Display module and display device

Abstract

According to the display module and the display device, the gap between the opening area on the flexible circuit board and the non-display side of the display panel is sealed through the sealing structure, water vapor can be effectively prevented from invading the display module, and the effect that the interior of the display module is corroded by the water vapor is prevented.

Description

Technical Field

[0001] This application relates to the field of display technology, and in particular to a display module and display device. Background Technology

[0002] With the development of display technology, organic light-emitting diode (OLED) flexible display panels are gradually emerging. Flexible display panels refer to screens that can be bent and folded, exhibiting excellent flexibility. Compared with traditional rigid screens, flexible screens have advantages such as good flexibility, thin and light size, and lower power consumption. Utility Model Content

[0003] In view of this, the purpose of this application is to provide a display module and a display device.

[0004] To achieve the above objectives, in a first aspect, this application provides a display module, comprising:

[0005] A display panel includes a display area and a non-display area surrounding the display area. The non-display area is provided with a connecting portion, and the connecting portion includes a binding area. An alignment mark is provided on at least one side of the binding area.

[0006] A flexible circuit board is located on the non-display side of the display panel. The flexible circuit board includes a bonding portion and an opening area located on at least one side of the bonding portion. The bonding portion is bonded to the bonding area to realize the electrical connection between the flexible circuit board and the display panel. The alignment mark is located within the orthographic projection of the opening area on the non-display area.

[0007] A sealing structure is located in the opening area, and the orthographic projection of the sealing structure on the display panel at least covers a portion of the orthographic projection of the opening area on the display panel.

[0008] In a second aspect, this application provides a display device including a display module as described in the first aspect.

[0009] As can be seen from the above, the display module and display device provided in this application can effectively block water vapor from entering the display module and prevent the interior of the display module from being corroded by water vapor by sealing the gap between the opening area on the flexible circuit board and the non-display side of the display panel through the sealing structure. Attached Figure Description

[0010] To more clearly illustrate the technical solutions in this application or related technologies, the drawings used in the description of the embodiments or related technologies will be briefly introduced below. Obviously, the drawings described below are only embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0011] Figure 1A A schematic diagram of an exemplary display module according to an embodiment of this application is shown before the flexible circuit board is bent.

[0012] Figure 1B A schematic diagram of an exemplary display module according to an embodiment of this application after bending a flexible circuit board is shown.

[0013] Figure 1C A schematic diagram of an exemplary display module after bending is shown according to an embodiment of this application.

[0014] Figure 1D A schematic diagram of the structure of an exemplary display module after bending is shown according to an embodiment of this application.

[0015] Figure 1E A partially enlarged schematic diagram of an exemplary flexible circuit board according to an embodiment of this application is shown.

[0016] Figure 1F A partially enlarged schematic diagram of an exemplary protection structure according to an embodiment of this application is shown.

[0017] Figure 1G A partially enlarged schematic diagram of a display module according to an embodiment of this application is shown.

[0018] Figure 1H A partially enlarged schematic diagram of an exemplary display module according to an embodiment of this application is shown.

[0019] Figure 1I A partially enlarged schematic diagram of another exemplary display module according to an embodiment of this application is shown.

[0020] Figure 2A A schematic diagram of an exemplary display module according to an embodiment of this application is shown.

[0021] Figure 2B A schematic diagram of an exemplary first sublayer according to an embodiment of this application is shown.

[0022] Figure 2C A schematic diagram of an exemplary second sublayer according to an embodiment of this application is shown.

[0023] Figure 2D A schematic diagram of an exemplary third sublayer according to an embodiment of this application is shown.

[0024] Figure 2E A schematic diagram of an exemplary protection structure according to an embodiment of this application is shown.

[0025] Figure 3A A schematic diagram of an exemplary first sublayer according to an embodiment of this application is shown.

[0026] Figure 3B A schematic diagram of an exemplary second sublayer according to an embodiment of this application is shown.

[0027] Figure 3C A schematic diagram of an exemplary third sublayer according to an embodiment of this application is shown.

[0028] Figure 3D A schematic diagram of an exemplary protection structure according to an embodiment of this application is shown.

[0029] Figure 4A A schematic diagram of an exemplary first sublayer according to an embodiment of this application is shown.

[0030] Figure 4B A schematic diagram of an exemplary second sublayer according to an embodiment of this application is shown.

[0031] Figure 4C A schematic diagram of an exemplary third sublayer according to an embodiment of this application is shown.

[0032] Figure 4D A schematic diagram of an exemplary protection structure according to an embodiment of this application is shown.

[0033] Figure 5A A schematic diagram of an exemplary first sublayer according to an embodiment of this application is shown.

[0034] Figure 5B A schematic diagram of an exemplary second sublayer according to an embodiment of this application is shown.

[0035] Figure 5C A schematic diagram of an exemplary third sublayer according to an embodiment of this application is shown.

