Wafer chip batch turnover device

Abstract

The utility model provides a batch turnover device for wafer chips, which relates to the technical field of chip detection and comprises a first bearing part, a second bearing part and a connecting assembly. The first bearing piece is provided with a first accommodating surface, and at least one first accommodating part is arranged on the first accommodating surface and is used for accommodating at least one wafer chip bearing tray to be overturned; the second bearing piece is provided with a second accommodating surface, at least one second accommodating part is arranged on the second accommodating surface, and the shape and the size of the second accommodating part correspond to those of the first accommodating part; the connecting assembly is connected with the first bearing part and the second bearing part, so that the first bearing part and the second bearing part can move relatively; and when the first accommodating surface and the second accommodating surface are folded, the first accommodating part and the corresponding second accommodating part form an accommodating space for fixing the wafer chip bearing tray. Through the above structure, overall and batch overturning of the wafer chip bearing tray can be realized, and low efficiency and damage risk caused by manual overturning of chips are avoided.

Description

TECHNICAL FIELD

[0001] The utility model relates to chip detection technical field especially relates to a wafer chip batch turnover device. BACKGROUND

[0002] In the field of semiconductor manufacturing and packaging testing, wafer chips (Die) are usually produced in the form of wafers (Wafer). In order to facilitate transportation, storage and subsequent automated processing, the cut wafer chips will be placed in a special bearing tray, such as a waffle pack, a gel-pak chip packaging gel box, etc. Among them, waffle box is widely used because of its simple structure and low cost. The waffle box includes a tray and a cover plate, and the tray is provided with a plurality of fixed grids, each fixed grid corresponding to a chip.

[0003] For flip-chip, the bumps (Bump) are usually located at the bottom of the chip. When the chip is inspected, the Bump needs to be turned up to observe the topography, size and other parameters of the Bump; while in SMT (Surface Mount Technology) patching, the Bump needs to be turned down to connect with the pads on the PCB (Printed Circuit Board). Therefore, between chip inspection and patching, the chips in the waffle box often need to be turned over in batches.

[0004] In the traditional way, the chips are turned over manually one by one by the operator, or turned over with the help of simple tools (such as tweezers, suction pen, etc.). This way is inefficient and easy to cause damage to the chip.

[0005] The existing simple device turns over, such as the turnover device disclosed in Chinese patent publication No. CN217306464U, which includes a turnover plate and two trays. The two trays are pressed together through the limiting hole on the turnover plate to realize the turnover of the chip. But after the chip is turned over by this device, it is taken out for detection and then put in again. Since the tray has no positioning means, it cannot guarantee that the chip and the groove on the tray correspond one by one, there is a defect, and it cannot realize the free conversion between the bump up and down.

[0006] Therefore, it is necessary to improve the existing wafer chip turnover technology to overcome the defects of the prior art. UTILITY MODEL CONTENT

[0007] In order to overcome the problems in the related art, the purpose of the utility model is to provide a wafer chip batch turnover device to solve the technical problems of low efficiency and easy damage of manual turnover of chips in the prior art, and the chip positioning after turnover is not accurate in the existing simple turnover device, and the free conversion cannot be realized.

[0008] A wafer chip batch turnover device, comprising:

[0009] a first carrier having a first receiving surface, the first receiving surface being provided with at least one first receiving part for receiving at least one wafer chip carrier tray to be flipped, the wafer chip carrier tray being used for carrying a plurality of wafer chips;

[0010] a second carrier having a second receiving surface, the second receiving surface being provided with at least one second receiving part corresponding to the first receiving part in shape and size;

[0011] a connecting assembly connecting the first carrier and the second carrier and allowing the first carrier and the second carrier to move relatively;

[0012] when the first receiving surface and the second receiving surface are folded together by the connecting assembly, the first receiving part and the corresponding second receiving part form a receiving space for fixing the wafer chip carrier tray.

[0013] Through the relative movement of the two carriers and the cooperation of the receiving parts, a receiving space is formed to fix the wafer chip carrier tray (such as a wafer box tray) therein. Since the carrier tray is firmly fixed, when the entire device is flipped, the carrier tray and the chips inside it will also be flipped as a whole, achieving the purpose of batch flipping. Compared with manually flipping chips one by one, this device improves the flipping efficiency and reduces the risk of chip damage.

[0014] Furthermore, the first carrier and the second carrier can adopt different shapes, such as circular, polygonal, etc., as long as they can achieve the function of accommodating and fixing the carrier tray.

