Wafer bearing mechanism
By designing a wafer carrier mechanism with retractable clamping components and support blocks, the problems of complex structure and insufficient adaptability of existing devices are solved. Stable clamping and fixing of wafers of different sizes is achieved, simplifying the structure, reducing costs, and improving process and inspection accuracy.
Patent Information
- Application Number
- CN202520171479.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-01-24
- Publication Date
- 2026-02-27
- Estimated Expiration
- 2035-01-24
AI Technical Summary
Existing wafer carrier devices are complex in structure, expensive, prone to wafer misalignment, have poor adaptability, and are insufficient for wafers of different sizes, affecting process and inspection accuracy.
A wafer carrier mechanism is designed, comprising retractable first and second clamping components and a support block. The mechanism uses a lifting component to clamp and fix wafers of different sizes. The clamping components and the support block work together to adapt to wafers of different sizes and avoid obstructing the back of the wafer during clamping.
It enables stable clamping and fixation of wafers of different sizes, simplifies the structure, reduces costs, and improves the accuracy and efficiency of processes and inspections.
Smart Images
Figure CN223957953U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model belongs to semiconductor equipment technical field especially, it relates to a wafer bearing mechanism. BACKGROUND
[0002] The wafer bearing device is usually used for holding the wafer so as to process or detect the wafer as the main structure in semiconductor processing equipment or detection equipment.
[0003] The wafer bearing device currently usually has the following problems: complex structure, high cost and complex maintenance, the surface of the wafer cannot be exposed after being placed on the wafer bearing mechanism, affecting wafer detection, the wafer carried by the wafer bearing device may be offset relative to the wafer bearing device, and the wafer may also be offset relative to the target position in the process of transferring the wafer by the mechanical arm, so that process deviation is caused in the subsequent process, or detection deviation is caused in the detection process, affecting yield and detection accuracy, the wafer may be broken by impact when being clamped and fixed, and the wafer bearing device corresponding to one processing equipment or one detection equipment can only carry one size of wafer, and the adaptability to different sizes of wafers is poor. SUMMARY
[0004] Therefore, the utility model aims at providing a wafer bearing mechanism, which is suitable for clamping and fixing wafers of different sizes.
[0005] To achieve the above-mentioned purposes, the technical scheme of the utility model is as follows:
[0006] The utility model provides a wafer bearing mechanism, comprising: first clamping assembly and a plurality of first supporting blocks are arranged on the first horizontal plane and are arranged at intervals along the circumference of the first preset circle, the two sides of the first clamping assembly are provided with the first supporting block, and one end of the first clamping assembly towards the center of the first preset circle is telescopic;Second clamping assembly and a plurality of second supporting blocks are arranged on the second horizontal plane and are arranged at intervals along the circumference of the second preset circle, the two sides of the second clamping assembly are provided with the second supporting block, and one end of the second clamping assembly towards the center of the second preset circle is telescopic;Lifting assembly is used for driving the second clamping assembly and a plurality of second supporting blocks to switch between the first horizontal plane and the second horizontal plane;Wherein, the second horizontal plane is above the first horizontal plane, the first preset circle is opposite to the second preset circle, and the radius of the first preset circle is greater than the radius of the second preset circle.
[0007] Further, the wafer carrying mechanism further comprises a mounting plate and a support, the mounting plate has a detection hole penetrating through the mounting plate along the thickness direction, a plurality of first supporting blocks and a first clamping assembly are arranged on the mounting plate around the circumference of the detection hole; the lifting assembly is arranged on the mounting plate through the support, and a plurality of second supporting blocks and a second clamping assembly are arranged on the lifting assembly.
[0008] Further, the first supporting block comprises a first main body part and a first carrying part connected with each other, the first main body part is arranged on the mounting plate, and the first carrying part is located at one end of the first main body part away from the mounting plate, and the first carrying part and the first main body part form a stepped structure.
[0009] Further, the support comprises a first support and a second support, the lifting assembly comprises a first lifting unit and a second lifting unit, the first lifting unit is arranged on the first support, the second supporting block is connected with the first lifting unit, the second lifting unit is arranged on the second support, and the second clamping assembly is connected with the second lifting unit.
[0010] Further, the second supporting blocks located on the same side of the second clamping assembly are arranged on the same first lifting unit, and the second supporting blocks located on the same side of the second clamping assembly are arranged on the same first lifting unit through the mounting piece, and the second supporting blocks are arranged on the opposite ends of the mounting piece.
