Wafer outer wall polishing and shaping equipment

Abstract

The utility model discloses wafer outer wall polishing and shaping equipment, which relates to the technical field of wafer polishing and comprises a circular seat frame, a polishing structure is arranged at the top of the circular seat frame, a plurality of discs are arranged at the top of the circular seat frame and are annularly distributed around the circular seat frame, rotating columns are fixedly connected to the bottoms of the discs, and the rotating columns are fixedly connected to the bottom of the circular seat frame. An L-shaped connecting block is rotationally connected to the outer side of the rotating column, a positioning structure is arranged at the top of the L-shaped connecting block, a first bevel gear is meshed with a plurality of second bevel gears, the second bevel gears drive a plurality of square rods to rotate through a plurality of rotating shafts, and therefore the square rods can achieve rotation of a plurality of fourth bevel gears; and a plurality of fourth bevel gears are engaged with a plurality of third bevel gears correspondingly, and the third bevel gears drive a plurality of discs to rotate through a plurality of rotating columns correspondingly, so that a plurality of fixed wafers rotate, the device can meet the requirement for polishing the wafers, and the practicability of the device is improved.

Description

Technical Field

[0001] This utility model relates to the field of wafer polishing technology, specifically wafer outer wall polishing and shaping equipment. Background Technology

[0002] Wafer outer wall polishing primarily involves using specific polishing equipment and tools to smooth the wafer's outer wall through methods such as rotating grinding discs. One of the most important tools in the wafer polishing process is the wafer polishing machine. It uses a rotating grinding disc to continuously smooth the wafer, ultimately achieving the desired surface flatness and roughness. When polishing the wafer's outer wall, it is necessary to select the appropriate polishing machine and grinding disc based on the wafer's material, size, and the required surface quality.

[0003] In the prior art, the outer wall of the wafer is polished by a polishing device. However, the polishing device can only polish one wafer at a time, and cannot polish multiple wafers at the same time. Therefore, the practicality of the device is reduced and the progress of wafer polishing is affected. Therefore, a wafer outer wall polishing and shaping device is designed to solve this shortcoming. Utility Model Content

[0004] The purpose of this invention is to provide a wafer outer wall grinding and shaping device to solve the problem that the grinding devices proposed in the prior art can only meet the needs of grinding one wafer at a time, but cannot meet the needs of grinding multiple wafers at the same time.

[0005] To achieve the above objectives, this utility model provides the following technical solution: a wafer outer wall grinding and shaping device, including a circular frame, a grinding structure on the top of the circular frame, multiple discs on the top of the circular frame, the multiple discs being arranged in a ring around the circular frame, a rotating column fixedly connected to the bottom of each disc, an L-shaped connecting block rotatably connected to the outer side of the rotating column, a positioning structure on the top of the L-shaped connecting block, a driving component on one side of the L-shaped connecting block, a pressure plate on the top of the disc, a pressing structure between the multiple pressure plates, a third bevel gear fixedly connected to the bottom end of the rotating column, a fourth bevel gear meshing with the outer side of the third bevel gear, the fourth bevel gear passing through one side of the L-shaped connecting block and rotatably connected to the L-shaped connecting block, a square rod slidably connected to the inner side of the fourth bevel gear, and a transmission structure between the multiple square rods.

[0006] Preferably, the grinding structure includes a grinding roller and a dual-axis motor. The grinding roller is located at the top of the circular base. A rotating rod is fixedly connected to the bottom of the grinding roller. The bottom end of the rotating rod passes through the top of the circular base and extends into the interior of the circular base. The dual-axis motor is located inside the circular base. A support frame is fixedly connected to the outside of the dual-axis motor. The top end of the support frame is fixedly connected to the top end of the interior of the circular base. The output end of the dual-axis motor is fixedly connected to the rotating rod.