[0036] Figure 5D A schematic diagram of an exemplary protection structure according to an embodiment of this application is shown.

[0037] Figure 5E A schematic diagram of an exemplary third sublayer according to an embodiment of this application is shown.

[0038] Figure 5F A schematic diagram of an exemplary protection structure according to an embodiment of this application is shown.

[0039] Figure 5G A schematic diagram of an exemplary display module according to an embodiment of this application is shown.

[0040] Figure 6A A partially enlarged schematic diagram of an exemplary display module according to an embodiment of this application is shown.

[0041] Figure 6B A partially enlarged schematic diagram of another exemplary display module according to an embodiment of this application is shown.

[0042] Figure 6C A partially enlarged schematic diagram of another exemplary display module according to an embodiment of this application is shown.

[0043] Figure 6D A schematic diagram of another exemplary display module according to an embodiment of this application is shown.

[0044] Figure 7 A schematic diagram of an exemplary display device according to an embodiment of this application is shown.

[0045] Figure 8 A flowchart illustrating a method for fabricating an exemplary display module according to an embodiment of this application is shown. Detailed Implementation

[0046] To make the objectives, technical solutions, and advantages of this application clearer, the following detailed description is provided in conjunction with specific embodiments and the accompanying drawings.

[0047] It should be noted that, unless otherwise defined, the technical or scientific terms used in the embodiments of this application should have the ordinary meaning understood by one of ordinary skill in the art to which this application pertains. The terms "first," "second," and similar terms used in the embodiments of this application do not indicate any order, quantity, or importance, but are merely used to distinguish different components. Terms such as "comprising" or "including" mean that the element or object preceding the word encompasses the elements or objects listed after the word and their equivalents, without excluding other elements or objects. Terms such as "connected" or "linked" are not limited to physical or mechanical connections, but can include electrical connections, whether direct or indirect. Terms such as "upper," "lower," "left," and "right" are only used to indicate relative positional relationships; when the absolute position of the described object changes, the relative positional relationship may also change accordingly.

[0048] Figure 1A A schematic diagram of an exemplary display module 100 according to an embodiment of this application is shown before the flexible circuit board 104 is bent.

[0049] Taking OLED display panels as an example, such as Figure 1AAs shown, the display module 100 can be a flexible display module, which generally includes a display panel 102 and a flexible circuit board 104. The display panel 102 may include a display area 1022 and a non-display area 1024 surrounding the display area 1022. The non-display area 1024 may be provided with a connecting portion 1026. The connecting portion 1026 may include a bonding area 1028. An alignment mark 1030 may be provided on at least one side of the bonding area 1028.

[0050] The flexible circuit board 104 is located on the non-display side of the display panel 102 after being bent.

[0051] Figure 1B A schematic diagram of an exemplary display module 100 according to an embodiment of this application after bending a flexible circuit board 104 is shown.

[0052] like Figure 1B As shown, the flexible circuit board 104, after being bent, is located on the non-display side 106 of the display panel 102. The flexible circuit board 104 may include a bonding portion 1042 and an opening area 1044 located on at least one side of the bonding portion 1042. Figure 1A and Figure 1B The bonding part 1042 is bonded to the bonding area 1028 to achieve electrical connection between the flexible circuit board 104 and the display panel 102.

[0053] Figure 1C A schematic diagram of an exemplary display module 100 according to an embodiment of this application after bending is shown.

[0054] Figure 1D A schematic diagram of the structure of an exemplary display module 100 after bending is shown according to an embodiment of this application.

[0055] Figure 1D The structural diagram shown can be obtained by cutting along the AA' direction in the 1C.

[0056] Combination Figure 1C and Figure 1DThe flexible circuit board 104 can be bonded to the display panel 102 using anisotropic conductive film (ACF) adhesive 1082 to achieve electrical connection between the flexible circuit board 104 and the display panel 102. The display module 100 may also include a driver chip (IC) 110. After the display module 100 is bent, the driver chip 110 is located on the non-display side of the display panel 102. To protect the driver chip 110 and the flexible circuit board 104, in some embodiments, a protective structure 112 can be added on the side of the flexible circuit board 104 and the driver chip 110 away from the display panel 102. This protective structure 112 can be a shielding film (IC Cover Tape) to dissipate heat and provide electromagnetic shielding for the driver chip 110 and the flexible circuit board 104.

[0057] The protective structure 112 may include a first sub-layer 1122, a second sub-layer 1124, and a third sub-layer 1126 arranged sequentially along the direction close to the display panel 102. The first sub-layer 1122 and the third sub-layer 1126 may include insulating material, and the second sub-layer 1124 may include conductive material. The insulating material may be insulating Mylar sheet, and the conductive material may be conductive cloth or copper foil. The thickness of the first sub-layer 1122 and the third sub-layer 1126 is generally 0.01 mm, and the thickness of the second sub-layer 1124 is generally 0.03 mm. Partial material removal is required in the third sub-layer 1126 to expose the conductive material of the second sub-layer 1124, allowing the second sub-layer 1124 to conduct to the exposed copper area 114 of the flexible circuit board 104, forming a ground. This allows the static electricity of the flexible circuit board 104 to be released in a timely manner, thus providing electrostatic discharge protection.