[0011] Further, the first lifting unit comprises a gas cylinder, and the second lifting unit comprises a gas cylinder.
[0012] Further, the second supporting block comprises a mounting part, a second main body part and a second carrying part connected in sequence, the mounting part is arranged on the mounting piece, the second carrying part is located at one end of the second main body part away from the mounting part, and the second carrying part and the second main body part form a stepped structure.
[0013] Further, the first clamping assembly comprises a first clamping part and a first driving unit, the first clamping part is located at one end of the first driving unit facing the center of the first preset circle, and the first driving unit can drive the first clamping part to move along the radial direction of the first preset circle, so as to push the wafer to the target position.
[0014] Further, the first clamping assembly and the second clamping assembly are the same structure, the second clamping assembly comprises a second clamping part and a second driving unit, when the second clamping assembly is located on the second horizontal plane, the second clamping assembly is located directly above the first clamping assembly, and when the second clamping assembly is located on the first horizontal plane, the second clamping is located on one side of the first clamping part facing the center of the first preset circle.
[0015] Further, the first driving unit is connected with the first clamping part through a connecting piece, the connecting piece comprises a limiting connecting part, a sliding block, a guide rail and an elastic part, the first end of the limiting connecting part is connected with the first driving unit, the end of the first clamping part towards the first driving unit is connected with the first end of the limiting connecting part through the elastic part, the second end of the limiting connecting part is bent towards the first clamping part to limit part of the first clamping part on the limiting connecting part, the guide rail is arranged on the limiting connecting part, and the sliding block is arranged on the first clamping part and connected with the guide rail.
[0016] Compared with the prior art, the wafer bearing mechanism provided by the utility model can achieve the following beneficial effects: the first clamping assembly and the plurality of first supporting blocks are used for bearing and clamping the first size wafer, the second clamping assembly and the plurality of second supporting blocks are used for bearing and clamping the second size wafer, the first size is greater than the second size, the second clamping assembly and the plurality of second supporting blocks can be switched from the second horizontal plane to the first horizontal plane under the driving of the lifting assembly, in this way, when the wafer bearing mechanism bears and clamps the first size wafer, the second clamping assembly and the plurality of second supporting blocks are moved to the second horizontal plane, the first clamping assembly and the plurality of first supporting blocks are used to bear and clamp the first size wafer, when the wafer bearing mechanism bears and clamps the second size wafer, the second clamping assembly and the plurality of second supporting blocks are moved to the first horizontal plane, and the second clamping assembly and the plurality of second supporting blocks are used to bear and clamp the second size wafer. In addition, under the premise of having relatively optimal functions, the wafer bearing mechanism provided by the utility model has a relatively simple structure, low setting cost and low maintenance difficulty. BRIEF DESCRIPTION OF DRAWINGS
[0017] The accompanying drawings, which form a part of the present application, are used to provide a further understanding of the application and are incorporated herein for explanatory purposes. The description and illustration of the embodiments of the present application are described and illustrated so as to explain the present application to those skilled in the art.
[0018] Figure 1 The wafer bearing mechanism described in the embodiments of the utility model is a top view;
[0019] Figure 2 The wafer bearing mechanism described in the embodiments of the utility model is a structural schematic view;
[0020] Figure 3 The first clamping assembly described in the embodiments of the utility model is a structural schematic view in a first perspective view;
[0021] Figure 4 The first clamping assembly described in the embodiments of the utility model is a structural schematic view in a second perspective view;
[0022] Figure 5The structure schematic view of the first supporting block;
[0023] Figure 6 The structure schematic view of the first supporting block;
[0024] Figure 7 The structure schematic view of the second supporting block.
[0025] The figure mark explanation: 102, first clamping assembly;101, first supporting block;113, second clamping assembly;111, second supporting block;100, mounting plate;1011, first main body part;1012, first bearing part;117, first support;115, second support;116, first lifting unit;114, second lifting unit;112, mounting piece;1111, mounting part;1112, second main body part;1113, second bearing part;135, first clamping part;133, first drive unit;130, limit connecting part;132, sliding block;134, guide rail;131, elastic part. DETAILED DESCRIPTION
[0026] In order to make the purpose, technical scheme and advantages of the utility model more clearly, the following will be further detailed with the utility model combining with the specific embodiment and the drawings.It should be understood that the specific embodiment described here is only used to explain the utility model, and does not constitute the limitation to the utility model.
