Hearth bottom plate of combustion device and semiconductor thermoelectric power generation device

Abstract

The utility model discloses a hearth bottom plate of a combustion device and a semiconductor thermoelectric power generation device. The hearth bottom plate comprises a bottom plate body, a mounting part used for connection is arranged on the bottom plate body, a mounting hole is formed in the bottom plate body, and a plurality of ventilation holes are formed in the other side corresponding to the side provided with the mounting part. A metal heat transfer plate is arranged on a bottom plate body which is arranged in the combustion device and at the lower part of the hearth, a plurality of semiconductor temperature difference power generation sheets are arranged on the metal heat transfer plate, a heat pipe made of a metal material, heat dissipation fins and a fan are arranged at the cold ends of the semiconductor temperature difference power generation sheets, and the air outlet direction of the fan is larger than the air outlet direction of the fan. The ventilation holes correspond to the ventilation holes in the bottom plate body. According to the utility model, through the collaborative layout of the metal heat dissipation piece, the heat pipe and the fan of the heat dissipation device, the power generation efficiency and the heat energy utilization rate are improved.

Description

Technical Field

[0001] This utility model relates to an auxiliary component of a combustion device, and a power generation device used in conjunction with the combustion device, particularly the furnace bottom plate of a lightweight, portable, modular combustion heating device and a semiconductor thermoelectric generator used in conjunction with the combustion device. Background Technology

[0002] Semiconductor thermoelectric power generation is based on the thermoelectric effect, directly converting thermal energy into electrical energy. It works by creating a temperature difference between two semiconductors with different properties, thereby generating a direct current voltage across them. When a temperature difference exists between the two thermoelectric generators, heat is transferred from the hotter side to the cooler side due to their different electrical conductivity. This heat transfer causes an electromotive force (EMF), or voltage difference, to be generated across the semiconductors, thus producing a direct current. The core component of thermoelectric power generation is the semiconductor thermocouple module. By rationally designing the materials and temperature difference of the semiconductor thermocouple module, the efficient conversion and utilization of electrical energy can be achieved.

[0003] For example, Chinese patent document CN105805873A discloses a novel energy-saving semiconductor regulating module, which includes a semiconductor cooling chip, a thermoelectric generator, and a temperature equalizer. A heat exchange device is fixed to one end surface of the semiconductor cooling chip, and a thermoelectric generator, temperature equalizer, or water tank is fixed to the other end surface. A temperature equalizer or thermoelectric generator is fixed to the other end surface of the thermoelectric generator, temperature equalizer, or water tank. One or more thermoelectric generators and / or temperature equalizers are stacked on the surface of the temperature equalizer or thermoelectric generator. A heat dissipation device is fixed to the outermost surface of the thermoelectric generator or temperature equalizer. While this structure uses a heat dissipation device, which can quickly transfer the heat or cold generated by the cooling chip and improve the conduction efficiency, the heat conduction efficiency is still not ideal. The power generation efficiency and thermal energy utilization rate still need further improvement. Therefore, it cannot be used in semiconductor thermoelectric generators used in conjunction with combustion devices, significantly limiting its application range.

[0004] Currently, to improve power generation efficiency and thermal energy utilization, it is necessary to simultaneously dissipate heat from thermoelectric generators (TEGs). Most heat dissipation devices for TEGs employ fan convection, water circulation, and heat pipe cooling. While providing energy to these devices increases the TEG's power output, thus compensating for the energy supplied to the devices, all of these methods require fans to enhance heat exchange. The energy consumed by the fans is solely used for heat dissipation and is not further utilized for energy optimization.

[0005] Therefore, in order to further optimize energy utilization efficiency, it is particularly important to design a heat dissipation device that can both increase power generation by expanding the temperature difference through heat dissipation and utilize the wind energy generated by the fan during heat dissipation. Summary of the Invention

[0006] In view of the shortcomings of the prior art, the technical problem to be solved by this utility model is: how to provide a furnace bottom plate of a combustion device that can be used in conjunction with a semiconductor thermoelectric generator, so that the combustion device (heating) can generate electricity through the semiconductor thermoelectric generator plate installed on the furnace bottom plate, thereby improving the power generation efficiency and thermal energy utilization rate.

[0007] A furnace bottom plate of a combustion device includes a bottom plate body; characterized in that a mounting part for connection is provided on the bottom plate body, a mounting hole is provided on the bottom plate body, and a plurality of ventilation holes are provided on the opposite side corresponding to the side where the mounting part is provided.

