Heat-conducting and insulating packaging adhesive for electronic components
By using a composite encapsulating adhesive structure, combined with a thermal conductive sheet and a buffer layer, the problems of insulation performance and environmental adaptability of the encapsulating adhesive are solved, achieving efficient heat dissipation and stable protection.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-03-31
- Publication Date
- 2026-03-03
AI Technical Summary
Existing encapsulating adhesives for electronic components are insufficient to meet the insulation requirements of high-precision equipment. After curing, they have high hardness, lack flexibility, and are prone to cracking. Furthermore, their performance fluctuates greatly under different environmental humidity levels, failing to provide stable protection.
The structure employs a composite encapsulating adhesive, comprising a base thermally conductive layer, a stress buffer layer, and a protective layer. Combined with a thermally conductive sheet and thermally conductive filler, the thermally conductive sheet rapidly transfers heat, the stress buffer layer disperses stress, and the protective layer prevents environmental erosion, ensuring structural stability and insulation performance.
It improves the stability of the thermal conductivity and insulation properties of the encapsulating adhesive, prevents cracking, enhances its protection capabilities in complex environments, and improves the heat dissipation efficiency and operational stability of electronic components.
Smart Images
Figure CN223963441U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of electronic component packaging technology, and in particular to a thermally conductive and insulating encapsulating adhesive for electronic components. Background Technology
[0002] As electronic devices continue to develop towards miniaturization and high performance, the integration of electronic components is becoming increasingly higher, and the heat generated during operation is increasing dramatically. At the same time, the requirements for electrical insulation performance are becoming more stringent to ensure the safety and stability of equipment operation.
[0003] Currently, there are many shortcomings in the encapsulating adhesives used on electronic components. Although some encapsulating adhesives have a certain thermal conductivity, their insulation performance is insufficient to meet the requirements of high-precision electronic equipment. Some encapsulating adhesives have high hardness after curing and lack flexibility. When electronic components deform due to thermal expansion and contraction, they are prone to cracking, resulting in a decrease in thermal conductivity and insulation performance. Some encapsulating adhesives also have large performance fluctuations under different environmental humidity, which cannot provide stable protection for electronic components.
[0004] Therefore, a thermally conductive insulating encapsulant for electronic components is proposed. Utility Model Content
[0005] The purpose of this invention is to provide a thermally conductive and insulating encapsulant for electronic components, which can solve many shortcomings of existing encapsulants used in electronic components. Although some encapsulants have a certain thermal conductivity, their insulation performance is insufficient to meet the requirements of high-precision electronic equipment. Some encapsulants have high hardness after curing and lack flexibility, which can easily lead to cracking when electronic components deform due to thermal expansion and contraction, resulting in a decrease in thermal conductivity and insulation performance. In addition, some encapsulants have large performance fluctuations under different environmental humidity, which cannot provide stable protection for electronic components.
[0006] To achieve the above objectives, this utility model provides the following technical solution: a thermally conductive insulating encapsulant for electronic components, comprising a composite encapsulant structure and a thermally conductive structure. The composite encapsulant structure includes a base thermally conductive layer, a stress buffer layer is disposed on top of the base thermally conductive layer, and a protective layer is disposed on top of the stress buffer layer. The thermally conductive structure is composed of multiple independent thermally conductive sheets, which are disposed between the stress buffer layer and the base thermally conductive layer on opposite sides. The protective layer contains thermally conductive filler.
[0007] Preferably, the basic thermally conductive layer is composed of silicone resin.
[0008] Preferably, the stress buffer layer is made of silicone rubber.
[0009] Preferably, the protective layer is composed of titanium dioxide epoxy resin.
[0010] Preferably, the heat-conducting sheet is made of metal foil or graphene material and has a thickness of 0.05 mm to 0.5 mm.
[0011] Preferably, the heat-conducting sheet is rectangular, circular, or polygonal in shape, and its edges are chamfered.
[0012] Preferably, the thermally conductive filler is one of alumina powder, boron nitride powder, or other highly thermally conductive inorganic fillers, and the particle size is from 1 μm to 100 μm.
[0013] Compared with the prior art, the beneficial effects of this utility model are:
[0014] 1. This application establishes a composite encapsulating adhesive structure consisting of a base thermally conductive layer, a stress buffer layer, and a protective layer. The base thermally conductive layer possesses excellent thermal conductivity and flexibility. Its thermal conductivity provides the basic conditions for heat conduction, enabling the initial transfer of heat generated by electronic components. Its flexibility allows it to deform in tandem with electronic components when they undergo minor deformations due to thermal expansion and contraction or mechanical vibration, preventing damage such as cracking of the composite encapsulating adhesive structure caused by stress concentration. The stress buffer layer disperses stress when the base thermally conductive layer is subjected to stress due to component deformation, preventing damage to the base thermally conductive layer due to excessive stress and maintaining the stability of the composite encapsulating adhesive structure. Furthermore, the protective layer forms an effective barrier in complex environments such as humidity and chemical corrosion, preventing moisture and chemicals from penetrating into the internal structure and maintaining the stable thermal conductivity and insulation performance of the composite encapsulating adhesive structure, providing reliable external protection for electronic components.