[0058] Figure 1E A partially enlarged schematic diagram of an exemplary flexible circuit board 104 according to an embodiment of this application is shown. Figure 1F A partially enlarged schematic diagram of an exemplary protection structure 112 according to an embodiment of this application is shown. Figure 1G A partially enlarged schematic diagram of a display module 100 according to an embodiment of this application is shown.

[0059] like Figure 1E As shown, the flexible circuit board 104 may include an exposed copper area 114, which is a conductive portion exposed for grounding. To make the second sublayer 1124, made of conductive material, conductively connected to the exposed copper area 114, the material of the third sublayer 1126 corresponding to the location of the exposed copper area 114 needs to be removed. The edge 116 of the third sublayer 1126 after material removal is as follows: Figure 1F As shown. Thus, as Figure 1GAs shown, after the protective structure 112 is covered on the flexible circuit board 104, the third sub-layer 1126 will not block the exposed copper area 114. The exposed copper area 114 can be connected to the second sub-layer 1124, so that the static electricity of the flexible circuit board 104 can be released in time, thereby playing the role of electrostatic protection.

[0060] Figure 1H A partially enlarged schematic diagram of an exemplary display module 100 according to an embodiment of this application is shown.

[0061] like Figure 1H As shown, the wiring area 108 of the bonding portion 1042 (e.g., the area where the bonding pin 1046 is located) and the bonding area 1028 of the display panel 102 can be bonded together using ACF adhesive 1082, so that the bonding pin 1046 in the bonding portion 1042 and the signal line in the bonding area 1028 form an electrical connection. The non-wiring area 120 of the bonding portion 1042 and the bonding area 1028 of the display panel 102 can be bonded together using backing adhesive 1202. The backing adhesive 1202 can be a pressure-sensitive adhesive (PSA).

[0062] Multiple sets of alignment marks 1030 are typically designed at the edge of the display panel 102 (e.g., the bonding area 1028). The alignment marks 1030 are used for alignment during the manufacturing process of the display module 100. The alignment marks 1030 may be located within the orthographic projection of the opening area 1044 onto the non-display area 1024, so that the flexible circuit board 104 can avoid obscuring the alignment marks 1030 by opening the flexible circuit board 104.

[0063] Figure 1I A partially enlarged schematic diagram of another exemplary display module 100 according to an embodiment of this application is shown.

[0064] The structural design of flexible display modules is becoming increasingly compact. When the alignment mark 1030 is close to the corresponding bonding pin 1046 of the bonding area 1028, the opening area 1044 will also be close to the bonding pin 1046 of the bonding part 1042. Thus, combined with... Figure 1D and 1I Moisture can enter the display module 100 through the gap between the opening area 1044 and the display panel 102, causing the interior of the display module 100 to be corroded by moisture. Especially when the opening area 1044 is close to the bonding pin 1046, the bonding pin 1046 is more susceptible to moisture corrosion, which can lead to corrosion and failure of the bonding pin 1046.

[0065] To prevent moisture from entering, in some embodiments, a sealing structure can be formed in the opening area 1044. The orthographic projection of the sealing structure on the display panel 102 can at least cover part of the orthographic projection of the opening area 1044 on the display panel 102, so as to seal the gap between the opening area 1044 and the display panel 102 and prevent the interior of the display module from being corroded by moisture.

[0066] Figure 2A A schematic diagram of an exemplary display module 200 according to an embodiment of this application is shown.

[0067] like Figure 2A As shown, in some embodiments, the sealing structure may include a first sealing structure 202, the orthographic projection of which covers the opening area 1044 and the orthographic projection of the alignment mark 1030 on the display panel 102. The first sealing structure 202 can be formed by a dispensing process. In this way, the first sealing structure 202 can seal the gap between the flexible circuit board 104 and the display panel 102, improving the problem of moisture entering the display module from the gap and thus corroding the metal traces inside the display module.

[0068] The first sealing structure 202 can be made of UV-type fluid adhesive (containing a UV photoinitiator), which is cured in an environment of light-emitting diode (LED) lamps or mercury lamps and nitrogen. The curing energy of the UV-type fluid adhesive generally needs to be greater than or equal to 600 MJ / cm². 2 The curing time is generally 3 seconds, and the curing rate of the colloid is generally greater than or equal to 99%. However, after the colloid cures, a slight stickiness exists on the surface. When the overall design or module structure design does not meet the minimum clearance requirements of the product's usage scenario, i.e., the internal structure of the display module is relatively compact, the first sealing structure 202 will make noise when it comes into contact with other structures within the display module or with the overall structure due to the slight stickiness of the colloid surface. For example, when the back panel of the display device is installed, the back panel will stick to the colloid surface. Since there is only slight stickiness on the colloid surface, the back panel will separate from the colloid surface after sticking together. This process of bonding and separating will make noise, affecting the user's experience when using the display device.