[0008] Furthermore, a heat-conducting plate made of metal is provided on the base plate body, with one end of the heat-conducting plate mounted on the base plate body via a bracket.

[0009] Furthermore, the bracket is mounted on the base plate body via connectors.

[0010] Furthermore, the mounting part is a boss, an internal cavity, or a downwardly recessed groove.

[0011] Furthermore, the mounting holes are arranged in a ring around the perimeter of the mounting portion.

[0012] A semiconductor thermoelectric generator is installed inside a combustion device, which contains a furnace. A base plate is located at the bottom of the furnace. The base plate is characterized by having a metal heat transfer plate attached to it via a mounting part. Several semiconductor thermoelectric generator plates are mounted on the metal heat transfer plate, with the hot end of each plate facing upwards and the cold end facing downwards. A heat dissipation device is located at the cold end of each thermoelectric generator plate. This heat dissipation device includes a metal heat pipe with several sets of heat dissipation fins at its rear end. A fan is positioned corresponding to the heat dissipation fins, with the fan's outlet direction corresponding to ventilation holes on the base plate.

[0013] Furthermore, several mounting slots are provided on the metal heat transfer plate, and a set of semiconductor thermoelectric generators are installed in each mounting slot.

[0014] Furthermore, the heat dissipation device also includes a metal heat sink that is in direct contact with the cold surface of the semiconductor thermoelectric chip; multiple heat sinks are provided on the surface of the metal heat sink, and heat dissipation grooves are provided between adjacent heat sinks.

[0015] Furthermore, at the front end of the heat pipe, the part that contacts the semiconductor thermoelectric generator is set to a semi-cylindrical shape, which fits into the groove of the semi-cylindrical part of the metal heat sink.

[0016] Furthermore, the heat transfer tubes are respectively inserted into the holes of the heat dissipation fins, and the contact area between the heat dissipation fins and the heat transfer tubes is provided with flanges to increase the contact area between the two.

[0017] In summary, this utility model, utilizing the furnace bottom plate of the combustion device and the semiconductor thermoelectric generator used in conjunction with the combustion device, has the following advantages over the prior art:

[0018] 1. The furnace bottom plate of this utility model is provided with several ventilation holes, through which the combustion-supporting gas can enter the furnace of the combustion device; it is provided with an installation structure through which a metal heat transfer plate is installed, so that heat energy can flow quickly and heat transfer efficiency can be improved.

[0019] 2. The furnace bottom plate of this utility model is provided with one or more heat-conducting plates, which can transfer the heat energy generated by the fuel in the combustion furnace to the metal heat transfer plate, increase the temperature of the metal heat transfer plate, and improve the power generation efficiency and heat energy utilization rate.

[0020] 3. The semiconductor thermoelectric generator of this utility model, used in conjunction with a combustion device, improves heat dissipation efficiency by employing a coordinated layout of heat pipes and a fan. The heat pipe assembly is arranged in an alternating stepped manner, which, together with the fan, forms a directional vortex.

[0021] 4. The semiconductor thermoelectric generator of this utility model, which is used in conjunction with a combustion device, features a modular and lightweight design, reducing its own weight, and the number of modules can be increased or decreased according to the number of semiconductor thermoelectric generator chips. Attached Figure Description

[0022] Figure 1 This is a schematic diagram of the furnace bottom plate structure of this utility model;

[0023] Figure 2 This is a schematic diagram of a semiconductor thermoelectric generator used in conjunction with a combustion device.

[0024] Figure 3 This is a schematic diagram of the structure of the metal heat transfer plate of this utility model;

[0025] Figure 4 Schematic diagram of the heat dissipation structure of the semiconductor thermoelectric generator of this utility model;

[0026] Figure 5 This is a schematic diagram of the connection structure between the heat pipe and the fins in this utility model.

[0027] In the diagram: 1—Furnace bottom plate body, 2—Mounting part, 3—Mounting hole, 4—Ventilation hole, 5—Heat conduction plate, 6—Bracket, 7—Connector, 10—Combustion device, 11—Furnace, 12—Furnace head, 13—Metal heat transfer plate, 14—Semiconductor thermoelectric generator, 15—Heat pipe, 16—Heat dissipation fins, 17—Fan, 18—Metal heat dissipation component, 20—Mounting groove, 21—Mounting connection hole; Detailed Implementation

[0028] The present invention will be further described below with reference to the accompanying drawings and embodiments.

