Heat conduction structure and heat dissipation assembly
By combining a thermally conductive mud layer with an insulating film layer, the high cost problem caused by adhesive backing on the radiator is solved, achieving precise bonding and efficient heat dissipation, making it suitable for various scenarios.
Patent Information
- Application Number
- CN202520734007.X
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-04-17
- Publication Date
- 2026-02-27
- Estimated Expiration
- 2035-04-17
AI Technical Summary
In existing heat-conducting structures, the installation of an insulating film layer on the heat sink requires the application of adhesive, which results in high costs.
A first thermally conductive putty layer and a second thermally conductive putty layer are respectively bonded to the structure to be dissipated and the heat sink, and an insulating film layer is set between the two. The extensibility and adhesion of the thermally conductive putty are used to achieve precise bonding, eliminating the need for adhesive backing.
It effectively saves costs, enhances heat dissipation, and is suitable for uneven radiators and structures to be cooled, simplifying the installation process.
Smart Images
Figure CN223957861U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model relates to the field of switching power supply, more particularly to a heat conduction structure and a heat dissipation assembly. BACKGROUND
[0002] Some high-temperature devices or parts inside the switching power supply need to use the heat conduction structure to conduct heat to the heat sink, and this method is often used on independent air ducts and liquid cooling modules. Figure 1 As shown in the figure, it includes a heat conduction layer 1 and an insulating film 2, and the heat conduction layer 1 is usually in contact with the part that needs heat conduction, and the insulating film is used to meet the safety requirements.
[0003] Among them, Figure 1 The heat conduction structure shown in the figure has the following defects. One side of the heat sink where the insulating film layer is installed usually needs to be coated with adhesive, resulting in high cost. UTILITY MODEL CONTENTS
[0004] The utility model solves the technical problem, in view of the above defects of prior art, provide a kind of heat conduction structure and heat dissipation assembly, it does not need adhesive, therefore, under the safety requirements, save cost.
[0005] The technical scheme adopted by the utility model to solve its technical problems is: a heat conduction structure is constructed, including first heat conduction mud layer, second heat conduction mud layer and the insulating film layer being arranged between the first heat conduction mud layer and the second heat conduction mud layer;The first side of the first heat conduction mud layer is attached to the structure to be cooled, and the second side is attached to the first side of the insulating film layer, the first side of the second heat conduction mud layer is attached to the second side of the insulating film layer, and the second side is attached to the heat sink.
[0006] In the heat conduction structure, the thickness of the first heat conduction mud layer is greater than the thickness of the second heat conduction mud layer, and the thickness of the second heat conduction mud layer is greater than the thickness of the insulating film layer.
[0007] In the heat conduction structure, the thickness of the first heat conduction mud layer is 3.5mm-4.5mm, the thickness of the second heat conduction mud layer is 0.5mm-1.5mm, and the thickness of the insulating film layer is 0.02mm-0.04mm.
[0008] In the heat conduction structure, the thickness of the first heat conduction mud layer is 4mm, the thickness of the second heat conduction mud layer is 1mm, and the thickness of the insulating film layer is 0.03mm.
[0009] The heat conduction structure is implemented, the first heat conduction mud layer is attached to the structure to be radiated, and the second heat conduction mud layer is attached to the radiator, so that the heat conduction mud can be precisely attached to the structure to be radiated and the radiator respectively by the extensibility and viscosity of the heat conduction mud, the adhesive is omitted, and cost is effectively saved.
[0010] Another technical scheme for solving the technical problems is to construct a heat dissipation assembly, comprising a structure to be radiated, a heat conduction structure and a radiator.
[0011] The thickness of the first heat conduction mud layer is greater than the thickness of the second heat conduction mud layer, and the thickness of the second heat conduction mud layer is greater than the thickness of the insulating film layer.
[0012] The thickness of the first heat conduction mud layer is 3.5mm-4.5mm, the thickness of the second heat conduction mud layer is 0.5mm-1.5mm, and the thickness of the insulating film layer is 0.02mm-0.04mm.
