Mainboard heat dissipation strengthening device of server

Abstract

The utility model provides a mainboard heat dissipation strengthening device of a server, and relates to the technical field of server heat dissipation, the mainboard heat dissipation strengthening device of the server comprises a vapor chamber, one side of the outer wall of the vapor chamber is adhered with heat conduction silica gel, one side of the outer wall of the vapor chamber is fixedly connected with a condensation pipe, and the output end of the condensation pipe is fixedly communicated with a first connecting pipe; the output end of the first connecting pipe fixedly communicates with a heat dissipation pipe, the outer surface wall of the heat dissipation pipe is fixedly sleeved with heat dissipation fins, and the bottoms of the heat dissipation fins are fixedly connected with a mounting plate. According to the utility model, under the interaction of all the components of the device, the reinforced heat dissipation of the server mainboard is realized, and a large amount of heat generated by the mainboard can be effectively dissipated by the heat conduction component even if the server runs for a long time with high load and is in a hot environment in summer, so that the temperature of the mainboard is kept in a reasonable interval; and the performance and the stability of the server are further ensured.

Description

Technical Field

[0001] This utility model relates to the field of server heat dissipation technology, and in particular to a server motherboard heat dissipation enhancement device. Background Technology

[0002] A server is a high-performance computer that serves as a core device in a network. It can store, process, and transmit large amounts of data and respond to client requests, providing functions such as website services, file storage, and database management.

[0003] During data processing, storage, and transmission, the motherboard inside a server generates a large amount of heat due to the high-frequency operation of electronic components such as the CPU and GPU, and the resistance heat generated by the current flowing through them. The server's motherboard cooling system uses fans to accelerate airflow or uses heat sinks to increase the heat dissipation area to cool the motherboard, thereby effectively reducing the motherboard temperature, ensuring stable server operation, and extending the lifespan of the hardware.

[0004] However, existing server motherboard cooling systems have the following shortcomings:

[0005] In existing technologies, server motherboard cooling devices typically use fans or heat sinks for heat dissipation. While this method can reduce motherboard temperature to some extent, servers operate under high loads for extended periods, and in hot summer weather, the ambient temperature rises significantly, which intensifies heat generation on the motherboard. The fans or heat sinks cannot effectively dissipate the heat in time, causing the motherboard temperature to continue to rise, affecting server performance and stability.

[0006] Therefore, we propose a server motherboard heat dissipation enhancement device to solve the problems mentioned above. Utility Model Content

[0007] The purpose of this invention is to provide a server motherboard heat dissipation enhancement device. By utilizing the heat conduction characteristics of a water pump driven by a heat-conducting component, the heat generated by the motherboard during operation can be quickly conducted and transferred. Furthermore, under the heat dissipation effect of the heat dissipation component, the coolant that absorbs heat can be rapidly cooled down. In this way, the problems mentioned in the background art can be solved.

[0008] To achieve the above objectives, the present invention adopts the following technical solution: a server motherboard heat dissipation enhancement device, comprising a heat spreader, thermally conductive silicone adhesive adhered to one side of the outer wall of the heat spreader, a condenser tube fixedly connected to one side of the outer wall of the heat spreader, a first connecting pipe fixedly connected to the output end of the condenser tube, a heat dissipation tube fixedly connected to the output end of the first connecting pipe, a heat dissipation fin fixedly sleeved on the outer wall of the heat dissipation tube, a mounting plate fixedly connected to the bottom of the heat dissipation fin, two cooling fans fixedly connected to one side of the outer wall of the mounting plate, a second connecting pipe fixedly connected to the output end of the heat dissipation tube, and a liquid storage tank fixedly connected to the output end of the second connecting pipe.

[0009] Preferably, the output end of the liquid storage tank is fixedly connected to a third connecting pipe, the output end of the third connecting pipe is fixedly connected to a water pump, the output end of the water pump is fixedly connected to a delivery pipe, and the input end of the condenser pipe is fixedly connected to the output end of the delivery pipe.

