Semiconductor discrete device testing device

Abstract

The utility model relates to the technical field of semiconductor testing, and provides a semiconductor discrete device testing device which comprises a workbench, a second fixing column is fixed in the middle of the top surface of the workbench, a bearing disc is arranged above the workbench, a rotating hole is formed in the middle of the bearing disc, the second fixing column penetrates through the rotating hole, and the second fixing column penetrates through the rotating hole. A plurality of first inserting holes are formed in the top face of the bearing disc and located in the outer side of the rotating hole, and a plurality of second inserting holes are formed in the top face of the bearing disc and located in the outer side of the rotating hole. The number of the first jacks and the number of the second jacks are multiple, a plurality of discrete semiconductor devices can be fixed on the bearing disc at the same time, the gear ring is driven to rotate by rotating the gear, the bearing disc is driven to rotate by the gear ring, the discrete semiconductor devices are moved to the position below a pressure tester one by one to be subjected to pressure resistance testing, and testing can be carried out on one side; the effect of taking and fixing the discrete semiconductor device is achieved, and the testing speed is increased.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor testing technology, specifically a semiconductor discrete device testing device. Background Technology

[0002] Semiconductor discrete devices generally refer to semiconductor crystal diodes, semiconductor transistors (abbreviated as transistors), and other special semiconductor devices. Electronic products are classified into "conductors" and "insulators" based on their conductivity. Semiconductors fall between "conductors" and "insulators." Semiconductor components are further classified into "discrete" and "integrated" based on their packaging form, such as diodes, transistors, and so on.

[0003] Existing semiconductor discrete device testing equipment often only allows for fixing one semiconductor discrete device at a time during withstand voltage testing. This necessitates removing the device after each withstand voltage test before proceeding to the next test, resulting in low overall efficiency and failing to meet the requirements of the application.

[0004] Therefore, there is a need for a semiconductor discrete device testing device that can improve testing efficiency. Utility Model Content

[0005] To address the aforementioned issues, this invention proposes a semiconductor discrete device testing apparatus that can fix multiple semiconductor discrete devices at once and perform cyclic testing with on-demand sampling, thereby improving the efficiency of withstand voltage testing.

[0006] To achieve the above objectives, the present invention proposes the following specific solutions:

[0007] A semiconductor discrete device testing apparatus includes a worktable, a second fixing post fixed at the center of the top surface of the worktable, a support tray above the worktable, a rotating hole in the center of the support tray, the second fixing post passing through the rotating hole, a first insertion hole on the top surface of the support tray (multiple first insertion holes located outside the rotating hole), a second insertion hole on the top surface of the support tray (multiple second insertion holes located outside the first insertion holes), a toothed ring fixedly fitted onto the upper outer wall of the support tray, a first fixing post fixed on the top surface of the worktable (located on one side of the support tray), a fixing ring fixedly fitted onto the outer wall of the first fixing post, a gear above the fixing ring meshing with the toothed ring, a through hole in the center of the gear, the first fixing post passing through the through hole, a rotating handle fixed to the edge of the top surface of the gear, a support plate fixed to one side wall of the worktable, a top plate fixed to the top of the support plate, an electric push rod fixed to the ground of the top plate, a pressure tester fixed to the lower end of the electric push rod, and the pressure tester located above the support tray.

[0008] As a preferred technical solution of the semiconductor discrete device testing device of this utility model, a fixed chamber is fixed on the top surface of the workbench, the fixed chamber is located on the other side of the support tray, an arc-shaped positioning plate is movably inserted into the inner side of the fixed chamber, an arc-shaped positioning groove is provided on the lower outer wall of the support tray, there are multiple arc-shaped positioning grooves, and one end of the arc-shaped positioning plate is located inside the arc-shaped positioning groove.

[0009] As a preferred technical solution of the semiconductor discrete device testing device of this utility model, the arc-shaped positioning plate has a plug-in groove in the middle of one side wall, and a plug-in rod is fixed in the middle of one side inner wall of the fixed chamber, with one end of the plug-in rod movably plugged into the inside of the plug-in groove.

[0010] As a preferred technical solution of the semiconductor discrete device testing device of this utility model, a spring is fixed on the inner wall of one side of the fixed chamber, the spring is located on the outside of the plug rod, and the spring is fixed on the side wall of the arc-shaped positioning plate.

