Thermal expansion device for semiconductor chip mounter
By using a thermal expansion device to expand the blue film on the back of the wafer, the problem of insufficient chip spacing on thin wafers is solved, the packaging yield is improved and the cost is reduced, and it is compatible with existing chip mounter production lines.
Patent Information
- Application Number
- CN202520461530.X
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-03-17
- Publication Date
- 2026-02-27
- Estimated Expiration
- 2035-03-17
AI Technical Summary
Existing pick-and-place machines struggle to prevent chip collisions during high-precision cutting of thin wafers, leading to chip cracking or wear, which affects packaging yield and increases costs.
A thermal expansion device is used to expand the blue film on the back of the wafer through a hot air blower, thereby increasing the chip spacing and preventing the pick-up head from rubbing against it. The movement of the hot air blower is controlled by a drive component to adapt to existing pick-and-place machine production lines.
It improves the yield rate of chip packaging, reduces cost losses, ensures uniform expansion of the blue film, avoids chip cracking, and enhances the practicality of the device.
Smart Images
Figure CN223957938U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model relates to a semiconductor chip chip mounter heat extension device suitable for semiconductor chip processing technical field. BACKGROUND
[0002] The chip mounter is a kind of processing equipment for mounting semiconductor chip, and the chip cut out by wafer sheet is taken out and mounted on PCB board material by automatic or manual operation.With the development of technology, the production thickness of wafer sheet in semiconductor chip packaging process is thinner and thinner, and the cutting precision is higher and higher, but the operation precision of chip mounter is difficult to improve, especially some manual chip mounter, chip is sucked from wafer sheet by suction head through manual operation of operator, when the thickness of wafer is less than 100 microns, and the spacing of chip on wafer is less than 40 microns, the operation of sucking chip is very easy to make chip between rubbing, thereby easily leading to chip cracking or wearing, and since chip crack is very small, it is difficult to distinguish with naked eye, thus, usually, abnormality is detected only in the process of testing after packaging, not only greatly influences packaging yield, but also wastes a lot of production cost. SUMMARY
[0003] In order to solve the defects existing in the prior art, the utility model provides a semiconductor chip chip mounter heat extension device.
[0004] The utility model discloses a technical scheme is: a semiconductor chip chip mounter with heat extension device, including frame, fixedly arranged on the frame and be used for placing the annular operation disc of wafer, set up in the operation disc one side and be used for heat extension wafer blue film's heat extension mechanism, heat extension mechanism includes along the horizontal direction and moves and sets up the hot -blast head, fixedly set up on the frame and be used for driving hot -blast head movement's drive assembly, with hot -blast head is connected and be used for conveying hot -blast device, the upper portion of hot -blast head is provided with a plurality of first air -blowing face, a plurality of first air -blowing face around the axis of hot -blast head is circular array distribution, and every first air -blowing face all is from top to bottom by inside to outside inclination, every first air -blowing face all is seted up with a plurality of first air -blowing hole, heat extension mechanism has at least two working conditions, when it is in first working condition, hot -blast head is located operation disc directly below, and hot -blast device starts up, when heat extension mechanism is in second working condition, hot -blast head leaves operation disc's lower area, and hot -blast device is closed. Through annular operation disc places the wafer to be processed, then through drive assembly drive hot -blast head, make it move to operation disc's directly below, and start hot -blast device and supply hot -blast, then through a plurality of first air -blowing face and the air -blowing hole seted up on first air -blowing face, make hot -blast can diffuse and evenly blow to operation disc on wafer back after blowing out from hot -blast head, in order to make wafer back through heat and make the blue film of wafer back expand, so that the pitch of chip on it expands, avoid the chip mounter suction head and take the chip and rub with adjacent chip, prevent the chip and crack, thereby improve the yield of chip package, reduce cost loss. And, when heat extension is completed, through drive assembly and withdraw hot -blast head, make it leave operation disc lower area, and close hot -blast device, can prevent hot -blast head and disturb the normal operation of each component of chip mounter, facilitate heat extension device and can adapt existing chip mounter production line and process.
[0005] Further, the frame includes a bottom plate, a vertical plate vertically arranged at a side of the bottom plate, the operation disc is fixed above the bottom plate, and the heat extension mechanism is fixedly connected with the vertical plate. The operation disc is fixed by the bottom plate, and the heat extension mechanism is fixed at a side of the operation disc by the vertical plate, so that the drive assembly drives the hot -blast head.