[0015] 2. By setting up thermal conductive sheets and thermal conductive fillers, when electronic components generate heat, multiple independent thermal conductive sheets can quickly transfer heat from the basic thermal conductive layer to the stress buffer layer, and then further conduct it outward. Its high thermal conductivity greatly improves the overall heat dissipation efficiency of the encapsulant. In addition, in conjunction with the thermal conductive filler, it can work together with the basic thermal conductive layer and thermal conductive sheets to quickly dissipate heat to the external environment, significantly improving the overall heat dissipation effect of the composite encapsulant structure and providing better heat dissipation guarantee for the stable operation of electronic components. Attached Figure Description
[0016] Figure 1 This is an overall structural diagram of the thermally conductive insulating encapsulant for electronic components according to this utility model;
[0017] Figure 2 This is an exploded view of the composite encapsulating adhesive structure of this utility model;
[0018] Figure 3 This is a schematic diagram showing the connection between the thermally conductive filler and the protective layer of this utility model;
[0019] Figure 4 This is a schematic diagram showing the connection between the heat-conducting sheet, the stress buffer layer, and the basic heat-conducting layer of this utility model.
[0020] In the diagram, 1 is the composite encapsulating adhesive structure; 2 is the basic thermally conductive layer; 3 is the stress buffer layer; 4 is the protective layer; 5 is the thermally conductive sheet; and 6 is the thermally conductive filler. Detailed Implementation
[0021] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.
[0022] Please see Figure 1-4 The present invention provides the following technical solution:
[0023] A thermally conductive insulating encapsulant for electronic components includes a composite encapsulant structure 1 and a thermally conductive structure. The composite encapsulant structure 1 includes a base thermally conductive layer 2, a stress buffer layer 3 on top of the base thermally conductive layer 2, and a protective layer 4 on top of the stress buffer layer 3. The thermally conductive structure is composed of multiple independent thermally conductive sheets 5, which are disposed between the stress buffer layer 3 and the base thermally conductive layer 2 on opposite sides. A thermally conductive filler 6 is disposed inside the protective layer 4.
[0024] In this embodiment, a composite encapsulating adhesive structure 1 consisting of a base thermally conductive layer 2, a stress buffer layer 3, and a protective layer 4 is provided. The base thermally conductive layer 2 has good thermal conductivity and flexibility. The thermal conductivity provides the basic conditions for heat conduction and can initially transfer the heat generated by electronic components. Its flexibility allows it to deform in tandem with electronic components when they undergo minor deformations due to thermal expansion and contraction or mechanical vibration, preventing damage such as cracking of the composite encapsulating adhesive structure 1 due to stress concentration. The stress buffer layer 3 can disperse the stress when the base thermally conductive layer 2 is subjected to stress due to component deformation, preventing damage to the base thermally conductive layer 2 due to excessive stress and maintaining the stability of the composite encapsulating adhesive structure 1. Furthermore, the protective layer 4 can form an effective barrier in complex environments such as humidity and chemical corrosion, preventing moisture and chemicals from penetrating into the internal structure and maintaining the stable thermal conductivity and insulation performance of the composite encapsulating adhesive structure 1, providing reliable external protection for electronic components.
[0025] Specifically, such as Figure 2 As shown, the basic thermally conductive layer 2 is composed of silicone resin.
[0026] Specifically, such as Figure 2 As shown, the stress buffer layer 3 is made of silicone rubber.
[0027] Specifically, such as Figure 2 As shown, the protective layer 4 is composed of titanium dioxide and epoxy resin.
[0028] In this embodiment: the basic thermally conductive layer 2 is made of silicone resin, which, through its chemical stability and flexibility, effectively ensures the performance stability of the composite encapsulation structure 1 under chemical corrosion and component deformation environments, laying the foundation for subsequent heat conduction and overall structural stability; the stress buffer layer 3 is made of silicone rubber, which, with its excellent elasticity and fatigue resistance, can effectively buffer the stress generated by the thermal expansion and contraction of electronic components, protecting the basic thermally conductive layer 2 from stress damage; the protective layer 4 is made of titanium dioxide epoxy resin, which provides reliable protection for the internal structure under complex and variable external environments, preventing the intrusion of moisture, chemicals, etc., and maintaining the thermal conductivity and insulation performance of the composite encapsulation structure 1.
[0029] Specifically, such as Figure 4 As shown, the heat-conducting sheet 5 is made of metal foil or graphene material, and has a thickness of 0.05 mm to 0.5 mm.