[0011] As a preferred technical solution of the semiconductor discrete device testing device of this utility model, a connecting plate is fixed at the top of the rotating handle, and a rotating cap is movably sleeved on the outside of the connecting plate.

[0012] As a preferred technical solution of the semiconductor discrete device testing device of this utility model, the rotating cap has a connecting hole in the middle of the ground, the rotating handle passes through the connecting hole, the upper end of the connecting hole is connected to a connecting groove, and the connecting plate is movably sleeved inside the connecting groove.

[0013] As a preferred technical solution of the semiconductor discrete device testing device of this utility model, a first limiting disk is fixed at the top of the first fixing post, and a second limiting disk is fixed at the top of the second fixing post.

[0014] As a preferred technical solution of the semiconductor discrete device testing device of this utility model, a controller is fixed to one side wall of the pressure tester, and a support leg is fixed to the bottom edge of the workbench.

[0015] Compared with the prior art, the present invention has the following beneficial effects:

[0016] This invention uses multiple first and second sockets on a support tray to insert and fix discrete semiconductor devices, which can be fixed at once. By holding the rotating cap and rotating the gear, the gear drives the gear ring to rotate, which in turn drives the support tray to rotate, moving the discrete semiconductor devices one by one under the pressure tester. An electric push rod drives the pressure tester to compress the discrete semiconductor devices for withstand pressure testing. After the test is completed, the discrete semiconductor device is moved out from under the pressure tester as the support tray rotates. This allows for the simultaneous testing and removal of the completed discrete semiconductor device and the installation of untested discrete semiconductor devices, greatly improving the efficiency of withstand pressure testing.

[0017] This invention features multiple arc-shaped positioning grooves on the lower outer wall of the support tray. The positions of these grooves correspond to the positions of the first and second insertion holes. When the first and second insertion holes are used to insert semiconductor discrete devices and the tray rotates to the bottom of the pressure tester, one end of the arc-shaped positioning plate on the inner side of the fixed compartment on the top surface of the workbench is pushed by a spring and precisely embeds into the corresponding arc-shaped positioning groove. This causes the operator to feel significant resistance when rotating the gear and stop rotating, waiting for the pressure test. After the test, only a slight rotational force is needed to press the arc-shaped positioning plate against the inner wall of the arc-shaped positioning groove, causing the arc-shaped positioning plate to move inward into the fixed compartment and out of the arc-shaped positioning groove. This cyclical operation ensures that each time the support tray stops rotating, a semiconductor discrete device is precisely positioned under the pressure tester, improving positioning accuracy. Attached Figure Description

[0018] To better describe the technical solution of this utility model in detail, the present invention will be further described below with reference to the accompanying drawings and embodiments.

[0019] Figure 1 This is a three-dimensional view of the overall structure provided by this utility model;

[0020] Figure 2 This is a three-dimensional sectional view of the present invention;

[0021] Figure 3 This is a perspective view of the arc-shaped positioning plate of this utility model;

[0022] Figure 4 This utility model Figure 2 Enlarged view of point A in the middle;

[0023] Figure 5 This utility model Figure 2 Enlarged view of point B in the middle;

[0024] Figure 6 This utility model Figure 2 Enlarged diagram of point C in the middle.

[0025] In the diagram: 1. Workbench; 11. Support leg; 12. Support plate; 121. Top plate; 13. Electric push rod; 131. Pressure tester; 132. Controller; 14. First fixed column; 141. First limit plate; 142. Fixed ring; 15. Gear; 151. Rotating handle; 152. Connecting plate; 153. Through hole; 16. Rotating cap; 161. Connecting hole; 162. Connecting groove; 17. Second fixed column; 171. Second limit plate; 18. Fixed chamber; 181. Insertion rod; 182. Spring; 19. Arc-shaped positioning plate; 191. Insertion groove; 2. Support plate; 21. First insertion hole; 22. Second insertion hole; 23. Gear ring; 24. Arc-shaped positioning groove; 25. Rotating hole. Detailed Implementation

[0026] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of the present utility model. Example

[0027] Please see Figure 1-6 As shown, the present invention provides the following technical solution: a semiconductor discrete device testing device, including a worktable 1, with a support leg 11 fixed to the bottom edge of the worktable 1, the support leg 11 supporting the worktable 1, which helps to ensure the stability of the worktable 1.