[0007] Preferably, the positioning structure includes a positioning frame, which is disposed on the top of the L-shaped connecting block. A circular groove is provided on the positioning frame, and a disc is disposed inside the circular groove. A third hydraulic rod is provided at the bottom of the positioning frame, which is fixedly connected to the top of the L-shaped connecting block. A connecting disc is fixedly connected to the top of the third hydraulic rod, and the connecting disc is fixed to the positioning frame by bolts, which allows the positioning frame to be disassembled and replaced.

[0008] Preferably, the top of the circular base is provided with multiple sliding grooves, and the tops of the multiple L-shaped connecting blocks pass through the multiple sliding grooves and are slidably connected to the circular base. The multiple sliding grooves are provided to facilitate the movement of the multiple L-shaped connecting blocks.

[0009] Preferably, the driving component includes a second hydraulic rod, which is fixedly connected to one side of the L-shaped connecting block. One end of the second hydraulic rod passes through the inner side of the circular base and is fixedly connected to the circular base. The second hydraulic rod allows for adjustment of the movement of the L-shaped connecting block.

[0010] Preferably, a first rubber anti-slip pad is installed on the top of the disc, and multiple pressure columns are fixedly connected to the bottom of the pressure plate. A second rubber anti-slip pad is installed at the bottom of each of the multiple pressure columns. The rubber anti-slip pad can improve the stability of the wafer fixation and protect the wafer.

[0011] Preferably, the pressing structure includes a first hydraulic rod, which is disposed on the top of the circular base. A fixing frame is fixedly connected to the outside of the first hydraulic rod, and the fixing frame is fixedly connected to the top of the circular base. A rod frame body is fixedly connected to the bottom end of the first hydraulic rod. A slider is slidably connected to the outside of the three ends of the rod frame body. A rotating rod is rotatably connected to the bottom end of a plurality of sliders. A connecting frame is slidably connected to the outside of a plurality of rotating rods. The plurality of connecting frames are respectively fixedly connected to one side of a plurality of L-shaped connecting blocks.

[0012] Preferably, the transmission structure includes a plurality of second bevel gears, each of which is disposed at one end of a plurality of square rods. A rotating shaft is fixedly connected to one side of each of the plurality of second bevel gears. One end of the rotating shaft passes through the square rod and is fixedly connected to the square rod. Support plates are rotatably connected to both ends of the outer side of the rotating shaft. The top end of the support plate is fixedly connected to a circular base. A first bevel gear is meshed between the plurality of second bevel gears. The first bevel gear is installed at the lower output end of the dual-axis motor.

[0013] Compared with the prior art, the beneficial effects of this utility model are:

[0014] 1. In this application, a first bevel gear meshes with multiple second bevel gears, and the multiple second bevel gears drive multiple square rods to rotate through multiple rotating shafts. Therefore, the multiple square rods can realize the rotation of multiple fourth bevel gears. The multiple fourth bevel gears mesh with multiple third bevel gears, and the multiple third bevel gears drive multiple discs to rotate through multiple rotating columns, thereby realizing the rotation of multiple fixed wafers. This enables the device to meet the requirements of polishing multiple wafers and improves the practicality of the device.

[0015] 2. This application places the wafer in a positioning frame, which positions the wafer so that the center of the wafer is aligned with the center of the disc and the pressure plate, thus facilitating wafer polishing.

[0016] 3. This application activates the first hydraulic rod, which drives the three ends of the rod frame to move multiple sliders simultaneously. The multiple sliders drive multiple pressure plates to move downward through multiple rotating rods, causing multiple pressure columns to move towards the top position of the wafer. Multiple pressure columns can simultaneously fix multiple wafers. Attached Figure Description

[0017] Figure 1 This is a schematic diagram of the overall structure of the wafer outer wall polishing and shaping equipment of this utility model;

[0018] Figure 2 This is a cross-sectional view of the circular support frame of the wafer outer wall polishing and shaping equipment of this utility model;

[0019] Figure 3 This utility model relates to a wafer outer wall grinding and shaping device. Figure 2 Enlarged view of the A-section structure;

[0020] Figure 4 This is a schematic diagram of the positioning frame structure of the wafer outer wall grinding and shaping equipment of this utility model.

