Miniaturized anti-interference receiver
By employing a ceramic substrate design in the BeiDou anti-interference receiver, and using isolation cavities and processing cavities to separate the receiving and processing sections, the problems of signal loss and heat dissipation are solved, achieving miniaturization and highly adaptable design of the receiver.
Patent Information
- Application Number
- CN202520471677.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-03-18
- Publication Date
- 2026-02-27
- Estimated Expiration
- 2035-03-18
AI Technical Summary
Existing BeiDou anti-interference receivers suffer from signal loss and poor adaptability to high-temperature environments during miniaturization, and traditional PCB solutions are unable to meet the requirements for size reduction.
The design employs a ceramic substrate, with the receiving module and processing module mounted on two parallel plates respectively. The receiving and processing sections are separated by an isolation cavity and a processing cavity, and high-temperature co-fired ceramic materials are used to reduce signal loss and heat dissipation.
This technology enables receiver miniaturization, reduces signal loss and heat dissipation risks, and improves adaptability and practicality, making it suitable for portable electronic devices and aerospace applications.
Smart Images
Figure CN223955812U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model belongs to satellite navigation technical field, and specifically relates to a miniaturized anti-interference receiver. BACKGROUND
[0002] Satellite navigation is a kind of technology for positioning and navigation using artificial earth satellite, and it provides all-weather navigation service for ground, ocean, air and space users.Satellite navigation anti-interference receiver is a kind of equipment specially designed to resist various interference signals, to ensure that satellite navigation system can accurately and reliably provide positioning, navigation and timing service.The miniaturization of satellite navigation anti-interference receiver is a necessary trend that can be developed, and now the design of Beidou anti-interference receiver still depends on traditional PCB scheme, PCB is the conductive plate that provides electrical connection between electronic components, and PCB scheme is the process of designing and manufacturing printed circuit board that can meet the function of the project according to the specific electronic project demand.
[0003] In the prior art, traditional PCB scheme is adopted in the design of Beidou anti-interference receiver, and there are limitations in signal loss and coping with high temperature environment, and when the size of anti-interference receiver is reduced, these problems will be further aggravated, and the adaptability and practicality are poor. UTILITY MODEL CONTENT
[0004] The utility model embodiment provides a kind of miniaturized anti-interference receiver, to solve the problem that the size of existing anti-interference receiver is difficult to reduce.
[0005] To achieve the above object, the technical scheme adopted by the utility model is as follows: provide a kind of miniaturized anti-interference receiver, comprising:
[0006] Ceramic substrate, with two parallel plate surfaces;
[0007] Receiving module, set on one of the plate surfaces, with a plurality of mutually isolated isolation cavities, each of the isolation cavities is provided with a receiving part;
[0008] Processing module, set on another plate surface, with processing cavity for placing processing part, the processing part is electrically connected with each receiving part.
[0009] In a possible implementation mode, the receiving module includes:
[0010] First adhesive layer, set on the plate surface corresponding to the ceramic substrate, one side of the first adhesive layer is bonded with the ceramic substrate;
[0011] Kovar ring isolation plate, bonded on the other side of the first adhesive layer, a plurality of accommodating cavities are arranged on the kovar ring isolation plate;
[0012] A cover plate is arranged on the kovar ring isolation plate, and the cover plate and each accommodating cavity form a plurality of isolation cavities.
[0013] A plurality of frequency conversion receiving assemblies are arranged, and each frequency conversion receiving assembly is arranged in one-to-one correspondence with each isolation cavity, and each frequency conversion receiving assembly is electrically connected to the ceramic substrate, and the frequency conversion receiving assembly is the receiving part.
[0014] In a possible implementation, the first adhesive layer is provided with openings matched with the accommodating cavities of the kovar ring isolation plate, and each opening penetrates the first adhesive layer.
[0015] In a possible implementation, the cover plate and the kovar ring isolation plate are integrally connected.
[0016] In a possible implementation, the processing module includes:
[0017] A second adhesive layer is arranged on the corresponding plate surface of the ceramic substrate, and one side of the second adhesive layer is adhered to the ceramic substrate.
[0018] A chip connecting plate is adhered to the other side of the second adhesive layer, and the chip connecting plate is provided with a connecting cavity.
[0019] A chip cover plate is arranged on the chip connecting plate, and the chip cover plate and each connecting cavity form the processing cavity.
[0020] A power management chip is arranged in the processing cavity and is electrically connected to the ceramic substrate, and the power management chip is the processing part.