[0013] The thickness of the first heat conduction mud layer is 4mm, the thickness of the second heat conduction mud layer is 1mm, and the thickness of the insulating film layer is 0.03mm.
[0014] The structure to be radiated comprises a PCB and a device to be radiated mounted on the first side of the PCB opposite to the first heat conduction mud layer, the pin of the device to be radiated penetrates through the PCB and is inserted into the first heat conduction mud layer, and the irregular heat dissipation surface of the radiator is attached to the second heat conduction mud layer.
[0015] The ratio of the thickness of the first heat conduction mud layer to the length of the pin is 4:1-2:1.
[0016] The heat dissipation assembly is implemented, the first heat conduction mud layer is attached to the structure to be radiated, and the second heat conduction mud layer is attached to the radiator, so that the heat conduction mud can be precisely attached to the structure to be radiated and the radiator respectively by the extensibility and viscosity of the heat conduction mud, the adhesive is omitted, and cost is effectively saved. BRIEF DESCRIPTION OF DRAWINGS
[0017] The utility model will be further described below in combination with the drawings and embodiments, wherein:
[0018] Figure 1 is the schematic diagram of the heat conduction structure of prior art;
[0019] Figure 2 is the schematic diagram of the preferred embodiment of the heat conduction structure of the utility model;
[0020] Figure 3 is the schematic diagram of the preferred embodiment of the heat dissipation assembly of the utility model. DETAILED DESCRIPTION
[0021] In order to make the purpose, technical scheme and advantages of the utility model more clear and obvious, the utility model will be further described in detail below in combination with the drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the utility model, and are not used to limit the utility model.
[0022] Figure 2 is the schematic diagram of the preferred embodiment of the heat conduction structure of the utility model. As Figure 2 Indicated, the heat conduction structure of the utility model, including first heat conduction mud layer 11, second heat conduction mud layer 12 and the insulating film layer 2 being arranged between first heat conduction mud layer 11 and second heat conduction mud layer 12. The first side of first heat conduction mud layer 11 is attached to the structure to be cooled, and the second side is attached to the first side of the insulating film layer 2. The first side of second heat conduction mud layer 12 is attached to the second side of the insulating film layer 2, and the second side is attached to the heat sink.
[0023] The heat conduction structure of the utility model is implemented, and the first heat conduction mud layer is attached to the structure to be cooled, and the second heat conduction mud layer is attached to the heat sink. Therefore, the first heat conduction mud layer and the second heat conduction mud layer can be precisely attached to the structure to be cooled and the heat sink respectively through the ductility and adhesion of the heat conduction mud, so that the adhesive is omitted, and the cost is effectively saved. Furthermore, the insulating film layer is arranged between the two heat conduction mud layers, which can be attached through the adhesion between the insulating film layer and the heat conduction mud layer, so that the adhesive is omitted, and the cost is effectively saved and the heat dissipation effect is further enhanced.
[0024] Further, in one preferred embodiment of the present application, the thickness of the first heat-conducting mud layer 11 is greater than the thickness of the second heat-conducting mud layer 12, and the thickness of the second heat-conducting mud layer 12 is greater than the thickness of the insulating film layer 2. In one preferred embodiment of the present application, the thickness of the first heat-conducting mud layer 11 is 3.5mm-4.5mm, the thickness of the second heat-conducting mud layer 12 is 0.5mm-1.5mm, and the thickness of the insulating film layer 2 is 0.02mm-0.04mm. In one preferred embodiment of the present application, the thickness of the first heat-conducting mud layer 11 is 4mm, the thickness of the second heat-conducting mud layer 12 is 1mm, and the thickness of the insulating film layer 2 is 0.03mm.
[0025] In the preferred embodiment, the insulating film layer is inserted into the heat-conducting mud to divide the heat-conducting mud into the second heat-conducting mud layer 12 and the first heat-conducting mud layer 11, and the first heat-conducting mud layer 11 is attached to the structure to be cooled, and the second heat-conducting mud layer 12 is attached to the heat sink. Because the material of the heat-conducting mud has certain viscosity, the structure to be cooled or the heat sink can be attached first according to the actual situation, and if the heat sink is not flat, the thickness of the second heat-conducting mud layer 12 can be adjusted.
