UV dispergation machine

Abstract

The utility model relates to the technical field of wafer production, and discloses a UV dispergation machine, which comprises a case, two slide rails are symmetrically fixed on the inner wall of the case, connecting strips are connected on the slide rails in a sliding manner, a same wafer placing rack is fixed on the side walls of the two connecting strips, a handle is fixed on the side wall of the wafer placing rack, and a plurality of grooves are formed in the side wall of the wafer placing rack. A detachable glass plate is arranged at the upper end of the wafer placing frame, a light source mechanism is arranged in the case and comprises a light source box and a lifting assembly, the detachable glass plate and the light source mechanism are arranged, so that a new glass plate can be quickly detached and replaced, and the distance between the light source box and the wafer can be adjusted according to needs. The problems that according to an existing UV dispergator, replacement of a new glass disc is troublesome, and the distance between the light source box and the wafer cannot be adjusted according to needs are solved, and therefore the dispergation effect of the wafer cannot be affected.

Description

TECHNICAL FIELD

[0001] The utility model relates to wafer production technical field, concretely relates to a UV debonding machine. BACKGROUND

[0002] The UV debonding machine, also known as a wafer debonding machine, is an equipment capable of automatically eliminating the adhesion between the UV film and the laser cutting film adhesive. The machine is mainly composed of a light source system, a power system, a control system, and a cooling system. The UV debonding machine is one of the important equipment for manufacturing chips. Its working principle is to use ultraviolet light of a specific wavelength to irradiate the wafer cutting film, so that it is quickly solidified, reducing the adhesion of the fixed film, and enabling the subsequent packaging process to proceed smoothly.

[0003] Because the chamber where the light source system is located and the chamber where the wafer is placed are usually isolated by a fixedly installed glass plate in the existing UV debonding machine, although the glass plate does not hinder the transmission of light, the glass plate is easy to be dirty and needs to be replaced with a new one, which is relatively troublesome, and the distance between the light source system and the glass plate is usually fixed, which cannot adjust the distance between the light source system and the wafer as required, which easily affects the debonding effect. SUMMARY

[0004] The utility model aims at overcoming the shortage of prior art, provides a kind of UV debonding machine, by being equipped with detachable glass disc and light source mechanism, to can quickly dismount and replace new glass disc, and can adjust the distance between light source box and wafer as required, solve the problem that new glass disc is replaced relatively troublesome in the existing UV debonding machine, cannot adjust the distance between light source box and wafer as required, so as not to affect the debonding effect of wafer.

[0005] The utility model solves the technical problem of the scheme:

[0006] A kind of UV debonding machine, including cabinet, two symmetrical slide rails are fixed on the inner wall of cabinet, connecting strip is slidably connected on slide rail, same wafer rack is fixed on the side wall of two connecting strips, handle is fixed on the side wall of wafer rack, detachable glass disc is arranged on the upper end of wafer rack, light source mechanism is arranged in cabinet, and light source mechanism includes light source box and lifting assembly.

[0007] When the wafer needs to be de-bonded, the handle is pulled outward, so that the wafer placing rack can be pulled out, then the wafer to be de-bonded is placed on the upper end of the glass plate, after the wafer is placed, the handle is pushed inward, so that the wafer placing rack can be pushed into the cabinet, and the wafer is located above the light source box, the lifting assembly is started to drive the light source box to lift, so that the distance between the light source box and the wafer can be adjusted according to the requirement, and then the light source box is started, so that the wafer can be de-bonded, and meanwhile, the glass plate is detachably arranged, if the glass plate is contaminated, the new glass plate can be quickly detached and replaced, so that the de-bonding effect is not affected.

[0008] According to the technical scheme, the detachable glass plate and the light source mechanism are arranged, so that the new glass plate can be quickly detached and replaced, and the distance between the light source box and the wafer can be adjusted according to the requirement, the problem that the existing UV de-bonding machine is troublesome when the new glass plate is replaced and the distance between the light source box and the wafer cannot be adjusted according to the requirement is solved, and the de-bonding effect of the wafer is not affected.