[0010] Preferably, the outer wall of the heat spreader is fixedly connected to four fixing plates, and each of the four fixing plates has a groove on one side of its outer wall.

[0011] Preferably, a sliding plate is slidably embedded between the inner walls of the four sliding grooves, and two return springs are fixedly connected to one side of the outer wall of each of the two sliding plates.

[0012] Preferably, two locking blocks are fixedly connected to the other side of the outer wall of each of the two sliding plates, and a connecting block is movably fitted onto the outer wall of each of the four locking blocks.

[0013] Preferably, each of the four connecting blocks has a slot on one side of its outer wall, and the outer walls of the four blocks are movably inserted into the four slots.

[0014] Preferably, the inner surface of each of the four connecting blocks is movably fitted with a fixing bolt.

[0015] Compared with the prior art, the advantages and positive effects of this utility model are as follows:

[0016] 1. In this utility model, through the interaction of the various components of the device, the heat generated by the motherboard can be quickly conducted and transferred by the water pump driven in combination with the heat conduction characteristics of the heat conduction component. Furthermore, under the heat dissipation effect of the heat dissipation component, the coolant that absorbs heat can be quickly cooled down. In this way, enhanced heat dissipation of the server motherboard is achieved. Even if the server runs under high load for a long time and is in a hot summer environment, the large amount of heat generated by the motherboard can be effectively dissipated by the heat conduction component, ensuring that the motherboard temperature is kept within a reasonable range, thereby ensuring the performance and stability of the server.

[0017] 2. In this utility model, through the interaction of the various components of the device, the quick fixing effect of the fixing component is utilized to realize the rapid disassembly of the heat dissipation component, thereby greatly improving the efficiency and convenience of server and heat dissipation component maintenance. Attached Figure Description

[0018] Figure 1 This utility model provides a front view perspective view of a motherboard heat dissipation enhancement device for servers.

[0019] Figure 2 This utility model provides a three-dimensional exploded view of a portion of the structure of a server motherboard heat dissipation enhancement device.

[0020] Figure 3 This utility model provides a side-view perspective exploded view of a portion of the structure in a server motherboard heat dissipation enhancement device.

[0021] Figure 4 This invention provides a frontal perspective three-dimensional exploded view of a portion of the structure in a server motherboard heat dissipation enhancement device.

[0022] Legend: 1. Heat spreader; 2. Thermal conductive silicone; 3. Condenser; 4. First connecting pipe; 5. Heat dissipation pipe; 6. Heat dissipation fins; 7. Mounting plate; 8. Cooling fan; 9. Second connecting pipe; 10. Liquid storage tank; 11. Third connecting pipe; 12. Water pump; 13. Delivery pipe; 14. Fixing plate; 15. Slide groove; 16. Slide plate; 17. Return spring; 18. Locking block; 19. Connecting block; 20. Slot; 21. Fixing bolt. Detailed Implementation

[0023] To better understand the above-mentioned objectives, features, and advantages of this utility model, the present utility model will be further described below with reference to the accompanying drawings and embodiments. It should be noted that, unless otherwise specified, the embodiments and features described in these embodiments can be combined with each other.

[0024] Many specific details are set forth in the following description in order to provide a full understanding of the present invention. However, the present invention may also be implemented in other ways different from those described herein. Therefore, the present invention is not limited to the specific embodiments disclosed in the following specification.

[0025] Example 1, as shown in the attached document Figure 1 -Appendix Figure 4As shown, this utility model provides a technical solution: a server motherboard heat dissipation enhancement device, including a heat spreader 1, thermally conductive silicone 2 adhered to one side of the outer wall of the heat spreader 1, a condenser pipe 3 fixedly connected to one side of the outer wall of the heat spreader 1, a first connecting pipe 4 fixedly connected to the output end of the condenser pipe 3, a heat dissipation pipe 5 fixedly connected to the output end of the first connecting pipe 4, heat dissipation fins 6 fixedly sleeved on the outer wall of the heat dissipation pipe 5, a mounting plate 7 fixedly connected to the bottom of the heat dissipation fins 6, two cooling fans 8 fixedly connected to one side of the outer wall of the mounting plate 7, a second connecting pipe 9 fixedly connected to the output end of the heat dissipation pipe 5, a liquid storage tank 10 fixedly connected to the output end of the liquid storage tank 10 fixedly connected to the output end of the liquid storage tank 10 fixedly connected to the output end of the third connecting pipe 11 fixedly connected to the output end of the third connecting pipe 11, a water pump 12 fixedly connected to the output end of the water pump 12 fixedly connected to the output end of the delivery pipe 13, and the input end of the condenser pipe 3 fixedly connected to the output end of the delivery pipe 13.