[0069] To improve the noise problem of the display device caused by the micro-adhesion of the colloid surface, in some embodiments, the protective structure located on the side of the flexible circuit board 104 away from the display panel 102 can be improved so that the orthographic projection of the protective structure on the display panel 102 at least covers the orthographic projection of the sealing structure (e.g., the first sealing structure 202) on the display panel 102. By covering the micro-adhesive surface of the colloid with the protective structure, the noise problem of the display device can be improved.

[0070] Figure 2B A schematic diagram of an exemplary first sublayer 1122 according to an embodiment of this application is shown. Figure 2C A schematic diagram of an exemplary second sublayer 1124 according to an embodiment of this application is shown. Figure 2D A schematic diagram of an exemplary third sublayer 1126 according to an embodiment of this application is shown. Figure 2E A schematic diagram of an exemplary protection structure 112 according to an embodiment of this application is shown.

[0071] Combination Figure 2B , 2C In embodiments 2D and 2E, the first sublayer 1122, the second sublayer 1124, and the third sublayer 1126 of the protective structure 112 in the original scheme cannot block the first sealing structure 202. Therefore, in some embodiments, at least one of the first, second, and third sublayers can be configured such that its orthographic projection on the display panel 102 at least covers the orthographic projection of the sealing structure (e.g., the first sealing structure 202) on the display panel 102, thereby improving the noise problem of the display device by blocking the adhesive micro-adhesive surface through the protective structure.

[0072] Figure 3A A schematic diagram of an exemplary first sublayer 302 according to an embodiment of this application is shown. Figure 3B A schematic diagram of an exemplary second sublayer 304 according to an embodiment of this application is shown. Figure 3C A schematic diagram of an exemplary third sublayer 306 according to an embodiment of this application is shown.

[0073] like Figure 3A As shown, in some embodiments, the first sublayer 302 may include a first extension 3022, the orthographic projection of the first extension 3022 on the display panel 102 covering the orthographic projection of the sealing structure (e.g., the first sealing structure 202) on the display panel 102. Figure 3B and Figure 3C As shown, in some embodiments, the second sublayer 304 and the third sublayer 306 may not be extended.

[0074] Figure 3D A schematic diagram of an exemplary protection structure 308 according to an embodiment of this application is shown.

[0075] like Figure 3DAs shown, after combining the first sub-layer 302, the second sub-layer 304, and the third sub-layer 306, a protective structure 308 can be formed. During the process, a pressing process is carried out to ensure that the first extension 3022 of the first sub-layer 302 is bonded to the micro-adhesive surface of the sealing structure. In this way, the protective structure 308 can shield the sealing structure through the first extension 3022 of the first sub-layer 302, thereby shielding the micro-adhesive surface of the sealing structure and improving the problem of abnormal noise caused by the contact between the micro-adhesive surface and the internal structure of the display module.

[0076] It is understandable that, in order to ensure that the exposed copper area of ​​the second sublayer 304 is conductive with the flexible circuit board 104, the third sublayer 306 still needs to remove some material to form the edge 116 of the third sublayer 306.

[0077] Figure 4A A schematic diagram of an exemplary first sublayer 302 according to an embodiment of this application is shown. Figure 4B A schematic diagram of an exemplary second sublayer 402 according to an embodiment of this application is shown. Figure 4C A schematic diagram of an exemplary third sublayer 306 according to an embodiment of this application is shown.

[0078] Combination Figure 4A , Figure 4B and Figure 4C In some embodiments, the second sub-layer 402 may include a second extension 4022, and the orthographic projections of the first extension 3022 and the second extension 4022 on the display panel 102 cover the orthographic projection of the sealing structure on the display panel 102. The third sub-layer 306 is not extended outward. In this way, the second sub-layer 402 can be extended to obtain the second extension 4022 while retaining the first extension 3022. This improves the problem that the first extension 3022 obtained by extending only the first sub-layer 302 is weak and the protective structure 308 is prone to curling.

[0079] Figure 4D A schematic diagram of an exemplary protection structure 404 according to an embodiment of this application is shown.