[0028] Reference Figure 1 , Figure 2 , Figure 4 and Figure 5As shown, specifically, a second fixing post 17 is fixed in the middle of the top surface of the workbench 1 to maintain the stability of the support tray 2. The support tray 2 is provided above the workbench 1 to support the discrete semiconductor devices. The support tray 2 has a rotating hole 25 in the middle, allowing the support tray 2 to rotate around the second fixing post 17 as the center. The second fixing post 17 passes through the rotating hole 25. A second limiting plate 171 is fixed at the top of the second fixing post 17 to prevent the support tray 2 from moving upward. The top surface of the support tray 2 has a first insertion hole 21, and there are multiple first insertion holes 21. The first insertion holes 21 are located outside the rotating hole 25. The top surface of the support tray 2 has a second insertion hole 22, and there are multiple second insertion holes 22. The second insertion holes 22 are located outside the first insertion holes. On the outside of 21, the first socket 21 and the second socket 22 are used for inserting semiconductor discrete device pins. A toothed ring 23 is fixedly sleeved on the upper outer wall of the support tray 2, which can drive the support tray 2 to rotate. A first fixing post 14 is fixed on the top surface of the worktable 1 to keep the gear 15 rotating stably. The first fixing post 14 is located on one side of the support tray 2. A fixing ring 142 is fixedly sleeved on the outer wall of the first fixing post 14 to support the gear 15. The gear 15 is located above the fixing ring 142, which can drive the toothed ring 23 to rotate. The gear 15 meshes with the toothed ring 23. A through hole 153 is provided in the middle of the gear 15, so that the gear 15 can rotate around the first fixing post 14 as the center. The first fixing post 14 passes through the through hole 153. A first limiting plate 141 is fixed to the top of the fixed column 14 to prevent the gear 15 from moving upward and disengaging from the first fixed column 14. A rotating handle 151 is fixed to the edge of the top surface of the gear 15 for controlling the rotation of the gear 15. A connecting plate 152 is fixed to the top of the rotating handle 151 for connecting the rotating cap 16. The rotating cap 16 is movably sleeved on the outside of the connecting plate 152. The rotating cap 16 is sleeved on the outside of the connecting plate 152, allowing the rotating handle 151 to be operated by gripping the rotating cap 16, making it more convenient and faster. A connecting hole 161 is provided in the middle of the ground of the rotating cap 16 for connecting the rotating handle 151. The rotating handle 151 passes through the connecting hole 161. A connecting groove 162 is provided through the upper end of the connecting hole 161 to accommodate the connecting plate. 152. To prevent the rotating cap 16 from falling off, the connecting plate 152 is movably sleeved inside the connecting groove 162. In this solution, the pins of the semiconductor discrete devices are inserted through multiple first sockets 21 and second sockets 22 on the support tray 2, thereby fixing multiple semiconductor discrete devices on the support tray 2. By holding the rotating cap 16, the rotating handle 151 is controlled to rotate the gear 15. The gear 15 drives the gear ring 23 to rotate, and the gear ring 23 drives the support tray 2 to rotate, thereby moving the semiconductor discrete devices one by one to the pressure tester 131 for testing. It is possible to test and pick up the tested semiconductor discrete devices and add new semiconductor discrete devices at the same time, improving the efficiency of the semiconductor discrete device withstand voltage test.