[0029] To make the objectives, technical solutions, and advantages of the embodiments of this utility model clearer, the technical solutions of the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this utility model. The components of the embodiments of this utility model described and shown in the accompanying drawings can generally be arranged and designed in various different configurations. Therefore, the following detailed description of the embodiments of this utility model provided in the accompanying drawings is not intended to limit the scope of the claimed utility model, but merely represents selected embodiments of the utility model. All other embodiments obtained by those skilled in the art based on the embodiments of this utility model without inventive effort are within the scope of protection of this utility model.

[0030] It should be noted that similar reference numerals and letters in the following figures indicate similar items. Therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures. In the description of this utility model, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," "outer," "front," and "rear," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the figures, or the orientation or positional relationship commonly used when the product is in use. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model. Furthermore, the terms "first," "second," and "third," etc., are only used to distinguish descriptions and should not be construed as indicating or implying relative importance. In addition, the terms "horizontal," "vertical," etc., do not indicate that the component is required to be absolutely horizontal or suspended, but can be slightly tilted. For example, "horizontal" simply means that its direction is more horizontal than "vertical," and does not mean that the structure must be completely horizontal, but can be slightly tilted. In the description of this utility model, it should also be noted that, unless otherwise explicitly specified and limited, the terms "set," "install," "connect," and "link" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.

[0031] Example:

[0032] The furnace bottom plate of the combustion device provided in this embodiment, such as Figure 1 , 2As shown, the device includes a base plate body 1, the shape of which matches the shape of the combustion chamber of the combustion device. Its shape can be rectangular, square, circular, or elliptical, etc., and it is installed at the lower part of the combustion chamber during use. The base plate body 1 has a mounting part 2 for connecting to related components. The mounting part 2 can be one or more bosses, one or more internal cavities, or one or more downward-recessed grooves, etc., adapted to the shape and size of the components to be connected. Screws, bolts, or adhesives are then used to install and connect the components through the mounting part 2. The base plate body 1 also has mounting holes 3 for connecting bolts during installation. The mounting holes 3 shown in the figure are arranged around the perimeter of the mounting part 2, facilitating detachable connection of the components using screws, bolts, etc. On the opposite side from the side with the mounting part 2, several ventilation holes 4 are provided. External combustion gases (such as air or oxygen) enter the combustion chamber of the combustion device through the ventilation holes 4 to participate in combustion. The ventilation holes 4 shown in the figure are arranged in multiple rows horizontally and vertically to form a grid-like structure, which facilitates the uniform introduction of combustion-supporting gas into the furnace.

[0033] On the base plate body 1, a metal heat-conducting plate 5 is also provided. One end of the heat-conducting plate 5 is set on the base plate body 1 through a bracket 6, and the other end has a certain length and extends into the furnace of the combustion device (extending upward in the figure). When the combustion device is burning, the temperature inside the furnace is high, which heats the heat-conducting plate 5, accelerates heat conduction, and allows the temperature of the base plate body 1 to rise as quickly as possible. As shown in the figure, the bracket 6 is set on the base plate body 1 through a connector 7. The connector 7 is an existing screw or bolt, which is convenient for quick disassembly and installation.

[0034] The semiconductor thermoelectric generator provided in this embodiment, used in conjunction with a combustion device, is as follows: Figure 3 , 4 As shown in Figure 5, a furnace 11 and a burner head 12 are arranged inside the combustion device 10. The furnace bottom plate mentioned above is arranged at the lower end of the furnace 11. A metal heat transfer plate 13 is arranged on the furnace bottom plate body 1 of the furnace bottom plate. The metal heat transfer plate 13 is tightly arranged on the furnace bottom plate body 1, specifically connected to the side (lower side) of the furnace bottom plate body 1 away from the furnace through the mounting part 2. Several semiconductor thermoelectric generators 14 are arranged on the metal heat transfer plate 13. The hot end of the semiconductor thermoelectric generator 14 faces the furnace 11 and is upward to absorb heat, while its cold end faces downward. In this way, after the fuel in the combustion device 10 is burned, a significant temperature difference is formed between the hot end and the cold end of the semiconductor thermoelectric generator 14, which generates an electric current and generates electricity.

[0035] See Figure 3The metal heat transfer plate 13 has several mounting slots 20, each housing a set of thermoelectric generators 14, forming multiple power generation modes. The metal heat transfer plate 13 also has mounting holes 21, through which bolts and screws are inserted to connect the metal heat transfer plate 13 to the furnace bottom plate body 1, forming a detachable connection structure. The thermoelectric generators 14 utilize existing technology; their current generation circuit connections, voltage transformation, and input to the power unit can all be implemented using existing technology and will not be further described here.