[0027] It should be noted that the embodiments in the utility model and the features in the embodiments can be combined with each other without conflict.
[0028] In the description of the utility model, it should be understood that the orientation or position relationship indicated by the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise" and the like is the orientation or position relationship based on the orientation or position relationship shown in the drawings, and is only for the convenience of describing the utility model and simplifying the description, and therefore cannot be understood as indicating or implying that the indicated device or element must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as limiting the utility model.In addition, the terms "first", "second" and the like are only for the purpose of description, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features.Therefore, the features limited by "first", "second" and the like can explicitly or implicitly include one or more features.In the description of the utility model, unless otherwise specified, the meaning of "multiple" is two or more.
[0029] In the description of the utility model, it is to explain, unless another explicit provision and limitation, term "installation", "link", "connection" should do broad sense understanding, for example, can be fixed connection, also can be detachable connection, or integrally connected;Can be mechanical connection, also can be electrical connection;Can be directly connected, also can be indirectly connected through intermediate medium, can be two elements inside the communication.For ordinary skilled in the art, the above-mentioned terms can be understood by the specific meaning in the utility model through specific circumstances.
[0030] The utility model will be described below in detail with reference to the drawings and in combination with the embodiments.
[0031] The wafer bearing mechanism provided by the utility model comprises: a first clamping assembly 102 and a plurality of first supporting blocks 101 which are arranged at intervals along the circumference of a first preset circle on a first horizontal plane, the two sides of the first clamping assembly 102 are provided with the first supporting blocks 101, and one end of the first clamping assembly 102 towards the center of the first preset circle is retractable; a second clamping assembly 113 and a plurality of second supporting blocks 111 which are arranged at intervals along the circumference of a second preset circle on a second horizontal plane, the two sides of the second clamping assembly 113 are provided with the second supporting blocks 111, and one end of the second clamping assembly 113 towards the center of the second preset circle is retractable; a lifting assembly, the lifting assembly is used for driving the second clamping assembly 113 and the plurality of second supporting blocks 111 to switch between the first horizontal plane and the second horizontal plane; wherein the second horizontal plane is located above the first horizontal plane, the first preset circle and the second preset circle are opposite, and the radius of the first preset circle is greater than the radius of the second preset circle.
[0032] The plurality of first supporting blocks 101 are used for bearing first size wafers, the retractable first clamping assembly 102 is used for pushing the first size wafers borne by the plurality of first supporting blocks 101 to a target position, the first clamping assembly 102 and the first supporting blocks 101 away from the first clamping assembly 102 are cooperatively matched to realize the clamping and fixing of the first size wafers at the target position, and similarly, the plurality of second supporting blocks 111 are used for bearing second size wafers, the retractable second clamping assembly 113 is used for pushing the second size wafers borne by the plurality of second supporting blocks 111 to a target position, and the second clamping assembly 113 and the second supporting blocks 111 away from the second clamping assembly 113 are cooperatively matched to realize the clamping and fixing of the second size wafers at the target position.
[0033] In some examples, the first size can be 12 inches, and the second size can be 8 inches.
[0034] It should be noted that the first preset circle in the embodiments of the utility model relates to the circle set according to the first size wafer, the second preset circle is the circle set according to the second size wafer, the embodiments of the utility model do not limit the size of the first preset circle and the second preset circle, as long as the first clamping assembly 102 and the plurality of first supporting blocks 101 can bear and clamp the wafer, and the second clamping assembly 113 and the plurality of second supporting blocks 111 can bear and clamp the wafer.
[0035] In some embodiments, the wafer bearing mechanism provided by the embodiments of the utility model can be applied in optical defect detection.
[0036] The wafer bearing mechanism provided by the utility model clamps and fixes the wafer, the back of the wafer is in an exposed state, the wafer bearing mechanism does not cause excessive shielding to the back of the wafer, so that the processing or detection of the back of the wafer can be realized.
[0037] In some embodiments, the number of first supporting blocks 101 and the number of second supporting blocks 111 are equal.
[0038] In some examples, referring to Figure 1 and Figure 2 The wafer bearing mechanism includes four first supporting blocks 101, the four first supporting blocks 101 are matched for bearing the first size wafer, and the two first supporting blocks 101 away from the first clamping assembly 102 are further matched with the first clamping assembly 102 to radially clamp and fix the first size wafer, specifically, the robot or other wafer carrying mechanism places the first size wafer on the four first supporting blocks 101, at this time, the first clamping assembly 102 does not contact the wafer, the wafer is borne by the four first supporting blocks 101, after the wafer is placed on the first supporting block 101, the first clamping assembly 102 pushes the wafer to the target position towards one end of the first preset circle center, and the two first supporting blocks 101 away from the first clamping assembly 102 clamp and fix the first size wafer at the target position.
