Nondestructive testing equipment for PZT piezoelectric film wafer

Abstract

The utility model discloses nondestructive testing equipment for a PZT piezoelectric film wafer, which comprises a base, an electric sliding rail is arranged on the base, an electric rotating table is mounted on the electric sliding rail, a vacuum chuck is mounted on the electric rotating table, a scanning mechanism is fixedly connected to the top of the base, an alignment mechanism is arranged on one side of the scanning mechanism, and a clamping mechanism is arranged on the other side of the scanning mechanism. The alignment mechanism comprises a mechanical arm, a fixing frame is installed on the mechanical arm, and a lifting screw rod is rotationally connected to the fixing frame. According to the nondestructive testing equipment for the PZT piezoelectric film wafer, an alignment seat is conveyed to the top of a vacuum chuck through a manipulator, a lifting motor drives a plurality of alignment rods to be located on the outer side of the wafer, and then a driving motor drives the alignment rods to move along limiting grooves, so that the alignment rods draw close to the center at the same time, and the wafer is rapidly aligned; therefore, the wafer can be aligned with the center of the vacuum chuck, the alignment time is shortened, and the detection efficiency can be improved.

Description

Technical Field

[0001] This utility model relates to the field of wafer inspection technology, specifically to a non-destructive testing device for PZT piezoelectric thin film wafers. Background Technology

[0002] When performing non-destructive testing on PZT piezoelectric thin film wafers, the wafer is typically fixed on a vacuum chuck, and a CCD camera is used to scan the wafer as it undergoes Archimedean spiral motion. Then, non-destructive testing is performed using software. In existing technologies, after the wafer is placed on the vacuum chuck, the operator needs to align the center of the wafer with the center of the chuck. This makes alignment difficult and time-consuming, resulting in less than ideal testing efficiency.

[0003] For example, patent publication number CN220895485U specifically describes a wafer adjustment platform, including: a base; at least three sets of adjustment components distributed circumferentially on the base; a top plate connected and supported on the at least three sets of adjustment components; and a support component rotatably mounted on the top plate, configured to support a wafer and drive the wafer to rotate; the at least three sets of adjustment components are configured to respectively drive the top plate to rise and fall at corresponding positions to level the support component or adjust its height. Using the wafer adjustment platform provided in this application, during the wafer inspection process... When a wafer tilts, one or more adjustment components can be controlled to drive the top plate to deflect from the corresponding position, thereby implementing real-time leveling of the support component and ensuring the horizontality of the wafer supported on the support component. By controlling all adjustment components to synchronously drive the top plate to rise and fall from the corresponding position, the rise and fall adjustment of the support component can be implemented, thereby driving the wafer to rise and fall synchronously. However, after the wafer is placed on the vacuum chuck, the operator needs to align the center of the wafer with the center of the chuck. This makes alignment difficult and time-consuming, resulting in less than ideal testing efficiency. Utility Model Content

[0004] To address the shortcomings of existing technologies, this invention provides a non-destructive testing device for PZT piezoelectric thin film wafers. It solves the problem that after the wafer is placed on a vacuum chuck, the operator needs to align the center of the wafer with the center of the chuck, which makes alignment difficult and time-consuming, resulting in less than ideal testing efficiency.

[0005] To achieve the above objectives, this utility model is implemented through the following technical solution: a non-destructive testing device for PZT piezoelectric thin film wafers, including a base, an electric slide rail on the base, an electric rotary table mounted on the electric slide rail, a vacuum suction cup mounted on the electric rotary table, a scanning mechanism fixedly connected to the top of the base, and an alignment mechanism on one side of the scanning mechanism;

[0006] The alignment mechanism includes a robotic arm with a fixed frame mounted on it. A lifting screw is rotatably connected to the fixed frame. A lifting motor is fixedly connected to the top of the lifting screw, and a limit block is fixedly connected to the bottom of the lifting screw. A lifting plate is threaded onto the lifting screw, and two guide sleeves are fixedly connected to the bottom of the lifting plate. Guide rods are slidably connected inside the two guide sleeves. An alignment seat is fixedly connected to the bottom of the guide sleeves. The alignment seat has multiple limit grooves inside, and an alignment rod is slidably connected inside each limit groove. A return spring is provided on one side of each alignment rod. A driven gear ring is rotatably connected inside the alignment seat. A drive gear is provided on one side of the driven gear ring, and a drive motor is fixedly connected to the top of the drive gear. Multiple push blocks are fixedly connected to the inner wall of the driven gear ring.