[0006] Further, the drive assembly includes a driver fixedly connected to the vertical plate and a connecting piece fixedly arranged on an output shaft of the driver, and the hot -blast head is fixedly arranged on the connecting piece. Specifically, the driver is a telescopic cylinder, and a cylinder body of the telescopic cylinder is fixed to the vertical plate, so that the connecting piece is driven to reciprocate by the telescopic cylinder, and the hot -blast head is driven.
[0007] Further, the heat-expanding mechanism further comprises a hard gas conveying pipe penetrating through the vertical plate and being in sliding connection with the vertical plate, one end of the hard gas conveying pipe being in communication with the hot air blowing head, the other end of the hard gas conveying pipe being in communication with the output end of the hot air device through a hose, and the connecting piece being in fixed connection with the hard gas conveying pipe. The hard gas conveying pipe is used to realize the fixed connection between the hot air blowing head and the connecting piece, and the hard gas conveying pipe is in sliding connection with the vertical plate, so that the stability of the hot air blowing head during movement is improved, and shaking is avoided. Specifically, the hard gas conveying pipe is made of a metal pipe or a plastic pipe.
[0008] Further, the hot air blowing head is horizontally provided with a second blowing surface on the top, and at least one second blowing hole is formed in the second blowing surface. The second blowing surface cooperates with the first blowing surface to ensure that the hot air blown by the hot air blowing head can uniformly and comprehensively cover the area above the hot air blowing head, so that the blue film on the back of the wafer can be uniformly expanded, thereby uniformly expanding the spacing between the chips.
[0009] Further, each of the plurality of first blowing surfaces is an isosceles trapezoid, and the opposite waists of every two adjacent first blowing surfaces coincide, and the upper bases of the plurality of first blowing surfaces jointly constitute the outer contour of the second blowing surface. Specifically, the second blowing surface and the plurality of first blowing surfaces form a prism shape, and the second blowing surface is the top surface of the prism. When the heat-expanding mechanism is in the first working state, the hot air blowing head is located directly below the center position of the work disc. The first blowing surface and the second blowing surface form a regular shape, so that the hot air blown by the hot air blowing head can be uniformly diffused. When the hot air blowing head is moved to the center position of the work disc, the hot air can uniformly act on the blue film on the back of the wafer.
[0010] Further, the hot air device comprises a fan with an input end in communication with an external air source, a heating device with an input end connected to the output end of the fan and used for heating the gas, and an output end of the heating device in communication with the hot air blowing head. The fan drives the airflow, the airflow is sent into the heating device, and then the heating device heats the gas to form hot air. Specifically, the heating device is an electric heating wire.
[0011] Further, the heat-expanding device further comprises a control device used for controlling the operation of the device, and the control device is electrically connected to the driving assembly, the fan and the heating device. The control device is used to automatically control the start and stop of the hot air, the temperature of the hot air, the blowing time, the flow of the hot air and other parameters, so as to be associated with the die bonder production line to realize automatic heat-expanding die bonding.
[0012] Thanks to the above technical solutions, the present application has the following advantages over the prior art:
[0013] The semiconductor chip mounter heat expansion device, through the heat expansion mechanism, conveys hot air, makes the wafer back blue film heat expansion, thereby expands the distance between the chips, avoids the chip suction head suction chip and the adjacent chip to rub, prevents the chip cracking, thereby improves the yield of the chip packaging, reduces the cost loss, and through the multiple inclined first blowing faces arranged on the upper part of the hot air blowing head, the blown hot air can be uniformly diffused, ensures that the blue film can be uniformly expanded. BRIEF DESCRIPTION OF DRAWINGS
[0014] Some specific embodiments of the present application will be described in detail hereinafter with reference to the drawings, which are given by way of example and are not limiting the present application. Identical reference signs in the drawings designate identical or similar components or parts. It should be understood by those skilled in the art that the drawings are not necessarily drawn to scale. In the drawings:
[0015] Figure 1 is a structural schematic of an embodiment of the present application Figure 1 ;
[0016] Figure 2 is a structural schematic of the embodiment shown in Figure 1 ; Figure 2 ;
[0017] Figure 3 is a structural schematic of the heat expansion mechanism in the embodiment shown in Figure 1 ;
[0018] Figure 4 is an enlarged view of the structure of the hot air blowing head in the embodiment shown in Figure 1 ;
[0019] Figure 5 is a structural schematic of the hot air device in the embodiment shown in Figure 1 ;
[0020] Figure 6 is a state schematic view of the heat expansion mechanism in the first working state in the embodiment shown in Figure 1 ;
[0021] Figure 7 is a state schematic view of the heat expansion mechanism in the second working state in the embodiment shown in Figure 1 ;
[0022] The following is a description of the reference signs:
[0023] 1, rack; 11, bottom plate; 12, vertical plate; 2, work disc; 3, heat expansion mechanism; 31, hot air blowing head; 311, first blowing surface; 312, first blowing hole; 313, second blowing surface; 314, second blowing hole; 32, driving assembly; 321, driver; 322, connecting piece; 33, hot air device; 331, fan; 332, heating device; 34, hard gas conveying pipe; 4, control device. DETAILED DESCRIPTION
[0024] The technical solutions of the present application will be described clearly and completely below with reference to the drawings. Obviously, the described embodiments are only some of the embodiments of the present application, not all. Based on the embodiments of the present application, all other embodiments obtained by those skilled in the art without creative labor fall within the scope of the present application.