[0039] In some examples, referring to Figure 1 and Figure 2The wafer carrying mechanism includes four second supporting blocks 111, which are matched to carry the second-size wafer. Two second supporting blocks 111 away from the second clamping assembly 113 are also matched with the second clamping assembly 113 to radially clamp and fix the second-size wafer. Specifically, the robot or other wafer carrying mechanism places the second-size wafer on the four second supporting blocks 111. At this time, the second clamping assembly 113 is not in contact with the wafer, and the wafer is carried by the four second supporting blocks 111. After the wafer is placed on the second supporting blocks 111, the second clamping assembly 113 pushes the wafer to the target position toward one end of the second preset circular center, and the two second supporting blocks 111 away from the second clamping assembly 113 clamp and fix the second-size wafer at the target position.
[0040] In some embodiments, the wafer carrying mechanism further includes a mounting plate 100 and a bracket. The mounting plate 100 has a detection through hole penetrating through the mounting plate 100 along the thickness direction. The plurality of first supporting blocks 101 and the first clamping assembly 102 are arranged on the mounting plate 100 around the circumference of the detection through hole. The lifting assembly is arranged on the mounting plate 100 through the bracket. The plurality of second supporting blocks 111 and the second clamping assembly 113 are arranged on the lifting assembly.
[0041] In some embodiments, referring to Figure 6 The first supporting block 101 includes a first main body part 1011 and a first carrying part 1012 connected with each other. The first main body part 1011 is arranged on the mounting plate 100. The first carrying part 1012 is located at one end of the first main body part 1011 away from the mounting plate 100. The first carrying part 1012 and the first main body part 1011 form a stepped structure to realize the carrying and clamping of the wafer. When the plurality of first supporting blocks 101 cooperate to carry the wafer, the surface of the first carrying part 1012 extending in the horizontal direction in the stepped structure is used to carry the wafer. When the plurality of first supporting blocks 101 cooperate with the first clamping assembly 102 to clamp the wafer, the side surface of the first main body part 1011 extending in the vertical direction in the stepped structure is used to clamp the wafer.
[0042] In some embodiments, referring to Figure 1 and Figure 2 The bracket includes a first bracket 117 and a second bracket 115. The lifting assembly includes a first lifting unit 116 and a second lifting unit 114. The first lifting unit 116 is arranged on the first bracket 117, and the second supporting block 111 is connected with the first lifting unit 116. The second lifting unit 114 is arranged on the second bracket 115, and the second clamping assembly 113 is connected with the second lifting unit 114.
[0043] In some embodiments, the second support blocks 111 on the same side of the second clamping assembly 113 are arranged on the same first lifting unit 116, and the second support blocks 111 on the same side of the second clamping assembly 113 are arranged on the same first lifting unit 116 through the mounting member 112, and the second support blocks 111 are arranged at opposite ends of the mounting member 112.
[0044] In some embodiments, the first support 117 is located between two adjacent first support blocks 101, and the two first support blocks 101 on both sides of the first support 117 are also located on the same side of the second clamping assembly 113.
[0045] In some embodiments, the first lifting unit 116 includes a pneumatic cylinder, and the second lifting unit 114 includes a pneumatic cylinder.
[0046] In some embodiments, referring to Figure 7 , the second support block 111 includes a mounting portion 1111, a second main body portion 1112 and a second bearing portion 1113 connected in sequence, the mounting portion 1111 is arranged on the mounting member 112, the second bearing portion 1113 is located at one end of the second main body portion 1112 away from the mounting portion 1111, and the second bearing portion 1113 and the second main body portion 1112 form a stepped structure to realize the bearing and clamping of the wafer; when the plurality of second support blocks 111 cooperate to bear the wafer, the surface of the second bearing portion 1113 extending in the horizontal direction in the stepped structure is used to bear the wafer; when the plurality of second support blocks 111 cooperate with the second clamping assembly 113 to clamp the wafer, the side surface of the second main body portion 1112 extending in the vertical direction in the stepped structure is used to clamp the wafer.