[0021] In a possible implementation, the power management chip, each frequency conversion receiving assembly, and the ceramic substrate are electrically connected.
[0022] In a possible implementation, the second adhesive layer is provided with a through opening matched with the connecting cavity of the chip connecting plate, and the through opening penetrates the second adhesive layer.
[0023] In a possible implementation, the ceramic substrate is a high-temperature co-fired ceramic.
[0024] Compared with the prior art, the ceramic substrate is arranged in the present implementation manner, and the receiving module and the processing module can be mounted on two parallel plate surfaces respectively; the receiving module can be arranged on one of the plate surfaces, and a plurality of receiving parts are mounted on a plurality of isolated isolation cavities; the processing module can be arranged on the other plate surface, and a processing part is placed in a processing cavity, and the ceramic substrate can be electrically connected with each receiving part and processing part respectively, so that the receiving part and the processing part are separated, the signal loss can be reduced through the isolation cavity, and the receiving part and the processing part are separated through the ceramic substrate, so that the heat dissipation problem of the processing part is solved, and the adaptability and practicability are good. BRIEF DESCRIPTION OF DRAWINGS
[0025] Figure 1 Structure diagram of the miniaturized anti-interference receiver Figure 1
[0026] Figure 2 Front view structure diagram of the miniaturized anti-interference receiver
[0027] Figure 3 Structure diagram of the miniaturized anti-interference receiver Figure 2
[0028] Figure 4 Structure diagram of the miniaturized anti-interference receiver Figure 3
[0029] Figure 5 Structure diagram of the miniaturized anti-interference receiver Figure 4
[0030] BRIEF DESCRIPTION OF DRAWINGS
[0031] 10, ceramic substrate; 20, receiving module; 21, first adhesive layer; 22, Kovar ring isolation plate; 23, isolation cover plate; 30, processing module; 31, second adhesive layer; 32, chip connecting plate; 33, chip cover plate. DETAILED DESCRIPTION
[0032] In order to make the technical problems, technical solutions and beneficial effects to be solved by the present application clearer, the present application will be further described in detail below with reference to the drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application and do not limit the present application.
[0033] It should be noted that the terms "length", "width", "height", "thickness", "upper", "lower", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "head", "tail" and the like indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation on the present application.
[0034] It should also be noted that unless otherwise explicitly specified and limited, the terms "mounting", "connecting", "fixing", "setting" and the like should be broadly understood, for example, it can be fixedly connected, or it can be detachably connected, or it can be integrated. It can be mechanically connected, or it can be electrically connected. It can be directly connected, or it can be indirectly connected through an intermediate medium. It can be the internal communication of two elements or the interaction relationship between two elements. For those skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.
[0035] In addition, the terms "first", "second" are only for descriptive purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined with "first", "second" can explicitly or implicitly include one or more of the features. In addition, the meaning of "multiple", "several" is two or more, unless otherwise explicitly specified and limited.
[0036] Please refer to Figure 1 and Figure 5 , now the miniaturized anti-interference receiver provided by the present application will be described. The miniaturized anti-interference receiver comprises a ceramic substrate 10, a receiving module 20 and a processing module 30. The ceramic substrate 10 has two parallel plate surfaces. The receiving module 20 is arranged on one of the plate surfaces and has a plurality of isolated isolation cavities, each of which is provided with a receiving part. The processing module 30 is arranged on the other plate surface and has a processing cavity for placing a processing part, and the processing part is electrically connected to each receiving part.
[0037] Compared with the prior art, the miniaturized anti-interference receiver provided in the embodiment is provided with a ceramic substrate 10, and the receiving module 20 and the processing module 30 can be respectively installed through two parallel plate surfaces. The receiving module 20 can be arranged on one of the plate surfaces, and a plurality of receiving parts are installed through a plurality of isolated isolation cavities. The processing module 30 can be arranged on the other plate surface, and a processing part is placed through a processing cavity. The ceramic substrate 10 can be electrically connected to each receiving part and processing part respectively, so that the receiving part and the processing part are separated. The signal loss can be reduced through the isolation cavity, and the receiving part and the processing part are separated through the ceramic substrate 10, so that the heat dissipation problem of the processing part is solved, and the adaptability and practicability are good.
[0038] The ceramic substrate 10 is used as a basic bearing structure, which has two parallel plate surfaces, and the receiving module 20 and the processing module 30 are arranged on the two plate surfaces respectively. Compared with the traditional receiver layout, this design method concentrates the function modules that can be dispersed in the past into a compact double-layer structure, greatly reducing the space volume occupied by the whole receiver. For example, in some portable electronic devices or miniaturized instruments in the field of aerospace where the device volume requirement is extremely harsh, this miniaturized receiver can easily adapt to the limited internal space, provide more space resources for other important components, and help to realize the miniaturization and light weight design goal of the whole device.