[0007] Preferably, the robotic arm is mounted on one side of the base, and the robotic arm is detachably connected to the base by bolts, which makes it easy to disassemble and assemble the robotic arm, thereby facilitating the maintenance of the robotic arm.

[0008] Preferably, the lifting motor is fixedly installed on the top of the fixed frame, and the output shaft end of the lifting motor is connected to the lifting screw, so that the lifting motor can drive the lifting screw to rotate.

[0009] Preferably, the top end of the guide rod is fixedly connected to the fixing frame, and the bottom end of the guide rod extends into the guide sleeve, so that the guide rod can guide the movement of the guide sleeve.

[0010] Preferably, the bottom end of the alignment rod passes through the alignment seat and extends partially to the bottom of the alignment seat, and a plurality of the alignment rods are evenly arranged on the alignment seat, so that the alignment rods can perform alignment operations on the wafer.

[0011] Preferably, the plurality of push blocks are respectively disposed on one side of the alignment rod, and the push blocks are in contact with the alignment rod, so that the push blocks can push the alignment rod to move.

[0012] Preferably, the scanning mechanism includes a stand, with guide grooves on both inner walls of the stand. A mounting plate is slidably connected between the two guide grooves. One end of the mounting plate is threaded with an adjusting screw, which is rotatably connected to the inner wall of the stand. One end of the adjusting screw is connected to an adjusting motor via a bevel gear pair. A CCD camera is mounted on the mounting plate, allowing adjustment of the CCD camera's mounting height, thereby effectively improving the flexibility and convenience of installation.

[0013] This invention provides a non-destructive testing device for PZT piezoelectric thin film wafers. Compared with the prior art, it has the following advantages:

[0014] 1. The non-destructive testing equipment for PZT piezoelectric thin film wafers uses a robotic arm to deliver the alignment seat to the top of the vacuum chuck. A lifting motor drives multiple alignment rods to the outside of the wafer, and then a drive motor moves the alignment rods along the limiting groove, so that multiple alignment rods move towards the center at the same time, quickly aligning the wafer. This allows the wafer to be aligned with the center of the vacuum chuck, shortening the alignment time and thus improving the testing efficiency.

[0015] 2. The non-destructive testing equipment for PZT piezoelectric thin film wafers uses an adjustable motor to drive an adjusting screw to rotate, which in turn raises and lowers the mounting plate, thereby adjusting the installation height of the CCD camera and effectively improving the flexibility and convenience of installation. Attached Figure Description

[0016] Figure 1 This is a schematic diagram of the overall structure of this utility model;

[0017] Figure 2 This is a schematic diagram of the alignment mechanism structure of this utility model;

[0018] Figure 3 This is a schematic diagram of the internal structure of the alignment seat of this utility model;

[0019] Figure 4 This is a schematic diagram of the scanning mechanism structure of this utility model.

[0020] In the diagram: 1. Base; 2. Alignment mechanism; 201. Robotic arm; 202. Fixing frame; 203. Lifting screw; 204. Lifting motor; 205. Lifting plate; 206. Guide sleeve; 207. Guide rod; 208. Limiting block; 209. Alignment seat; 210. Limiting groove; 211. Alignment rod; 212. Return spring; 213. Driven gear ring; 214. Driving gear; 215. Drive motor; 216. Pushing block; 3. Electric slide rail; 4. Scanning mechanism; 401. Stand; 402. Guide slide groove; 403. Adjustment motor; 404. Mounting plate; 405. CCD camera; 5. Electric rotary table; 6. Vacuum suction cup. Detailed Implementation