[0015] Furthermore, the receiving part can adopt different forms, such as a boss, a clamping groove, etc., as long as it can cooperate with the shape of the carrier tray to achieve fixation.

[0016] Furthermore, the connecting assembly can adopt different structures, such as a sliding rail, a guide groove, etc., as long as it can achieve the relative movement of the two carriers.

[0017] Further, the connecting assembly includes at least one limiting part, the limiting part being arranged between the first carrier and the second carrier for guiding the relative sliding between the first carrier and the second carrier.

[0018] The arrangement of the limiting part makes the relative movement between the first carrier and the second carrier more controllable and stable. The guiding action of the limiting part ensures that the two carriers move along the predetermined trajectory, improving the reliability and safety of the flipping. Avoiding the irregular movement or shaking of the two carriers, which may cause the misalignment of the carrier tray during the flipping process.

[0019] Further, the limiting member can be a sliding rail, a sliding groove, a guide pin, a guide groove, or any structure that can guide and limit.

[0020] Further, the number of limiting members can be one or more.

[0021] Further, the limiting member includes a limiting column arranged on the first carrier and a limiting hole arranged on the second carrier, and the limiting column and the limiting hole are in sliding fit.

[0022] The sliding fit of the limiting column and the limiting hole is a simple and reliable limiting method. The limiting column plays a guiding and supporting role, and the limiting hole plays a restraining and positioning role. It is simple to manufacture, easy to assemble, and low in cost, while ensuring sufficient positioning accuracy and stability.

[0023] Further, the positions of the limiting column and the limiting hole can be interchanged, i.e., the limiting column is arranged on the second carrier and the limiting hole is arranged on the first carrier.

[0024] Further, the cross-sectional shape of the limiting column and the limiting hole can be circular, square, rectangular, or special-shaped.

[0025] Further, the fit of the limiting column and the limiting hole can be clearance fit, transition fit, or interference fit, which can be selected according to actual needs.

[0026] Further, the first accommodating portion and the second accommodating portion are both groove structures, and the shape and size of the groove structure match the outer shape of the wafer chip carrier tray.

[0027] The groove structure can closely fit the outer shape of the wafer chip carrier tray, providing all-around restraint and support. Since the shape and size of the groove match the carrier tray, the carrier tray will not shake or shift after being placed in the groove, ensuring the stability and reliability of the carrier tray during the flipping process.

[0028] Further, the depth of the groove can be adjusted as needed to accommodate wafer chip carrier trays of different thicknesses.

[0029] Further, the inner wall or bottom of the groove can be provided with elastic materials or buffer structures, such as rubber, foam, etc., to protect the wafer chip carrier tray.

[0030] Further, at least one of the first carrier and the second carrier is provided with a positioning structure for fixing the wafer chip carrier tray in the accommodating space.

[0031] The positioning structure further fixes the wafer chip box, so that it will not come off even under shock conditions, increasing the reliability.

[0032] Further, the first carrier and the second carrier are both provided with positioning structures.

[0033] Further, the positioning structures can be provided outside the accommodation space.

[0034] Further, the positioning structures can be the first and second carriers themselves, achieved through precise manufacturing tolerances, or achieved through other structures.

[0035] Further, the positioning structures include protrusions, buckles, elastic members, or grooves provided on the first and / or second accommodation portions.

[0036] The protrusions, buckles, elastic members, or grooves can provide additional fixing force to prevent the wafer chip carrier tray from moving or falling unexpectedly within the accommodation space. These structures can cooperate with corresponding structures on the carrier tray to achieve more reliable fixation.

[0037] Further, the number and position of the positioning structures can be adjusted as needed.

[0038] Further, the first and / or second accommodation portions are provided with open slots on both sides for avoiding the clamps of the wafer chip carrier tray and / or for taking and placing the wafer chip carrier tray.

[0039] The open slots take into account the fact that wafer chip carrier trays (such as wafer box trays) are usually fixed using clamps. The open slots can avoid the clamps and avoid interference, allowing the turnover device to be used compatibly with the clamps. At the same time, the open slots also facilitate the operator to take and place the carrier tray, improving the convenience of operation.

[0040] Further, the shape and size of the open slots can be adjusted according to the specific shape and size of the clamps.

[0041] Further, the position of the open slots can be on both sides or at other positions, as long as it can avoid the clamps and facilitate taking and placing.