[0047] In some embodiments, referring to Figure 3 and Figure 4 , the first clamping assembly 102 includes a first clamping portion 135 and a first driving unit 133, the first clamping portion 135 is located at one end of the first driving unit 133 facing the center of the first preset circular shape, and the first driving unit 133 can drive the first clamping portion 135 to move along the radial direction of the first preset circular shape, so that the first clamping portion 135 pushes the wafer to the target position.
[0048] In some embodiments, referring to Figure 5 , the first clamping assembly 102 and the second clamping assembly 113 have the same structure, the second clamping assembly 113 includes a second clamping portion and a second driving unit, the second clamping portion is located at one end of the second driving unit facing the center of the second preset circular shape, and the second driving unit can drive the second clamping portion to move along the radial direction of the second preset circular shape, so that the second clamping portion pushes the wafer to the target position.
[0049] In some embodiments, when the second clamping assembly 113 is located at the second horizontal plane, the second clamping assembly 113 is located directly above the first clamping assembly 102, and when the second clamping assembly 113 is located at the first horizontal plane, the first clamping portion 135 is located at one side of the first preset circular center.
[0050] In some embodiments, the second support 115 has a hollow region, and the first clamping assembly 102 is located in the hollow region.
[0051] In some embodiments, referring to Figure 3 and Figure 4 , the first driving unit 133 is connected with the first clamping portion 135 through a connecting piece, and the connecting piece includes a limiting connecting portion 130, a sliding block 132, a guide rail 134, and an elastic portion 131. The first end of the limiting connecting portion 130 is connected with the first driving unit 133, one end of the first clamping portion 135 facing the first driving unit 133 is connected with the first end of the limiting connecting portion 130 through the elastic portion 131, and the second end of the limiting connecting portion 130 is bent towards the first clamping portion 135 to limit part of the first clamping portion 135 on the limiting connecting portion 130. The guide rail 134 is arranged on the limiting connecting portion 130, the sliding block 132 is arranged on the first clamping portion 135, and the sliding block 132 is connected with the guide rail 134. The guide rail 134 and the sliding block 132 are used to ensure that the first driving unit 133 pushes the first clamping portion 135 to move along the radial direction of the first preset circle, and play a guiding role. The second end of the limiting connecting portion 130 is bent towards the first clamping portion 135 to limit the first clamping portion 135. The elastic portion 131 is arranged to make the first clamping portion 135 elastically contact the wafer, and plays a buffering role in the clamping process, so that the first clamping portion 135 can not only clamp the wafer, but also avoid over-pressing the wafer.
[0052] It should be noted that the first clamping portion 135 can include a limiting portion and a clamping jaw connected with each other. The clamping jaw is located at one end of the limiting portion away from the first driving unit 133, and the limiting portion is limited on the limiting connecting portion 130. The clamping jaw is used to push the wafer and clamp the wafer.
[0053] In some embodiments, the elastic portion 131 includes a spring, a damper, or an air pressure buffer. The utility model preferably uses a spring as the elastic portion 131, which avoids occupying too much space for the elastic portion 131 and is conducive to reducing the weight of the connecting piece and the setting cost.
[0054] In some embodiments, the second driving unit is also connected with the second clamping portion through a connecting piece. The specific connection mode can refer to the connection mode of the second driving unit and the second clamping portion, which is not described here.
[0055] In some embodiments, the first drive unit 133 comprises a pneumatic cylinder and the second drive unit comprises a pneumatic cylinder.
[0056] It should be understood that the various forms of flow shown above can be reordered, added to, or steps deleted. For example, the steps recited in the disclosure of the present application can be executed in parallel, in series, or in a different order, as long as the desired results of the technical solution of the present application can be achieved, which is not limited herein.
[0057] The above detailed description does not constitute a limitation on the scope of protection of the present application. Those skilled in the art should understand that various modifications, combinations, sub-combinations and substitutions can be made according to design requirements and other factors. Any modification, equivalent substitution and improvement made within the spirit and principles of the present application shall be included in the scope of protection of the present application.