[0080] like Figure 4DAs shown, combining the first sub-layer 302, the second sub-layer 402, and the third sub-layer 306 forms a protective structure 404. During the manufacturing process, a pressing process ensures that the first extension 3022 of the first sub-layer 302 and the second extension 4022 of the second sub-layer 402 adhere to the micro-adhesive surface of the sealing structure. Thus, the protective structure 404 can shield the sealing structure through the first and second extensions 3022, thereby blocking the micro-adhesive surface of the sealing structure and improving the problem of rattling noise caused by contact between the micro-adhesive surface and the internal structure of the display module. Simultaneously, the bond strength between the first and second extensions 3022 and 4022 is stronger, making the protective structure 404 more stable. The simultaneous outward expansion of the first sub-layer 302 and the second sub-layer 402 also facilitates processing.

[0081] It is understandable that, in order to ensure that the exposed copper area of ​​the second sublayer 402 is conductive with the flexible circuit board 104, the third sublayer 306 still needs to remove some material to form the edge 116 of the third sublayer 306.

[0082] Figure 5A A schematic diagram of an exemplary first sublayer 302 according to an embodiment of this application is shown. Figure 5B A schematic diagram of an exemplary second sublayer 304 according to an embodiment of this application is shown. Figure 5C A schematic diagram of an exemplary third sublayer 502 according to an embodiment of this application is shown.

[0083] like Figure 5A and Figure 5B As shown, in some embodiments, the second sublayer 304 may not be expanded outwards, but the first sublayer 302 and the third sublayer may be expanded outwards. For example... Figure 5C As shown, in some embodiments, the third sub-layer 502 may include a third extension 5022, the orthographic projection of the third extension 5022 on the display panel 102 covering the orthographic projection of the sealing structure on the display panel 102.

[0084] Figure 5D A schematic diagram of an exemplary protection structure 504 according to an embodiment of this application is shown.

[0085] like Figure 5D As shown, after the first sub-layer 302, the second sub-layer 304 and the third sub-layer 502 are combined, a protective structure 504 can be formed. During the process, a pressing process will be carried out to ensure that the third extension 5022 of the third sub-layer 502 is bonded to the micro-adhesive surface of the sealing structure. In this way, the protective structure 504 can shield the sealing structure through the third extension 5022, thereby shielding the micro-adhesive surface of the sealing structure and improving the problem of abnormal noise caused by the contact between the micro-adhesive surface and the internal structure of the display module.

[0086] It is understandable that, in order to ensure the conductivity between the exposed copper area of ​​the second sublayer 304 and the flexible circuit board 104, the third sublayer 502 still needs to remove some material to form the edge 116 of the third sublayer 502.

[0087] Figure 5E A schematic diagram of an exemplary third sublayer 506 according to an embodiment of this application is shown.

[0088] Combination Figure 5C and 5E The third extension 5022 on one side of the third sub-layer 502 has an island structure, meaning it is not connected to the main body 5024 of the third sub-layer 502. Such an island structure is prone to loss. Therefore, in some embodiments, the third sub-layer 506 may include a first portion 5062 and a second portion 5064. The orthographic projection of the first portion 5062 on the display panel 102 overlaps the orthographic projection of the binding portion 1042 on the display panel 102. The orthographic projection of the second portion 5064 on the display panel 102 overlaps a portion of the orthographic projection of the binding portion 1042 on the display panel 102. The first portion 5062 is connected to the third extension 5022 through the second portion 5064. In this way, the third extension 5022 can be connected to the main body of the third sub-layer 506 through the second portion 5064, avoiding the problem of the third extension 5022 being easily lost due to its island structure. Meanwhile, in some embodiments, the distance between the second portion 5064 and the edge of the exposed copper area 114 can be 0.5-0.8mm to prevent the second portion 5064 from blocking the exposed copper area 114.

[0089] Figure 5F A schematic diagram of an exemplary protection structure 508 according to an embodiment of this application is shown.

[0090] like Figure 5F As shown, after the first sub-layer 302, the second sub-layer 304 and the third sub-layer 506 are combined, a protective structure 508 can be formed. During the process, a pressing process will be carried out to ensure that the third extension 5022 of the third sub-layer 506 is bonded to the micro-adhesive surface of the sealing structure. In this way, the protective structure 508 can shield the sealing structure through the third extension 5022, thereby shielding the micro-adhesive surface of the sealing structure and improving the problem of abnormal noise caused by the contact between the micro-adhesive surface and the internal structure of the display module.

[0091] It is understandable that, in order to ensure the conductivity between the exposed copper area of ​​the second sublayer 304 and the flexible circuit board 104, the third sublayer 506 still needs to remove some material to form the edge 116 of the third sublayer 506.

[0092] It should be noted that the above-described embodiments of expanding the first, second, and third sub-layers are merely exemplary. In some embodiments, the third sub-layer can be expanded based on the expansion of the first and second sub-layers; alternatively, the first and third sub-layers can be expanded without expanding the second sub-layer; or the second sub-layer can be expanded alone or both the second and third sub-layers can be expanded. In this case, it is necessary to ensure that the extended portion of the second sub-layer does not contact other metal layers to form a short circuit. Therefore, other solutions that are the same as or similar to the above embodiments, i.e., embodiments that use the expansion or extension of the sub-layers of the protective structure to shield the micro-adhesive surface of the sealing structure and achieve the corresponding improvement in the technical effect of abnormal noise, should all be included in the protection scope of this application.