[0042] Further, if the wafer chip box does not use clamps, the open slots can only be used for convenient taking and placing.

[0043] Further, the first carrier and the second carrier are connected by a hinge.

[0044] The hinge connection is a simple and reliable connection method that can achieve rotation opening and closing between the two carriers.

[0045] Further, the hinge can be a metal hinge, a plastic hinge, or other types of hinges.

[0046] Further, the number of hinges can be one or more.

[0047] Further, the hinges can be arranged at the edges of the carriers or other positions of the carriers.

[0048] Further, a locking mechanism is further included for maintaining the first carrier and the second carrier in a folded state.

[0049] The locking mechanism can prevent the first carrier and the second carrier from being accidentally opened during the turning process, causing the carrier tray to fall or the chips to scatter. The locking mechanism improves the reliability and safety of the turning device.

[0050] Further, the locking mechanism can take different forms, such as a latch, a bolt, etc.

[0051] Further, the locking mechanism is a buckle, a pull buckle, or a magnetic buckle.

[0052] The buckle, the pull buckle, and the magnetic buckle are simple in structure, easy to operate, and can quickly and reliably lock the first carrier and the second carrier together.

[0053] Further, different types and specifications of buckles, pull buckles, or magnetic buckles can be selected according to actual needs.

[0054] Further, the locking mechanism can be a threaded connection, a latch connection, a magic tape connection, or other forms.

[0055] The beneficial effects of the utility model are as follows:

[0056] The utility model provides a wafer chip batch turning device which is simple in structure and easy to operate, forms a containing space through the containing parts on the first carrier and the second carrier, can integrally contain and fix at least one wafer chip carrier tray, and realizes opening and closing through the relative movement of the two carriers, thereby providing a basis for the batch turning of the wafer chip carrier tray, without manually turning the chips one by one or with the aid of complex equipment, improving the turning efficiency and reducing the operation difficulty and chip damage risk. BRIEF DESCRIPTION OF DRAWINGS

[0057] Figure 1 is a schematic view of the wafer chip batch turning device provided by embodiment 1 in the application;

[0058] Figure 2 is a schematic view of the wafer chip batch turning device provided by embodiment 1 in the application when loading a waffle box tray;

[0059] Figure 3 is an exploded view of the wafer chip batch turning device provided by embodiment 1 in the application before turning;

[0060] Figure 4 is the exploded view of the wafer chip batch turnover device provided in embodiment 1 in the present application.

[0061] Reference signs:

[0062] 100, first bearing part; 110, first accommodating surface; 111, first accommodating part; 120, limiting column;

[0063] 200, second bearing part; 210, second accommodating surface; 211, second accommodating part; 220, limiting hole;

[0064] 300, open slot;

[0065] 400, wafer box tray. DETAILED DESCRIPTION

[0066] The preferred embodiments of the present application will be described in more detail by referring to the attached drawings. Although the preferred embodiments of the present application are shown in the drawings, it should be understood that the present application can be implemented in various forms and should not be limited by the embodiments described herein. On the contrary, these embodiments are provided to make the present application more thorough and complete, and to fully convey the scope of the present application to those skilled in the art.

[0067] Embodiment 1

[0068] As shown in Figures 1 to 4 , the present embodiment provides a wafer chip batch turnover device, which comprises a first bearing part 100 and a second bearing part 200. As shown in Figure 1 , the first bearing part 100 and the second bearing part 200 are both plate-shaped structures made of anti-static materials (such as anti-static ABS, anti-static POM, aluminum alloy, etc.).

[0069] The first bearing part 100 has a first accommodating surface 110, and one or more first accommodating parts 111 are arranged on the first accommodating surface 110. The first accommodating part 111 is a groove structure, and the shape and size of the groove are matched with the outer shape of a wafer chip bearing tray (such as a wafer box tray), so that the bearing tray can be stably accommodated therein. On both sides of the first accommodating part 111, an open slot 300 is arranged for facilitating the operator to take and place the wafer box tray.400

[0070] The second bearing part 200 has a second accommodating surface 210, on which one or more second accommodating parts 211 are arranged. The shape and size of the second accommodating part 211 correspond to those of the first accommodating part 111, and the second accommodating part 211 is also a groove structure. When the first bearing part 100 and the second bearing part 200 are folded, the first accommodating part 111 and the corresponding second accommodating part 211 jointly form a closed accommodating space, which completely fixes the two oppositely arranged wafer trays therein.