Claims
1. A wafer carrying mechanism characterized by comprising: The wafer carrying mechanism comprises: a first clamping assembly (102) and a plurality of first supporting blocks (101) arranged along the circumference of a first preset circle on a first horizontal plane, the first clamping assembly (102) being provided with the first supporting blocks (101) on both sides thereof, and the first clamping assembly (102) being retractable towards one end of the first preset circle; a second clamping assembly (113) and a plurality of second supporting blocks (111) arranged along the circumference of a second preset circle on a second horizontal plane, the second clamping assembly (113) being provided with the second supporting blocks (111) on both sides thereof, and the second clamping assembly (113) being retractable towards one end of the second preset circle; a lifting assembly for driving the second clamping assembly (113) and the plurality of second supporting blocks (111) to switch between the first horizontal plane and the second horizontal plane. The second horizontal plane is located above the first horizontal plane, the first preset circle and the second preset circle are opposite to each other, and the radius of the first preset circle is greater than the radius of the second preset circle.
2. The wafer carrying mechanism according to claim 1, wherein The wafer carrying mechanism further comprises a mounting plate (100) and a support, the mounting plate (100) being provided with a detection through hole penetrating through the mounting plate (100) in the thickness direction, and the plurality of first supporting blocks (101) and the first clamping assembly (102) being arranged on the mounting plate (100) around the circumference of the detection through hole. The lifting assembly is arranged on the mounting plate (100) through the support, and the plurality of second supporting blocks (111) and the second clamping assembly (113) are arranged on the lifting assembly.
3. The wafer carrying mechanism according to claim 2, wherein The first supporting block (101) comprises a first main body portion and a first carrying portion connected to each other, the first main body portion being arranged on the mounting plate (100), the first carrying portion being located at one end of the first main body portion away from the mounting plate (100), and the first carrying portion and the first main body portion forming a stepped structure.
4. The wafer carrying mechanism of claim 2, wherein, The support comprises a first support (117) and a second support (115), the lifting assembly comprises a first lifting unit (116) and a second lifting unit (114), the first lifting unit (116) being arranged on the first support (117), the second supporting block (111) being connected to the first lifting unit (116), the second lifting unit (114) being arranged on the second support (115), and the second clamping assembly (113) being connected to the second lifting unit (114).
5. The wafer carrying mechanism according to claim 4, wherein The second supporting blocks (111) located on the same side of the second clamping assembly (113) are arranged on the same first lifting unit (116), and the second supporting blocks (111) located on the same side of the second clamping assembly (113) are arranged on the same first lifting unit (116) through a mounting member (112), the second supporting blocks (111) being arranged at opposite ends of the mounting member (112).
6. The wafer carrying mechanism of claim 4, wherein, The first lifting unit (116) comprises a cylinder, and the second lifting unit (114) comprises a cylinder.
7. The wafer carrying mechanism of claim 5, wherein The second supporting block (111) comprises a mounting portion, a second main body portion and a second bearing portion connected in sequence, the mounting portion is arranged on the mounting member (112), the second bearing portion is located at one end of the second main body portion away from the mounting portion, and the second bearing portion and the second main body portion form a stepped structure.
8. The wafer carrying mechanism of claim 1, wherein, The first clamping assembly (102) comprises a first clamping portion (135) and a first driving unit (133), the first clamping portion (135) is located at one end of the first driving unit (133) facing the center of the first preset circle, and the first driving unit (133) can drive the first clamping portion (135) to move along the radial direction of the first preset circle, so that the first clamping portion (135) pushes the wafer to the target position.
9. The wafer carrying mechanism of claim 8, wherein, The first clamping assembly (102) and the second clamping assembly (113) are the same structure, the second clamping assembly (113) comprises a second clamping portion and a second driving unit, when the second clamping assembly (113) is located on the second horizontal plane, the second clamping assembly (113) is located directly above the first clamping assembly (102), when the second clamping assembly (113) is located on the first horizontal plane, the second clamping portion is located on the side of the first clamping portion (135) facing the center of the first preset circle.
10. The wafer carrying mechanism of claim 8, wherein, The first driving unit (133) is connected with the first clamping portion (135) through a connecting member, the connecting member comprises a limiting connecting portion (130), a sliding block (132), a guide rail (134) and an elastic portion (131), wherein the first end of the limiting connecting portion (130) is connected with the first driving unit (133), one end of the first clamping portion (135) facing the first driving unit (133) is connected with the first end of the limiting connecting portion (130) through the elastic portion (131), the second end of the limiting connecting portion (130) is bent towards the first clamping portion (135) to limit part of the first clamping portion (135) on the limiting connecting portion (130), the guide rail (134) is arranged on the limiting connecting portion (130), and the sliding block (132) is arranged on the first clamping portion (135). The sliding block (132) is connected with the guide rail (134).