[0025] In the description of the present application, it should be noted that the terms "up", "down" related to the direction description are defined according to the direction of the normal setting of the heat expansion device. Specifically, when the heat expansion device is normally placed, the side facing the ground is "down", and vice versa. The terms "first", "second" are only for the purpose of description, and cannot be understood as indicating or implying relative importance. In addition, the technical features involved in different embodiments of the present application described below can be combined with each other as long as they do not conflict with each other.
[0026] Reference is made to the accompanying drawings Figures 1-7The semiconductor chip placement machine heat expansion device in the embodiment comprises a rack 1, a work disc 2 in a ring shape fixedly arranged on the rack 1 and used for placing a wafer, a heat expansion mechanism 3 arranged on one side of the work disc 2 and used for heat expanding a blue film of the wafer, the heat expansion mechanism 3 comprises a hot air blowing head 31 arranged in a horizontal direction, a driving assembly 32 fixedly arranged on the rack 1 and used for driving the hot air blowing head 31 to move, and a hot air device 33 connected with the hot air blowing head 31 and used for conveying hot air, a plurality of first blowing faces 311 are arranged on the upper portion of the hot air blowing head 31, the plurality of first blowing faces 311 are distributed in a circumferential array around the axis of the hot air blowing head 31, and each first blowing face 311 is inclined from top to bottom and from inside to outside, and a plurality of first blowing holes 312 are arranged on each first blowing face 311, the heat expansion mechanism 3 has at least two working states, when the heat expansion mechanism 3 is in a first working state, the hot air blowing head 31 is located directly below the work disc 2, and the hot air device 33 is started, and when the heat expansion mechanism 3 is in a second working state, the hot air blowing head 31 is away from the lower region of the work disc 2, and the hot air device 33 is turned off. The wafer to be processed is placed on the work disc 2 in the ring shape, then the hot air blowing head 31 is driven by the driving assembly 32 to move to the position directly below the work disc 2, and the hot air device 33 is started to supply hot air, then the hot air is blown out from the hot air blowing head 31 and diffused and uniformly blown to the back of the wafer on the work disc 2 through the plurality of first blowing faces 311 and the blowing holes 312 arranged on the first blowing faces 311, so that the blue film on the back of the wafer is expanded by heat, thereby expanding the distance between the chips on the wafer, avoiding the collision between the suction head of the placement machine and the adjacent chips when the chips are sucked, preventing the chips from cracking, thereby improving the yield of the chip packaging and reducing the cost loss. When the heat expansion is completed, the hot air blowing head 31 is retracted by the driving assembly 32 to be away from the lower region of the work disc 2, and the hot air device 33 is turned off, so that the hot air blowing head 31 does not interfere with the normal operation of the components of the placement machine, and the heat expansion device can be adapted to the existing placement machine production line for processing.
[0027] In a more preferred embodiment, the rack 1 comprises a bottom plate 11 and a vertical plate 12 arranged on the side of the bottom plate 11, the work disc 2 is fixed above the bottom plate 11, and the heat expansion mechanism 3 is fixedly connected with the vertical plate 12, so that the work disc 2 is fixed by the bottom plate 11 and the heat expansion mechanism 3 is fixed on the side of the work disc 2 by the vertical plate 12, facilitating the driving assembly 32 to drive the hot air blowing head 31.