[0026] The overall effect achieved in Embodiment 1 is as follows: During use, the water pump 12 is first started, which draws out and pressurizes the coolant in the storage tank 10, causing it to flow into the meandering condenser pipes 3. Simultaneously, due to the tight adhesion between the thermally conductive silicone 2 and the motherboard, the thermally conductive silicone 2 can efficiently absorb the heat generated by the motherboard and transfer the heat to the heat spreader 1. The heat spreader 1 can quickly and evenly conduct heat. At this time, the coolant flowing in the condenser pipes 3 can carry away the heat conducted from the heat spreader 1. Subsequently, under the continuous drive of the water pump 12, the coolant after absorbing heat flows through the first connecting pipe 4 into the similarly meandering heat dissipation pipes 5. The heat dissipation fins 6 fixedly fitted on the outer wall of the heat dissipation pipes 5 can increase the heat dissipation area, and the condenser pipes 3... Both heat pipe 5 and heat sink 6 are made of copper, which has good thermal conductivity, and can conduct heat more efficiently. At this time, the two cooling fans 8 are activated, and the strong wind generated blows directly onto the heat sink 6, which efficiently dissipates the coolant in the heat sink 5. The cooled coolant flows back to the storage tank 10 through the second connecting pipe 9. Under the continuous drive of the water pump 12, the coolant circulates and absorbs the heat generated by the motherboard, thereby enhancing the heat dissipation effect and keeping the motherboard temperature within a reasonable range to ensure the stable operation of the server.

[0027] Example 2, as Figure 2-4 As shown, four fixing plates 14 are fixedly connected to the outer wall of the heat spreader 1. Each of the four fixing plates 14 has a groove 15 on one side of its outer wall. Each of the four grooves 15 has a sliding plate 16 slidably embedded between the inner walls of its inner surface. Each of the two sliding plates 16 has two return springs 17 fixedly connected to one side of its outer wall. Each of the two sliding plates 16 has two locking blocks 18 fixedly connected to the other side of its outer wall. Each of the four locking blocks 18 has a connecting block 19 movably fitted onto its outer wall. Each of the four connecting blocks 19 has a slot 20 on one side of its outer wall, and the outer walls of the four locking blocks 18 are movably inserted into the four slots 20. Each of the four connecting blocks 19 has a fixing bolt 21 movably inserted into its inner surface.

[0028] The effect achieved by the entire embodiment 2 is as follows: First, the four connecting blocks 19 are securely installed on the corresponding positions of the motherboard using four fixing bolts 21. When it is necessary to disassemble the heat dissipation component, only the two sliding plates 16 need to be pushed. The movement of the two sliding plates 16 will cause the four locking blocks 18 to be dislodged from the corresponding locking slots 20, thereby releasing the fixed restriction on the heat dissipation plate 1. In this way, the heat dissipation component can be quickly disassembled, which greatly facilitates the maintenance, repair and replacement of the heat dissipation component of the server motherboard.