[0021] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0022] Please see Figure 1-3This utility model provides a technical solution: a non-destructive testing device for PZT piezoelectric thin film wafers, including a base 1, an electric slide rail 3 on the base 1, an electric rotary table 5 mounted on the electric slide rail 3, a vacuum chuck 6 mounted on the electric rotary table 5, a scanning mechanism 4 fixedly connected to the top of the base 1, and an alignment mechanism 2 on one side of the scanning mechanism 4. The wafer on the vacuum chuck 6 can be quickly aligned by the alignment mechanism 2, so that the wafer can be aligned with the center of the vacuum chuck 6, shortening the alignment time and thus improving the testing efficiency. Then, the electric slide rail 3 and the electric rotary table 5 drive the wafer to perform Archimedean spiral motion (motion performed by rotating while moving in a straight line), so that the scanning mechanism 4 can scan the wafer for non-destructive testing.

[0023] The alignment mechanism 2 includes a robotic arm 201, which can move the alignment seat 209 and can be folded up when not in use to prevent obstruction of the inspection operation. The robotic arm 201 is located on one side of the base 1 and is detachably connected to the base 1 by bolts, making it easy to assemble and disassemble the robotic arm 201 for easy maintenance. A fixed frame 202 is mounted on the robotic arm 201, and a lifting screw 203 is rotatably connected to the fixed frame 202. A lifting screw is fixedly connected to the top of the lifting screw 203. A lifting motor 204 is fixedly mounted on the top of the fixed frame 202, and the output shaft of the lifting motor 204 is connected to the lifting screw 203, enabling the lifting motor 204 to drive the lifting screw 203 to rotate. A limit block 208 is fixedly connected to the bottom end of the lifting screw 203, and a lifting plate 205 is threaded onto the lifting screw 203. Two guide sleeves 206 are fixedly connected to the bottom end of the lifting plate 205, and guide rods 207 are slidably connected inside the two guide sleeves 206. The top ends of the guide rods 207 are fixedly connected to the fixed frame 202. Next, the bottom end of the guide rod 207 extends into the guide sleeve 206, enabling the guide rod 207 to guide the movement of the guide sleeve 206. An alignment seat 209 is fixedly connected to the bottom end of the guide sleeve 206. Multiple limiting grooves 210 are formed inside the alignment seat 209, and an alignment rod 211 is slidably connected inside each limiting groove 210. The bottom end of the alignment rod 211 passes through the alignment seat 209 and partially extends to the bottom of the alignment seat 209. Multiple alignment rods 211 are evenly distributed on the alignment seat 209, enabling the alignment rods 211 to align the wafer. The alignment rod 211 is provided with a return spring 212 on one side, which can reset the alignment rod 211. The alignment seat 209 is rotatably connected to a driven gear ring 213. The driven gear ring 213 is provided with a driving gear 214 on one side. The top of the driving gear 214 is fixedly connected to a drive motor 215. Multiple push blocks 216 are fixedly connected to the inner wall of the driven gear ring 213. The multiple push blocks 216 are respectively arranged on one side of the alignment rod 211, and the push blocks 216 are in contact with the alignment rod 211, so that the push blocks 216 can push the alignment rod 211 to move.

[0024] Please see Figure 1 and Figure 4 The scanning mechanism 4 includes a stand 401. Guide grooves 402 are provided on the inner walls of both sides of the stand 401. A mounting plate 404 is slidably connected between the two guide grooves 402. An adjusting screw is threaded to one end of the mounting plate 404. The adjusting screw is rotatably connected to the inner wall of the stand 401. One end of the adjusting screw is connected to an adjusting motor 403 through a bevel gear pair. A CCD camera 405 is mounted on the mounting plate 404. The CCD camera 405 can scan the wafer that is undergoing Archimedean spiral motion, thereby enabling non-destructive testing. The adjusting motor 403 can drive the adjusting screw to rotate, and the rotation of the adjusting screw can drive the mounting plate 404 to rise and fall, thereby adjusting the mounting height of the CCD camera 405, which can effectively improve the flexibility and convenience of installation.