[0026] The heat-conducting structure of the present application has a wider application scenario, is convenient to install, can avoid the back adhesive process, avoid the influence of glue on heat dissipation, can select a thinner insulating film to be embedded, improve the heat conductivity, and further improve the heat dissipation effect. Even for uneven heat sinks and / or structures to be cooled, the ductility and viscosity of the heat-conducting mud can be used to precisely attach the structure to be cooled and the heat sink, respectively, so as to omit the back adhesive, thereby effectively saving costs. The design of the present application is very ingenious, and multiple functions can be realized by using a very simple structure, which is low in cost and suitable for various scenarios.
[0027] Figure 3 is a schematic view of a preferred embodiment of the heat dissipation assembly of the present application. As Figure 3As shown, the heat dissipation assembly comprises a structure to be cooled, a heat conduction structure and a heat sink 5; the heat conduction structure comprises a first heat conduction mud layer 11, a second heat conduction mud layer 12 and an insulating film layer 2 arranged between the first heat conduction mud layer 11 and the second heat conduction mud layer 12; the first side of the first heat conduction mud layer 11 is attached to the structure to be cooled, and the second side is attached to the first side of the insulating film layer 2; the first side of the second heat conduction mud layer 12 is attached to the second side of the insulating film layer 2, and the second side is attached to the heat sink 5. The structure to be cooled comprises a PCB board 4 and a device to be cooled 3 mounted on the back side of the PCB board 4 away from the first heat conduction mud layer 11. The pin 31 of the device to be cooled 3 penetrates through the PCB board 4 and is inserted into the first heat conduction mud layer 11. The irregular heat dissipation surface of the heat sink 5 is attached to the second heat conduction mud layer 12.
[0028] As shown in the drawings, Figure 3 The heat conduction mud layer can be first mounted on the irregular heat sink 5, and the heat conduction mud layer is attached to the irregular heat dissipation surface of the heat sink 5 by using the ductility and viscosity of the heat conduction mud layer, and then the PCB board 4 is mounted, the pin 31 of the device to be cooled 3 is embedded in the heat conduction mud layer, and the insulating film layer is inserted into the heat conduction mud layer, so as to realize the heat conduction structure comprising the first heat conduction mud layer 11, the second heat conduction mud layer 12 and the insulating film layer 2 arranged between the first heat conduction mud layer 11 and the second heat conduction mud layer 12. The heat of the device to be cooled 3 is transmitted to the heat sink through the pin, the first heat conduction mud layer, the insulating film layer and the second heat conduction mud layer. The insulating film layer in the middle of the heat conduction mud layer can meet the safety requirements.
[0029] Further, in a preferred embodiment of the present application, the thickness of the first heat conduction mud layer 11 is greater than the thickness of the second heat conduction mud layer 12, and the thickness of the second heat conduction mud layer 12 is greater than the thickness of the insulating film layer 2. In a preferred embodiment of the present application, the thickness of the first heat conduction mud layer 11 is 3.5mm-4.5mm, the thickness of the second heat conduction mud layer 12 is 0.5mm-1.5mm, and the thickness of the insulating film layer 2 is 0.02mm-0.04mm. In a preferred embodiment of the present application, the thickness of the first heat conduction mud layer 11 is 4mm, the thickness of the second heat conduction mud layer 12 is 1mm, and the thickness of the insulating film layer 2 is 0.03mm. In a preferred embodiment of the present application, the ratio of the thickness of the first heat conduction mud layer 11 to the length of the pin is in the range of 4:1-2:1.
