it is necessary to point out that the following specific embodiments are only used to further illustrate the present application, and cannot be understood as the limitation of the protection scope of the present application, the skilled in the art can make some non-essential improvements and adjustments to the present application according to the above application content.

[0024] Embodiment:

[0025] As Figure 1 shown, the utility model provides a kind of solder paste thickness gauge, including mounting frame 1, thickness detector 2 is installed by mechanical arm and is provided on mounting frame 1, the bottom of mounting frame 1 is provided with the cavity for the conveyor belt (not shown in drawing) passes through, in use, mounting frame 1 is fixedly installed in the upper of conveyor belt of conveying PCB board, PCB board is conveyed by conveyor belt, and the two ends of PCB board are exposed with the two sides of conveyor belt, to facilitate clamping PCB board. Thickness detector 2 can be moved by mechanical arm, to measure the thickness of solder paste on PCB board, wherein, it can be understood that the control of mechanical arm and the working principle of thickness detector 2 are the common technical means in the art, and here is not repeated.

[0026] As Figure 1 、 2 shown, in the embodiment, two groups of stop seats 3 are oppositely arranged on mounting frame 1, two groups of stop seats 3 are arranged at intervals, and inclined surfaces 4 are arranged on the opposite surfaces of the two groups of stop seats 3, and stop blocks 5 are arranged on the top of the inclined surfaces 4. One group of stop seats 3 is slidably and fixedly arranged on mounting frame 1, positioning grooves 17 are formed at the two ends of mounting frame 1, the two ends of stop seat 3 are slidably clamped in the positioning grooves 17, threaded knobs 18 are screwed at the two ends of stop seat 3, and the inner side of threaded knob 18 abuts against mounting frame 1.

[0027] The distance between the two groups of stop seats 3 can be adjusted according to the thickness of the PCB board to be measured, when adjusting, loosen the threaded knob 18 and make one group of stop seats 3 slide along the positioning groove 17, until the distance between the top ends of the inclined surfaces 4 of the two groups of stop seats 3 is the same as the length of the PCB board, and then tighten the threaded knob 18 to fix the position of the stop seat 3.

[0028] As Figure 2 、 3 shown, in the embodiment, two groups of support seats 10 are slidably arranged on the inner side of mounting frame 1, two groups of rotatable lifting wheels 11 are arranged on the support seats 10, annular grooves 12 are arranged on the outer circular surface of the lifting wheels 11, and a plurality of annular grooves 12 are located on the same plane. A first telescopic rod 6 is arranged vertically on mounting frame 1, a receiving frame 7 is arranged at the telescopic end of the first telescopic rod 6, and the support seat 10 is arranged on the receiving frame 7. A second telescopic rod 8 is arranged horizontally on the receiving frame 7, and the support seat 10 is arranged at the telescopic end of the second telescopic rod 8.

[0029] The PCB is intermittently conveyed by the conveying belt, and after the PCB is conveyed to the inner side of the mounting frame 1, the first telescopic rods 6 are controlled to extend by the same distance, so that the lifting wheels 11 on the two sides are respectively clamped to the two sides of the PCB, and the PCB is located in the annular groove 12 to position the width direction of the PCB, and then the two groups of second telescopic rods 8 are controlled to extend simultaneously to drive the groups of lifting wheels 11 to ascend, so that the PCB ascends, and when the edges of the PCB in the length direction contact the inclined surface 4, the PCB is pushed to slide and drive the lifting wheels 11 to rotate until the two ends of the PCB move to the top of the inclined surface 4, so that the length direction of the PCB is positioned, thereby realizing automatic positioning and eliminating the need for workers to load and unload the PCB.

[0030] As shown in Figure 3 In the embodiment, the mounting frame 9 is arranged on the support seat 10, the rack 14 is slidably arranged on one side of the mounting frame 9, the gear 13 is arranged on the lifting wheel 11, the gear 13 is engaged with the rack 14, the baffle 15 is arranged on the rack 14, the elastic members 16 are arranged on the two sides of the baffle 15, and the end portions of the elastic members 16 abut against the inner wall of the mounting frame 9.