[0009] The utility model is further provided with: the detachable glass plate includes a placing groove formed on the upper end of the wafer placing rack, two symmetrical clamping grooves are formed on the inner wall of the wafer placing rack, clamping plates are inserted into the clamping grooves, a plurality of metal springs are fixed to the end of the clamping plate, the end of the metal spring is fixed to the inner wall of the clamping groove, two symmetrical sliding grooves are formed on the upper end of the wafer placing rack, and a driving rod is fixed to the end of the clamping plate penetrating through the sliding groove.

[0010] According to the technical scheme, when the new glass plate needs to be detached and replaced, the two driving rods are pulled to the two sides, and the plurality of metal springs are compressed, so that the two clamping plates are driven to move outward, the clamping plate is separated from the glass plate, the glass plate placed in the placing groove can be detached, and the new glass plate can be replaced, after the new glass plate is replaced, the two driving rods are loosened, the plurality of metal springs are reset, the two clamping plates are reset, and the clamping plate is abutted on the upper end of the glass plate, so that the glass plate can be fixed.

[0011] The utility model is further provided with: a placing cavity for placing the light source box is formed in the cabinet, and a plurality of UV lamp tubes are fixed in the light source box.

[0012] According to the technical scheme, when the wafer needs to be de-bonded, the handle is pulled outward, so that the wafer placing rack can be pulled out, then the wafer to be de-bonded is placed on the upper end of the glass plate, after the wafer is placed, the handle is pushed inward, so that the wafer placing rack can be pushed into the cabinet, and the wafer is located above the light source box, the lifting assembly is started to drive the light source box to lift, so that the distance between the light source box and the wafer can be adjusted according to the requirement, and then the light source box is started, so that the wafer can be de-bonded, and meanwhile, the glass plate is detachably arranged, if the glass plate is contaminated, the new glass plate can be quickly detached and replaced, so that the de-bonding effect is not affected.

[0013] The utility model is further provided with: the lifting assembly includes a servo electric cylinder fixed to the bottom of the cabinet, the servo electric cylinder is fixed to the lower end of the light source box penetrating through the cabinet, and a plurality of guide rods are inserted into the cabinet and fixed to the lower end of the light source box.

[0014] Through the technical scheme, when the light source box needs to be lifted, the servo electric cylinder is started, so that the light source box can be lifted.

[0015] The utility model further provides to be: two handle that fixed with symmetry in the both sides of case, the side wall of case is formed with a plurality of heat dissipation holes.

[0016] Through the technical scheme, through being equipped with handle, thereby convenient for carrying case, through being equipped with a plurality of heat dissipation holes, make outside air can with the air in the case mutual, help reduce the temperature in the case, thereby improved the service life and stability of the utility model.

[0017] The utility model has the advantages of:

[0018] Compared with the prior art, by being equipped with detachable glass disc and light source mechanism, thereby can quickly detach and replace new glass disc, and can adjust the distance between light source box and wafer according to the requirement, solve the problem that the existing UV debonding machine is more troublesome when replacing new glass disc, and cannot adjust the distance between light source box and wafer according to the requirement, thereby will not affect the debonding effect of wafer.

[0019] By being equipped with handle, thereby convenient for carrying case.

[0020] By being equipped with a plurality of heat dissipation holes, thereby improved the service life and stability of the utility model. DETAILED DESCRIPTION

[0021] Fig. 1 It is three-dimensional structure schematic view of the utility model;

[0022] Fig. 2 It is three-dimensional structure schematic view of part wafer rack and part connecting piece;

[0023] Fig. 3 It is sectional view of the utility model.