[0093] Figure 5G A schematic diagram of an exemplary display module 500 according to an embodiment of this application is shown.

[0094] like Figure 5G As shown, taking the protective structure 404 as an example, the protective structure 404 can block the micro-adhesive surface of the first sealing structure 202, thereby improving the problem of abnormal noise caused by the contact between the micro-adhesive surface and the internal structure of the display module.

[0095] In some embodiments, an anti-sticking agent can be sprayed onto the surface of the first sealing structure 202, making the side of the first sealing structure 202 away from the display panel 102 a non-stick surface, thereby improving the noise problem of the display device. In some embodiments, the flatness and height of the cured surface of the first sealing structure 202 can be controlled by optimizing the dispensing process to prevent the first sealing structure 202 from contacting the internal structure of the display module (e.g., the back panel), thereby improving the noise problem of the display device. In some embodiments, the material of the first sealing structure 202 can be adjusted, using a material whose cured adhesive surface is non-sticky, thereby improving the noise problem of the display device.

[0096] Figure 6A A partially enlarged schematic diagram of an exemplary display module 600 according to an embodiment of this application is shown.

[0097] like Figure 6A As shown, in some embodiments, the sealing structure may include a second sealing structure 602, the orthographic projection of which on the display panel 102 covers a portion of the orthographic projection of the opening area 1044 on the display panel 102. By sealing the gap between the opening area 1044 and the display panel 102 near the bonding pin 1046 through the second sealing structure 602, moisture can be prevented from entering through the gap between the opening area 1044 and the display panel 102 near the bonding pin 1046, thereby improving the problem of moisture corrosion of the bonding pin 1046.

[0098] In some embodiments, the display module 600 may further include a first adhesive layer 604 located between the bonding area 1028 and the bonding portion 1042, and the first adhesive layer 604 and the second sealing structure 602 are integrally formed. The first adhesive layer 604 can be formed by irregularly designing the ACF adhesive, with the portion of the ACF adhesive located in the opening area 1044 serving as the second sealing structure 202. Thus, the second sealing structure 602 is a structure in which the ACF adhesive extends from between the bonding area 1028 and the bonding portion 1042, thereby improving the sealing performance of the second sealing structure 602.

[0099] Figure 6B A partially enlarged schematic diagram of another exemplary display module 600 according to an embodiment of this application is shown.

[0100] like Figure 6B As shown, in some embodiments, the gap D1 between the first adhesive layer 604 and the backing adhesive 1202 can be between 0.2-0.3 mm, so as to improve the problem of moisture entering through the gap D1 while preventing the first adhesive layer 604 and the backing adhesive 1202 from sticking together.

[0101] Figure 6C A partially enlarged schematic diagram of another exemplary display module 600 according to an embodiment of this application is shown.

[0102] like Figure 6C As shown, in some embodiments, the gaps D2 and D3 between the first adhesive layer 604 and the backing adhesive 1202 can be between 0.1 and 0.5 mm to ensure that the second sealing structure 602 does not obstruct the alignment mark 1030. In some embodiments, the width D4 of the overlapping area between the first adhesive layer 604 and the backing adhesive 1202 can be greater than or equal to 1 mm to ensure the conductivity of the first adhesive layer 604.

[0103] Figure 6D A schematic diagram of another exemplary display module 600 according to an embodiment of this application is shown.

[0104] like Figure 6DAs shown, in some embodiments, the flexible circuit board 104 may further include a non-bonding portion (e.g., a non-trace area 120), and the connecting portion 1026 may further include a non-bonding area (e.g., the area of ​​the display panel 102 corresponding to the non-trace area 120). The display module 600 further includes a second adhesive layer 606, which is located between the non-bonding area and the non-bonding portion. The sealing structure further includes a third sealing structure 608, the orthographic projection of which on the display panel 102 covers a portion of the orthographic projection of the opening area 1044 on the display panel 102. The second adhesive layer 606 and the third sealing structure 608 are integrally formed. By simultaneously sealing the gap between the flexible circuit board 104 and the display panel 102 with the second sealing structure 602 and the third sealing structure 608, the problem of moisture intrusion can be further improved. Furthermore, the third sealing structure 608 is a structure in which the second adhesive layer 606 extends from between the bonding area 1028 and the bonding portion 1042, resulting in better sealing performance.

[0105] It should be noted that, based on the provision of the second and / or third sealing structures, the sub-layers of the protective structure can also be expanded to shield the second and / or third sealing structures. The scheme of expanding the sub-layers of the protective structure is the same as or similar to the scheme described in any of the above embodiments and has the same technical effect; therefore, it will not be repeated here.