[0031] During the process that the PCB drives the lifting wheel 11 to rotate, the rack 14 is driven to slide on one side of the mounting frame 9 through the cooperation of the gear 13 and the rack 14, so that the baffle 15 is driven to move to compress one of the elastic members 16, and the movement of the lifting wheel 11 is buffered by the elastic member 16, so that the electric elements on the PCB are prevented from being displaced due to the large amplitude shaking when the PCB contacts the inclined surface 4.

[0032] The specific use mode and beneficial effects of the utility model are as follows:

[0033] The thickness detector 2 is driven by the mechanical arm to measure the thickness of the solder paste on the PCB, and in use, the thickness detector 2 is installed above the conveying belt conveying the PCB, and the two ends of the PCB extend out of the conveying belt, the PCB is intermittently conveyed by the conveying belt, when the PCB to be detected is conveyed to the inner side of the mounting frame 1, the two groups of support seats 10 are simultaneously controlled to slide inward by a specified distance to clamp the two ends of the PCB by the lifting wheels 11, the PCB is located in the annular groove 12, so that the PCB is automatically positioned in the width direction, then the two groups of support seats 10 are controlled to move upward to drive the PCB to ascend by a specified distance, and during the process that the PCB ascends, one end of the PCB is abutted by the inclined surface 4 and slides in the annular groove 12 until the PCB abuts against the stopper 5, so that the PCB is automatically positioned in the length direction, thereby eliminating the need for workers to manually position the PCB during the process of measuring the thickness of the solder paste, effectively reducing the labor intensity of the workers, and improving the efficiency of measuring the thickness of the solder paste.

[0034] The basic principle and main features of the present application and the advantages of the present application are shown and described above, and it is obvious for those skilled in the art that the present application is not limited to the details of the above exemplary embodiments, and some modifications or improvements can be made on the basis of the present application, which is obvious for those skilled in the art. Therefore, these modifications or improvements made without deviating from the spirit of the present application all belong to the scope of protection required by the present application.

Claims

1. A solder paste thickness gauge, characterized in that, Including: Mounting frame (1), on which a thickness measuring instrument (2) is mounted by a robotic arm, and at the bottom of the mounting frame (1) is a cavity for the conveyor belt to pass through; Two sets of stop seats (3) are arranged opposite each other on the mounting frame (1) at intervals. Inclined surfaces (4) are arranged on the opposite surfaces of the two sets of stop seats (3), and a stop block (5) is provided at the top of the inclined surface (4). The support base (10) has two sets arranged opposite to each other, which can be lifted and slidably disposed inside the mounting frame (1). The support base (10) is provided with two sets of rotatable lifting wheels (11). The outer circular surface of the lifting wheel (11) is provided with an annular groove (12), and multiple sets of the annular groove (12) are located on the same plane.

2. The solder paste thickness gauge according to claim 1, characterized in that: The mounting frame (1) is provided with a vertically arranged first telescopic rod (6), and the telescopic end of the first telescopic rod (6) is provided with a receiving frame (7), and the support seat (10) is provided on the receiving frame (7).

3. The solder paste thickness gauge according to claim 2, characterized in that: The receiving frame (7) is provided with a horizontally arranged second telescopic rod (8), and the support seat (10) is provided at the telescopic end of the second telescopic rod (8).

4. The solder paste thickness gauge according to claim 1, characterized in that: One set of the stop seats (3) is slidably and fixably mounted on the mounting bracket (1).

5. A solder paste thickness gauge according to claim 4, characterized in that: The mounting bracket (1) has positioning grooves (17) at both ends. The two ends of the stop seat (3) are slidably engaged in the positioning grooves (17). The two ends of the stop seat (3) are screwed with threaded knobs (18). The inner side of the threaded knobs (18) abuts against the mounting bracket (1).

6. The solder paste thickness gauge according to claim 4, characterized in that: The support base (10) is provided with an installation frame (9), a rack (14) is slidably provided on one side of the installation frame (9), a gear (13) is provided on the lifting wheel (11), the gear (13) meshes with the rack (14), a baffle (15) is provided on the rack (14), and elastic elements (16) are provided on both sides of the baffle (15), the end of the elastic element (16) abuts against the inner wall of the installation frame (9).

Citation Information

Patent Citations

  • Solder paste thickness detection device

    CN218765195U

  • PCB solder paste thickness testing device

    CN221882385U