[0021] The following are the labeling elements in the diagram: 1. Circular base; 2. First hydraulic rod; 3. Fixed frame; 4. Rod frame body; 5. Slide groove; 6. Grinding roller; 7. Rotating rod; 8. Dual-axis motor; 9. First bevel gear; 10. Second bevel gear; 11. Square rod; 12. Rotating shaft; 13. Support plate; 14. L-shaped connecting block; 15. Rotating column; 16. Third bevel gear; 17. Fourth bevel gear; 18. Second hydraulic rod; 19. Positioning frame; 190. Circular groove; 20. Third hydraulic rod; 21. Connecting plate; 22. Circular disc; 23. Pressure plate; 24. Pressure column; 25. Rotating rod; 26. Connecting frame; 27. Slider. Detailed Implementation

[0022] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0023] Example: Includes a circular base 1 with a grinding structure on top. Multiple discs 22 are arranged in a ring around the circular base 1. A rotating column 15 is fixedly connected to the bottom of each disc 22. An L-shaped connecting block 14 is rotatably connected to the outer side of each rotating column 15. A positioning structure is provided on the top of each L-shaped connecting block 14. Multiple sliding grooves 5 are formed on the top of the circular base 1. The tops of the multiple L-shaped connecting blocks 14 pass through the sliding grooves 5 and are slidably connected to the circular base 1. A driving component is provided on one side of each L-shaped connecting block 14, including a second hydraulic rod 18. The second hydraulic rod 18 is fixedly connected to one side of the L-shaped connecting block 14, and one end of the second hydraulic rod 18 passes through the inner side of the circular base 1 and is fixedly connected to it. A pressure plate 23 is provided on the top of each disc 22, and a first rubber anti-slip pad is installed on the top of the disc 22. Multiple pressure columns 24 are fixedly connected to the bottom of the pressure plate 23, and the bottom ends of the multiple pressure columns 24 are... A second rubber anti-slip pad is installed, and a pressing structure is provided between multiple pressure plates 23. A third bevel gear 16 is fixedly connected to the bottom end of the rotating column 15. A fourth bevel gear 17 is meshed with the outer side of the third bevel gear 16. The fourth bevel gear 17 passes through one side of the L-shaped connecting block 14 and is rotatably connected to the L-shaped connecting block 14. A square rod 11 is slidably connected to the inner side of the fourth bevel gear 17. A transmission structure is provided between multiple square rods 11. The transmission structure includes multiple second bevel gears 10. Multiple second bevel gears 10 are all set at one end of multiple square rods 11. A rotating shaft 12 is fixedly connected to one side of multiple second bevel gears 10. One end of the rotating shaft 12 passes through the square rod 11 and is fixedly connected to the square rod 11. Support plates 13 are rotatably connected to both ends of the outer side of the rotating shaft 12. The top end of the support plate 13 is fixedly connected to the circular base 1. A first bevel gear 9 is meshed between multiple second bevel gears 10. The first bevel gear 9 is installed at the lower output end of the dual-axis motor 8.

[0024] The grinding structure includes a grinding roller 6 and a dual-axis motor 8. The grinding roller 6 is located at the top of the circular base 1. A rotating rod 7 is fixedly connected to the bottom of the grinding roller 6. The bottom end of the rotating rod 7 passes through the top of the circular base 1 and extends into the interior of the circular base 1. The dual-axis motor 8 is located inside the circular base 1. A support frame is fixedly connected to the outside of the dual-axis motor 8. The top end of the support frame is fixedly connected to the top end of the interior of the circular base 1. The output end of the dual-axis motor 8 is fixedly connected to the rotating rod 7.