[0106] This application also provides a display device. Figure 7 A schematic diagram of an exemplary display device according to an embodiment of this application is shown.

[0107] like Figure 7 As shown, this embodiment provides a display device 701, including a display substrate 7011. The display substrate 7011 is any embodiment of the aforementioned display substrate or an arrangement or combination of embodiments. The display device is a product with image display function, such as: a monitor, television, billboard, digital photo frame, laser printer with display function, telephone, mobile phone, personal digital assistant (PDA), digital camera, portable camcorder, viewfinder, navigator, vehicle, large-area wall, home appliance, information query equipment (such as e-government, banking, hospital, power and other departments' business query equipment, monitors, etc.).

[0108] This application also provides a method for manufacturing a display module. Figure 8 A schematic flowchart of an exemplary display module fabrication method 800 according to an embodiment of this application is shown. Figure 8 As shown, the preparation method 800 may include the following steps.

[0109] In step 802, a display panel is provided, the display panel including a display area and a non-display area surrounding the display area, the non-display area being provided with a connecting portion, the connecting portion including a binding area, and an alignment mark being provided on at least one side of the binding area.

[0110] In step 804, a flexible circuit board is provided, the flexible circuit board being located on the non-display side of the display panel, the flexible circuit board including a bonding portion and an opening area located on at least one side of the bonding portion, the bonding portion being bonded to the bonding area to achieve an electrical connection between the flexible circuit board and the display panel, and the alignment mark being located within the orthographic projection of the opening area on the non-display area.

[0111] In step 806, a sealing structure is formed in the opening area, the orthographic projection of the sealing structure on the display panel at least covering a portion of the orthographic projection of the opening area on the display panel.

[0112] In some embodiments, the sealing structure includes a first sealing structure, the orthographic projection of the first sealing structure on the display panel covering the orthographic projection of the opening area and the alignment mark on the display panel; or the sealing structure includes a second sealing structure, the orthographic projection of the second sealing structure on the display panel covering a portion of the orthographic projection of the opening area on the display panel.

[0113] In some embodiments, the display module further includes a protective structure, and the manufacturing method further includes forming the protective structure on a side of the flexible circuit board away from the display panel, wherein the orthographic projection of the protective structure on the display panel at least covers the orthographic projection of the sealing structure on the display panel.

[0114] In some embodiments, the protective structure includes a first sublayer, a second sublayer, and a third sublayer arranged sequentially along a direction close to the display panel. The first sublayer and the third sublayer include insulating materials, the second sublayer includes conductive materials, and the flexible circuit board includes an exposed copper area on the side away from the display panel. The second sublayer is electrically connected to the exposed copper area. The orthographic projection of at least one of the first, second, and third sublayers on the display panel at least covers the orthographic projection of the sealing structure on the display panel.

[0115] In some embodiments, the first sublayer includes a first extension whose orthographic projection on the display panel overlaps the orthographic projection of the sealing structure on the display panel.

[0116] In some embodiments, the second sublayer includes a second extension, and the orthographic projections of the first extension and the second extension on the display panel cover the orthographic projection of the sealing structure on the display panel.

[0117] In some embodiments, the third sublayer includes a third extension whose orthographic projection on the display panel overlaps the orthographic projection of the sealing structure on the display panel.

[0118] In some embodiments, the third sublayer further includes a first portion and a second portion, wherein the orthographic projection of the first portion on the display panel covers the orthographic projection of the bonding portion on the display panel, and the orthographic projection of the second portion on the display panel covers a portion of the orthographic projection of the bonding portion on the display panel, and the first portion is connected to the third extension via the second portion.

[0119] In some embodiments, the display module further includes a first adhesive layer located between the bonding area and the bonding portion, and the first adhesive layer and the second sealing structure are integrally formed.

[0120] In some embodiments, the flexible circuit board further includes a non-bonding portion, the connecting portion further includes a non-bonding area, the display module further includes a second adhesive layer located between the non-bonding area and the non-bonding portion, and the sealing structure further includes a third sealing structure, the orthographic projection of the third sealing structure on the display panel covering a portion of the orthographic projection of the opening area on the display panel; the second adhesive layer and the third sealing structure are integrally formed.

[0121] In some embodiments, the side of the first sealing structure away from the display panel is a non-adhesive side.

[0122] This application provides a display module and display device that, through a sealing structure, seals the gap between the opening area on the flexible circuit board and the non-display side of the display panel, effectively preventing moisture from entering the display module and preventing the interior of the display module from being corroded by moisture.

[0123] Those skilled in the art should understand that the discussion of any of the above embodiments is merely exemplary and is not intended to imply that the scope of this application (including the claims) is limited to these examples; within the framework of this application, the technical features of the above embodiments or different embodiments can also be combined, the steps can be implemented in any order, and there are many other variations of different aspects of the embodiments of this application as described above, which are not provided in the details for the sake of brevity.