[0036] In order to dissipate the heat of the thermoelectric generator 14 as quickly as possible, heat dissipation treatment is required for the thermoelectric generator 14. In this invention, a heat dissipation device is provided at the cold end of the thermoelectric generator 14. The heat dissipation device includes a heat pipe 15. The heat pipe 15 is made of metal, preferably copper, which has excellent thermal conductivity and heat transfer performance. The front end (evaporation end) of the heat pipe 15, the part that contacts the cold end of the thermoelectric generator 14, is set as a semi-circle or circle. Usually, the round pipe is flattened to form a semi-circle or circle to increase the contact area with the thermoelectric generator 14 and improve the heat conduction capacity. At the rear end (condenser end) of the heat pipe 15, several sets of heat dissipation fins 16 are provided, as shown in the figure. The heat pipe 15 is inserted into the holes of the heat dissipation fins 16, increasing the heat dissipation area after heat exchange with the heat dissipation fins 16. The heat dissipation fins 16 are composed of multiple parallel aluminum fins. The heat pipe 15 is connected to the fin group by insertion. The contact part between the heat dissipation fins 16 and the heat pipe 15 is provided with flanges to increase the contact area and improve the heat exchange capacity. Corresponding to the heat dissipation fins 16, a fan 17 is provided. The air outlet direction of the fan 17 corresponds to (directly faces) the ventilation hole 4 on the base plate body 1. After the fan 17 is started, the generated air force blows towards the heat dissipation fins 16, enhancing the heat dissipation effect of the heat dissipation fins 16 and rapidly dissipating heat at the condenser end of the heat pipe 15 through convection heat exchange. Some of the air force blows towards the ventilation hole 4 on the base plate body 1, through which combustion air is delivered into the furnace to enable the combustion device to burn normally and generate the required heat.

[0037] The front end of the heat pipe 15 is tightly attached to the cold end face of the thermoelectric generator 14, which satisfies the large-area attachment of the thermoelectric generator. The semi-circular shape eliminates the need to embed the heat pipe 15 into the bottom of the spade tooth. Instead, it directly contacts the thermoelectric generator 14 through high-temperature nano-ceramic adhesive, which greatly reduces the thermal resistance. At the same time, it reduces the thickness of the spade tooth base and reduces the overall weight of the device.

[0038] The heat dissipation device further includes a metal heat sink 18 disposed below the cold end of the thermoelectric generator 14. The contact surface of the metal heat sink 18 is in direct contact with the cold surface of the thermoelectric generator. In this embodiment, high-temperature nano-ceramic adhesive with high thermal conductivity is directly bonded to the cold surface of the thermoelectric generator, resulting in good thermal conductivity. The metal heat sink 18 can be processed using a tooth-shaving process to form multiple heat sink fins on its surface. There are deep heat dissipation grooves between adjacent heat sink fins, increasing the heat dissipation area. The metal heat sink 18 has slots, and the heat pipe 15 is made into a semi-cylindrical shape at its front end (evaporation end) using a pressing technique, which is then bonded to the semi-cylindrical slots of the metal heat sink 18, resulting in good thermal conductivity. As a heat transfer element, the heat pipe 15 can also contain phase change material, making full use of the principle of heat conduction and the rapid heat transfer properties of the phase change medium to quickly transfer the heat of the heated object to the outside of the heat source through the heat pipe, demonstrating excellent thermal conductivity. In operation, the evaporation section of heat pipe 15 is heated, and the working liquid (phase change medium) inside the pipe core evaporates, carrying away heat. This heat is the latent heat of vaporization of the working liquid. The vapor flows from the central channel to the condensation section of the heat pipe, condenses into liquid, and releases latent heat. Under the action of capillary force, the liquid flows back to the evaporation section. In this way, a closed loop is completed, thereby transferring a large amount of heat from the heating section to the heat dissipation section. The condensation end of the heat pipe (used with a fin assembly customized based on the principle of air conditioning surface cooler) combines the heat pipe with the fins through tube insertion, and uses edge-flanging technology to ensure a good fit between the heat pipe and each aluminum fin, ensuring heat transfer effect. The heat pipes are arranged in two layers in the fins, thereby making better use of the limited cross-sectional area to arrange more heat pipes.