[0025] Specifically, the downward pressing structure, which will be further explained later, moves multiple pressing columns 24 downwards, fixing the wafer onto multiple disks 22. Multiple second hydraulic rods 18 are activated to move multiple L-shaped connecting blocks 14, which then move towards the position of the grinding roller 6. After fixing, the wafer contacts the grinding roller 6. Then, the dual-axis motor 8 is activated. The specific model of the dual-axis motor 8 is not limited; it depends on the compatible equipment. The upper output of the dual-axis motor 8 drives the grinding roller 6 to rotate, and the lower output drives the first... When the bevel gear 9 rotates, the first bevel gear 9 meshes with multiple second bevel gears 10. The multiple second bevel gears 10 drive multiple square rods 11 to rotate through multiple rotating shafts 12. Therefore, the multiple square rods 11 can realize the rotation of multiple fourth bevel gears 17. The multiple fourth bevel gears 17 mesh with multiple third bevel gears 16. The multiple third bevel gears 16 drive multiple discs 22 to rotate through multiple rotating columns 15, so that multiple fixed wafers can rotate. This allows the device to meet the requirements of polishing multiple wafers and improves the practicality of the device.

[0026] Example: Figure 2 and Figure 4 As shown, the positioning structure includes a positioning frame 19, which is located on the top of the L-shaped connecting block 14. A circular groove 190 is provided on the positioning frame 19, and a disc 22 is located inside the circular groove 190. A third hydraulic rod 20 is provided at the bottom of the positioning frame 19, which is fixedly connected to the top of the L-shaped connecting block 14. A connecting disc 21 is fixedly connected to the top of the third hydraulic rod 20, and the connecting disc 21 is fixed to the positioning frame 19 by bolts.

[0027] Specifically, the wafer is placed in the positioning frame 19, which positions the wafer so that its center is aligned with the center of the disc 22 and the pressure plate 23, so as to facilitate wafer polishing.

[0028] When it is necessary to polish wafers of various sizes, simply remove the bolts under the connecting plate 21 and replace the positioning bracket 19 with one that is compatible with the wafer.

[0029] Example: Figure 1 , Figure 2 and Figure 4 As shown, the pressing structure includes a first hydraulic rod 2, which is disposed on the top of the circular base 1. A fixing frame 3 is fixedly connected to the outside of the first hydraulic rod 2. The fixing frame 3 is fixedly connected to the top of the circular base 1. A rod frame body 4 is fixedly connected to the bottom end of the first hydraulic rod 2. Sliding blocks 27 are slidably connected to the outside of the three ends of the rod frame body 4. Rotating rods 25 are rotatably connected to the bottom ends of the multiple sliding blocks 27. Connecting frames 26 are slidably connected to the outside of the multiple rotating rods 25. The multiple connecting frames 26 are respectively fixedly connected to one side of the multiple L-shaped connecting blocks 14.

[0030] Specifically, the first hydraulic rod 2 is activated, which drives the three ends of the rod frame 4 to move multiple sliders 27 simultaneously. The multiple sliders 27 drive multiple pressure plates 23 to move downward through multiple rotating rods 25, so that multiple pressure columns 24 move towards the top position of the wafer. Multiple wafers can be fixed simultaneously through the multiple pressure columns 24.

[0031] It will be apparent to those skilled in the art that this invention is not limited to the details of the exemplary embodiments described above, and that it can be implemented in other specific forms without departing from the spirit or essential characteristics of this invention. Therefore, the embodiments should be considered illustrative and non-limiting in all respects, and the scope of this invention is defined by the appended claims rather than the foregoing description. Thus, it is intended that all variations falling within the meaning and scope of equivalents of the claims be included within this invention. No reference numerals in the claims should be construed as limiting the scope of the claims.

Claims

1. Wafer outer wall polishing and shaping apparatus, characterized by: The utility model provides a circular seat frame (1), the top of circular seat frame (1) is equipped with polishing structure, the top of circular seat frame (1) is equipped with a plurality of disc (22), a plurality of disc (22) annular distribution around circular seat frame (1), the bottom of disc (22) is fixedly connected with rotating column (15), the outside rotating connection of rotating column (15) has L shaped connecting piece (14), the top of L shaped connecting piece (14) is equipped with positioning structure, one side of L shaped connecting piece (14) is equipped with driving part, the top of disc (22) is equipped with pressure plate (23), and the lower pressure structure is equipped between a plurality of pressure plate (23), the bottom fixed connection of rotating column (15) has third bevel gear (16), and the outside meshing connection of third bevel gear (16) has fourth bevel gear (17), and fourth bevel gear (17) passes through one side of L shaped connecting piece (14) and is rotatably connected with L shaped connecting piece (14), and the inside sliding connection of fourth bevel gear (17) has square bar (11), and the transmission structure is equipped between a plurality of square bar (11).