[0029] The working principle of the entire device is as follows: During use, first inject an appropriate amount of coolant into the storage tank 10, then connect the thermally conductive silicone 2 to the mainboard, and use four fixing bolts 21 to fix the four connecting blocks 19 to the corresponding positions on the mainboard. During the mainboard's operation, the water pump 12 is first started. The water pump 12 draws out and pressurizes the coolant in the storage tank 10, causing it to flow into the meandering condenser pipes 3. Simultaneously, the thermally conductive silicone 2 adheres tightly to the mainboard, efficiently absorbing the heat generated by the mainboard and transferring it to the heat spreader plate 1. The heat spreader plate 1 has excellent thermal conductivity, allowing for rapid and uniform heat transfer. At this time, the coolant flowing in the condenser pipes 3 carries away the heat transferred from the heat spreader plate 1. Under the continuous drive of the water pump 12, the coolant, after absorbing heat, flows through the first connecting pipe 4 into the similarly meandering heat dissipation pipes 5, and the heat dissipation fins on the outer wall of the heat dissipation pipes 5... 6 increases the heat dissipation area. At this time, two cooling fans 8 are activated. The strong airflow generated by the fans blows towards the heat dissipation fins 6, efficiently dissipating the coolant in the heat pipe 5. The cooled coolant flows back to the storage tank 10 through the second connecting pipe 9. Under the continuous action of the water pump 12, the coolant circulates and continuously absorbs the heat generated by the motherboard. When it is necessary to disassemble the heat dissipation component, the staff pushes the two sliding plates 16. The two sliding plates 16 will drive the four locking blocks 18 to move out of the corresponding slots 20, thereby releasing the fixed restriction on the heat spreader 1, so as to realize the quick disassembly of the heat dissipation component. During this process, the movement of the two sliding plates 16 will squeeze the four return springs 17. When it is necessary to install the heat dissipation component, with the help of the elastic restoring force of the four return springs 17, the four locking blocks 18 can be quickly inserted into the corresponding slots 20 to realize the stable installation of the heat dissipation component.

[0030] The above description is merely a preferred embodiment of the present utility model and is not intended to limit the present utility model in any other way. Any person skilled in the art may make changes or modifications to the above-disclosed technical content to create equivalent embodiments for application in other fields. However, any simple modifications, equivalent changes, and modifications made to the above embodiments based on the technical essence of the present utility model without departing from the technical solution of the present utility model shall still fall within the protection scope of the technical solution of the present utility model.

Claims

1. A motherboard heat dissipation enhancement device for servers, characterized in that: Including the even hot plate (1), the outer wall of even hot plate (1) one side is bonded with the heat-conducting silica gel (2), the outer wall of even hot plate (1) one side is fixedly connected with condenser pipe (3), the output of condenser pipe (3) fixedly communicated with first connecting pipe (4), the output of first connecting pipe (4) fixedly communicated with heat dissipation pipe (5), the outer surface wall of heat dissipation pipe (5) is fixedly covered with heat dissipation fin (6), the bottom of heat dissipation fin (6) is fixedly connected with mounting plate (7), the outer wall of mounting plate (7) one side is fixedly connected with two heat dissipation fan (8), the output of heat dissipation pipe (5) is fixedly communicated with second connecting pipe (9), the output of second connecting pipe (9) is fixedly communicated with liquid storage tank (10); The output of liquid storage tank (10) is fixedly communicated with third connecting pipe (11), the output of third connecting pipe (11) is fixedly communicated with water pump (12), the output of water pump (12) is fixedly communicated with delivery pipe (13), and the input of condenser pipe (3) is fixedly communicated with the output of delivery pipe (13); The outer surface wall of even hot plate (1) is fixedly connected with four fixed plates (14), the outer wall of four fixed plates (14) one side is provided with sliding groove (15); The inner surface wall between four sliding grooves (15) is slidably embedded with slide plate (16), the outer wall of two slide plates (16) one side is fixedly connected with two reset springs (17); The outer wall of two slide plates (16) the other side is fixedly connected with two clamping blocks (18), the outer surface wall of four clamping blocks (18) is movably covered with connecting block (19); The outer wall of four connecting blocks (19) one side is provided with clamping groove (20), and the outer surface wall of four clamping blocks (18) is movably inserted in the inside of four clamping grooves (20); The inner surface wall of four connecting blocks (19) is movably inserted with fixed bolt (21).

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