[0039] The plurality of isolated isolation cavities in the receiving module 20 and the processing cavity in the processing module 30 provide precise installation positions for various functional components. This highly integrated design enables functions that originally require multiple independent modules and complex wiring connections to be implemented in a compact structure. For example, a plurality of receiving parts are concentrated in the isolation cavities of the receiving module 20, and a processing part is arranged in the processing cavity of the processing module 30, which reduces the length and complexity of the connection lines between the modules. This not only reduces the signal loss and interference risk caused by long lines, but also makes the assembly of the whole receiver more convenient, improves the production efficiency, and reduces the production cost.
[0040] In some embodiments, the receiving module 20 described above can adopt a structure as shown in Figures 1 to 3 Figures 1 to 3 The receiving module 20 comprises a first adhesive layer 21, a Kovar ring isolation plate 22, an isolation cover plate 23, and a frequency conversion receiving assembly. The first adhesive layer 21 is arranged on the corresponding plate surface of the ceramic substrate 10, and one side of the first adhesive layer 21 is bonded to the ceramic substrate 10. The Kovar ring isolation plate 22 is bonded to the other side of the first adhesive layer 21, and the Kovar ring isolation plate 22 is provided with a plurality of accommodating cavities. The isolation cover plate 23 is arranged on the Kovar ring isolation plate 22, and the isolation cover plate 23 and the accommodating cavities jointly form a plurality of isolation cavities. The frequency conversion receiving assembly is provided with a plurality of frequency conversion receiving assemblies, and the plurality of frequency conversion receiving assemblies are arranged one-to-one corresponding to the plurality of isolation cavities. Each frequency conversion receiving assembly is electrically connected to the ceramic substrate 10, and the frequency conversion receiving assembly is a receiving part.
[0041] In the receiving module 20, the plurality of accommodating cavities on the Kovar ring isolation plate 22 and the isolation cover plate 23 jointly construct a plurality of mutually isolated isolation cavities, and each isolation cavity independently accommodates one frequency conversion receiving assembly. In a complex electromagnetic environment, when a plurality of signals of different frequencies simultaneously flow in, the isolation design plays an isolation role.
[0042] The Kovar material, that is, the iron-nickel-cobalt alloy, greatly reduces the risk of structural damage caused by thermal stress, and ensures that the receiver can still operate stably in a temperature fluctuation environment, such as an outdoor communication device subjected to day-night temperature difference changes.
[0043] In some embodiments, the first adhesive layer 21 described above can adopt the structure as shown in Figure 3 . Referring to Figure 3 , the first adhesive layer 21 is provided with openings adapted to the accommodating cavities of the Kovar ring isolation plate 22, and each opening penetrates through the first adhesive layer 21.
[0044] In some embodiments, the cover plate described above can adopt the structure as shown in Figure 1 , Figure 2 . Referring to Figure 1 , Figure 2 , the isolation cover plate 23 is integrally connected with the Kovar ring isolation plate 22.
[0045] The integral connection can be understood as sintering the isolation cover plate 23 to the Kovar ring isolation layer through a gold-tin sealing welding process.
[0046] In some embodiments, the processing module 30 described above can adopt the structure as shown in Figure 2 . Referring to Figure 2The processing module 30 comprises a second adhesive layer 31, a chip connecting plate 32, a chip cover plate 33 and a power management chip. The second adhesive layer 31 is arranged on the corresponding plate surface of the ceramic substrate 10, and one side of the second adhesive layer 31 is adhered to the ceramic substrate 10. The chip connecting plate 32 is adhered to the other side of the second adhesive layer 31, and the chip connecting plate 32 is provided with a connecting cavity. The chip cover plate 33 is arranged on the chip connecting plate 32, and the chip cover plate 33 and each connecting cavity jointly form a processing cavity. The power management chip is arranged in the processing cavity and is electrically connected to the ceramic substrate 10, and the power management chip is the processing part.
[0047] The chip connecting plate 32 and the ceramic substrate 10 are tightly connected through the second adhesive layer 31, and the chip cover plate 33 and the chip connecting plate 32 form the processing cavity, which realizes the high compactness of the processing module 30. The compact structure design concentrates the originally dispersed power management function in a small space, greatly reducing the space volume occupied by the processing module 30.