[0071] The first bearing part 100 and the second bearing part 200 are connected by a connecting assembly and can move relative to each other. In this embodiment, the connecting assembly is a sliding connection structure, which specifically includes a limiting column 120 arranged on the first bearing part 100 and a limiting hole 220 (which can also be a limiting groove) arranged on the second bearing part 200. The number of limiting columns 120 is two or more, which are distributed on the periphery (for example, four corners) of the first accommodating part 111. The limiting column 120 and the limiting hole 220 are in sliding fit, which guides the relative sliding between the first bearing part 100 and the second bearing part 200, and realizes the opening and closing of the turnover device.

[0072] The operation process of the wafer chip batch turnover device of this embodiment is described as follows:

[0073] 1. Open the turnover device, and separate the first bearing part 100 and the second bearing part 200 by sliding.

[0074] 2. Place the bearing tray, place the wafer tray loaded with chips to be turned over in the first accommodating part 111 of the first bearing part 100, and cover another identical wafer tray, so that the fixed grids at each corresponding position on the wafer trays are aligned with each other, as shown in Figure 2 .

[0075] 3. Fold the turnover device, and fold the first bearing part 100 and the second bearing part 200 by sliding. At this time, the first accommodating part 111 and the second accommodating part 211 jointly form a closed accommodating space, which fixes the bearing tray.

[0076] 4. Turn over, manually turn over the entire device by 180 degrees. The chips will fall into the corresponding grid of the other wafer tray under the action of gravity, as shown in Figure 3 , Figure 4 .

[0077] 5. Unlock and open the turnover device, and slide to separate the first bearing part 100 and the second bearing part 200.

[0078] 6. Take out the bearing tray, and take out the wafer tray after the turnover is completed.

[0079] The wafer chip batch turnover device of the embodiment adopts two bearing members connected by sliding, which is simple in structure and convenient to operate. The cooperation of the limiting column 120 and the limiting hole 220 realizes the smooth and accurate relative sliding between the two bearing members, ensuring the reliability of the turnover process. The groove structure can stably accommodate the waffle box tray, and the design of the open slot 300 facilitates the tray taking and placing by the operator, improving the work efficiency. The device can realize batch turnover of chips, avoiding chip damage caused by manual turnover, and improving production efficiency and product yield.

[0080] Embodiment 2

[0081] The embodiment provides a wafer chip batch turnover device, which comprises a first bearing member 100 and a second bearing member 200. The first bearing member 100 and the second bearing member 200 are both frame structures and are made of anti-static materials, such as anti-static polycarbonate (PC) or anti-static polyether ether ketone (PEEK).

[0082] The first bearing member 100 has a first accommodating surface 110, and a first accommodating part 111 is arranged on the first accommodating surface 110. The first accommodating part 111 is a hollow area in the frame, which is slightly larger than the shape and size of a wafer chip bearing tray (such as a waffle box tray) and can allow the waffle box tray to pass through the hollow area. On the inner side edge of the first bearing member 100, a protrusion or elastic buckle is arranged to fix the waffle box tray in the first accommodating part 111 when the turnover device is closed.

[0083] The second bearing member 200 has a second accommodating surface 210, and a second accommodating part 211 is arranged on the second accommodating surface 210. The second accommodating part 211 is also a hollow area in the frame, which corresponds to the shape and size of the first accommodating part 111. When the first bearing member 100 and the second bearing member 200 are closed, the first accommodating part 111 and the second accommodating part 211 jointly form a space for fixing the waffle box tray. On the inner side edge of the second bearing member 200, a protrusion or elastic buckle is arranged to cooperate with the positioning structure on the first bearing member 100 when the turnover device is closed.

[0084] The first bearing member 100 and the second bearing member 200 are connected by a hinge. The hinge is arranged on one side edge of the first bearing member 100 and the second bearing member 200, so that the two bearing members can be opened and closed like a book.

[0085] On the other side edge (opposite to the hinge) of the first bearing member 100 and the second bearing member 200, a locking mechanism is arranged. The locking mechanism is a magnetic buckle, which comprises a magnet and an iron sheet (or two magnets) arranged on the first bearing member 100 and the second bearing member 200, respectively. When the turnover device is closed, the magnetic buckle can attract the two bearing members together and keep the closed state.

[0086] The following describes the operation process of the wafer chip batch turnover device of the embodiment:

[0087] 1. Open the turnover device, and open the first bearing part 100 and the second bearing part 200 along the hinge.