[0025] During operation, the robotic arm 201 delivers the alignment seat 209 to the top of the vacuum chuck 6. The lifting motor 204 drives the lifting screw 203 to rotate, which in turn moves the lifting plate 205. The movement of the lifting plate 205 moves the guide sleeve 206, which in turn moves the alignment seat 209, placing multiple alignment rods 211 on the outer side of the wafer. Then, the drive motor 215 drives the drive gear 214 to rotate, which in turn moves the driven gear ring 213. The rotation of the driven gear ring 213 in turn moves the push block 216, which in turn moves the alignment rods 211 along the limiting groove 210, causing multiple alignment rods 211 to move towards the center simultaneously, quickly aligning the wafer and ensuring that the wafer is aligned with the center of the vacuum chuck 6. This shortens the alignment time and improves the detection efficiency.

[0026] Furthermore, any content not described in detail in this specification is existing technology known to those skilled in the art.

Claims

1. A nondestructive testing device for PZT piezoelectric thin film wafer, comprising a base (1), characterized in that: The base (1) is provided with an electric sliding rail (3), the electric sliding rail (3) is installed with an electric rotary table (5), the electric rotary table (5) is installed with a vacuum chuck (6), the base (1) top is fixedly connected with a scanning mechanism (4), and the scanning mechanism (4) one side is equipped with an alignment mechanism (2). The alignment mechanism (2) includes a mechanical hand (201), the mechanical hand (201) is installed with a fixed frame (202), the fixed frame (202) is rotatably connected with a lifting screw (203), the lifting screw (203) top is fixedly connected with a lifting motor (204), the lifting screw (203) bottom is fixedly connected with a limit block (208), the lifting screw (203) is threadedly connected with a lifting plate (205), the lifting plate (205) bottom is fixedly connected with two guide sleeves (206), two the guide sleeve (206) inside is slidably connected with a guide rod (207), the guide sleeve (206) bottom is fixedly connected with an alignment seat (209), the alignment seat (209) is internally provided with a plurality of limit grooves (210), each The limit groove (210) inside is slidably connected with an alignment rod (211), the alignment rod (211) one side is equipped with a return spring (212), the alignment seat (209) inside is rotatably connected with a driven gear ring (213), the driven gear ring (213) one side is equipped with a driving gear (214), the driving gear (214) top is fixedly connected with a drive motor (215), the driven gear ring (213) inner wall is fixedly connected with a plurality of push blocks (216).

2. The non-destructive testing apparatus of PZT piezoelectric thin film wafers of claim 1, wherein: The mechanical hand (201) is arranged on one side of the base (1), and the mechanical hand (201) is detachably connected with the base (1) by bolts.

3. The non-destructive testing apparatus of PZT piezoelectric thin film wafers of claim 1, wherein: The lifting motor (204) is fixedly installed on the top of the fixed frame (202), and the output shaft end of the lifting motor (204) is connected with the lifting screw (203).

4. The non-destructive testing apparatus of PZT piezoelectric thin film wafers of claim 1, wherein: The guide rod (207) top is fixedly connected with the fixed frame (202), and the guide rod (207) bottom extends into the guide sleeve (206).

5. The non-destructive testing apparatus of PZT piezoelectric thin film wafers of claim 1, wherein: The alignment rod (211) bottom penetrates the alignment seat (209) and partially extends to the bottom of the alignment seat (209), and a plurality of alignment rods (211) are evenly arranged on the alignment seat (209).

6. The non-destructive testing apparatus of PZT piezoelectric thin film wafers of claim 1, wherein: A plurality of push blocks (216) are arranged on one side of the alignment rod (211), and the push blocks (216) are in contact with the alignment rod (211).

7. The non-destructive testing apparatus of PZT piezoelectric thin film wafers of claim 1, wherein: The scanning mechanism (4) includes a stand (401), the stand (401) two sides inner wall all are provided with guide sliding groove (402), two the guide sliding groove (402) between sliding connection has the mounting plate (404).

8. The non-destructive testing apparatus of PZT piezoelectric thin film wafers of claim 7, wherein: One end of the mounting plate (404) is threadedly connected with an adjusting screw, the adjusting screw is rotatably connected with the inner wall of the stand (401), one end of the adjusting screw is drivingly connected with an adjusting motor (403) through a bevel gear pair, and the mounting plate (404) is installed with a CCD camera (405).

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