[0028] In a more preferable embodiment, the driving assembly 32 comprises a driver 321 fixedly connected to the vertical plate 12, a connecting member 322 fixedly arranged on the output shaft of the driver 321, and the hot air blowing head 31 fixedly arranged on the connecting member 322. Specifically, the driver 321 is arranged as a telescopic cylinder, and the cylinder body of the telescopic cylinder is fixed to the vertical plate 12, so as to drive the connecting member 322 to reciprocate through the telescopic cylinder, and further drive the hot air blowing head 31.
[0029] In a more preferable embodiment, the hot expanding mechanism 3 further comprises a hard air conveying pipe 34 arranged through the vertical plate 12 and in sliding connection with the vertical plate 12. One end of the hard air conveying pipe 34 is in communication with the hot air blowing head 31, and the other end of the hard air conveying pipe 34 is in communication with the output end of the hot air device 33 through a hose. The connecting member 322 is fixedly connected to the hard air conveying pipe 34. The fixed connection between the hot air blowing head 31 and the connecting member 322 is realized through the hard air conveying pipe 34, and the sliding connection between the hard air conveying pipe 34 and the vertical plate 12 is realized at the same time, so as to improve the stability of the hot air blowing head 31 during movement and avoid shaking. Specifically, the material of the hard air conveying pipe 34 is arranged as a metal pipe or a plastic pipe.
[0030] In a more preferable embodiment, the top of the hot air blowing head 31 is horizontally provided with a second blowing face 313, and at least one second blowing hole 314 is arranged on the second blowing face 313. The second blowing face 313 cooperates with the first blowing face 311, so that the hot air blown out by the hot air blowing head 31 can uniformly and comprehensively cover the area above the hot air blowing head, and ensure that the blue film on the back of the wafer can be uniformly expanded, so as to uniformly expand the spacing between the chips.
[0031] In a more preferable embodiment, each of the plurality of first blowing faces 311 is arranged as an isosceles trapezoid, and the opposite waists of every two adjacent first blowing faces 311 coincide. The upper bases of the plurality of first blowing faces 311 jointly constitute the outer contour of the second blowing face 313. Specifically, the second blowing face 313 and the plurality of first blowing faces 311 constitute a prism shape, and the second blowing face 313 is the top face of the prism. When the hot expanding mechanism 3 is in the first working state, the hot air blowing head 31 is located directly below the center position of the work disc 2. When the hot expanding mechanism is in the first working state, the hot air blowing head 31 is located directly below the center position of the work disc 2. By arranging the first blowing face 311 and the second blowing face 313 as a regular shape, it is ensured that the hot air blown out by the hot air blowing head 31 can be uniformly diffused. By moving the hot air blowing head 31 to the position directly below the center position of the work disc 2, it is ensured that the hot air can uniformly act on the blue film on the back of the wafer.
[0032] In a more preferable embodiment, the hot air device 33 comprises a fan 331 having an input end connected to an external air source, a heating device 332 having an input end connected to an output end of the fan 331 and used for heating air, and an output end of the heating device 332 connected to the hot air blowing head 31, air is driven by the fan 331, sent into the heating device 332, and then heated by the heating device 332 to form hot air, and specifically, the heating device 332 is an electric heating wire.
[0033] In a more preferable embodiment, the hot expansion device further comprises a control device 4 used for controlling operation of the device, and the control device 4 is electrically connected to the driving assembly 32, the fan 331 and the heating device 332 respectively. By arranging the control device 4, hot air starting or stopping, hot air temperature, blowing time, hot air flow and other parameters can be automatically controlled, so as to be associated with a chip mounter production line to realize automatic hot expansion chip mounting.
[0034] Thanks to the above technical scheme, the present application has the following advantages over the prior art:
[0035] The semiconductor chip mounter hot expansion device has the advantages that: the hot expansion mechanism conveys hot air to make the blue film on the back of the wafer expand under heat, thereby expanding the distance between the chips, avoiding collision between the chip suction head and the adjacent chip when the chip suction head sucks the chip, preventing the chip from cracking, improving the yield of chip packaging, reducing cost loss, and ensuring that the blue film can expand uniformly by arranging multiple inclined first blowing surfaces on the upper part of the hot air blowing head, so that the hot air blown out can be uniformly diffused; in addition, the driving assembly drives the hot air blowing head to move out of the area below the workbench after hot expansion is completed, so as to adapt to the chip mounter, avoid interfering with other moving parts of the chip mounter, and improve the practicability.