[0124] Additionally, to simplify the description and discussion, and to avoid obscuring the embodiments of this application, the well-known power / ground connections to integrated circuit (IC) chips and other components may or may not be shown in the provided drawings. Furthermore, the apparatus may be shown in block diagram form to avoid obscuring the embodiments of this application, and this also takes into account the fact that the details of the implementation of these block diagram apparatuses are highly dependent on the platform on which the embodiments of this application will be implemented (i.e., these details should be fully understood by those skilled in the art). While specific details (e.g., circuits) have been set forth to describe exemplary embodiments of this application, it will be apparent to those skilled in the art that the embodiments of this application can be implemented without these specific details or with variations thereof. Therefore, these descriptions should be considered illustrative rather than restrictive.

[0125] Although this application has been described in conjunction with specific embodiments thereof, many substitutions, modifications, and variations of these embodiments will be apparent to those skilled in the art from the foregoing description. For example, other memory architectures (e.g., dynamic RAM (DRAM)) may be used with the embodiments discussed.

[0126] The embodiments of this application are intended to cover all such substitutions, modifications, and variations that fall within the broad scope of the appended claims. Therefore, any omissions, modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the embodiments of this application should be included within the protection scope of this application.

Claims

1. A display module, comprising: A display panel includes a display area and a non-display area surrounding the display area. The non-display area is provided with a connecting portion, and the connecting portion includes a binding area. An alignment mark is provided on at least one side of the binding area. A flexible circuit board is located on the non-display side of the display panel. The flexible circuit board includes a bonding portion and an opening area located on at least one side of the bonding portion. The bonding portion is bonded to the bonding area to realize the electrical connection between the flexible circuit board and the display panel. The alignment mark is located within the orthographic projection of the opening area on the non-display area. A sealing structure is located in the opening area, and the orthographic projection of the sealing structure on the display panel at least covers a portion of the orthographic projection of the opening area on the display panel.

2. The display module as described in claim 1, wherein, The sealing structure includes a first sealing structure, the orthographic projection of which covers the opening area and the orthographic projection of the alignment mark on the display panel; or The sealing structure includes a second sealing structure, the orthographic projection of the second sealing structure on the display panel covering a portion of the orthographic projection of the opening area on the display panel.

3. The display module as described in claim 1, wherein, The display module also includes: A protective structure is located on the side of the flexible circuit board away from the display panel, and the orthographic projection of the protective structure on the display panel at least covers the orthographic projection of the sealing structure on the display panel.

4. The display module as described in claim 3, wherein, The protective structure includes a first sub-layer, a second sub-layer, and a third sub-layer arranged sequentially along the direction close to the display panel. The first sub-layer and the third sub-layer include insulating material, the second sub-layer includes conductive material, and the side of the flexible circuit board away from the display panel includes an exposed copper area. The second sub-layer is electrically connected to the exposed copper area. The orthographic projection of at least one of the first sublayer, the second sublayer, and the third sublayer on the display panel at least covers the orthographic projection of the sealing structure on the display panel.

5. The display module as described in claim 4, wherein, The first sublayer includes a first extension, the orthographic projection of the first extension on the display panel covering the orthographic projection of the sealing structure on the display panel.

6. The display module as described in claim 5, wherein, The second sublayer includes a second extension, the orthographic projections of the first extension and the second extension on the display panel covering the orthographic projection of the sealing structure on the display panel.

7. The display module according to any one of claims 4-6, wherein, The third sublayer includes a third extension, the orthographic projection of which on the display panel overlaps the orthographic projection of the sealing structure on the display panel.

8. The display module as described in claim 7, wherein, The third sub-layer further includes a first part and a second part, wherein the orthographic projection of the first part on the display panel covers the orthographic projection of the bonding part on the display panel, and the orthographic projection of the second part on the display panel covers a portion of the orthographic projection of the bonding part on the display panel, and the first part is connected to the third extension through the second part.

9. The display module as described in claim 2, wherein, The display module further includes a first adhesive layer, which is located between the bonding area and the bonding portion, and the first adhesive layer and the second sealing structure are integrally formed.

10. The display module as claimed in claim 9, wherein, The flexible circuit board further includes a non-bonding portion, the connecting portion further includes a non-bonding area, the display module further includes a second adhesive layer, the second adhesive layer is located between the non-bonding area and the non-bonding portion, and the sealing structure further includes a third sealing structure, the orthographic projection of the third sealing structure on the display panel covers a portion of the orthographic projection of the opening area on the display panel; The second adhesive layer and the third sealing structure are integrally formed.

11. The display module as described in claim 2, wherein, The side of the first sealing structure away from the display panel is a non-adhesive side.

12. A display device comprising a display module as described in any one of claims 1-11.

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