[0088] 2. Place the chip bearing tray, and place the wafer box tray loaded with the chips to be turned over in the first accommodating part 111 (the hollowed-out area) of the first bearing part 100, so that the edge of the wafer box tray is in contact with the protrusion or elastic buckle on the inner side of the first bearing part 100.

[0089] 3. Fold the turnover device: rotate the second bearing part 200 along the hinge to fold with the first bearing part 100. At this time, the second accommodating part 211 on the second bearing part 200 and the first accommodating part 111 together form a space, and the wafer box tray is clamped in the middle. At the same time, the positioning structure on the second bearing part 200 cooperates with the positioning structure of the first bearing part 100 to ensure that the tray is fixed, and the magnetic buckle attracts the two bearing parts together.

[0090] 4. Turn over: manually turn over the entire device by 180 degrees. The chips fall from one wafer box tray to another wafer box tray under the action of gravity.

[0091] 5. Open the turnover device, and slightly force the magnetic buckle to open, and open the first bearing part 100 and the second bearing part 200 along the hinge.

[0092] 6. Take out the chip bearing tray, and take out the wafer box tray that has completed the turnover.

[0093] The wafer chip batch turnover device of the embodiment adopts two frame structure bearing parts connected by a hinge, which is convenient to open and close and easy to operate. The hollowed-out area in the frame serves as an accommodating part. The positioning structure of the protrusion or elastic buckle can fix the wafer box tray in the accommodating part to prevent the tray from moving or falling off during the turnover process. The locking mechanism of the magnetic buckle makes the device more stable in the folded state, ensuring the reliability of the turnover process.

[0094] Embodiment 3

[0095] The embodiment provides a wafer chip batch turnover device, which comprises a first bearing part 100 and a second bearing part 200. The first bearing part 100 and the second bearing part 200 are both block-shaped structures, and are made of aluminum alloy material and subjected to anodic oxidation treatment to achieve anti-static effect.

[0096] The first bearing part 100 has a first containing surface 110, and a first containing part 111 is arranged on the first containing surface 110. The first containing part 111 is a groove formed by precision machining, and the shape and size of the groove are precisely matched with the shape of a wafer chip bearing tray (such as a wafer box tray), so that the wafer box tray can be tightly accommodated in the groove. The depth of the groove is greater than 0 and less than or equal to the thickness of a wafer box tray. The first bearing part 100 is also provided with a positioning structure, which is a plurality of protrusions distributed on the bottom of the groove. The protrusions correspond to the steps around the bottom of the wafer box tray, and the positioning is realized through the cooperation of the protrusions and the steps.

[0097] The second bearing part 200 has a second containing surface 210, and a second containing part 211 is arranged on the second containing surface 210. The second containing part 211 is also a groove formed by precision machining, and the shape and size of the groove are correspondingly matched with the first containing part 111. The second bearing part 200 is also provided with a positioning structure, which is a plurality of protrusions distributed on the bottom of the groove.

[0098] The first bearing part 100 and the second bearing part 200 are connected by threads. Threaded holes are arranged at four corners (or more positions) of the first bearing part 100, and through holes are arranged at corresponding positions of the second bearing part 200. By screwing the screw through the through hole of the second bearing part 200 and connecting with the threaded hole of the first bearing part 100, the two bearing parts can be fixed together.

[0099] The operation process of the wafer chip batch turnover device of the embodiment is described as follows:

[0100] 1. Place the wafer box tray containing the chips to be turned over in the first containing part 111 of the first bearing part 100, so that the steps on the bottom of the wafer box tray are aligned with the protrusions on the first bearing part 100.

[0101] 2. Place another wafer box tray (empty tray) in the second containing part 211 of the second bearing part 200, and fix the tray through the positioning structure on the second bearing part 200.

[0102] 3. Cover the second bearing part 200 on the first bearing part 100, so that the through hole on the second bearing part 200 is aligned with the threaded hole on the first bearing part 100.

[0103] 4. Screw the screw through the through hole of the second bearing part 200 into the threaded hole of the first bearing part 100 until the two bearing parts are tightly fitted. At this time, the first containing part 111 and the second containing part 211 jointly form a containing space, and the two wafer box trays are fixed in the containing space.

[0104] 5. Manually turn the entire device 180 degrees. The chips fall from one waffle box tray into the corresponding position of the other waffle box tray under the effect of gravity.