[0024] Reference signs: 1, case;101, place cavity;102, heat dissipation hole;2, wafer rack;201, place groove;202, clamping groove;203, sliding groove;3, handle;4, glass disc;5, light source box;6, clamping plate;7, metal spring piece;8, knob lever;9, UV lamp tube;10, servo electric cylinder;11, guide rod;12, handle. DETAILED DESCRIPTION

[0025] The specific implementation of the utility model will be described in further detail in combination with the drawings and examples. The following examples are used to illustrate the utility model, but not to limit the scope of the utility model.

[0026] The following reference Figs. 1 to 3This utility model will now be described.

[0027] A UV degumming machine includes a housing 1. Two slide rails are symmetrically fixed on the inner wall of the housing 1. Connecting strips are slidably connected on the slide rails. A wafer placement rack 2 is fixed on the side wall of the two connecting strips. A handle 3 is fixed on the side wall of the wafer placement rack 2. A detachable glass plate 4 is provided at the upper end of the wafer placement rack 2. A light source mechanism is provided inside the housing 1. The light source mechanism includes a light source box 5 and a lifting assembly.

[0028] When debonding of the wafer is required, pull out the handle 3 to pull out the wafer placement rack 2, then place the wafer to be debonded on the top of the glass tray 4. After placing the wafer, push the handle 3 inward to push the wafer placement rack 2 into the chassis 1, positioning the wafer above the light source box 5. Activate the lifting assembly to raise and lower the light source box 5, allowing adjustment of the distance between the light source box 5 and the wafer as needed. Then activate the light source box 5 to debond the wafer. The glass tray 4 is detachable, so if it gets dirty, it can be quickly removed and replaced with a new one without affecting the debonding effect.

[0029] By incorporating a detachable glass disk 4 and a light source mechanism, the glass disk 4 can be quickly disassembled and replaced, and the distance between the light source box 5 and the wafer can be adjusted as needed. This solves the problem that it is relatively troublesome to replace the glass disk 4 in existing UV degumming machines, and that the distance between the light source box 5 and the wafer cannot be adjusted as needed, thus ensuring that the degumming effect of the wafer is not affected.

[0030] The detachable glass tray 4 includes a placement groove 201 formed on the upper end of the wafer placement rack 2. Two snap-fit ​​grooves 202 are symmetrically formed on the inner wall of the wafer placement rack 2. A snap-fit ​​plate 6 is inserted into the snap-fit ​​groove 202. Several metal springs 7 are fixed to the end of the snap-fit ​​plate 6. The ends of the several metal springs 7 are fixed to the inner wall of the snap-fit ​​groove 202. Two sliding grooves 203 are symmetrically formed on the upper end of the wafer placement rack 2. A toggle lever 8 is fixed to the protruding end of the snap-fit ​​plate 6 that passes through the sliding groove 203.

[0031] When it is necessary to disassemble and replace the glass plate 4, pull the two levers 8 to both sides, which will compress several metal springs 7. This will cause the two locking plates 6 to move outward, so that the locking plates 6 are separated from the glass plate 4. The glass plate 4 placed in the placement slot 201 can be removed and a new glass plate 4 can be replaced. After the new glass plate 4 is replaced, release the two levers 8, which will reset the several metal springs 7. At the same time, the two locking plates 6 will reset, so that the locking plates 6 abut against the upper end of the glass plate 4, thereby fixing the glass plate 4.

[0032] The box 1 is formed with a placing cavity 101 for placing the light source box 5, and a plurality of UV lamp tubes 9 are fixed in the light source box 5.

[0033] When the wafer needs to be debonded, the plurality of UV lamp tubes 9 are started, so that the wafer can be debonded.

[0034] The lifting assembly comprises a servo electric cylinder 10 fixed at the bottom of the box 1, the servo electric cylinder 10 is fixed at the lower end of the light source box 5 through the extending end of the box 1, and a plurality of guide rods 11 are inserted into the box 1 and fixed at the lower end of the light source box 5.

[0035] When the light source box 5 needs to be lifted, the servo electric cylinder 10 is started, so that the light source box 5 can be lifted.