[0030] The heat dissipation assembly of the utility model, adopt first heat-conducting mud layer to fit the structure to be cooled, second heat-conducting mud layer fits radiator, therefore through the ductility and viscosity of heat-conducting mud can be respectively with the structure to be cooled and radiator precision fit, thereby omitting back glue, further effectively save the cost, and insulating film layer is set between two heat-conducting mud layers, can utilize the viscosity between insulating film layer and heat-conducting mud layer and fit thereby omitting back glue, further effectively save the cost and further enhance the heat dissipation effect. And the design of the utility model is very ingenious, and multiple functions can be realized by using very simple structure, and the cost is low and applicable to various scenes.
[0031] Although the utility model is explained through specific embodiments, those skilled in the art should understand that various transformations and equivalent substitutions can be made to the utility model without departing from the scope of the utility model.In addition, various modifications can be made to the utility model for specific situations or materials without departing from the scope of the utility model. Therefore, the utility model is not limited to the disclosed specific embodiments, but should include all the embodiments falling within the scope of the claims of the utility model.
[0032] The above only is the preferred embodiment of the utility model, and does not limit the utility model, and any modification, equivalent substitution and improvement, etc. within the spirit and principle of the utility model should be included in the protection scope of the utility model.
Claims
1. A thermally conductive structure, characterized by, The first heat-conducting mud layer, the second heat-conducting mud layer and the insulating film layer are arranged between the first heat-conducting mud layer and the second heat-conducting mud layer; the first side of the first heat-conducting mud layer is attached to the structure to be cooled, and the second side is attached to the first side of the insulating film layer; the first side of the second heat-conducting mud layer is attached to the second side of the insulating film layer, and the second side is attached to the heat sink.
2. The thermally conductive structure of claim 1, wherein, The thickness of the first heat-conducting mud layer is greater than the thickness of the second heat-conducting mud layer, and the thickness of the second heat-conducting mud layer is greater than the thickness of the insulating film layer.
3. The thermally conductive structure of claim 2, wherein, The thickness of the first heat-conducting mud layer is 3.5mm-4.5mm, the thickness of the second heat-conducting mud layer is 0.5mm-1.5mm, and the thickness of the insulating film layer is 0.02mm-0.04mm.
4. The thermally conductive structure of claim 3, wherein, The thickness of the first heat-conducting mud layer is 4mm, the thickness of the second heat-conducting mud layer is 1mm, and the thickness of the insulating film layer is 0.03mm.
5. A heat dissipating assembly, characterized by, The structure to be cooled, the heat-conducting structure and the heat sink are included; the heat-conducting structure includes the first heat-conducting mud layer, the second heat-conducting mud layer and the insulating film layer arranged between the first heat-conducting mud layer and the second heat-conducting mud layer. The first side of the first heat-conducting mud layer is attached to the structure to be cooled, and the second side is attached to the first side of the insulating film layer; the first side of the second heat-conducting mud layer is attached to the second side of the insulating film layer, and the second side is attached to the heat sink.
6. The heat dissipating assembly of claim 5, wherein, The thickness of the first heat-conducting mud layer is greater than the thickness of the second heat-conducting mud layer, and the thickness of the second heat-conducting mud layer is greater than the thickness of the insulating film layer.
7. The heat dissipating assembly of claim 6, wherein, The thickness of the first heat-conducting mud layer is 3.5mm-4.5mm, the thickness of the second heat-conducting mud layer is 0.5mm-1.5mm, and the thickness of the insulating film layer is 0.02mm-0.04mm.
8. The heat dissipating assembly of claim 7, wherein, The thickness of the first heat-conducting mud layer is 4mm, the thickness of the second heat-conducting mud layer is 1mm, and the thickness of the insulating film layer is 0.03mm.
9. The heat dissipating assembly according to any one of claims 5 to 8, wherein, The structure to be cooled includes the PCB board and the device to be cooled mounted on the first side of the PCB board opposite to the first heat-conducting mud layer; the pin of the device to be cooled penetrates through the PCB board and is inserted into the first heat-conducting mud layer, and the irregular heat dissipation surface of the heat sink is attached to the second heat-conducting mud layer.
10. The heat dissipating assembly of claim 9, wherein, The ratio of the thickness of the first heat-conducting mud layer to the length of the pin is 4:1-2:1.