[0030] Specifically, such as Figure 4 As shown, the heat-conducting sheet 5 is shaped like a rectangle, a circle, or a polygon, and its edges are chamfered.
[0031] In this embodiment: the heat-conducting sheet 5 is made of metal foil or graphene material, which has high thermal conductivity and can quickly transfer heat. The thickness design of 0.05mm to 0.5mm takes into account both thermal conductivity and the miniaturization and lightweight requirements of electronic devices. Without increasing the volume and weight too much, it significantly improves the heat dissipation efficiency of the composite encapsulation adhesive structure 1, ensuring that the heat generated by electronic components is dissipated in time, thus improving its performance and stability. The various shapes of the heat-conducting sheet 5 can be flexibly selected according to the actual shape and layout of the electronic components, achieving better fit and heat collection and conduction. The chamfering treatment of the edges avoids scratches and damage to other structural layers during installation, improving the safety of the encapsulation process and the integrity of the overall structure, and reducing the risk of performance degradation due to installation damage.
[0032] Specifically, such as Figure 3 As shown, the thermally conductive filler 6 is one of alumina powder, boron nitride powder or other highly thermally conductive inorganic fillers, and the particle size is from 1μm to 100μm.
[0033] In this embodiment: the thermally conductive filler 6 is a highly thermally conductive inorganic filler with a particle size between 1μm and 100μm, forming an efficient thermally conductive network within the protective layer 4, enhancing the thermal conductivity of the protective layer 4, and working in conjunction with other thermally conductive structures to improve the overall heat dissipation effect of the composite encapsulant structure 1.
[0034] Working principle: When using the encapsulating adhesive, the base thermally conductive layer 2 is first coated onto the surface of the component. While the base thermally conductive layer 2 has initially cured but still retains some tack, the thermally conductive sheet 5 is placed on top. The stress buffer layer 3 is then connected to the thermally conductive sheet 5 using a thermally conductive and insulating adhesive. A protective layer 4 is then applied to form the composite encapsulating adhesive structure 1. Finally, the entire composite encapsulating adhesive structure 1 is cured. When electronic components generate heat, the base thermally conductive layer 2 can initially transfer the heat away, and together with the thermally conductive sheet 5 and thermally conductive filler 6, the heat can be quickly dissipated to the external environment. The overall heat dissipation effect of the composite encapsulant structure 1 is significantly improved. Through the stress buffer layer 3, when the base thermal conductive layer 2 is subjected to stress due to component deformation, the stress buffer layer 3 can disperse the stress and prevent the base thermal conductive layer 2 from being damaged due to excessive stress, thus maintaining the stability of the composite encapsulant structure 1. Furthermore, through the protective layer 4, in complex environments such as humidity and chemical corrosion, the protective layer 4 can form an effective barrier to prevent moisture, chemicals, etc. from penetrating into the internal structure, maintaining the stability of the thermal conductivity and insulation performance of the composite encapsulant structure 1, and providing reliable external protection for electronic components.
[0035] The above are merely preferred embodiments of the present utility model and are not intended to limit the present utility model. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.
Claims
1. A thermally conductive insulating encapsulant for electronic components, comprising a composite encapsulant structure (1) and a thermally conductive structure, characterized in that: The composite encapsulating adhesive structure (1) includes a basic thermally conductive layer (2), a stress buffer layer (3) is provided on the top of the basic thermally conductive layer (2), and a protective layer (4) is provided on the top of the stress buffer layer (3). The thermally conductive structure is composed of multiple independent thermally conductive sheets (5), and the thermally conductive sheets (5) are disposed between the stress buffer layer (3) and the basic thermally conductive layer (2) on opposite sides. The protective layer (4) is provided with a thermally conductive filler (6).
2. The thermally conductive insulating encapsulant for electronic components according to claim 1, characterized in that: The basic thermally conductive layer (2) is composed of silicone resin.
3. The thermally conductive insulating encapsulant for electronic components according to claim 1, characterized in that: The stress buffer layer (3) is made of silicone rubber.
4. The thermally conductive insulating encapsulant for electronic components according to claim 1, characterized in that: The protective layer (4) is composed of titanium dioxide epoxy resin.
5. The thermally conductive insulating encapsulant for electronic components according to claim 1, characterized in that: The heat-conducting sheet (5) is made of metal foil or graphene material and has a thickness of 0.05 mm to 0.5 mm.
6. The thermally conductive insulating encapsulant for electronic components according to claim 1, characterized in that: The heat-conducting sheet (5) is rectangular, circular, or polygonal in shape, and its edges are chamfered.
7. The thermally conductive insulating encapsulant for electronic components according to claim 1, characterized in that: The thermally conductive filler (6) is one of alumina powder, boron nitride powder or other highly thermally conductive inorganic fillers, and the particle size is from 1 μm to 100 μm.