[0105] 6. Loosen the screw and remove the second carrier 200.

[0106] 7. Take out the waffle box tray that has completed the turnover.

[0107] The wafer chip batch turnover device of the embodiment adopts a precisely machined groove as a containing part, can be closely matched with the waffle box tray, and realizes accurate positioning. The protrusion at the bottom of the groove is matched with the steps around the bottom of the waffle box tray, further enhances the reliability of positioning, ensures the one-to-one correspondence relationship between the chips and the waffle box tray grid before and after turnover, and provides protection for subsequent automatic processing (such as detection and patching). The threaded connection mode makes the connection between the two carriers more firm, ensures the stability of the turnover process. The use of aluminum alloy material and anodic oxidation treatment not only ensures the strength and durability of the device, but also has good anti-static performance, protecting the safety of the chips.

[0108] The relative arrangement of components and steps, numerical expressions, and numerical values set forth in these embodiments do not limit the scope of the application unless otherwise specifically stated. In all examples shown and discussed herein, any specific value should be interpreted as merely exemplary and not as a limitation. Therefore, other examples of the exemplary embodiments can have different values. It should be noted that similar reference numbers and letters represent similar items in the following drawings, and therefore, once an item is defined in one drawing, it does not need to be further discussed in subsequent drawings.

[0109] In addition, it should be noted that the use of the words "first", "second", and the like is merely for the convenience of distinction, and the above words have no special meaning unless otherwise stated, and therefore cannot be understood as a limitation on the scope of protection of the application.

[0110] The above only describes preferred embodiments of the present application and is not intended to limit the present application. For those skilled in the art, the present application can have various modifications and changes. Any modification, equivalent replacement, improvement, etc. made within the spirit and principles of the present application shall be included in the protection scope of the present application.

Claims

1. A wafer chip batch flip device, characterized in that, The application relates to a wafer chip carrier turnover device. The turnover device comprises a first carrier (100) and a second carrier (200). The first carrier (100) has a first accommodating surface (110) provided with at least one first accommodating part (111) for accommodating at least one wafer chip carrier to be turned over, the wafer chip carrier being used for carrying a plurality of wafer chips. The second carrier (200) has a second accommodating surface (210) provided with at least one second accommodating part (211) corresponding to the first accommodating part (111) in shape and size. A connecting assembly is arranged to connect the first carrier (100) and the second carrier (200) so that the first carrier (100) and the second carrier (200) can move relatively.

2. The wafer chip volume flip device of claim 1, wherein, When the first accommodating surface (110) and the second accommodating surface (210) are folded by the connecting assembly, the first accommodating part (111) and the corresponding second accommodating part (211) form an accommodating space for fixing the wafer chip carrier.

3. The wafer chip volume flip device of claim 2, wherein, The connecting assembly comprises at least one limiting part arranged between the first carrier (100) and the second carrier (200) for guiding the relative sliding between the first carrier (100) and the second carrier (200).

4. The wafer chip volume flip device of claim 1, wherein, The limiting part comprises a limiting column (120) arranged on the first carrier (100) and a limiting hole (220) arranged on the second carrier (200), the limiting column (120) and the limiting hole (220) being in sliding fit.

5. The wafer chip volume flip device of claim 1, wherein, The first accommodating part (111) and the second accommodating part (211) are both in groove structure, the groove structure matching the outer shape of the wafer chip carrier in shape and size.

6. The wafer chip volume flip device of claim 5, wherein, At least one of the first carrier (100) and the second carrier (200) is provided with a positioning structure for fixing the wafer chip carrier in the accommodating space.

7. The wafer chip volume flip device of claim 1, wherein, The positioning structure comprises a protrusion, a buckle, an elastic part or a groove arranged on the first accommodating part (111) and / or the second accommodating part (211).

8. The wafer chip volume flip device of claim 1, wherein, Both sides of the first accommodating part (111) and / or the second accommodating part (211) are provided with an open slot (300) for avoiding the clamps of the wafer chip carrier and / or taking and placing the wafer chip carrier.

9. The wafer chip volume flip device of any of claims 1-8, wherein, The first carrier (100) and the second carrier (200) are connected by a hinge.

10. The wafer chip volume flip device of claim 9, wherein, The application further comprises a locking mechanism for keeping the first carrier (100) and the second carrier (200) in the folded state. The locking mechanism is a buckle, a pull buckle or a magnetic buckle.

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