2. The wafer outer wall polishing apparatus according to claim 1, characterized by: The polishing structure includes a polishing roller (6) and a double-shaft motor (8), the polishing roller (6) is arranged at the top of the circular seat frame (1), the bottom of the polishing roller (6) is fixedly connected with a rotating rod (7), the bottom of the rotating rod (7) penetrates through the top of the circular seat frame (1) and extends into the circular seat frame (1), the double-shaft motor (8) is arranged inside the circular seat frame (1), the outer side of the double-shaft motor (8) is fixedly connected with a support frame, the top end of the support frame is fixedly connected with the inner top end of the circular seat frame (1), and the upper output end of the double-shaft motor (8) is fixedly connected with the rotating rod (7).

3. The wafer outer wall polishing apparatus according to claim 1, characterized by: The positioning structure includes a positioning frame (19), the positioning frame (19) is arranged at the top of the L-shaped connecting piece (14), a circular groove (190) is formed in the positioning frame (19), the disc (22) is arranged inside the circular groove (190), the bottom of the positioning frame (19) is provided with a third hydraulic rod (20), the third hydraulic rod (20) is fixedly connected to the top of the L-shaped connecting piece (14), the top end of the third hydraulic rod (20) is fixedly connected with a connecting disc (21), and the connecting disc (21) and the positioning frame (19) are fixedly connected by bolts.

4. The wafer outer wall polishing apparatus according to claim 1, characterized by: A plurality of sliding grooves (5) are formed in the top of the circular seat frame (1), the top end of each L-shaped connecting piece (14) penetrates through the sliding grooves (5) and is slidably connected with the circular seat frame (1).

5. The wafer outer wall polishing apparatus according to claim 1, characterized by: The driving part includes a second hydraulic rod (18), the second hydraulic rod (18) is fixedly connected to one side of the L-shaped connecting piece (14), one end of the second hydraulic rod (18) penetrates through the inner side of the circular seat frame (1) and is fixedly connected with the circular seat frame (1).

6. The wafer outer wall polishing apparatus according to claim 1, wherein: A first rubber non-slip pad is mounted on the top of the disc (22), a plurality of pressure columns (24) are fixedly connected to the bottom of the pressure plate (23), and a second rubber non-slip pad is mounted on the bottom end of each pressure column (24).

7. The wafer outer wall polishing apparatus according to claim 1, characterized by: The lower pressing structure comprises a first hydraulic rod (2) arranged on the top of the circular seat frame (1), a fixed frame (3) fixedly connected to the outside of the first hydraulic rod (2) and fixedly connected to the top of the circular seat frame (1), a rod frame body (4) fixedly connected to the bottom end of the first hydraulic rod (2), sliding blocks (27) slidingly connected to the three outer sides of the rod frame body (4), rotating rods (25) rotatably connected to the bottom ends of the sliding blocks (27), connecting frames (26) slidingly connected to the outer sides of the rotating rods (25), and a plurality of L-shaped connecting blocks (14) to which the connecting frames (26) are fixedly connected.

8. The wafer outer wall polishing apparatus according to claim 1, characterized by: The transmission structure comprises a plurality of second bevel gears (10) arranged on one end of a plurality of square rods (11), a rotating shaft (12) fixedly connected to one side of each of the second bevel gears (10), the rotating shaft (12) penetrating through the square rod (11) and being fixedly connected to the square rod (11), a support plate (13) rotatably connected to the outer sides of both ends of the rotating shaft (12), the support plate (13) being fixedly connected to the top of the circular seat frame (1), a first bevel gear (9) meshingly connected between the second bevel gears (10), and the first bevel gear (9) being mounted on the lower output end of the double-shaft motor (8).

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