[0039] This invention utilizes four heat dissipation modes—tooth-shaped heat dissipation, finned heat dissipation, heat transfer tube heat conduction, and fan convection—to significantly enhance the heat dissipation effect of the cold end face of the thermoelectric generator 14, thereby further reducing the cold end temperature. Furthermore, forced convection via the fan 17 delivers a large amount of air required for combustion into the furnace, greatly enhancing combustion and heating effects while reducing combustion byproducts. Additionally, the copper heat transfer plate 13 increases the temperature of the hot end face of the thermoelectric generator 14. This further increase in hot end temperature and decrease in cold end temperature widens the temperature difference between the hot and cold ends of the thermoelectric generator 14, significantly enhancing power generation. Therefore, this invention's combustion device achieves a dual improvement in power generation efficiency and heating effect.

[0040] The working principle of this utility model is as follows: 1. The heating surface of the semiconductor thermoelectric generator generates high temperature; 2. The heat transfer tube quickly conducts heat to the far-end heat dissipation fin assembly; 3. The heat dissipation fins increase the heat dissipation surface area, and the fan accelerates the airflow; 4. The cold air carries away the heat through the gaps between the heat dissipation fins, forming a continuous heat dissipation cycle.

[0041] Finally, it should be noted that the above embodiments are only used to illustrate the technical solution of this utility model and not to limit the technical solution. Although the applicant has described this utility model in detail with reference to preferred embodiments, those skilled in the art should understand that any modifications or equivalent substitutions to the technical solution of this utility model without departing from the spirit and scope of this technical solution should be covered within the scope of the claims of this utility model.

Claims

1. A hearth floor of a combustion installation, comprising a floor body (1); characterized in that, On the bottom plate body (1), the mounting portion (2) is arranged for connection, the mounting hole (3) is arranged on the bottom plate body (1), and a plurality of ventilation holes (4) are arranged on the other side corresponding to the side provided with the mounting portion (2).

2. The furnace floor of a combustion apparatus according to claim 1, characterized in that On the bottom plate body (1), the heat-conducting sheet (5) made of metal is arranged, and one end of the heat-conducting sheet (5) is arranged on the bottom plate body (1) through the support (6).

3. The furnace floor of a combustion apparatus according to claim 2, characterized in that The support (6) is arranged on the bottom plate body (1) through the connecting piece (7).

4. A furnace floor for a combustion device according to any one of claims 1 to 3, characterised in that The mounting portion (2) is a boss, or an internal cavity, or a downwardly recessed internal groove.

5. The hearth floor of a combustion apparatus according to any one of claims 1 to 3, characterized in that The mounting hole (3) is arranged around the periphery of the mounting portion (2).

6. A semiconductor thermoelectric power generation device provided inside a combustion device (10), wherein a hearth (11) is provided inside the combustion device (10), and the bottom plate body (1) according to any one of claims 1 to 5 is provided at a lower portion of the hearth (11). On the bottom plate body (1), the metal heat-conducting plate (13) is arranged and connected to the hearth bottom plate body (1) through the mounting portion (2), a plurality of semiconductor thermoelectric generation sheets (14) are arranged on the metal heat-conducting plate (13), the hot end of the semiconductor thermoelectric generation sheet (14) is upward, and the cold end is downward; a heat dissipation device is arranged on the cold end of the semiconductor thermoelectric generation sheet (14), the heat dissipation device comprises a heat pipe (15) made of metal, a plurality of sets of heat dissipation fins (16) are arranged at the rear end of the heat pipe (15); a fan (17) is arranged corresponding to the heat dissipation fin (16).

7. The semiconductor thermoelectric generator of claim 6, wherein A plurality of mounting grooves (20) are arranged on the metal heat-conducting plate (13), and one set of semiconductor thermoelectric generation sheets (14) is fitted and mounted in each mounting groove (20).

8. The semiconductor thermoelectric generator according to claim 6 or 7, characterized by The heat dissipation device further comprises a metal heat-dissipating piece (18) in direct contact with the cold surface of the semiconductor thermoelectric generation sheet (14); a plurality of heat dissipation sheets are arranged on the surface of the metal heat-dissipating piece (18), and heat dissipation grooves are arranged between adjacent heat dissipation sheets.

9. The semiconductor thermoelectric generator of claim 8, wherein, The front end of the heat pipe (15) is arranged in a semicylindrical shape at the position in contact with the semiconductor thermoelectric generation sheet (14), and is fitted with the semicylindrical groove of the metal heat-dissipating piece (18).

10. The semiconductor thermoelectric generator according to claim 6 or 7, characterized by The heat pipe (15) is respectively arranged in the hole of the heat dissipation fin (16), and the heat dissipation fin (16) is provided with a turn-up at the position in contact with the heat pipe (15) to increase the contact area.

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