[0029] Reference Figure 1 , Figure 2 , Figure 3 and Figure 6As shown, specifically, a fixed chamber 18 is fixed on the top surface of the workbench 1 to accommodate the arc-shaped positioning plate 19. The fixed chamber 18 is located on the other side of the support tray 2. The arc-shaped positioning plate 19 is movably inserted into the inner side of the fixed chamber 18, which restricts the rotation of the support tray 2 to a certain extent. An arc-shaped positioning groove 24 is provided on the lower outer wall of the support tray 2 to cooperate with the arc-shaped positioning plate 19 to restrict the rotation of the support tray 2 and to position the semiconductor discrete devices. Multiple arc-shaped positioning grooves 24 are provided. One end of the arc-shaped positioning plate 19 is located inside the arc-shaped positioning groove 24. A insertion groove 191 is provided in the middle of one side wall of the arc-shaped positioning plate 19 for connecting the insertion rod 181. The insertion rod 181 is fixed in the middle of one side inner wall of the fixed chamber 18 to prevent the spring 182 from bending. One end of the insertion rod 181 is movably inserted into the inner side of the insertion groove 191. A spring 182 is fixed in the inner wall of one side of the fixed chamber 18, which pushes the arc-shaped positioning plate 19 to move through elasticity. The spring 182 is located at the insertion rod 181. On the outside of 81, spring 182 is fixed to the side wall of arc-shaped positioning plate 19. In this scheme, after the support tray 2 rotates at a certain angle, one end of arc-shaped positioning plate 19 is embedded in the inner side of arc-shaped positioning groove 24 under the elastic push of spring 182, so that the operator feels the resistance of gear 15 rotation and stops rotating. When one end of arc-shaped positioning plate 19 is embedded in the inner side of arc-shaped positioning groove 24, a semiconductor discrete device is just moved under pressure tester 131, achieving precise positioning. After the test is completed, it is only necessary to increase the force of rotating gear 15, so that the inner wall of arc-shaped positioning groove 24 can squeeze the arc surface of one end of arc-shaped positioning plate 19, so that arc-shaped positioning plate 19 compresses spring 182 and moves into the inner side of fixed chamber 18, thus no longer affecting the rotation of support tray 2. In this way, whenever the arc surface of one end of arc-shaped positioning plate 19 is embedded in the inner side of arc-shaped positioning groove 24, it means that a semiconductor discrete device is just moved under pressure tester 131, ensuring the accuracy of positioning.

[0030] Reference Figure 1 and Figure 2As shown, specifically, a support plate 12 is fixed to one side wall of the workbench 1 to fix and support the top plate 121. The top plate 121 is fixed to the top of the support plate 12 to fix the electric push rod 13. The electric push rod 13 is fixed to the ground of the top plate 121 (the electric push rod 13 is existing technology, and the specific operation mode and principle can be referred to the electric hydraulic push rod in the existing technology. It is controlled by the controller 132 to open and close, so it is not described in detail here). A pressure tester 131 is fixed to the lower end of the electric push rod 13 to compress the semiconductor discrete device for pressure resistance testing. The pressure tester 131 is located above the support tray 2. A controller 132 is fixed to one side wall of the pressure tester 131 (the controller 132 is existing technology, and the specific operation mode and principle can be referred to the switch controller in the existing technology. It is used to control the opening and closing of the equipment, so it is not described in detail here). In this solution, the controller 132 controls the electric push rod 13 to drive the pressure tester 131 to move downward to compress the semiconductor discrete device and perform pressure resistance testing on the semiconductor discrete device. It can automatically apply pressure, which is stable and convenient.

[0031] The working principle and usage process of this utility model:

[0032] In use, the leads of the discrete semiconductor device are inserted into the first socket 21 and the second socket 22 to fix the discrete semiconductor device onto the support tray 2. Multiple discrete semiconductor devices can be fixed at once. Then, the rotating cap 16 is held to control the rotating handle 151 to rotate the gear 15. The gear 15 drives the gear ring 23 to rotate, and the gear ring 23 drives the support tray 2 to rotate. After the support tray 2 rotates a certain angle, an arc-shaped positioning groove 24 moves to one side of the arc-shaped positioning plate 19. Under the elastic thrust of the spring 182, one end of the arc-shaped positioning plate 19 is embedded into the arc-shaped positioning groove 24, applying a certain resistance to the support tray 2. When the operator feels the resistance, the operation stops, so that a discrete semiconductor device is exactly below the pressure tester 131. Then, the controller 132 controls the electric... When the push rod 13 is activated, the electric push rod 13 drives the pressure tester 131 to press down on the semiconductor discrete device for withstand voltage testing. After the test is completed, the operator applies a certain force to continue rotating the gear 15, causing the inner wall of the arc-shaped positioning groove 24 to press against the arc surface of one end of the arc-shaped positioning plate 19. The arc-shaped positioning plate 19 is compressed by the force and moves towards the inside of the fixed chamber 18. After the arc-shaped positioning plate 19 moves out of the inner side of the arc-shaped positioning groove 24, the support tray 2 rotates normally. By repeating this cycle, it can be ensured that each semiconductor discrete device is accurately moved under the pressure tester 131 for testing. At the same time, the semiconductor discrete device that has been tested is moved out of the pressure tester 131, making it convenient for the operator to pick up and add new semiconductor discrete devices, so as to quickly complete the withstand voltage test of multiple semiconductor discrete devices.