[0036] The above embodiments are only for illustrating the technical concept and characteristics of the present application, and the purpose is to enable those skilled in the art to understand the content of the present application and implement it, and cannot limit the protection scope of the present application, and any equivalent changes or modifications made according to the spirit and essence of the present application should be covered within the protection scope of the present application.
Claims
1. A heat spreading device for a semiconductor die bonder, characterized by: The utility model provides a wafer heat expanding device, which comprises a rack (1), a ring-shaped work disc (2) fixedly arranged on the rack (1) and used for placing a wafer, a heat expanding mechanism (3) arranged on one side of the work disc (2) and used for heat expanding a wafer blue film, the heat expanding mechanism (3) comprises a hot air blowing head (31) arranged in a horizontal direction, a driving assembly (32) fixedly arranged on the rack (1) and used for driving the hot air blowing head (31) to move, and a hot air device (33) connected with the hot air blowing head (31) and used for conveying hot air, a plurality of first blowing faces (311) are arranged on the upper portion of the hot air blowing head (31), the plurality of first blowing faces (311) are arranged in a circumferential array around the axis of the hot air blowing head (31), and each first blowing face (311) is inclined from top to bottom and from inside to outside, a plurality of first blowing holes (312) are arranged on each first blowing face (311), and the heat expanding mechanism (3) has at least two working states, when the heat expanding mechanism (3) is in a first working state, the hot air blowing head (31) is located directly below the work disc (2), and the hot air device (33) is started; when the heat expanding mechanism (3) is in a second working state, the hot air blowing head (31) is away from the lower region of the work disc (2), and the hot air device (33) is turned off.
2. The semiconductor die bonder heat spreading apparatus of claim 1, wherein: The rack (1) comprises a bottom plate (11) and a vertical plate (12) arranged on the side of the bottom plate (11), the work disc (2) is fixedly arranged above the bottom plate (11), and the heat expanding mechanism (3) is fixedly connected with the vertical plate (12).
3. The semiconductor die bonder heat spreading apparatus of claim 2, wherein: The driving assembly (32) comprises a driver (321) fixedly connected with the vertical plate (12) and a connecting piece (322) fixedly arranged on the output shaft of the driver (321), and the hot air blowing head (31) is fixedly arranged on the connecting piece (322).
4. The semiconductor die bonder heat spreading apparatus of claim 3, wherein: The heat expanding mechanism (3) further comprises a hard gas conveying pipe (34) penetrating through the vertical plate (12) and being in sliding connection with the vertical plate (12), one end of the hard gas conveying pipe (34) is in communication with the hot air blowing head (31), the other end of the hard gas conveying pipe (34) is in communication with the output end of the hot air device (33) through a hose, and the connecting piece (322) is fixedly connected with the hard gas conveying pipe (34).
5. The semiconductor die bonder heat spreading apparatus of claim 1, wherein: A second blowing face (313) is horizontally arranged on the top of the hot air blowing head (31), and at least one second blowing hole (314) is arranged on the second blowing face (313).
6. The semiconductor die bonder heat spreading apparatus of claim 5, wherein: Each first blowing face (311) is arranged in an isosceles trapezoidal shape, the opposite legs of every two adjacent first blowing faces (311) are coincident with each other, and the upper bases of the plurality of first blowing faces (311) jointly form the outer contour of the second blowing face.
7. The semiconductor die bonder heat spreading apparatus of claim 6, wherein: When the heat expanding mechanism is in the first working state, the hot air blowing head (31) is located directly below the center of the work disc (2).
8. The semiconductor die bonder heat spreading apparatus of claim 1, wherein: The hot air device (33) comprises a fan (331) with an input end connected to an external air source, and a heating device (332) with an input end connected to an output end of the fan (331) and used for heating air, and an output end of the heating device (332) connected to the hot air blowing head (31).
9. The semiconductor die bonder heat spreading apparatus of claim 7, wherein: The heat spreading device further comprises a control device (4) used for controlling operation of the device, and the control device (4) is electrically connected to the driving assembly (32), the fan (331) and the heating device (332) respectively.