[0048] The chip cover plate 33 and the connecting cavity on the chip connecting plate 32 jointly form the processing cavity, which provides a relatively closed working space for the power management chip. The processing cavity has good electromagnetic shielding performance and can effectively block the influence of external electromagnetic interference on the power management chip. In a complex electromagnetic environment such as the city center, a large number of electromagnetic signals of different frequencies exist in the environment. The processing cavity can prevent these interference signals from being coupled into the circuit of the power management chip, avoid power management abnormalities caused by interference, and ensure that the power management chip can stably and accurately perform its power regulation and management tasks, thereby ensuring the normal operation of the entire receiver.
[0049] In some embodiments, the power management chip described above can adopt the structure as shown in Figures 1 to 5 . Referring to Figures 1 to 5 , the power management chip, each frequency conversion receiving component and the ceramic substrate 10 are electrically connected.
[0050] In some embodiments, the second adhesive layer 31 described above can adopt the structure as shown in Figure 5 . Referring to Figure 5 , the second adhesive layer 31 is provided with an overpass that is adapted to the connecting cavity of the chip connecting plate 32, and the overpass penetrates the second adhesive layer 31.
[0051] In some embodiments, the ceramic substrate 10 described above can adopt the structure as shown in Figures 1 to 5 . Referring to Figures 1 to 5 , the ceramic substrate 10 is a high-temperature co-fired ceramic.
[0052] The high-temperature co-fired ceramic has very high resistivity, which can effectively prevent current leakage between different modules and components. In a small anti-interference receiver, this characteristic prevents current interference between the receiving module 20 and the processing module 30 due to close electrical connection, ensuring that each module works independently and stably.
[0053] The above is only a preferred embodiment of the present application, and is not intended to limit the present application. Any modification, equivalent replacement and improvement made within the spirit and principle of the present application shall be included in the protection scope of the present application.
Claims
1. A miniaturized anti-interference receiver, characterized in that, include: A ceramic substrate having two parallel surfaces; A receiving module is disposed on one of the plates and has multiple mutually isolated cavities, each of which is equipped with a receiving part; A processing module, disposed on another of the aforementioned plates, has a processing cavity for placing a processing unit, the processing unit being electrically connected to each of the aforementioned receiving units.
2. The miniaturized anti-interference receiver as described in claim 1, characterized in that, The receiving module includes: A first adhesive layer is disposed on the plate surface corresponding to the ceramic substrate, and one side of the first adhesive layer is bonded to the ceramic substrate; Kovar ring spacer is bonded to the other side of the first adhesive layer, and the Kovar ring spacer is provided with multiple receiving cavities; An isolation cover plate is installed on the Kovar ring isolation plate, and the isolation cover plate and each of the receiving cavities together constitute a plurality of isolation cavities; The frequency converter receiving component is provided in multiple ways, and each frequency converter receiving component is arranged in a one-to-one correspondence with the multiple isolation cavities. Each frequency converter receiving component is electrically connected to the ceramic substrate, and the frequency converter receiving component is the receiving part.
3. The miniaturized anti-interference receiver as described in claim 2, characterized in that, The first adhesive layer has openings that are adapted to the receiving cavities of the Kovar ring separator, and each opening penetrates the first adhesive layer.
4. The miniaturized anti-interference receiver as described in claim 2, characterized in that, The isolation cover plate is integrally connected to the Kovar ring isolation plate.
5. The miniaturized anti-interference receiver as described in claim 2, characterized in that, The processing module includes: A second adhesive layer is disposed on the plate surface corresponding to the ceramic substrate, and one side of the second adhesive layer is bonded to the ceramic substrate; A chip connection board is bonded to the other side of the second adhesive layer, and the chip connection board is provided with a connection cavity; A chip cover plate is disposed on the chip connection plate, and the chip cover plate and each of the connection cavities together constitute the processing cavity; A power management chip is disposed within the processing cavity and electrically connected to the ceramic substrate; the power management chip is the processing unit.
6. The miniaturized anti-interference receiver as described in claim 5, characterized in that, The power management chip, each of the frequency converter receiving components, and the ceramic substrate are electrically connected.
7. The miniaturized anti-interference receiver as described in claim 5, characterized in that, The second adhesive layer has an opening adapted to the connection cavity of the chip connection board, and the opening penetrates the second adhesive layer.
8. The miniaturized anti-interference receiver as described in claim 1, characterized in that, The ceramic substrate is a high-temperature co-fired ceramic.