[0036] Two handles 12 are symmetrically fixed at the two sides of the box 1, and a plurality of heat dissipation holes 102 are formed in the side wall of the box 1.

[0037] The handle 12 is provided, so that the box 1 is convenient to carry, and the plurality of heat dissipation holes 102 are provided, so that the external air can interact with the air in the box 1, the temperature in the box 1 is reduced, and the service life and stability of the utility model are improved.

[0038] Working principle:

[0039] When the wafer needs to be debonded, the handle 3 is pulled outwards, so that the wafer placing frame 2 can be pulled out, then the wafer to be debonded is placed at the upper end of the glass disc 4, after the wafer is placed, the handle 3 is pushed inwards, so that the wafer placing frame 2 can be pushed into the box 1, and the wafer is located above the UV lamp tube 9, the servo electric cylinder 10 is started, the light source box 5 is lifted, the distance between the light source box 5 and the wafer can be adjusted, then the plurality of UV lamp tubes 9 are started, so that the wafer can be debonded, if the glass disc 4 is dirty, the two lever rods 8 are pulled to the two sides, and the plurality of metal elastic sheets 7 are compressed, so that the two clamping plates 6 are driven to move outwards, the clamping plate 6 is separated from the glass disc 4, so that the glass disc 4 placed in the placing groove 201 can be disassembled, and a new glass disc 4 can be replaced, after the new glass disc 4 is replaced, the two lever rods 8 are loosened, the plurality of metal elastic sheets 7 are reset, the two clamping plates 6 are reset, the clamping plate 6 abuts against the upper end of the glass disc 4, and then the glass disc 4 can be fixed, so that the debonding effect is not affected.

[0040] The above is only the preferred embodiment of the utility model, and it should be pointed out that for ordinary technical personnel in the technical field, without departing from the technical principle of the utility model, a plurality of improvements and modifications can be made, and the improvements and modifications of the above assumptions should be regarded as the protection range of the utility model.

Claims

1. A UV debonder comprising a cabinet (1), characterized in that: The inner wall of the cabinet (1) is symmetrically provided with two slide rails, the slide rails are slidably connected with connecting strips, the side walls of the two connecting strips are fixed with the same wafer placing rack (2), the side wall of the wafer placing rack (2) is fixed with a handle (3), the upper end of the wafer placing rack (2) is provided with a detachable glass plate (4), the cabinet (1) is provided with a light source mechanism, and the light source mechanism comprises a light source box (5) and a lifting assembly.

2. A UV debonder according to claim 1, characterized in that: The detachable glass plate (4) comprises a placing groove (201) formed on the upper end of the wafer placing rack (2), the inner wall of the wafer placing rack (2) is symmetrically provided with two clamping grooves (202), the clamping grooves (202) are inserted with clamping plates (6), the end portions of the clamping plates (6) are fixed with a plurality of metal springs (7), the end portions of the metal springs (7) are fixed on the inner wall of the clamping groove (202), the upper end of the wafer placing rack (2) is symmetrically provided with two sliding grooves (203), and the protruding end of the clamping plate (6) penetrating through the sliding groove (203) is fixed with a pulling rod (8).

3. A UV debonder according to claim 1, characterized in that: The cabinet (1) is formed with a placing cavity (101) for placing the light source box (5), and the light source box (5) is fixed with a plurality of UV lamp tubes (9).

4. The UV debonder of claim 1, wherein: The lifting assembly comprises a servo electric cylinder (10) fixed at the bottom of the cabinet (1), the servo electric cylinder (10) penetrates through the cabinet (1) and is fixed at the lower end of the light source box (5), and the lower end of the light source box (5) is fixed with a plurality of guide rods (11) inserted into the cabinet (1).

5. The UV debonder of claim 1, wherein: The two sides of the cabinet (1) are symmetrically provided with two handles (12), and the side wall of the cabinet (1) is formed with a plurality of heat dissipation holes (102).

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