[0033] Finally, it should be noted that the above description is merely a preferred embodiment of this utility model and is not intended to limit the utility model. Although the utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this utility model should be included within the protection scope of this utility model.

Claims

1. A semiconductor discrete device testing apparatus, comprising a worktable (1), characterized in that: A second fixing post (17) is fixed in the middle of the top surface of the workbench (1). A support tray (2) is provided above the workbench (1). A rotating hole (25) is provided in the middle of the support tray (2). The second fixing post (17) passes through the rotating hole (25). A first insertion hole (21) is provided on the top surface of the support tray (2). There are multiple first insertion holes (21). The first insertion hole (21) is located outside the rotating hole (25). A second insertion hole (22) is provided on the top surface of the support tray (2). There are multiple second insertion holes (22). The second insertion hole (22) is located outside the first insertion hole (21). A toothed ring (23) is fixedly sleeved on the upper outer wall of the support tray (2). A first fixing post (14) is fixed on the top surface of the workbench (1). Located on one side of the support tray (2), the first fixed column (14) is fixedly fitted with a fixed ring (142) on its outer wall. A gear (15) is provided above the fixed ring (142). The gear (15) meshes with the gear ring (23). A through hole (153) is provided in the middle of the gear (15). The first fixed column (14) passes through the through hole (153). A rotating handle (151) is fixed on the top edge of the gear (15). A support plate (12) is fixed on one side wall of the workbench (1). A top plate (121) is fixed on the top of the support plate (12). An electric push rod (13) is fixed on the ground of the top plate (121). A pressure tester (131) is fixed at the lower end of the electric push rod (13). The pressure tester (131) is located above the support tray (2).

2. The semiconductor discrete device testing apparatus according to claim 1, characterized in that: The workbench (1) has a fixed compartment (18) fixed on its top surface. The fixed compartment (18) is located on the other side of the support tray (2). An arc-shaped positioning plate (19) is movably inserted into the inner side of the fixed compartment (18). An arc-shaped positioning groove (24) is provided on the outer wall of the lower end of the support tray (2). There are multiple arc-shaped positioning grooves (24). One end of the arc-shaped positioning plate (19) is located inside the arc-shaped positioning groove (24).

3. The semiconductor discrete device testing apparatus according to claim 2, characterized in that: The arc-shaped positioning plate (19) has a insertion groove (191) in the middle of one side wall, and a insertion rod (181) is fixed in the middle of one side inner wall of the fixed chamber (18). One end of the insertion rod (181) is movably inserted into the inside of the insertion groove (191).

4. The semiconductor discrete device testing apparatus according to claim 3, characterized in that: A spring (182) is fixed to the inner wall of one side of the fixed chamber (18). The spring (182) is located outside the plug rod (181) and is fixed to the side wall of the arc-shaped positioning plate (19).

5. The semiconductor discrete device testing apparatus according to claim 4, characterized in that: The top of the rotating handle (151) is fixed with a connecting plate (152), and a rotating cap (16) is movably sleeved on the outside of the connecting plate (152).

6. The semiconductor discrete device testing apparatus according to claim 5, characterized in that: The rotating cap (16) has a connecting hole (161) in the middle of the ground. The rotating handle (151) passes through the connecting hole (161). The upper end of the connecting hole (161) is connected to a connecting groove (162). The connecting plate (152) is movably sleeved inside the connecting groove (162).

7. The semiconductor discrete device testing apparatus according to claim 6, characterized in that: The first fixed post (14) is fixed with a first limiting plate (141) at its top end, and the second fixed post (17) is fixed with a second limiting plate (171) at its top end.

8. The semiconductor discrete device testing apparatus according to claim 7, characterized in that: A controller (132) is fixed to one side wall of the pressure tester (131), and a support leg (11) is fixed to the bottom edge of the workbench (1).

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